Chip packaging structure and communication equipment
By creating connection holes on the substrate and heat sink and using connecting fasteners for fixation, the problem of insufficient adhesive strength of the heat sink was solved, thereby improving the stability of the chip packaging structure.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-31
- Publication Date
- 2026-03-27
AI Technical Summary
Under high-density packaging and liquid cooling conditions, the existing chip packaging structure has insufficient adhesive strength of the heat sink, which makes it easy to fall off and affect the stability of the chip packaging structure.
Connection holes are made on the substrate and the heat sink respectively, and they are fixed with fasteners to prevent the heat sink from falling off and improve the bonding strength.
It effectively prevents the heat sink from falling off, improves the stability of the chip packaging structure, and meets the needs of high-density packaging and liquid cooling environments.
Smart Images
Figure CN224054780U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] Embodiments of the present application relate to the chip packaging technical field, and in particular to a chip packaging structure and a communication device. BACKGROUND
[0002] With the development of high computing power applications such as edge computing and artificial intelligence training, the demand for chip performance is also increasing, therefore, advanced packaging technologies such as chiplet, 2.5D / 3D packaging, wafer level packaging (WLP) have gradually become effective means to improve chip performance.
[0003] However, in the advanced packaging process, as the number of chips per unit area increases, the space left for the chip heat dissipation cover is reduced, and the heat dissipation cover has a small bonding area, thereby affecting the stability of the chip packaging structure. Therefore, under this background, how to provide a technical solution to improve the stability of the chip packaging structure has become a technical problem that needs to be solved by those skilled in the art. CONTENT OF THE UTILITY MODEL
[0004] To solve the above problems, embodiments of the present application provide a chip packaging structure and a communication device.
[0005] In a first aspect, embodiments of the present application provide a chip packaging structure, comprising:
[0006] a substrate, a first connecting hole is formed at an edge position of the substrate;
[0007] a heat dissipation cover with adhesive at the bottom, the heat dissipation cover is provided with a second connecting hole, the position of the second connecting hole corresponds to the position of the first connecting hole;
[0008] a connecting fastener located in the first connecting hole and the second connecting hole to fix the heat dissipation cover on the substrate;
[0009] a chip fixed on the substrate and located in the space surrounded by the heat dissipation cover and the substrate.
[0010] In a second aspect, embodiments of the present application provide a communication device, the communication device comprising the chip packaging structure as described in the first aspect.
[0011] The chip packaging structure provided in this application embodiment, on the basis of the heat sink being bonded to the substrate, further provides a first connection hole at the edge of the substrate and a second connection hole at the position corresponding to the first connection hole on the heat sink; thereby, connecting fasteners can be set in the first connection hole and the second connection hole, so that the substrate and the heat sink are fixedly connected by the connecting fasteners, preventing the heat sink from falling off, thereby improving the stability of the chip packaging structure. Attached Figure Description
[0012] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.
[0013] Figure 1 This is a schematic diagram of a chip packaging structure.
[0014] Figure 2 This is a schematic diagram of the chip packaging structure provided in the embodiments of this application.
[0015] Figure 3 yes Figure 2 The diagram shows a top view of the chip packaging structure.
[0016] Figure 4a This is a schematic diagram of the wiring area of the chip packaging structure provided in the embodiments of this application.
[0017] Figure 4b This is another schematic diagram of the wiring area of the chip packaging structure provided in the embodiments of this application.
[0018] Figure 5 This is another schematic diagram of the chip packaging structure provided in the embodiments of this application.
[0019] Figure 6 This is another schematic diagram of the chip packaging structure provided in the embodiments of this application.
[0020] Figure 7 yes Figure 6 The diagram shows a top view of the chip packaging structure. Detailed Implementation
[0021] As described in the background section, the structural stability of the chip packaging structure needs to be improved. For example, a chiplet is a small chip die. After multiple chiplets with different functions or different processes are interconnected, a chip packaging structure formed by advanced packaging technologies such as 2.5D / 3D packaging can be a chip system, thereby improving the performance of the chip and the chip system to meet the increasing demand for chip performance.
[0022] For high-density packaging technologies represented by chiplet packaging, as the number of chips per unit area increases, the space left for the heat dissipation cover to be attached in the process of bonding the heat dissipation cover and the substrate by silicone adhesive decreases. Therefore, due to the space limitation and the increase in bonding difficulty, problems such as insufficient bonding area and reduced bonding strength of the heat dissipation cover may occur during the use of the packaged chip, thereby causing the heat dissipation cover to fall off, and in severe cases, the chip packaging structure (such as a chip system) may be scrapped.
[0023] In addition, although the application of server liquid cooling technology, especially the immersion liquid cooling scheme in high-performance servers effectively solves the heat dissipation bottleneck of traditional air cooling systems, the cooling liquid can cause different degrees of damage to the chemical stability of the organic silicone adhesive. For example, the chemical components in the fluorinated liquid can react with the three-dimensional network structure inside the silicone through hydrogen ions, destroy the cross-linking structure of the silicone molecules, and cause the physical properties to decrease. This chemical reaction further causes problems such as decomposition of the silicone and reduction of thermal stability, and in extreme cases, it can also cause the heat dissipation cover to fall off, affecting the normal operation of the system.
[0024] Figure 1 is a structural diagram of a chip packaging structure. As shown in Figure 1 the chip packaging structure includes a substrate 10, a plurality of chips 31 fixed on the substrate 10, a heat dissipation cover 20 bonded to the substrate 10 by an adhesive 41, and the chips 31 located inside the heat dissipation cover 20.
[0025] Since the heat dissipation cover 20 and the substrate 10 are bonded by the adhesive 41, the smaller the bonding area of the heat dissipation cover 20 and the substrate 10, the lower the bonding strength, and the more likely the heat dissipation cover 20 will fall off. In addition, when the adhesive 41 reacts with the cooling liquid outside the chip packaging structure, causing the adhesive 41 to change structure or decompose, the bonding strength will also decrease, and the heat dissipation cover will fall off.
[0026] Therefore, the stability of the existing chip packaging structure needs to be improved.
[0027] To this end, the application provides a chip packaging structure, comprising: a substrate, a first connecting hole being formed at an edge position of the substrate; a heat dissipation cover with an adhesive at a bottom, the heat dissipation cover being provided with a second connecting hole, the position of the second connecting hole corresponding to the position of the first connecting hole; a connecting fastener being located in the first connecting hole and the second connecting hole to fix the heat dissipation cover on the substrate; and a chip being fixed on the substrate and located in a space enclosed by the heat dissipation cover and the substrate.
[0028] The chip packaging structure provided by the application further forms the first connecting hole at the edge position of the substrate and the second connecting hole at the corresponding position of the first connecting hole on the heat dissipation cover, so that the connecting fastener is arranged in the first connecting hole and the second connecting hole, the substrate and the heat dissipation cover are fixedly connected through the connecting fastener, the heat dissipation cover is prevented from falling off, and the stability of the chip packaging structure is improved.
[0029] In order to make the above-mentioned purposes, features and advantages of the application more obvious and easy to understand, the specific embodiments of the application will be described in detail below with reference to the drawings.
[0030] As shown in Figure 2 The chip packaging structure provided by the embodiments of the application comprises:
[0031] A substrate 30, a first connecting hole (not shown) being formed at an edge position of the substrate 30; a heat dissipation cover 42 with an adhesive 41 at a bottom, the heat dissipation cover 42 being provided with a second connecting hole 43, the position of the second connecting hole 43 corresponding to the position of the first connecting hole; a connecting fastener 44 being located in the first connecting hole and the second connecting hole 43 to fix the heat dissipation cover 42 on the substrate 30; and a chip 31 being fixed on the substrate 30 and located in a space enclosed by the heat dissipation cover 42 and the substrate 30.
[0032] The substrate 30 is connected with the chip 31 to drive the chip 31 to work. The chip 31 generates heat during work, which needs to be dissipated through the heat dissipation cover 42. Meanwhile, the heat dissipation cover 42 also has a protective effect on the chip 31. The chip 31 is located in the space enclosed by the heat dissipation cover 42 and the substrate 30, which can ensure that the chip 31 is isolated from the external environment during use, thereby avoiding the influence of dust, coolant and other substances on the normal work of the chip 31.
[0033] The bottom of the heat dissipation cover 42 is provided with an adhesive 41, that is, the heat dissipation cover 42 and the substrate 30 are bonded by the adhesive 41; but the heat dissipation cover 42 and the substrate 30 are bonded by the adhesive 41, and it can be understood that the smaller the bonding area of the heat dissipation cover 42 and the substrate 41, the lower the bonding strength, and the more prone to the problem of heat dissipation cover falling off.
[0034] Therefore, in the chip packaging structure provided by the embodiment of the application, the first connecting hole is arranged at the edge position of the substrate 30, and the second connecting hole 43 is arranged at the heat dissipation cover 42, the position of the second connecting hole 43 corresponds to the position of the first connecting hole, so that the connecting fixture 44 can fix and connect the heat dissipation cover 42 and the substrate 30 through the first connecting hole and the second connecting hole 43, and the problem of the heat dissipation cover 42 falling off caused by the insufficient bonding strength of the adhesive 41 is avoided.
[0035] In some specific embodiments, the chip packaging structure is applied to an immersion liquid-cooled communication device, wherein the chip packaging structure is immersed in an immersion liquid-cooled solvent (usually non-conductive cooling liquid), but the cooling liquid can cause different degrees of damage to the chemical stability of the organic silicone grease water, so that the connecting fixture 44 can fix and connect the heat dissipation cover 42 and the substrate 30 through the first connecting hole and the second connecting hole 43, so as to avoid the reaction of the adhesive 41 with the cooling liquid and the decomposition of the adhesive 41 caused by the thermal stability of the adhesive 41, avoid the heat dissipation cover 42 falling off, and improve the stability of the chip packaging structure.
[0036] In some specific embodiments, the first connecting hole arranged at the edge position of the substrate 30 can be formed by mechanical drilling before the substrate 30 is connected with the chip 31, so as to avoid the damage of the chip caused by vibration or flying debris after the chip 31 is attached to the substrate 30 and mechanical drilling is performed again; after the first connecting hole is formed, the chip 31 is attached to the substrate 30, and the chip 31 is attached to the substrate 30 by a welding process, for example, a reflow soldering process.
[0037] In some specific embodiments, in the design and manufacturing stage of the heat dissipation cover 42, the second connecting hole 43 arranged at the heat dissipation cover 42 is obtained by machining at the position corresponding to the first connecting hole on the heat dissipation cover 42.
[0038] To improve the connection strength, in some embodiments, the connection fixture 44 is a threaded fastener, and the first connection hole and the second connection hole 43 are threaded holes matched with the threaded fastener. As a common fastener, the threaded fastener has strong versatility, is easy to install and disassemble, and can also adjust the connection fastening degree as needed. By fixing the heat dissipation cover 42 on the substrate 30 through the threaded fastener, the connection strength of the heat dissipation cover 42 and the substrate 30 can be effectively improved, the probability of the heat dissipation cover falling off in the chip packaging structure is further reduced, and the stability of the chip packaging structure is improved.
[0039] After the heat dissipation cover 42 is adhered to the substrate 30 through the adhesive 41, the first connection hole and the second connection hole 43 are aligned, and then the threaded fastener can be screwed into the first connection hole and the second connection hole 43 through a screwdriver or other equipment. Specifically, the tightening torque of the threaded fastener is 0.1 N·m-2.0 N·m, for example, 0.1 N·m, 0.6 N·m, 1.0 N·m, 2.0 N·m, etc., which ensures that the threaded fastener can fix the heat dissipation cover 42 on the substrate 30, while avoiding problems such as structural deformation of the substrate 30 caused by excessive tightening torque.
[0040] Further, in some specific embodiments, the threaded fastener is a combination of one or more of M4, M6, M8, M10, and M12 metric screws. The threaded fastener uses metric screws, which is easy to purchase and use in the chip packaging structure, and different specifications of screws can be used in different positions (i.e., the positions of the first connection hole and the second connection hole) of the chip packaging structure according to the design needs of the chip packaging structure, for example, M10 metric screws are used in positions with strong stress on the heat dissipation cover 42, and M6 metric screws are used in other positions, thereby further improving the connection strength and stability of the heat dissipation cover 42 and the substrate 30, and improving the stability of the chip packaging structure.
[0041] In some embodiments, the connecting fasteners 44 can be cured adhesive material. For example, after the substrate 30 is adhered to the heat dissipation cover 42 by the adhesive 41, the first connecting holes are aligned with the second connecting holes 43, the adhesive material is filled in the first connecting holes and the second connecting holes 43, and the adhesive material is cured by a curing method corresponding to the adhesive material. Specifically, when the adhesive material is photosensitive glue (ultraviolet curing glue), the photosensitive glue is cured by ultraviolet irradiation; when the adhesive material is epoxy resin, the epoxy resin is cured by heating. Using cured adhesive material as connecting fasteners can avoid the deformation of the substrate 30 caused by the pressure applied to the substrate 30 and the heat dissipation cover 42 when the threaded fasteners are screwed, thereby avoiding the performance of the chip package structure being affected.
[0042] In some embodiments, the number of the first connecting holes, the second connecting holes 43 and the connecting fasteners 44 is at least one. When the connecting fasteners 44 are multiple, the strength of the fixed connection between the heat dissipation cover 42 and the substrate 30 can be improved, and the probability of the heat dissipation cover 42 falling off can be reduced.
[0043] In some embodiments, as shown in Figure 3 The adhesive area where the heat dissipation cover 42 is adhered to the substrate 30 is a hollow rectangle, and the number of the connecting fasteners 44 is 12, and the connecting fasteners 44 are arranged at equal intervals in the adhesive area. Referring to Figure 2 and Figure 3 , the adhesive part of the heat dissipation cover 42 and the substrate 30 is the edge part of the substrate 30. For high-density packaging technology represented by chiplet packaging, as the number of chips per unit area increases, the space left for the heat dissipation cover to be attached, that is, the area of the adhesive area, decreases. Due to space limitations and increased adhesion difficulty, problems such as insufficient adhesive area and reduced adhesive strength of the heat dissipation cover may occur during use of the packaged chip. In order to improve the connection strength of the heat dissipation cover 42 fixed on the substrate 30, 12 connecting fasteners 44 are used to fix the heat dissipation cover 42 on the substrate 30, and each connecting fastener 44 passes through a first connecting hole and a second connecting hole 43. Specifically, the second connecting hole 43 can be composed of multiple holes with different diameters. For example, the second connecting hole 43 can include a through hole facing the first connecting hole and a counterbore connected to the through hole, the diameter of the through hole is the same as the diameter of the first connecting hole, and the diameter of the counterbore is greater than the diameter of the first connecting hole. Therefore, when using connecting fasteners 44 such as screws, the connecting fasteners 44 can provide pressure towards the substrate 30 through the interface between the counterbore and the through hole, thereby improving the strength of the heat dissipation cover 42 fixed on the substrate 30.
[0044] In some embodiments, as shown in Figure 4a The substrate 30 has a wiring area 301 in which substrate circuitry is disposed, and the edge position of the first connecting hole 45 is located in a non-wiring area. Since the first connecting hole 45 is formed by mechanical drilling of the substrate 30, the drilling position should be located in a non-wiring area to avoid affecting the substrate circuitry in the wiring area 301. In some specific embodiments, during the design stage of the substrate 30, a portion of the edge of the substrate 30 is reserved as a drilling area, i.e., an area in which the first connecting hole 45 is subsequently formed by drilling. The drilling area is a non-wiring area, and no substrate circuitry is designed in the non-wiring area of the substrate 30. As shown in Figure 4b The wiring area 301 can also surround the first connecting hole 45, thereby improving the utilization rate of the substrate area.
[0045] Further, in some specific embodiments, as shown in Figure 5 The substrate 30 has a multi-layer structure, and as shown, each layer of the multi-layer structure has a corresponding wiring area 301, and the first connecting hole does not penetrate the multi-layer structure. In order to achieve higher circuit density and improve the performance of the chip packaging structure, the substrate has a multi-layer structure, such as a PCB (Printed Circuit Board) laminated structure, and the wiring area of each layer inside can be the same or different depending on design requirements. Therefore, it is necessary to ensure that the first connecting hole 45 does not pass through the wiring area 301 on any layer to avoid affecting the electrical performance of the substrate 30.
[0046] In order to further improve the stability of the chip packaging structure, in some embodiments, referring to Figure 6 and Figure 7 The chip packaging structure further includes a fixing member 46, which includes an annular side wall 461 and first and second cover portions 462 and 463 located at both ends of the annular side wall 461; the first cover portion 462 covers the top surface at the edge position of the heat dissipation cover 42, and the second cover portion 463 covers the bottom of the substrate 30, so that the first and second cover portions and the annular side wall surround the outer edge of the heat dissipation cover 42 and the outer edge of the substrate 30; and a third connecting hole is formed in the first cover portion 462, and the position of the third connecting hole corresponds to the position of the second connecting hole (not shown).
[0047] The annular side wall 461 of the fixing member 46 can shield the side surface of the substrate 30 and the heat dissipation cover 42, so as to isolate the adhesive 41 from the external environment, and when the chip packaging structure is applied to a communication device with liquid immersion cooling, the adhesive 41 can be prevented from reacting with the cooling liquid to decompose or cause the thermal stability of the adhesive 41 to decrease, and the heat dissipation cover 42 can be prevented from falling off; the first covering part 462 and the second covering part 463 at both ends of the annular side wall 461 of the fixing member 46 cover the top surface at the edge of the heat dissipation cover 42 and the bottom of the substrate 30 respectively, so that when the bonding strength of the adhesive 41 decreases, the heat dissipation cover cannot fall off, and the stability of the chip packaging structure is further improved.
[0048] The mounting mode of the fixing member 46 can be that after the heat dissipation cover 42 is bonded to the substrate 30 by the adhesive 41, the fixing member 46 is mounted, the first connecting hole, the second connecting hole and the third connecting hole on the fixing member are aligned, and then the substrate 30, the heat dissipation cover 42 and the fixing member 46 are fixedly connected by the connecting fastener 44, so as to further improve the stability of the chip packaging structure. For example, the connecting fastener 44 is a threaded fastener, and the first connecting hole is a threaded hole matched with the threaded fastener, so that after the fixing member 46 is mounted, the threaded fastener is screwed into the first connecting hole, the second connecting hole and the third connecting hole by a screwdriver or the like, and the chip packaging structure is formed.
[0049] It can be seen that the chip packaging structure provided by the embodiment of the present application can be surrounded by the fixing member 46 after the heat dissipation cover 42 and the substrate 30 are surrounded, and the fixing member 46, the heat dissipation cover 42 and the substrate 30 are fixedly connected by the connecting fastener 44, the fixing member 46 can prevent the adhesive 41 from reacting with the cooling liquid, and the heat dissipation cover 42 and the substrate 30 are surrounded, so as to further improve the stability of the chip packaging structure.
[0050] The embodiment of the present application also provides a communication device, which comprises the chip packaging structure according to any one of the preceding embodiments.
[0051] Although the present application is disclosed as above, the present application is not limited thereto. Any person skilled in the art can make various modifications and changes without departing from the spirit and scope of the present application, and the protection scope of the present application should be subject to the scope defined by the claims.
Claims
1. A chip package structure, characterized by, include: A substrate, wherein a first connection hole is provided at the edge of the substrate; The heat dissipation cover has an adhesive at the bottom and a second connection hole, the position of which corresponds to the position of the first connection hole; Connecting fasteners are located within the first connecting hole and the second connecting hole to fix the heat sink cover onto the substrate; The chip is fixed on the substrate and located within the space enclosed by the heat sink and the substrate.
2. The chip package structure of claim 1, wherein, The number of the first connection hole, the second connection hole, and the connection firmware is at least one.
3. The chip package structure of claim 2, wherein, The bonding area where the heat sink cover is bonded to the substrate is a hollow rectangle, and the number of connecting fasteners is 12, which are arranged at equal intervals within the bonding area.
4. The chip package structure of claim 1, wherein, The substrate has a wiring area, and the wiring area contains substrate circuitry. The edge where the first connection hole is located is in a non-wiring area.
5. The chip package structure of claim 4, wherein, The substrate has a multilayer structure, and each layer of the multilayer structure has a corresponding wiring area. The first connection hole does not penetrate the multilayer structure.
6. The chip package structure of claim 1, wherein, Also includes: The fastener includes an annular sidewall and a first cover portion and a second cover portion located at both ends of the annular sidewall; The first covering portion covers the top surface at the edge of the heat sink cover, and the second covering portion covers the bottom of the substrate, so that the first covering portion, the second covering portion, and the annular sidewall surround the outer edge of the heat sink cover and the outer edge of the substrate; Furthermore, a third connecting hole is provided on the first covering part, and the position of the third connecting hole corresponds to the position of the second connecting hole.
7. The chip package structure of claim 1, wherein, The connecting fastener is a threaded fastener, and the first connecting hole and the second connecting hole are threaded holes that mate with the threaded fastener.
8. The chip package structure of claim 7, wherein, The threaded fastener is one or more of the following: M4, M6, M8, M10, and M12 metric screws.
9. The chip package structure of claim 7, wherein, The tightening torque of the threaded fastener is 0.1 to 2.0 N·m.
10. The chip package structure of claim 1, wherein, The connecting fastener is a cured adhesive material.
11. A communication device, characterized by Includes the chip packaging structure as described in any one of claims 1 to 10.