Circuit board potting mold convenient to demold

Abstract

The utility model discloses a circuit board potting mould convenient for demoulding, which comprises a mould body and an upper cover arranged on the mould body, the mould body is provided with a plurality of potting cavities arranged in an array, one side of the upper cover far away from the mould body is provided with a plurality of potting pipes, each potting pipe is communicated with the potting cavity, and the potting cavities are communicated with the potting pipes. And the demolding assembly is arranged on the mold body and is used for demolding the circuit board after the encapsulation is completed. According to the utility model, through the arrangement of the demolding assembly, under the cooperation effect of the plugging assembly, the driving assembly and the moving assembly, the demolding convenience of the circuit board is improved, and compared with the existing ejector pin demolding operation, demolding protection can be formed on the encapsulated circuit board, so that the risk of deformation or indentation on the encapsulated surface of the circuit board is reduced, and the product quality is improved. Therefore, the embedding quality of the circuit board is improved.

Description

Technical Field

[0001] This utility model relates to the field of circuit board manufacturing technology, specifically to a circuit board encapsulation mold that is easy to demold. Background Technology

[0002] After circuit boards for smart earphones, smart wearables, and other small smart products are encapsulated using potting molds, the small size and complex structure of these circuit boards mean that the molds are too tightly fitted to the circuit boards to ensure precision. This results in tiny gaps being filled by the potting material, leading to high friction during demolding. While existing technologies use ejector pins for demolding, which can achieve the demolding operation, the pressure from the ejector pins can easily cause deformation or indentations on the potted surface of the circuit board, thus affecting the quality of the potting process.

[0003] Therefore, there is an urgent need for a circuit board encapsulation mold that is easy to demold to solve the above problems. Utility Model Content

[0004] To achieve the above objectives, the present invention provides the following technical solution: a circuit board potting mold that facilitates demolding, comprising a mold body and an upper cover disposed on the mold body, wherein the mold body has a plurality of potting cavities arranged in an array, and the upper cover has a plurality of potting tubes disposed on the side away from the mold body, wherein each potting tube is connected to a potting cavity, and further comprising a demolding component disposed on the mold body for demolding the circuit board after potting;

[0005] The mold body has an installation cavity, the demolding component is disposed in the installation cavity, and each of the filling cavities has multiple through holes, each of the through holes being configured to communicate with the installation cavity;

[0006] The demolding assembly includes multiple square tubes fixedly connected between two opposing inner walls of the mounting cavity. The end of each square tube near the top cover is flush with the filling cavity. Each square tube is provided with a sealing component for sealing the tube opening. The mounting cavity is provided with a driving component for driving each sealing component. Multiple connecting tubes are provided inside the mounting cavity. Each connecting tube is fixedly connected to an mounting tube on the side near the square tube. The end of each mounting tube away from the connecting tube is connected to the square tube.

[0007] The mold body is equipped with an air supply pipe. One end of the air supply pipe is connected to an external high-pressure air pump, and the other end of the air supply pipe is located inside the mounting cavity. Each connecting pipe is connected to the side wall of the air supply pipe.

[0008] The sealing assembly includes a sealing column slidably connected to a square tube. A flexible rubber column is fixedly connected to the end of the sealing column away from the top cover. The end of the flexible rubber column away from the sealing column is connected to the bottom wall of the square tube.

[0009] The drive assembly includes a U-shaped plate slidably connected to one side of the square tube. Drive rods are fixedly connected to opposite ends of the U-shaped plate. The sealing column has inclined surfaces on both sides near the two drive rods. The opposite ends of the two drive rods are slidably connected to the two inclined surfaces respectively.

[0010] The mold body is provided with a moving assembly for moving each U-shaped plate. The moving assembly includes multiple T-shaped rods fixedly connected to two opposing inner walls of the mounting cavity. Each T-shaped rod on the same side is slidably connected to a moving plate. The side of two moving plates that are close to each other is connected to each adjacent U-shaped plate through multiple fixed rods. Each U-shaped plate is connected to each other through a moving rod.

[0011] The mold body is equipped with a push rod motor on its side wall, and the output end of the push rod motor is connected to one of the two moving plates.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] This invention, through the setting of a demolding component, with the cooperation of a sealing component, a driving component, and a moving component, not only improves the convenience of demolding the circuit board, but also provides demolding protection for the potted circuit board compared to existing ejector pin demolding operations. This reduces the risk of deformation or indentation on the potted surface of the circuit board, thereby improving the quality of circuit board potting. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0015] Figure 2 This is a schematic diagram of the internal structure of the mold body of this utility model;

[0016] Figure 3 This is a schematic diagram of the internal structure of the demolding component of this utility model;

[0017] Figure 4 This is a schematic diagram of the structure of the mobile component of this utility model;

[0018] Figure 5 This is a schematic diagram of the sealing component and driving component of this utility model.

[0019] In the diagram: 101, mold body; 102, top cover; 103, filling tube; 104, filling cavity; 201, mounting cavity; 202, through hole; 203, square tube; 204, connecting tube; 205, gas supply tube; 206, mounting tube; 301, sealing column; 302, flexible rubber column; 401, U-shaped plate; 402, drive rod; 403, inclined plane; 501, T-shaped rod; 502, moving plate; 503, fixed rod; 504, moving rod; 505, push rod motor. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] Example 1

[0022] Please see Figures 1-5 The diagram shows a circuit board potting mold that facilitates demolding, including a mold body 101 and a top cover 102 disposed on the mold body 101. The mold body 101 has a plurality of potting cavities 104 arranged in an array. The top cover 102 has a plurality of potting tubes 103 on the side away from the mold body 101. Each potting tube 103 is connected to the potting cavity 104. The mold body 102 also includes a demolding component disposed on the mold body 101 for demolding the circuit board after potting.

[0023] The mold body 101 has an installation cavity 201, the demolding component is disposed in the installation cavity 201, and each potting cavity 104 has multiple through holes 202, each through hole 202 being configured to communicate with the installation cavity 201.

[0024] The demolding assembly includes multiple square tubes 203 fixedly connected between two opposing inner walls of the mounting cavity 201. The end of each square tube 203 near the top cover 102 is flush with the filling cavity 104. Each square tube 203 is provided with a sealing component for sealing the tube opening. The mounting cavity 201 is provided with a driving component for driving each sealing component. Multiple connecting tubes 204 are provided inside the mounting cavity 201. Each connecting tube 204 is fixedly connected to a mounting tube 206 on the side near the square tube 203. The end of each mounting tube 206 away from the connecting tube 204 is connected to the square tube 203.

[0025] It should be noted that by setting up the demolding component, with the cooperation of the sealing component, driving component and moving component, the convenience of demolding the circuit board is improved. Compared with the existing ejector pin demolding operation, it can form demolding protection for the potted circuit board, thereby reducing the risk of deformation or indentation on the potted surface of the circuit board, thus improving the quality of circuit board potting.

[0026] Please see Figure 3 The mold body 101 shown in the figure is provided with an air supply pipe 205. One end of the air supply pipe 205 is connected to an external high-pressure air pump, and the other end of the air supply pipe 205 is located in the mounting cavity 201. Each connecting pipe 204 is connected to the side wall of the air supply pipe 205.

[0027] It should be noted here that the high-pressure air pump and the air supply pipe 205 facilitate the delivery of external air to the square pipe 203.

[0028] Please see Figure 5 The sealing assembly shown in the figure includes a sealing post 301 that is slidably connected to the square tube 203. A flexible rubber post 302 is fixedly connected to one end of the sealing post 301 away from the upper cover 102. The other end of the flexible rubber post 302 away from the sealing post 301 is connected to the bottom wall of the square tube 203.

[0029] It should be noted here that the sealing component is used to seal the square tube 203 during the circuit board potting process, thereby preventing the potting adhesive from flowing into the mounting cavity 201.

[0030] Please see Figure 4 and Figure 5 The driving assembly shown in the figure includes a U-shaped plate 401 slidably connected to one side of the square tube 203. The two opposite ends of the U-shaped plate 401 are fixedly connected to driving rods 402. The sealing column 301 has inclined surfaces 403 on both sides near the two driving rods 402. The opposite ends of the two driving rods 402 are slidably connected to the two inclined surfaces 403 respectively.

[0031] It should be noted here that the configuration of the drive component facilitates the movement of the sealing column 301 closer to or further away from the filling cavity 104.

[0032] Working principle: When potting circuit boards of smart earphones, smart wearables and other smart small products, multiple circuit boards are first placed in the potting cavity 104 of the mold body 101 and the top cover 102 is closed. Then, a certain amount of potting glue is injected into the potting cavity 104 through the potting tube 103. Then, wait or use appropriate treatment methods to allow the potting glue to cure, thereby completing the potting operation of the circuit board. This gives the circuit board waterproof, moisture-proof, salt spray-proof, mildew-proof, shock-proof and impact-resistant properties.

[0033] After the circuit board is potted, the moving component is used to move each U-shaped plate 401. During the movement of each U-shaped plate 401, the two opposing drive rods 402 will move synchronously. During the synchronous movement of the two drive rods 402, under the interaction force between the drive rods 402 and the inclined surface 403 and the guiding action of the square tube 203, the sealing column 301 will be moved away from the circuit board, thereby releasing the seal on the opening of the mounting tube 206.

[0034] After removing the seal on the port of mounting pipe 206, the external high-pressure air pump is started, allowing high-pressure airflow to flow from the air supply pipe 205 into the connecting pipe 204, and finally to the square pipe 203 through each mounting pipe 206 (the air pressure in the air supply pipe 205 is greater than or equal to the sum of the air pressures in each mounting pipe 206, so that the air pressure flowing into each square pipe 203 is equal). When the high-pressure airflow flows into the square pipe 203, the pushing action of the high-pressure airflow can generate an outward thrust on the potted circuit board, thereby realizing the demolding operation of the circuit board. This improves the convenience of demolding the circuit board, and compared with the existing ejector pin demolding operation, it can form a demolding protection for the potted circuit board, thereby reducing the risk of deformation or indentation on the potted surface of the circuit board, thus improving the quality of circuit board potting.

[0035] Example 2

[0036] Please see Figure 3 and Figure 4 This embodiment further illustrates Example 1. The mold body 101 shown in the figure is provided with a moving assembly for moving each U-shaped plate 401. The moving assembly includes a plurality of T-shaped rods 501 fixedly connected to two opposing inner walls of the mounting cavity 201. Each T-shaped rod 501 located on the same side is slidably connected to a moving plate 502. The side of the two moving plates 502 that are close to each other is connected to each adjacent U-shaped plate 401 through a plurality of fixed rods 503. Each adjacent U-shaped plate 401 is connected to each other through a moving rod 504. A push rod motor 505 is provided on the side wall of the mold body 101. The output end of the push rod motor 505 is connected to one of the two moving plates 502.

[0037] It should be noted here that: by setting up the moving components, the push action of the push rod motor 505 and the guiding action of each T-shaped rod 501 are used to make each U-shaped plate 401 move synchronously.

[0038] It is worth noting that the model of the push rod motor 505 is DT-1KN. As it is existing technology, its specific structure and working principle have been mastered by those in the field, and will not be elaborated on here.

[0039] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A circuit board potting mold facilitating demolding, comprising: a mold body (101) and an upper cover (102) arranged on the mold body (101), the mold body (101) is provided with a plurality of potting cavities (104) arranged in an array, and the upper cover (102) is provided with a plurality of potting pipes (103) on the side away from the mold body (101), each potting pipe (103) is arranged in communication with the potting cavity (104); characterized in that it further comprises: a demolding assembly arranged on the mold body (101) for demolding the circuit board after potting is completed; the mold body (101) is provided with a mounting cavity (201), the demolding assembly is arranged in the mounting cavity (201), each potting cavity (104) is provided with a plurality of through holes (202), and each through hole (202) is arranged in communication with the mounting cavity (201); the demolding assembly comprises a plurality of square tubes (203) fixedly connected between the opposite two inner walls of the mounting cavity (201), each square tube (203) is arranged flush with the potting cavity (104) at the end close to the upper cover (102), each square tube (203) is provided with a plugging assembly for plugging the tube opening, the mounting cavity (201) is provided with a driving assembly for driving each plugging assembly, and the mounting cavity (201) is provided with a plurality of connecting pipes (204), each connecting pipe (204) is fixedly connected with a mounting pipe (206) on the side close to the square tube (203), and each mounting pipe (206) is connected with the square tube (203) at the end away from the connecting pipe (204).

2. The circuit board potting mold with easy demolding according to claim 1, characterized in that: The mold body (101) is provided with a gas conveying pipe (205), one end of the gas conveying pipe (205) is connected with an external high-pressure gas pump, the other end of the gas conveying pipe (205) is located in the mounting cavity (201), and each connecting pipe (204) is connected with the side wall of the gas conveying pipe (205).

3. The circuit board potting mold with easy demolding according to claim 1, characterized in that: The plugging assembly comprises a plugging column (301) slidably connected to the square tube (203), the plugging column (301) is fixedly connected with a flexible rubber column (302) at the end away from the upper cover (102), and the flexible rubber column (302) is connected with the bottom wall of the square tube (203) at the end away from the plugging column (301).

4. The circuit board potting mold with easy demolding according to claim 3, characterized in that: The driving assembly comprises a U-shaped plate (401) slidably connected to one side of the square tube (203), the U-shaped plate (401) is fixedly connected with a driving rod (402) at opposite ends, the plugging column (301) is provided with an inclined surface (403) on the two sides close to the two driving rods (402), and the opposite ends of the two driving rods (402) are slidably connected to the two inclined surfaces (403), respectively.

5. A circuit board potting mold facilitating demolding according to claim 4, characterized in that: The mold body (101) is provided with a moving assembly for moving each U-shaped plate (401), the moving assembly comprises a plurality of T-shaped rods (501) fixedly connected to opposite two inner walls of the installation cavity (201), each T-shaped rod (501) located at the same side is slidably connected with a moving plate (502), and two moving plates (502) are connected with adjacent each U-shaped plate (401) through a plurality of fixed rods (503) on the side close to each other.

6. A circuit board potting mold facilitating demolding according to claim 5, characterized in that: The side wall of the mold body (101) is provided with a push rod motor (505), and the output end of the push rod motor (505) is connected with one of the two moving plates (502).

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