Wafer film expanding device

Abstract

The utility model relates to a wafer film expanding device which comprises a film expanding platform deck outer ring assembly, a film expanding platform deck inner ring assembly, a film expanding reciprocating pressing assembly and a wafer film expanding jacking executing mechanism which drives the film expanding platform deck outer ring assembly in the middle of the upper portion to move in the vertical direction. And a film expanding carrying table inner ring assembly is mounted on the inner ring of the film expanding carrying table outer ring assembly. The wafer film expanding device provided by the utility model can realize full-automatic film expanding, realizes reasonable separation of die gaps, and is convenient for subsequent processes.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor industry especially relates to a wafer film expanding device. BACKGROUND

[0002] With the development of semiconductor industry, especially the miniaturization of die size and the development of semiconductor packaging to high integration and miniaturization, many high requirement packaging processes begin to use invisible cutting, and then the wafer or chip attached with film is completely separated according to the predetermined line to obtain independent individual. Because it is necessary to avoid quality problems such as burr during cutting, and at the same time, it is necessary to ensure that the die in the wafer can be separated by the required gap, on the other hand, the product on the market at present mainly uses the sub-mother ring to expand the film manually, so as to separate the die (wherein the die refers to a single cut down unpackaged semiconductor chip, usually referred to as "bare chip"), which is low in efficiency and cannot meet the demand of automation, so high-precision equipment and strict process control are needed, which is challenging.

[0003] In view of the above defects, the designer actively researches and innovates to create a wafer film expanding device, which has higher industrial utilization value. CONTENT OF THE UTILITY MODEL

[0004] To solve any one of the above technical problems, the utility model aims at providing a wafer film expanding device.

[0005] To achieve the above purpose, the utility model adopts the following technical scheme:

[0006] The wafer film expanding device comprises a film expanding carrier outer ring assembly, a film expanding carrier inner ring assembly, a film expanding reciprocating compression assembly and a wafer film expanding jacking execution mechanism, the wafer film expanding jacking execution mechanism drives the film expanding carrier outer ring assembly in the upper middle part to move in the vertical direction, and the film expanding carrier inner ring assembly is installed in the inner ring of the film expanding carrier outer ring assembly;

[0007] The wafer film expanding jacking execution mechanism comprises an execution flat plate, a lead screw connecting plate and a bottom connecting plate from top to bottom in sequence, the execution flat plate is connected together with the bottom connecting plate below through a plurality of supporting columns, the driving end of the motor top in the middle of the bottom connecting plate bottom is connected with the lead screw through a coupling, the lead screw connecting plate is driven by the lead screw nut to move in the vertical direction, the lead screw connecting plate is connected with the lifting bottom disc above the execution flat plate through a plurality of lifting bottom disc guide shafts, and the lifting bottom disc is connected with the film expanding carrier outer ring assembly above;

[0008] The film expanding reciprocating compression assembly comprises a steel ring support which is located above the outer side of the film expanding carrier outer ring assembly and can move left and right.

[0009] The further improvement of the utility model is that the expansion film steel ring positioning assembly is sequentially comprised of a positioning flat plate and a positioning bottom plate from top to bottom, the front and back sides of the positioning flat plate and the positioning bottom plate are connected together through a plurality of supporting blocks, positioning cylinder one and positioning cylinder two are respectively installed on the bottom of the positioning flat plate close to the front and back sides, positioning cylinder one and positioning cylinder two respectively drive the clamping shaft above the positioning flat plate to move in the direction of the inner and outer sides, and the clamping shaft is used for side clamping positioning treatment of the inner steel ring.

[0010] The further improvement of the utility model is that the expansion film steel ring positioning assembly is sequentially comprised of a positioning flat plate and a positioning bottom plate from top to bottom, the front and back sides of the positioning flat plate and the positioning bottom plate are connected together through a plurality of supporting blocks, positioning cylinder one and positioning cylinder two are respectively installed on the bottom of the positioning flat plate close to the front and back sides, positioning cylinder one and positioning cylinder two respectively drive the clamping shaft above the positioning flat plate to move in the direction of the inner and outer sides, and the clamping shaft is used for side clamping positioning treatment of the inner steel ring.

[0011] The further improvement of the utility model is that the expansion film steel ring positioning assembly is sequentially comprised of a positioning flat plate and a positioning bottom plate from top to bottom, the front and back sides of the positioning flat plate and the positioning bottom plate are connected together through a plurality of supporting blocks, positioning cylinder one and positioning cylinder two are respectively installed on the bottom of the positioning flat plate close to the front and back sides, positioning cylinder one and positioning cylinder two respectively drive the clamping shaft above the positioning flat plate to move in the direction of the inner and outer sides, and the clamping shaft is used for side clamping positioning treatment of the inner steel ring.

[0012] The further improvement of the utility model is that the expansion film steel ring positioning assembly is sequentially comprised of a positioning flat plate and a positioning bottom plate from top to bottom, the front and back sides of the positioning flat plate and the positioning bottom plate are connected together through a plurality of supporting blocks, positioning cylinder one and positioning cylinder two are respectively installed on the bottom of the positioning flat plate close to the front and back sides, positioning cylinder one and positioning cylinder two respectively drive the clamping shaft above the positioning flat plate to move in the direction of the inner and outer sides, and the clamping shaft is used for side clamping positioning treatment of the inner steel ring.

[0013] The further improvement of the utility model is that the expansion film steel ring positioning assembly is sequentially comprised of a positioning flat plate and a positioning bottom plate from top to bottom, the front and back sides of the positioning flat plate and the positioning bottom plate are connected together through a plurality of supporting blocks, positioning cylinder one and positioning cylinder two are respectively installed on the bottom of the positioning flat plate close to the front and back sides, positioning cylinder one and positioning cylinder two respectively drive the clamping shaft above the positioning flat plate to move in the direction of the inner and outer sides, and the clamping shaft is used for side clamping positioning treatment of the inner steel ring.

[0014] The further improvement of the utility model is that the expansion film steel ring positioning assembly is sequentially comprised of a positioning flat plate and a positioning bottom plate from top to bottom, the front and back sides of the positioning flat plate and the positioning bottom plate are connected together through a plurality of supporting blocks, positioning cylinder one and positioning cylinder two are respectively installed on the bottom of the positioning flat plate close to the front and back sides, positioning cylinder one and positioning cylinder two respectively drive the clamping shaft above the positioning flat plate to move in the direction of the inner and outer sides, and the clamping shaft is used for side clamping positioning treatment of the inner steel ring.

[0015] As a further improvement of the utility model, the steel ring support support plate and the sliding block support plate are respectively arranged on the front and back sides of the bottom of the steel ring support, the reciprocating cylinder fixing plate is arranged on the inner side of the steel ring support support plate, and the guide rail plate is arranged on the inner side of the sliding block support plate; the reciprocating cylinder arranged on the inner side of the reciprocating cylinder fixing plate drives the steel ring support support plate to move in the left-right direction through the sliding plate and the reciprocating connecting plate one; the sliding block support plate moves on the guide rail plate in the left-right direction through the guide rail; the reciprocating cylinder fixing plate and the guide rail plate are respectively arranged on the front and back sides of the execution flat plate; the left sides of the reciprocating cylinder fixing plate and the guide rail plate are connected together through the reciprocating connecting plate two; the reciprocating connecting plate two is connected together with the outer side support plate below through the back side support plate; and the reinforcing plate is arranged on the back side support plate; and at least one bumper is arranged on the right side of the reciprocating cylinder fixing plate through the bumper support.

[0016] As a further improvement of the utility model, the lifting chassis guide shaft is arranged on the execution flat plate through the bearing four; at least one lifting sensor is arranged on the bottom of the lifting chassis through the sensor fixing plate; and the lifting sensing sheet matched with the lifting sensor is arranged on the execution flat plate on the side of the lifting sensor.

[0017] As a further improvement of the utility model, at least one adjusting screw is arranged on the bottom side of the bottom connecting plate through the adjusting fixing block.

[0018] By the above scheme, the utility model has at least the following advantages:

[0019] The wafer film expanding device can realize full-automatic film expanding, realize reasonable separation of die gaps and facilitate subsequent processes.

[0020] The utility model contains reciprocating motion mechanism, when needing, press tightly steel ring, wafer film expanding jacking mechanism jacks up wafer, realize the even separation of film, after wafer film expanding mechanism assembly drops, film expanding reciprocating motion mechanism can retract, make things convenient for unloading.

[0021] The film expanding steel ring positioning and clamping assembly can clamp the steel ring, effectively fix the steel ring and prevent the steel ring from moving during jacking.

[0022] The film expanding carrier outer ring assembly can guide the film during jacking of the wafer film expanding jacking mechanism and prevent the film from being broken.

[0023] The film expanding carrier inner ring assembly can effectively fix the film and the wafer through outer ring adsorption vacuum and inner ring adsorption vacuum in the film expanding carrier inner ring assembly.

[0024] The above description is only an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, the preferred embodiments of this utility model are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0025] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a schematic diagram of the structure of a wafer expansion device according to the present invention;

[0027] Figure 2 yes Figure 1 Schematic diagram of the outer ring assembly of the expansion membrane stage;

[0028] Figure 3 yes Figure 1 Schematic diagram of the inner ring assembly of the expansion membrane stage;

[0029] Figure 4 yes Figure 3 A bottom view;

[0030] Figure 5 yes Figure 1 Schematic diagram of the reciprocating pressing assembly for the expansion membrane;

[0031] Figure 6 yes Figure 1 Schematic diagram of the structure of the expansion membrane steel ring positioning assembly;

[0032] Figure 7 yes Figure 1 A schematic diagram of the structure of the wafer expansion lifting actuator.

[0033] The meanings of the labels in the figures are as follows.

[0034] 1. Steel ring; 2. Outer ring assembly of expansion stage; 3. Inner ring assembly of expansion stage; 4. Reciprocating clamping assembly of expansion stage; 5. Positioning assembly of expansion steel ring; 6. Wafer expansion lifting actuator.

[0035] Bearing 201, ball bearing 202, expanding film circular base plate 203, expanding film pressing plate 204;

[0036] Main support sheet metal 301, side support sheet metal 302, bearing two 303, suction cup base 304, inner ring vacuum joint 305, outer ring vacuum joint 306, center ring 307, suction cup base guide shaft 308, cover plate 309, intermediate connecting plate 310, frame 311, adsorption stage 312;

[0037] Buffer 401, buffer support 402, steel ring support support plate 403, reciprocating connecting plate one 404, reciprocating air cylinder 405, steel ring support 406, sliding block support plate 407, guide rail 408, outer side support plate 409, rear side support plate 410, reinforcing plate 411, reciprocating connecting plate two 412, guide rail plate 413, reciprocating air cylinder fixed plate 414, sliding plate 415;

[0038] Positioning cylinder one 501, positioning flat plate 502, clamping shaft 503, sensor one 504, positioning cylinder two 505, positioning bottom plate 506, sensor two 507, sensing sheet 508, support block 509;

[0039] Execution flat plate 601, positioning guide shaft 602, sensor three 603, lifting chassis 604, lifting chassis guide shaft 605, bearing three 606, limiting shaft 607, jacking cylinder 608, support column 609, adjusting fixed block 610, adjusting screw 611, motor 612, motor fixed block 613, coupling 614, motor connecting shaft 615, bottom connecting plate 616, lead screw 617, lead screw connecting plate 618, guide shaft connecting plate 619, bearing four 620, sensor fixed plate 621, jacking plate 622. DETAILED DESCRIPTION

[0040] The specific embodiments of the present application will be further described in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present application, but not to limit the scope of the present application.

[0041] In order to enable the personnel in the technical field to better understand the present application scheme, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, not all the embodiments. The components of the embodiments of the present application described and shown in the accompanying drawings can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of the present application.

[0042] As Figures 1-7As shown,

[0043] The first embodiment of the utility model:

[0044] As Figure 1 A wafer film expanding device, which comprises a film expanding outer ring assembly 2, a film expanding inner ring assembly 3, a film expanding reciprocating compression assembly 4 and a wafer film expanding jacking actuator 6, the wafer film expanding jacking actuator 6 drives the film expanding outer ring assembly 2 in the middle of the upper part to move in the vertical direction, the film expanding inner ring assembly 3 is installed in the inner ring of the film expanding outer ring assembly 2, and the film expanding steel ring positioning assembly 5 is installed on both sides of the upper part of the wafer film expanding jacking actuator 6. Wherein, the steel ring 1 can be placed between the film expanding reciprocating compression assembly 4 and the film expanding outer ring assembly 2 and the film expanding inner ring assembly 3.

[0045] I. The wafer film expanding jacking actuator 6 mainly comprises an execution flat plate 601, a lead screw connecting plate 618 and a bottom connecting plate 616.

[0046] As Figure 7 Adjusting fixing blocks 610 are arranged on both sides of the bottom connecting plate 616, adjusting screws 611 are arranged in the adjusting fixing blocks 610, a motor connecting shaft 615 is arranged below the bottom connecting plate 616, a motor fixing block 613 is arranged below the motor connecting shaft 615, a motor 612 is installed on the motor fixing block 613, the motor 612 is connected with a lead screw 617 through a shaft coupling 614, a supporting stand column 609 is further arranged above the bottom connecting plate 616, an execution flat plate 601 is arranged above the supporting stand column 609, a lead screw connecting plate 618 is arranged on the sliding block of the lead screw 617, a lifting bottom disc guide shaft 605 is arranged on the lead screw connecting plate 618, a bearing four 620 (linear bearing) is arranged in the lifting bottom disc guide shaft 605, a lifting bottom disc 604 is installed at the end of the lifting bottom disc guide shaft 605, a sensor three 603 is arranged at a position of the lifting bottom disc 604, a positioning guide shaft 602 and a bearing three 606 (linear bearing) are also arranged on the execution flat plate 601, a limiting shaft 607 is also arranged above the execution flat plate 601, jacking cylinders 608 are also arranged on both sides of the execution flat plate 601, and a jacking plate 622 is installed above the jacking cylinders 608.

[0047] II. The film expanding steel ring positioning assembly 5 mainly comprises a positioning flat plate 502 and a positioning bottom plate 506.

[0048] As Figure 6The support block 509 is installed on both sides of the positioning bottom plate 506, the positioning flat plate 502 is installed above the support block 509, the positioning cylinder one 501 is installed on one side below the positioning flat plate 502, the positioning cylinder two 505 is installed on the other side below the positioning flat plate 502, the clamping shaft 503 is installed on the positioning cylinder one 501 and the positioning cylinder two 505 respectively, and the sensor one 504 and the sensor two 507 are also installed on the positioning bottom plate 506.

[0049] III. The film expanding reciprocating compression assembly 4 mainly includes a steel ring support support plate 403, a reciprocating cylinder 405, a steel ring support 406, a guide rail plate 413 and a reciprocating cylinder fixing plate 414.

[0050] As Figure 5 The reciprocating cylinder 405 is installed on one side of the reciprocating cylinder fixing plate 414, the sliding plate 415 is installed on the reciprocating cylinder 405, the sliding plate 415 is connected with the steel ring support support plate 403 through the reciprocating connecting plate one 404, the bumper support 402 is arranged on one side of the reciprocating cylinder fixing plate 414, the bumper 401 is arranged on the bumper support 402, the steel ring support 406 is installed above the steel ring support support plate 403, the sliding block support plate 407 is also installed on the other side of the steel ring support 406, the guide rail 408 is installed on the guide rail plate 413, the sliding block support plate 407 is installed on the guide rail 408, the reciprocating connecting plate two 412 is installed on the guide rail plate 413 and the cylinder fixing plate 414, the rear side support plate 410 is installed below the reciprocating connecting plate two 412, the outer side support plate 409 is installed on the rear side support plate 410, and the reinforcing plate 411 is installed on the outer side support plate 409.

[0051] IV. The film expanding platform inner ring assembly 3 mainly includes a suction cup base 304, a cover plate 309, an intermediate connecting plate 310, a frame 311 and a suction platform 312.

[0052] As Figures 3-4 The intermediate connecting plate 310 is installed below the cover plate 309, the frame 311 is installed on the outer side of the intermediate connecting plate 310, the suction platform 312 is installed in the frame 311, the suction cup base 304 is installed above the cover plate 309, the suction cup base guide shaft 308 is installed on the suction cup base 304, the bearing two 303 (linear bearing) is installed in the suction cup base guide shaft 308, the main support sheet metal 301 is installed on the suction cup base guide shaft 308, and the side support sheet metal 302 is installed on the main support sheet metal 301.

[0053] V. The film expanding platform outer ring assembly 2 mainly includes a film expanding round disc 203 and a film expanding pressure plate 204.

[0054] As Figure 2The bearing one 201 is installed on the upper circle of the film expanding round bottom disc 203, the ball 202 is installed outside the bearing one 201, and the film expanding pressure disc 204 is installed in the film expanding round bottom disc 203.

[0055] The working process of the utility model is briefly described as follows:

[0056] When film expansion is needed, first, the steel ring 1 with a wafer and a film is placed on the left film expansion steel ring positioning assembly 5 and the right film expansion steel ring positioning assembly 5, then the positioning cylinder one 501 on the film expansion steel ring positioning assembly 5 is retracted to drive the clamping shaft 503 to clamp the steel ring 1, the film expansion reciprocating compression assembly 4 drives the steel ring support 406 to move from one end to the other end by the reciprocating cylinder 405, then the lifting cylinder 608 in the wafer film expansion lifting mechanism 6 drives the lifting plate 622 to move upward, the lifting plate 622 drives the film expansion steel ring positioning assembly 5 to move upward, and the steel ring is clamped in the up-down direction.

[0057] The motor 612 drives the screw rod 617 to rotate through the shaft coupling 614, drives the lifting bottom disc 604 to move upward, drives the film expansion carrier inner ring assembly 3 and the film expansion carrier outer ring assembly 2 to move upward, each die in the cut wafer is expanded, then the inner ring vacuum joint 305 of the film expansion carrier inner ring assembly 3 is opened, the die is adsorbed through the adsorption carrier 312, the outer ring vacuum joint 3065 of the film expansion carrier inner ring assembly 3 is opened to adsorb the outer ring film, in the process of upward movement of the inner ring wafer, the ball 202 in the film expansion carrier outer ring assembly 2 can guide the film, prevent the film from being broken, complete the wafer film expansion action, and ensure normal production of the next process.

[0058] The utility model provides a wafer film expanding device, can realize full -automatic film expansion, realize die gap reasonable separation, make things convenient for subsequent process.

[0059] The film expansion steel ring positioning and clamping assembly can clamp the steel ring, effectively fix the steel ring, and prevent the steel ring from moving in the lifting process.

[0060] The film expansion carrier outer ring assembly can guide the film and prevent the film from being broken in the lifting process of the wafer film expansion lifting mechanism.

[0061] The film expansion carrier inner ring assembly can effectively fix the film and the wafer through outer ring adsorption vacuum and inner ring adsorption vacuum in the film expansion carrier inner ring assembly.

[0062] In the description of the utility model, need understanding is, the term "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "internal", "external" and so on indicate the orientation or positional relation based on the orientation or positional relation shown in the drawing, just for the convenience of describing the utility model and simplifying the description, and not indicate or imply that the indicated device or element must have a particular orientation, construct and operate in a particular orientation, therefore can not be understood as the limitation of the utility model. In addition, the term "first", "second" and so on are only for the purpose of description, and can not be understood as indicating or implying relative importance or implying the number of the indicated technical features. Therefore, the features limited by "first", "second" and so on can be explicitly or implicitly included one or more features. In the description of the utility model, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0063] In the description of the utility model, it should be pointed out that, unless otherwise specified and limited, the terms "mounting", "connecting", "connection" should be understood broadly, for example, can be fixedly connected, can be detachably connected, or integrally connected, can be mechanically connected, can be electrically connected, can be directly connected, can be indirectly connected through an intermediate medium, can be the communication inside two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood through specific circumstances.

[0064] The above is only the preferred embodiment of the utility model, and is not used to limit the utility model, it should be pointed out that, for ordinary skilled in the art, on the premise of not departing from the technical principles of the utility model, can make several improvements and variations, these improvements and variations also should be regarded as the protection scope of the utility model.

Claims

1. A wafer expansion apparatus, characterized in that: The device includes an outer ring assembly (2) of a film expansion stage, an inner ring assembly (3) of a film expansion stage, a film expansion reciprocating clamping assembly (4) and a wafer film expansion lifting actuator (6). The wafer film expansion lifting actuator (6) drives the outer ring assembly (2) of the film expansion stage in the upper middle part to move in the vertical direction. The inner ring assembly (3) of the film expansion stage is installed in the inner ring of the outer ring assembly (2). The wafer expansion lifting actuator (6) includes, from top to bottom, an execution plate (601), a lead screw connecting plate (618), and a bottom connecting plate (616). The execution plate (601) is connected to the bottom connecting plate (616) below through several support columns (609). The drive end of the motor (612) installed at the bottom center of the bottom connecting plate (616) through a motor fixing block (613) and several motor connecting shafts (615) is connected to the lead screw (617) through a coupling (614). The lead screw (617) drives the lead screw connecting plate (618) to move vertically through the lead screw nut. The lead screw connecting plate (618) is connected to the lifting chassis (604) located above the execution plate (601) through several lifting chassis guide shafts (605). The lifting chassis (604) is connected to the outer ring assembly (2) of the expansion stage above. The expanding film reciprocating pressing assembly (4) includes a steel ring bracket (406) located above the outer ring assembly (2) of the expanding film stage and movable left and right.

2. The wafer expansion apparatus as described in claim 1, characterized in that, Expanding steel ring positioning components (5) are installed on both the left and right sides of the outer ring assembly (2) of the expanding stage. A lifting cylinder (608) is installed on the execution plate (601) directly below the expanding steel ring positioning component (5). The driving end of the top of the lifting cylinder (608) drives the expanding steel ring positioning component (5) above to move vertically through the lifting plate (622).

3. The wafer expansion apparatus as described in claim 2, characterized in that, The expanding steel ring positioning assembly (5) includes a positioning plate (502) and a positioning base plate (506) from top to bottom. The front and rear sides of the positioning plate (502) and the positioning base plate (506) are connected together by several support blocks (509). Positioning cylinder one (501) and positioning cylinder two (505) are respectively installed on the bottom of the positioning plate (502) near the front and rear sides. Positioning cylinder one (501) and positioning cylinder two (505) drive the clamping shaft (503) located above the positioning plate (502) to move in the direction of inward and outward. The clamping shaft (503) is used to perform side clamping and positioning of the inner steel ring (1).

4. The wafer expansion apparatus as described in claim 3, characterized in that, Sensor 1 (504) and Sensor 2 (507) are respectively installed on the positioning base plate (506) below the positioning cylinder 1 (501) and positioning cylinder 2 (505). Positioning sensing plates (508) are respectively installed at the bottom of the locking shaft (503) above the sensor 1 (504) and sensor 2 (507). Several positioning guide shafts (602) are installed on the execution plate (601) through bearing 3 (606). The top of the positioning guide shaft (602) is installed on the bottom of the positioning base plate (506), and the bottom of the positioning guide shaft (602) passes through the execution plate (601) and is connected to the guide shaft connecting plate (619) below. Several limiting shafts (607) are installed on the execution plate (601) below the positioning base plate (506).

5. The wafer expansion apparatus as described in claim 1, characterized in that, The outer ring assembly (2) of the film expansion stage includes a film expansion circular base (203) and a film expansion pressure plate (204). The inner ring assembly (3) of the film expansion stage includes a suction cup base (304), a cover plate (309), an intermediate connecting plate (310), a frame (311), and an adsorption stage (312). A bearing (201) is installed on the outer ring of the film expansion circular base (203). A plurality of balls (202) are evenly installed on the outer side of the bearing (201) along the circumferential direction. An expansion plate (204) is installed on the inner ring of the expansion circular base (203); a cover plate (309) is installed on the suction cup base (304), the cover plate (309) is connected to the frame (311) through the intermediate connecting plate (310), the frame (311) is located inside the expansion circular base (203), an adsorption stage (312) is installed inside the frame (311), and the suction cup base (304) protrudes from the bottom of the expansion circular base (203).

6. The wafer expansion apparatus as described in claim 5, characterized in that, A plurality of suction cup base guide shafts (308) are installed at the bottom of the suction cup base (304). The suction cup base guide shafts (308) are mounted on the execution plate (601) via bearing two (303). The bottom of the suction cup base guide shafts (308) passes through the execution plate (601) and is then mounted on the main support sheet metal (301). Side support sheet metal (302) is installed between two adjacent main support sheet metals (301).

7. The wafer expansion apparatus as described in claim 5, characterized in that, An inner ring vacuum connector (305), an outer ring vacuum connector (306), and a central ring (307) are installed on the suction cup base (304).

8. The wafer expansion apparatus as described in claim 1, characterized in that, A steel ring support plate (403) and a slider support plate (407) are respectively installed on the front and rear sides of the bottom of the steel ring support (406). A reciprocating cylinder fixing plate (414) is installed on the inner side of the steel ring support plate (403), and a guide rail plate (413) is installed on the inner side of the slider support plate (407). The reciprocating cylinder (405) installed on the inner side of the reciprocating cylinder fixing plate (414) drives the steel ring support plate (403) to move in the left and right directions through the sliding plate (415) and the reciprocating connecting plate (404). The slider support plate (407) is connected to the guide rail plate (413) via the guide rail (408). The reciprocating cylinder fixing plate (414) and guide rail plate (413) are respectively installed on the front and rear sides of the execution plate (601). The left side of the reciprocating cylinder fixing plate (414) and guide rail plate (413) are connected together by reciprocating connecting plate two (412). The reciprocating connecting plate two (412) is connected to the lower outer support plate (409) by the rear support plate (410), and a reinforcing plate (411) is installed on the rear support plate (410). At least one buffer (401) is installed on the right side of the reciprocating cylinder fixing plate (414) by buffer bracket (402).

9. The wafer expansion apparatus as described in claim 1, characterized in that, The lifting chassis guide shaft (605) is mounted on the execution plate (601) via bearing four (620); at least one lifting sensor is mounted on the bottom of the lifting chassis (604) via sensor fixing plate (621), and a lifting sensing plate adapted to the above-mentioned lifting sensor is mounted on the execution plate (601) on one side of the lifting sensor.

10. The wafer expansion apparatus as described in claim 1, characterized in that, At least one adjusting screw (611) is installed on one side of the bottom of the bottom connecting plate (616) via an adjusting fixing block (610).

Images