Exhaust mechanism of semiconductor plastic package mold

Abstract

The utility model discloses an exhaust mechanism of a semiconductor plastic package mold, which belongs to the field of semiconductor plastic package molds, and comprises a body mechanism, a sealing mechanism is mounted at the outer end of the body mechanism, a positioning mechanism is mounted at the upper end of the body mechanism, the sealing mechanism comprises a sealing ring, and the sealing ring is connected with the positioning mechanism. The outer end of the sealing ring is movably connected with a connecting ring, clamping frames are installed at the outer end of the sealing ring, the clamping frames are symmetrically distributed, and each clamping frame is of an L-shaped structure. When the extraction base is installed, the extraction base and the sealing ring are assembled to form a sealing structure, the clamping frame is pressed in a matched mode to enable the clamping head to be connected with the clamping groove, the sealing ring and the extraction base can be stably connected, and the sealing function can effectively prevent external pollutants from entering the mold due to structure falling; and the sealing design can improve the exhaust efficiency, ensure that the gas can be smoothly exhausted without backflow, and improve the exhaust effect of the exhaust mechanism of the semiconductor plastic package mold.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor molding compound, and in particular to a venting mechanism for semiconductor molding compound. Background Technology

[0002] Semiconductor molding dies play a crucial role in the semiconductor packaging process, ensuring the reliability and performance of packaged products. They are used in fields such as electronic products and automotive electronics. When using semiconductor molding dies, the venting mechanism is of paramount importance.

[0003] Chinese patent application number CN202222978235.0 provides an exhaust mechanism for semiconductor molding compounds. This solution uses a filter and a purification plate to perform initial purification on the drawn-in air, and then uses a purifier to perform secondary purification on the drawn-in air before it is discharged. This makes the exhaust mechanism more effective at purifying harmful gases and the discharged gas safer, thus ensuring the health requirements of workers.

[0004] Existing venting mechanisms for semiconductor molding compounds have certain drawbacks. First, the venting mechanism generates pressure during the venting process, which can lead to poor sealing at the joints and prevent gas from escaping smoothly, resulting in backflow. Furthermore, insufficient sealing allows external contaminants to enter the mold, compromising the cleanliness of the mold environment and reducing its lifespan. To address these issues, we propose a new venting mechanism for semiconductor molding compounds. Utility Model Content

[0005] To overcome the shortcomings of existing technologies, the purpose of this utility model is to provide a venting mechanism for semiconductor molding compounds. By setting a sealing ring and a retainer, when the device is venting, the extraction seat is assembled with the sealing ring during installation. At this time, the sealing ring forms a sealing structure at the outer end of the extraction seat. After installation, the retainer is pressed, and the retainer, in conjunction with the force of the elastic element, deforms and drives the retainer head, which then engages with the inner end of the retainer slot. This allows for a stable connection between the sealing ring and the extraction seat, providing a sealing function between the venting mechanism structures. This effectively prevents external contaminants from entering the mold due to structural detachment, maintaining a clean environment inside the mold. Furthermore, the sealing design improves venting efficiency, ensuring that gas can be smoothly discharged without backflow, thus enhancing the venting effect of the semiconductor molding compound venting mechanism.

[0006] The above-mentioned technical objective of this utility model is achieved through the following technical solution:

[0007] A venting mechanism for a semiconductor molding compound includes a body mechanism, a sealing mechanism installed at the outer end of the body mechanism, and a positioning mechanism installed at the upper end of the body mechanism.

[0008] The sealing mechanism includes a sealing ring, a connecting ring movably connected to the outer end of the sealing ring, and a bracket installed at the outer end of the sealing ring. The brackets are symmetrically distributed and have an L-shaped structure. Each bracket has an adjustment groove at its inner end, and an elastic element is installed at the inner end of the adjustment groove.

[0009] By installing a sealing ring and a clip, the venting effect of the venting mechanism of this semiconductor molding die can be improved.

[0010] Furthermore, the outer end of the card holder is equipped with symmetrically distributed card heads, and the outer end of the card heads is provided with card slots.

[0011] By installing a clip head, which engages with the slot, the stability of the seal ring connection can be increased.

[0012] Furthermore, the slot is located at the inner end of the connecting ring.

[0013] By installing the slot, the sealing ring can be stably installed between itself and the extraction seat, while also making disassembly and maintenance more convenient.

[0014] Furthermore, the main body mechanism includes an exhaust platform, an exhaust drive component is installed at the upper end of the exhaust platform, an exhaust assembly is installed at the outer end of the exhaust drive component, and an exhaust pipe is fixedly connected to the outer end of the exhaust assembly.

[0015] By installing an exhaust platform, a support structure can be formed on the outside of the exhaust drive component. The exhaust platform also facilitates the placement of the mold, thereby increasing the structural stability of the mold's exhaust mechanism.

[0016] Furthermore, a connecting valve is installed at the bottom end of the exhaust drive component, an extraction seat is installed at the outer end of the connecting valve, and multiple air extraction components are installed at the bottom end of the extraction seat.

[0017] By installing an air extraction component, the ease of air venting and sealing of the venting mechanism of the semiconductor molding die can be increased.

[0018] Furthermore, the upper end of the exhaust platform is equipped with symmetrically distributed adjustment frames, and the outer ends of the adjustment frames are rotatably connected to a handle.

[0019] By installing an adjustment bracket, the adjustment components can achieve stable operation.

[0020] Furthermore, an adjustment component is installed on the outer end of the throttle, a movable frame is installed on the top of the adjustment component, a receiving rod is fixedly connected to the upper end of the movable frame, the receiving rod has a "Z" shaped structure, and a positioning ring is installed on the front end of the receiving rod.

[0021] By installing a movable frame and a positioning ring, the stability of the venting mechanism of this semiconductor molding die is further improved.

[0022] Furthermore, an anti-detachment ring is installed at the inner end of the positioning ring, and a guide groove is provided at the inner end of the adjusting frame.

[0023] Installing anti-slip rings can further enhance the anti-slip positioning effect of the positioning rings.

[0024] In summary, this utility model has the following beneficial effects:

[0025] 1. By setting a sealing ring and a retainer, when the device is venting, the extraction seat is assembled with the sealing ring during installation. At this time, the sealing ring forms a sealing structure at the outer end of the extraction seat. After installation, the retainer is pressed, and the retainer, in conjunction with the force of the elastic element, deforms and drives the retainer head. The retainer head is then engaged with the inner end of the slot, which allows for a stable connection between the sealing ring and the extraction seat. This provides a sealing function between the structures of the venting mechanism, effectively preventing external contaminants from entering the mold due to structural detachment, maintaining a clean environment inside the mold. The sealing design also improves venting efficiency, ensuring that gas can be smoothly discharged without backflow, thus improving the venting effect of the venting mechanism of the semiconductor encapsulation mold.

[0026] 2. By setting a slot, the slot can engage with the card head, which can make the connection between the extraction seat and the sealing ring stable. When the card holder is pressed, the card head will deform and the card head can be removed to separate it from the slot. This makes the installation of the sealing ring and the extraction seat stable and also makes disassembly and maintenance more convenient.

[0027] 3. By setting up a moving frame and positioning rings, rotating the throttle causes the adjusting assembly, consisting of a screw and a sleeve, to rotate. This adjusting assembly causes the moving frame to adjust its position, which in turn drives the positioning rings. A pair of adjustable positioning rings are positioned outside the exhaust pipe, making the exhaust pipe and exhaust assembly more stable. This makes the connection between the exhaust mechanism structures more stable, preventing loosening during exhaust and further improving the exhaust stability of the semiconductor encapsulation mold's exhaust mechanism. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the overall structure in this embodiment;

[0029] Figure 2 This is a three-dimensional structural schematic diagram of the sealing mechanism in this embodiment;

[0030] Figure 3 This is in this embodiment Figure 1 A magnified three-dimensional structural diagram of point A in the middle;

[0031] Figure 4 This is a top view of the sealing mechanism in this embodiment;

[0032] Figure 5 This is in this embodiment Figure 4 A magnified structural diagram of the plane at point B in the middle;

[0033] Figure 6 This is a three-dimensional structural diagram of the adjustment component in this embodiment.

[0034] In the diagram, 1. Main body mechanism; 101. Exhaust platform; 102. Exhaust drive component; 103. Exhaust assembly; 104. Exhaust pipe; 105. Connecting valve; 106. Extraction seat; 107. Air extraction assembly; 2. Sealing mechanism; 201. Sealing ring; 202. Connecting ring; 203. Card holder; 204. Adjustment groove; 205. Elastic element; 206. Card head; 207. Card slot; 3. Positioning mechanism; 301. Adjustment frame; 302. Rotary handle; 303. Adjustment assembly; 304. Moving frame; 305. Support rod; 306. Positioning ring; 307. Anti-detachment ring; 308. Guide groove. Detailed Implementation

[0035] The present invention will be further described in detail below with reference to the accompanying drawings.

[0036] Identical parts are indicated by the same reference numerals. It should be noted that the terms "front," "rear," "left," "right," "up," and "down" used in the following description refer to directions in the accompanying drawings, while the terms "bottom surface," "top surface," "inner," and "outer" refer to directions toward or away from the geometric center of a specific part, respectively.

[0037] Reference Figure 1-6 As shown, this is a preferred embodiment of the venting mechanism of a semiconductor encapsulation mold, which includes a main body mechanism 1, a sealing mechanism 2 installed at the outer end of the main body mechanism 1, and a positioning mechanism 3 installed at the upper end of the main body mechanism 1.

[0038] The sealing mechanism 2 includes a sealing ring 201, a connecting ring 202 is movably connected to the outer end of the sealing ring 201, and a bracket 203 is installed on the outer end of the sealing ring 201. The brackets 203 are symmetrically distributed and have an L-shaped structure. Each inner end of the bracket 203 is provided with an adjustment groove 204, and an elastic element 205 is installed on the inner end of the adjustment groove 204.

[0039] Reference Figure 2-5As shown, further, the outer end of the card holder 203 is equipped with symmetrically distributed card heads 206, and the outer end of the card head 206 is provided with a card slot 207.

[0040] Reference Figure 4-5 As shown, the card slot 207 is further located at the inner end of the connecting ring 202.

[0041] When installing the extraction seat 106, it is assembled with the sealing ring 201. At this time, the sealing ring 201 forms a sealing structure at the outer end of the extraction seat 106. After installation, the clamp 203 is pressed down. The clamp 203, in conjunction with the force of the elastic element 205, deforms and drives the clamp head 206. The clamp head 206 is then engaged with the inner end of the clamp groove 207, which allows for a stable connection between the sealing ring 201 and the extraction seat 106. The engagement of the clamp head 206 with the clamp groove 207 increases the stability of the connection between the sealing ring 201 and the clamp head 206. The snap-fit ​​design ensures a stable connection between the extraction seat 106 and the sealing ring 201. When the clip 203 is pressed, the clip head 206 deforms and can be removed to separate it from the clip groove 207. This design allows for stable installation of the sealing ring 201 and the extraction seat 106 while also facilitating disassembly and maintenance. The sealing function of the exhaust mechanism effectively prevents external contaminants from entering the mold due to structural detachment, maintaining a clean environment inside the mold. Furthermore, the sealing design improves exhaust efficiency, ensuring smooth gas discharge without backflow.

[0042] Reference Figure 1 As shown, the main body mechanism 1 further includes an exhaust platform 101, an exhaust drive 102 is installed at the upper end of the exhaust platform 101, an exhaust assembly 103 is installed at the outer end of the exhaust drive 102, and an exhaust pipe 104 is fixedly connected to the outer end of the exhaust assembly 103.

[0043] Reference Figure 1-2 As shown, further, a connecting valve 105 is installed at the bottom end of the exhaust drive 102, an extraction seat 106 is installed at the outer end of the connecting valve 105, and a plurality of extraction components 107 are installed at the bottom end of the extraction seat 106.

[0044] By installing the exhaust platform 101, a support structure can be formed on the outside of the exhaust drive component 102. The exhaust platform 101 is convenient for placing the mold. The air extraction component 107 consists of an air extraction pipe, an electric heating block, a heating wire, and an air suction nozzle. The air extraction component 107, together with the connecting valve 105 and the extraction seat 106, can extract the air from the mold sealing film, so that the upper port of the sealing film faces inward. The heating component set inside the air extraction component 107 can cause the sealing film to clump together with heat after the exhaust is completed, thereby increasing the convenience of the exhaust mechanism of the semiconductor molding die for exhaust sealing.

[0045] Reference Figure 1 and Figure 6 As shown, further, the upper end of the exhaust platform 101 is equipped with symmetrically distributed adjustment frames 301, and the outer ends of the adjustment frames 301 are rotatably connected to the handles 302.

[0046] Reference Figure 6 As shown, further, an adjustment component 303 is installed on the outer end of the throttle 302, a movable frame 304 is installed on the top of the adjustment component 303, and a support rod 305 is fixedly connected to the upper end of the movable frame 304. The support rod 305 has a "Z" shaped structure, and a positioning ring 306 is installed on the front end of each support rod 305.

[0047] Reference Figure 1-3 As shown, the inner end of the positioning ring 306 is further provided with an anti-detachment ring 307, and the inner end of the adjusting bracket 301 is provided with a guide groove 308.

[0048] By installing the adjustment bracket 301, a support structure can be formed on the outside of the adjustment component 303, allowing the adjustment component 303 to operate stably. Rotating the throttle 302 causes the adjustment component 303, which consists of a screw and a sleeve, to rotate. This causes the adjustment component 303 to adjust the position of the moving frame 304, which in turn drives the positioning ring 306. A pair of adjustable positioning rings 306 are positioned on the outside of the exhaust pipe 104, making the connection between the exhaust pipe 104 and the exhaust component 103 more stable and preventing loosening during exhaust. The anti-detachment ring 307 forms a further anti-detachment structure on the outside of the positioning ring 306, further increasing the anti-detachment positioning effect of the positioning ring 306.

[0049] Specific implementation process: When using the device, a pair of handles 302 are rotated respectively. The handles 302 can rotate the adjustment assembly 303 composed of screw and sleeve. The adjustment assembly 303 causes the moving frame 304 to adjust its position and drive the positioning ring 306. A pair of adjustable positioning rings 306 are positioned outside the exhaust pipe 104, which can make the exhaust pipe 104 and the exhaust assembly 103 more stable, so that the device structure can perform stable exhaust.

[0050] Before venting, the extraction seat 106 is assembled with the sealing ring 201 during installation. At this time, the sealing ring 201 forms a sealing structure at the outer end of the extraction seat 106. After installation, the clip 203 is pressed down. The clip 203, in conjunction with the force of the elastic element 205, deforms and drives the clip head 206. The clip head 206 is then engaged with the inner end of the slot 207, thus ensuring a stable connection between the sealing ring 201 and the extraction seat 106. The slot 207 can engage with the clip head 206, allowing the extraction seat 106 and the sealing ring to be stably connected. While ensuring a stable connection between 201, when the card holder 203 is pressed, the card head 206 deforms and can be removed to separate it from the card slot 207, thus providing a sealing function between the exhaust mechanism structures. This effectively prevents external contaminants from entering the mold due to structural detachment, keeping the mold environment clean. The sealing design also improves exhaust efficiency, ensuring that gas can be discharged smoothly without backflow. After installation, the exhaust drive 102 starts and works with the suction assembly 107 to perform exhaust work.

[0051] Finally, the air extraction assembly 107 consists of an air extraction pipe, an electric heating block, a heating wire, and an air suction nozzle. The air extraction assembly 107, together with the connecting valve 105 and the extraction seat 106, can extract the air from the mold sealing film, so that the upper port of the sealing film faces inward. The heating component installed inside the air extraction assembly 107 can cause the sealing film to clump together with heat after the exhaust is completed, thereby increasing the convenience of the exhaust mechanism of the semiconductor molding die for exhaust sealing.

[0052] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. An exhaust mechanism of a semiconductor plastic package mold characterized by comprising: Including the body mechanism (1), the outer end of the body mechanism (1) is provided with a sealing mechanism (2), and the upper end of the body mechanism (1) is provided with a positioning mechanism (3); The sealing mechanism (2) comprises a sealing ring (201), the outer end of the sealing ring (201) is movably connected with a connecting ring (202), the outer end of the sealing ring (201) is provided with a clamping frame (203), the clamping frame (203) is symmetrically distributed, the clamping frame (203) is in L-shaped structure, the inner end of the clamping frame (203) is provided with an adjusting groove (204), and the inner end of the adjusting groove (204) is provided with an elastic element (205).

2. The exhaust mechanism of a semiconductor plastic package mold according to claim 1, wherein: The outer end of the clamping frame (203) is provided with a clamping head (206) which is symmetrically distributed, and the outer end of the clamping head (206) is provided with a clamping groove (207).

3. The exhaust mechanism of a semiconductor plastic package mold according to claim 2, wherein: The clamping groove (207) is located at the inner end of the connecting ring (202).

4. The exhaust mechanism of a semiconductor plastic package mold according to claim 1, wherein: The body mechanism (1) comprises an exhaust platform (101), the upper end of the exhaust platform (101) is provided with an exhaust driving element (102), the outer end of the exhaust driving element (102) is provided with an exhaust assembly (103), and the outer end of the exhaust assembly (103) is fixedly connected with an exhaust pipe (104).

5. The exhaust mechanism of a semiconductor plastic package mold according to claim 4, wherein: The bottom end of the exhaust driving element (102) is provided with a connecting valve (105), the outer end of the connecting valve (105) is provided with a suction seat (106), and the bottom end of the suction seat (106) is provided with a plurality of suction assemblies (107).

6. The exhaust mechanism of a semiconductor plastic package mold according to claim 4, wherein: The upper end of the exhaust platform (101) is provided with an adjusting frame (301) which is symmetrically distributed, and the outer end of the adjusting frame (301) is rotatably connected with a rotating handle (302).

7. The exhaust mechanism of a semiconductor plastic package mold according to claim 6, wherein: The outer end of the rotating handle (302) is provided with an adjusting assembly (303), the top end of the adjusting assembly (303) is provided with a moving frame (304), the upper end of the moving frame (304) is fixedly connected with a receiving rod (305), the receiving rod (305) is in "Z" shape structure, and the front end of the receiving rod (305) is provided with a positioning ring (306).

8. The exhaust mechanism of a semiconductor plastic package mold according to claim 7, wherein: The inner end of the positioning ring (306) is provided with an anti-dropping ring (307), and the inner end of the adjusting frame (301) is provided with a guide groove (308).

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