High-speed circuit signal test module
By using a high-speed signal chip controlled by MCU and FPGA circuits to generate and analyze PRBS signals, the problems of complex and costly high-speed circuit signal testing are solved. This enables low-jitter, high-precision signal testing, simplifies the operation process, and reduces costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-13
- Publication Date
- 2026-03-31
AI Technical Summary
Existing technologies for testing high-speed circuit signals are complex and costly, making it difficult to meet the needs of rapid testing.
A high-speed signal chip controlled by MCU and FPGA circuits generates and analyzes PRBS signals, which are transmitted through the MCIO high-speed signal connector. Combined with an LCD display, parameters can be easily set and results can be viewed.
It achieves low jitter and high-precision signal generation and analysis, reduces testing costs, improves testing efficiency, and covers the frequency band from 2.5Gbps to 32Gbps, meeting the testing needs of high-speed circuit signals.
Smart Images

Figure CN224066938U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to electronic testing technical field, concretely relates to a high speed circuit signal test module. BACKGROUND
[0002] With the rapid development of information technology, high speed circuit signal plays a vital role in communication, data processing and other fields. However, the transmission quality of high speed signal is often affected by various factors, such as cable loss, impedance mismatch, electromagnetic interference, etc. Therefore, it is particularly important to accurately and efficiently test high speed circuit signal.
[0003] The traditional test method needs expensive test instruments such as vector network analyzer, high speed oscilloscope, and the test cost is high, the test time is long, and it is difficult to meet the rapid test demand of high speed cable, PCBA production. Therefore, developing a kind of high speed circuit signal test module capable of generating high frequency PRBS signal, simple test process and high test precision has important significance for improving the test efficiency of high speed circuit signal and reducing the test cost. UTILITY MODEL CONTENTS
[0004] In view of the deficiencies in the prior art, the technical problem to be solved by the utility model is to provide a high speed circuit signal test module to solve the problems of complex test signal test process and high test cost in the prior art.
[0005] To solve the above technical problems, the utility model realizes the following scheme: the utility model provides a high speed circuit signal test module, which comprises:
[0006] A control unit, which comprises an MCU and an FPGA circuit electrically connected with the MCU, wherein the MCU is provided with a plurality of function interfaces;
[0007] A high speed signal chip connected with the MCU, which has two units inside, one of which is a signal generating unit, and the other is a signal analysis unit, wherein the signal generating unit is used to generate PRBS signal, and the signal analysis unit is used to analyze the received response signal;
[0008] A plurality of test interface units connected with the high speed signal chip, used to transmit the PRBS signal to the object to be tested and receive the response signal output by the object to be tested.
[0009] Further, the high-speed signal chip has complete high-speed signal generation and receiving circuit inside, wherein the RX signal is a receiving signal of the high-speed signal, the TX signal is a sending signal of the high-speed signal, the RX signal and the TX signal are sent and received in the form of differential pairs, each chip has multiple RX differential pair signals and TX differential pair signals in equal number with the RX differential pair signals.
[0010] Further, the PRBS signal is between 2.5Gbps and 32Gbps in speed and contains values at both ends.
[0011] Further, the multiple functional interfaces at least include a GPIO interface, an analog sampling IO interface, a frequency test interface and an I2C test interface.
[0012] Further, the test interface unit adopts an MCIO high-speed signal connector.
[0013] Further, the model of the MCIO high-speed signal connector is G97R22312HR.
[0014] Further, the display unit is electrically connected with the MCU display unit.
[0015] Further, the display unit adopts an LCD display screen.
[0016] Compared with the prior art, the utility model has the beneficial effects that:
[0017] 1. The high-speed circuit signal test module can ensure that the generated signal has low jitter, high precision and programmability, and solves the problems of complex high-speed signal test process and high test cost in the prior art.
[0018] 2. The high-speed circuit signal test module adopts the MCIO high-speed signal connector, and can ensure stable transmission and reception of the signal.
[0019] 3. The high-speed circuit signal test module can realize accurate analysis of the high-speed signal, and performs error code analysis on the received signal, and fails the test if the error code rate exceeds the set error code rate.
[0020] 4. The high-speed circuit signal test module can generate PRBS signals in the range of 2.5Gbps to 32Gbps, covering the main frequency band of the current high-speed circuit signal and meeting the demand of high-speed circuit signal test.
[0021] 5. The test method is simple and easy to operate, and the user only needs to set parameters and view results through a graphical user interface, without complex operation steps, thereby improving the test efficiency. BRIEF DESCRIPTION OF DRAWINGS
[0022] Figure 1 The utility model discloses a high speed circuit signal test module principle block diagram.
[0023] Figure 2 The utility model discloses an MCU circuit diagram.
[0024] Figures 3-10 Respectively Figure 2 The enlarged view of A area, B area, C area, D area, F area, G area, H area.
[0025] Figure 11 It is the circuit diagram of high speed signal chip Part A part circuit diagram.
[0026] Figure 12 It is the circuit diagram of high speed signal chip Part B part circuit diagram.
[0027] Figure 13 It is the left area circuit amplification drawing of test interface unit of the utility model.
[0028] Figure 14 It is the right area circuit amplification drawing of test interface unit of the utility model.
[0029] Figure 15 It is the display unit circuit diagram of the utility model. DETAILED DESCRIPTION
[0030] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model, so that the advantages and characteristics of the utility model can be more easily understood by those skilled in the art, and the protection scope of the utility model can be more clearly and definitely defined. Obviously, the described embodiments of the utility model are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.
[0031] In addition, the technical features involved in different embodiments of the utility model described below can be combined with each other as long as there is no conflict.
[0032] Embodiment 1: the specific structure of the utility model is as follows:
[0033] Please refer to the attached Figures 1-15 The utility model discloses a high speed circuit signal test module, including control unit, high speed signal chip, a plurality of test interface unit.
[0034] The control unit includes an MCU and an FPGA circuit electrically connected to the MCU. The MCU has multiple functional interfaces; these interfaces include at least a GPIO interface, an analog sampling I / O interface, a frequency test interface, and an I2C test interface. The MCU can control a high-speed signal chip to initiate and receive signals. Figure 3 As shown, pins 23-26 of the MCU and pins 29-32 of the MCU are both ADC pins, and the ADC provides analog sampling functionality. Figures 4-5 , Figure 7 The GPIO pin provides GPIO functionality. For example... Figure 7 As shown, pins 40, 42, 44, and 45 of the MCU are CAPTURE_CLK pins, which provide sampling functionality for frequency testing. Figure 6 As shown, pins 60-62 of the MCU are DAC pins, which provide analog output.
[0035] The MCU used is an STM32F407 processor.
[0036] FPGA (Field-Programmable Gate Array) is a product of further development based on programmable devices such as PAL, GAL, and CPLD. It emerged as a semi-custom circuit in the field of Application-Specific Integrated Circuits (ASICs), solving the shortcomings of custom circuits while overcoming the limitation of the limited gate count of original programmable devices.
[0037] This high-speed signal chip internally comprises two units: a signal generation unit and a signal analysis unit. The signal generation unit generates a PRBS signal, which has a speed between 2.5Gbps and 32Gbps and includes values at both ends. The signal analysis unit analyzes the received response signal. The signal generation unit employs advanced digital signal processing technology to ensure the generated signal has low jitter, high accuracy, and programmability. The signal analysis unit analyzes the received response signal, including measuring key parameters such as timing jitter, amplitude consistency, frequency response, and phase characteristics. The high-speed signal chip's signal analysis unit uses advanced signal processing algorithms to achieve accurate analysis of high-speed signals. Bit error rate analysis is performed on the received signal; if the bit error rate exceeds the set value, the test fails.
[0038] The internal of the high-speed signal chip has complete high-speed signal generation and receiving circuit, wherein, the RX signal is a receiving signal of the high-speed signal, the TX signal is a sending signal of the high-speed signal, the RX signal and the TX signal are sent and received in the form of differential pairs, each chip has multiple pairs of RX differential pair signals and TX differential pair signals in equal number with the RX differential pair signals.
[0039] A plurality of test interface units are connected with the high-speed signal chip, for transmitting the PRBS signal to the object to be tested (such as a high-speed signal cable, a PCBA, etc.) and receiving the response signal output by the object to be tested. The test interface unit adopts an MCIO high-speed signal connector to ensure stable transmission and reception of the signal. The model of the MCIO high-speed signal connector is G97R22312HR. The test interface unit of the utility model supports PCIE5.0 transmission output at most, the RX signal and the TX signal are sent and received in the form of differential pairs, each MCIO connector has 8 pairs of RX differential pair signals and 8 pairs of TX differential pair signals. Each 4 MCIO connectors correspond to one HS_IC.
[0040] The high-speed circuit signal test module of the utility model further includes a display unit electrically connected with the MCU display unit. The display unit adopts an LCD display screen. The LCD display screen on the device is used for displaying the working state of the control test module. The control and display unit adopts an intuitive graphical user interface, which facilitates the user to set parameters and view results. The display screen is connected with the high-speed control board through a serial port, and the MCU outputs the relevant information of the test to the display screen through the serial port.
[0041] The following are the test steps of the high-speed circuit signal test module of the utility model:
[0042] Step one, set the test parameters: the host computer sends control instructions to the control unit through the communication bus (serial port or RS485 interface), and the control unit controls the high-speed chip to generate the required frequency, waveform type, test duration and other parameters.
[0043] Step two, generate test signal: the signal generator unit generates PRBS signal according to the set parameters, and transmits it to the object to be tested through the test interface unit.
[0044] Step three, receive and analyze the response signal: the test interface unit sends and receives the response signal output by the object to be tested, and transmits it to the signal analysis unit for analysis.
[0045] Step four, display the test result: the signal analysis unit transmits the analysis result to the LCD display screen of the control and display unit, and the user can view the test result through the graphical user interface.
[0046] In summary, this high-speed circuit signal testing module ensures that the generated signals have low jitter, high precision, and programmability, solving the problems of complex testing processes and high costs in existing high-speed signal testing technologies. This high-speed circuit signal testing module uses an MCIO high-speed signal connector, ensuring stable signal transmission and reception. It enables precise analysis of high-speed signals, performing bit error rate analysis on received signals; if the bit error rate exceeds the set value, the test fails. This high-speed circuit signal testing module can generate PRBS signals in the range of 2.5Gbps to 32Gbps, covering the main frequency bands of current high-speed circuit signals and meeting the needs of high-speed circuit signal testing. The testing method of this invention is simple and easy to implement; users only need to set parameters and view results through a graphical user interface, eliminating the need for complex operation steps and improving testing efficiency.
[0047] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural or procedural transformations made based on the contents of the present utility model specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present utility model.
Claims
1. A high speed circuit signal test module, characterized by, The application relates to a high-speed signal test device, which comprises the following: a control unit, which comprises an MCU and an FPGA circuit electrically connected with the MCU, wherein the MCU is provided with a plurality of function interfaces; a high-speed signal chip connected with the MCU, which has two units inside, one of which is a signal generation unit and the other is a signal analysis unit, wherein the signal generation unit is used for generating a PRBS signal, and the signal analysis unit is used for analyzing a received response signal; a plurality of test interface units connected with the high-speed signal chip, which are used for transmitting the PRBS signal to an object to be tested and receiving a response signal output by the object to be tested.
2. The high-speed circuit signal test module of claim 1, wherein, The high-speed signal chip has complete high-speed signal generation and receiving circuits inside, wherein an RX signal is a high-speed signal receiving signal, a TX signal is a high-speed signal transmitting signal, the RX signal and the TX signal are transmitted and received in the form of a differential pair, each chip has a plurality of pairs of RX differential pair signals and a same number of TX differential pair signals as the RX differential pair signals.
3. The high-speed circuit signal test module of claim 1, wherein, The PRBS signal is between 2.5 Gbps and 32 Gbps in speed and contains values at two ends.
4. The high-speed circuit signal test module of claim 1, wherein, The plurality of function interfaces at least comprise a GPIO interface, an analog sampling IO interface, a frequency test interface and an I2C test interface.
5. The high-speed circuit signal test module of claim 1, wherein, The test interface unit adopts an MCIO high-speed signal connector.
6. The high-speed circuit signal test module of claim 5, wherein, The model of the MCIO high-speed signal connector is G97R22312HR.
7. The high-speed circuit signal test module of claim 1, wherein, The application further comprises a display unit electrically connected with an MCU display unit.
8. The high-speed circuit signal test module of claim 7, wherein, The display unit adopts an LCD display screen.