Surface treatment device for electronic chip processing

Abstract

The utility model relates to the field of semiconductor equipment manufacturing, and discloses a surface treatment device for electronic chip processing, which comprises a cleaning machine, the top end of the cleaning machine is fixedly connected with a placing frame, the inner wall of the placing frame is provided with an electric telescopic rod, and the movable end of the electric telescopic rod is fixedly connected with a push plate. A movable plate is in contact with the top end of the cleaning machine, a clamping groove is fixedly connected to the side wall of the movable plate, a cleaning brush is elastically connected to the inner wall of the rear end of the movable plate through a movable spring, a limiting mechanism is arranged on the outer wall of the movable plate, an upper shell is fixedly connected to the top end of the cleaning machine, and a drying assembly is arranged on the inner wall of the cleaning machine. The limiting mechanism comprises a baffle. According to the chip cleaning device, separation and superposition of the insertion block and the notch of the movable plate are utilized to enable the baffle to shield the chip, the push plate is matched to extrude the cleaning brush, impurities on the surface of the cleaning brush are cleaned, and the chip surface treatment effect is further improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of semiconductor equipment manufacturing especially relates to a surface treatment device for electronic chip processing. BACKGROUND

[0002] Electronic chip is a kind of miniaturized electronic device, usually made of semiconductor material, also known as integrated circuit (IC), and the surface treatment device for electronic chip processing refers to the device for treating the chip surface to improve its performance, improve reliability and meet the requirements of specific process in the process of electronic chip manufacturing.

[0003] During chip processing, the staff will put the chip into the corresponding clamp, then place the clamp in the cleaning solution, and the chemical solution reacts with the pollutants on the chip surface to dissolve, decompose or transform the pollutants into substances soluble in the cleaning solution, so as to achieve the purpose of removing pollutants.

[0004] In the prior art, the following defects exist: in the existing part of the equipment, the chip is soaked in the cleaning solution during cleaning, and it is difficult to completely clean the pollutants on the chip surface only by relying on the cleaning solution, and part of the pollutants still adhere to the chip surface, which cannot further improve the cleaning effect of the chip, and when the chip is cleaned, it needs to be transported to the drying room for drying, but the surface of the chip is wet, and the chip surface is easy to adhere dust or impurities during transportation, causing secondary pollution, therefore, the surface treatment device for electronic chip processing is proposed to solve the above problems. UTILITY MODEL CONTENTS

[0005] In order to make up for the above shortcomings, the utility model provides a surface treatment device for electronic chip processing, which aims at improving the problem that the cleaning effect cannot be further improved in the prior art.

[0006] In order to achieve the above purpose, the utility model adopts the following technical scheme: a surface treatment device for electronic chip processing, including cleaning machine, the top end of cleaning machine is fixedly connected with placing frame, the inner wall of placing frame is provided with electric telescopic rod, the movable end of electric telescopic rod is fixedly connected with push plate, the top end of cleaning machine is contacted with movable plate, the side wall of movable plate is fixedly connected with clamping groove, the rear end inner wall of movable plate is elastically connected with cleaning brush through movable spring, the outer wall of movable plate is provided with limiting mechanism, the top end of cleaning machine is fixedly connected with upper shell, the inner wall of cleaning machine is provided with drying assembly;

[0007] The limiting mechanism includes a baffle, the baffle is slidably connected to the outer wall of the movable plate, and the left end inner wall of the baffle is elastically connected with the plug through the moving spring.

[0008] As a further description of the above technical scheme:

[0009] The drying assembly comprises a supporting column which is connected to the inner wall of the cleaning machine in a penetrating and sliding manner, the bottom end of the supporting column is fixedly connected with a moving plate, the bottom end of the moving plate is fixedly connected with a second telescopic rod, and the bottom end inner wall of the upper shell is fixedly connected with a fan.

[0010] As a further description of the above technical solution:

[0011] The push plate is provided with a rectangular plate which is in contact with the outer wall of the cleaning brush.

[0012] As a further description of the above technical solution:

[0013] The cleaning brush is slidingly connected to the side wall of the movable plate.

[0014] As a further description of the above technical solution:

[0015] The plug block is slidingly connected to the top end of the baffle, and the plug block is clamped to the outer wall of the movable plate.

[0016] As a further description of the above technical solution:

[0017] The outer wall of the movable plate is in contact with the outer wall of the clamping groove.

[0018] As a further description of the above technical solution:

[0019] The clamping groove is provided with a penetrating opening, the cleaning brush is provided with a protruding block, and the protruding block is in contact with the inner side wall of the clamping groove.

[0020] As a further description of the above technical solution:

[0021] The moving plate is slidingly connected to the inner wall of the cleaning machine, and the second telescopic rod is arranged on the inner wall of the cleaning machine.

[0022] The utility model has the advantages of the following beneficial effects:

[0023] 1. In the utility model, the separation and coincidence of the plug block and the movable plate slot are used to shield the chip by the baffle, and the impurities on the surface of the cleaning brush are cleaned by extruding the cleaning brush with the push plate, thereby further improving the processing effect of the chip surface.

[0024] 2. In the utility model, the second telescopic rod, the supporting column, the fan and the moving plate are arranged, the cleaned chip is lifted from the cleaning liquid by the second telescopic rod, the hot air blown by the fan is used for drying the chip, the secondary pollution of the chip during transfer is avoided, and the chip processing efficiency is further improved. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1The utility model provides a kind of surface treatment device's upper shell and cleaning machine integrated display schematic diagram for electronic chip processing;

[0026] Figure 2 The utility model provides a kind of surface treatment device's upper shell, cleaning machine and placement frame section view schematic diagram for electronic chip processing;

[0027] Figure 3 The utility model provides a kind of surface treatment device's placement frame and cleaning machine display schematic diagram for electronic chip processing;

[0028] Figure 4 The utility model provides a kind of surface treatment device's movable plate and push plate display schematic diagram for electronic chip processing;

[0029] Figure 5 The utility model provides a kind of surface treatment device's baffle and movable plate exploded schematic diagram for electronic chip processing;

[0030] Figure 6 The utility model provides a kind of surface treatment device's baffle section view schematic diagram for electronic chip processing;

[0031] Figure 7 The utility model provides a kind of surface treatment device's movable plate and slot exploded section view schematic diagram for electronic chip processing.

[0032] Legend:

[0033] 1, cleaning machine;2, placement frame;3, electric telescopic rod;4, push plate;5, movable plate;6, slot;7, cleaning brush;8, movable spring;9, insert block;10, moving spring;11, baffle;12, upper shell;13, fan;14, second telescopic rod;15, moving plate;16, support column. Specific implementation

[0034] The technical scheme in the embodiments of the utility model will be described clearly and completely in conjunction with the drawings in the embodiments of the utility model, obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the person skilled in the art without creative labor belong to the scope of the utility model protection.

[0035] Refer to Figures 1-3The utility model provides an embodiment: a surface treatment device for electronic chip processing, including cleaning machine 1, the top fixed connection rest frame 2 of cleaning machine 1, the inner wall of rest frame 2 is provided with electric telescopic handle 3, and electric telescopic handle 3 is a kind of device that electric energy is converted into mechanical energy, and the rod telescopic motion is realized by motor drive, the movable end of electric telescopic handle 3 is fixedly connected with push plate 4, and the top of cleaning machine 1 is contacted with movable plate 5, and cleaning machine 1 supports movable plate 5, movable plate 5 is provided with two groups, and each group right side movable plate 5 is fixedly connected with support column 16, the side wall of movable plate 5 is fixedly connected with clamping groove 6, clamping groove 6 is same with chip, the rear end inner wall of movable plate 5 is elastically connected with cleaning brush 7 by movable spring 8, when cleaning brush 7 moves back, movable spring 8 is compressed, when reset, the elastic force of movable spring 8 is used to reset with cleaning brush 7, the outer wall of movable plate 5 is provided with limiting mechanism, the top of cleaning machine 1 is fixedly connected with upper shell 12, the inner wall of cleaning machine 1 is provided with drying assembly, limiting mechanism includes baffle 11, baffle 11 is slidably connected on the outer wall of movable plate 5, slot corresponding with baffle 11 is formed in movable plate 5, so that baffle 11 can move vertically, the left end inner wall of baffle 11 is elastically connected with plug 9 by moving spring 10, when plug 9 moves left, moving spring 10 is compressed, when reset, the elastic force of moving spring 10 is used to reset with plug 9.

[0036] Referring to Figure 2 , drying assembly includes support column 16, support column 16 is through and slidably connected on the inner wall of cleaning machine 1, slot corresponding with support column 16 is formed in cleaning machine 1, so that support column 16 can move vertically, the bottom of support column 16 is fixedly connected with moving plate 15, the bottom of moving plate 15 is fixedly connected with second telescopic rod 14, the bottom inner wall of upper shell 12 is fixedly connected with fan 13, hot air blown by fan 13 can dry the chip cleaned, moving plate 15 is slidably connected on the inner wall of cleaning machine 1, slot corresponding with moving plate 15 is formed in cleaning machine 1, so that moving plate 15 can move vertically, and second telescopic rod 14 is arranged on the inner wall of cleaning machine 1.

[0037] Referring to Figures 3-5 , rectangular plate is arranged on push plate 4, rectangular plate is in contact with the outer wall of cleaning brush 7, and rectangular plate will extrude cleaning brush 7, so that cleaning brush 7 moves back, cleaning brush 7 is slidably connected on the side wall of movable plate 5, slot is formed in movable plate 5, so that cleaning brush 7 can move back and forth, plug 9 is slidably connected on the top of baffle 11, slot corresponding with plug 9 is formed in baffle 11, so that plug 9 can move left and right.

[0038] Referring to Figures 5-7The plug 9 is clamped on the outer wall of the movable plate 5, two groups of notches corresponding to the plug 9 are formed on the movable plate 5, the plug 9 is clamped in the first notch in the initial state, the outer wall of the movable plate 5 is in contact with the outer wall of the clamping groove 6, and the movable plate 5 acts on the chip in the clamping groove 6; the clamping groove 6 is provided with a through opening, and the cleaning brush 7 is provided with a protruding block in contact with the inner side wall of the clamping groove 6.

[0039] Working principle: when the chip needs to be cleaned, the hand inserts the chip into the notch of the clamping groove 6, moves the plug 9 to the left, and the plug 9 extrudes the moving spring 10; when the plug 9 is separated from the notch on the movable plate 5, the hand moves the plug 9 downward, the plug 9 moves downward with the baffle 11, the chip is shielded, the plug 9 coincides with the second notch on the movable plate 5 at this time, the hand releases the plug 9, the plug 9 is inserted into the notch of the movable plate 5 by the elastic force of the moving spring 10, the limiting of the baffle 11 is completed, then the cleaning liquid is poured into the placing frame 2, the external electric control electric telescopic rod 3 moves the push plate 4 backward, the cleaning brush 7 moves backward and extrudes the movable spring 8 when the rectangular plate on the push plate 4 contacts and extrudes the cleaning brush 7, the cleaning brush 7 cleans the impurities and dust on the surface of the chip, when the cleaning brush 7 cleans the surface of the chip, the electric telescopic rod 3 moves the push plate 4 forward, and when the push plate 4 is no longer in contact with the cleaning brush 7, the cleaning brush 7 is moved to the initial position by the elastic force of the movable spring 8, and the chip surface is continuously cleaned during movement; when the electric telescopic rod 3 moves the push plate 4 backward again, the cleaning brush 7 continues to move along the above-mentioned track.

[0040] When the chip cleaning is completed, the external electric control second telescopic rod 14 moves the movable plate 5, the supporting column 16 and the moving plate 15 upward, when the movable plate 5 rises with the chip from the cleaning liquid, the external electric control fan 13 dries the chip, after the drying treatment is completed, the hand moves the plug 9 to the left, when the plug 9 is separated from the notch on the movable plate 5, the hand moves the plug 9 vertically, the plug 9 moves vertically with the baffle 11, when the baffle 11 does not shield the chip, the hand releases the plug 9 to clamp the plug 9 into the notch of the movable plate 5, the limiting of the baffle 11 is completed, then the worker can take out the chip by hand, and if the chip needs to be cleaned again, the above-mentioned operation steps can be continuously repeated.

[0041] Finally, it should be noted that: the above only for the preferred embodiments of the present application, and is not intended to limit the present application, although the foregoing embodiments of the present application has been described in detail, for the skilled in the art, it still can be modified, or for part of the technical features of the equivalent replacement, the spirit and principles of the present application, made any modification, equivalent replacement, improvement, etc., should be included within the scope of the present application.

Claims

1. A surface treatment apparatus for electronic chip processing, comprising a cleaning machine (1), characterized in that: The top end of the cleaning machine (1) is fixedly connected with a placing frame (2), the inner wall of the placing frame (2) is provided with an electric telescopic rod (3), the movable end of the electric telescopic rod (3) is fixedly connected with a push plate (4), the top end of the cleaning machine (1) is in contact with a movable plate (5), the side wall of the movable plate (5) is fixedly connected with a clamping groove (6), the rear end inner wall of the movable plate (5) is elastically connected with a cleaning brush (7) through an elastic spring (8), the outer wall of the movable plate (5) is provided with a limiting mechanism, the top end of the cleaning machine (1) is fixedly connected with an upper shell (12), and the inner wall of the cleaning machine (1) is provided with a drying assembly. The limiting mechanism comprises a baffle (11), the baffle (11) is slidably connected to the outer wall of the movable plate (5), and the left end inner wall of the baffle (11) is elastically connected with an insertion block (9) through a moving spring (10).

2. The surface treatment apparatus for electronic chip processing according to claim 1, characterized by: The drying assembly comprises a supporting column (16), the supporting column (16) penetrates and is slidably connected to the inner wall of the cleaning machine (1), the bottom end of the supporting column (16) is fixedly connected with a moving plate (15), the bottom end of the moving plate (15) is fixedly connected with a second telescopic rod (14), and the bottom end inner wall of the upper shell (12) is fixedly connected with a fan (13).

3. The surface treatment apparatus for electronic chip processing according to claim 1, wherein: The push plate (4) is provided with a rectangular plate, and the rectangular plate is in contact with the outer wall of the cleaning brush (7).

4. The surface treatment apparatus for electronic chip processing according to claim 1, wherein: The cleaning brush (7) is slidably connected to the side wall of the movable plate (5).

5. The surface treatment apparatus for electronic chip processing according to claim 1, wherein: The insertion block (9) is slidably connected to the top end of the baffle (11), and the insertion block (9) is clamped on the outer wall of the movable plate (5).

6. The surface treatment apparatus for electronic chip processing according to claim 1, wherein: The outer wall of the movable plate (5) is in contact with the outer wall of the clamping groove (6).

7. The surface treatment apparatus for electronic chip processing according to claim 1, wherein: A through opening is formed in the clamping groove (6), and a protruding block is arranged on the cleaning brush (7), and the protruding block is in contact with the inner side wall of the clamping groove (6).

8. The surface treatment apparatus for electronic chip processing according to claim 2, wherein: The moving plate (15) is slidably connected to the inner wall of the cleaning machine (1), and the second telescopic rod (14) is arranged on the inner wall of the cleaning machine (1).

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