Server

By using cable management brackets with support feet in the server, and utilizing hydrophobic elements to isolate the cables from the circuit boards, the electrochemical corrosion problem caused by contact between the cables and the circuit boards is solved, thus improving the server's corrosion resistance and stability.

CN224068245UActive Publication Date: 2026-03-31XFUSION DIGITAL TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-01-02
Publication Date
2026-03-31

AI Technical Summary

Technical Problem

The limited space between the server's cables and the circuit board makes it easy for the cables to come into contact with components such as resistors and capacitors on the circuit board. In environments with humidity, heat, or corrosive gases, this can easily lead to corrosion and failure of the circuit board.

Method used

The cable management bracket features a support foot design with a hydrophobic section. This section helps to keep the cables and circuit boards spaced apart, preventing moisture buildup and reducing the likelihood of condensation. The support foot can be moved or fixed to the circuit board to physically isolate the cables from the board.

Benefits of technology

It effectively avoids electrochemical corrosion caused by contact between wires and circuit boards, reduces condensation formation, and improves the stability and corrosion resistance of wires and circuit boards.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a server. The server comprises a circuit board, a wire rod and a wire arrangement frame. The wire arranging frame comprises a wire arranging buckle and supporting legs. The wire arrangement buckle is provided with a limiting area used for fixing wires. The supporting leg is connected to the wire arrangement buckle. The supporting legs are provided with hydrophobic parts. The hydrophobic parts are at least located on the surfaces of the ends, away from the limiting areas, of the supporting legs. The supporting legs are used for being fixed to the circuit board through the hydrophobic parts or movably placed on the circuit board, so that the wire rods and the circuit board are arranged at intervals. The hydrophobic part is located between the wire rod and the circuit board. According to the server provided by the invention, the possibility of corrosion between the wire rod and the circuit board can be reduced.
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Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of servers, in particular to a server. BACKGROUND

[0002] The space between the wire and the circuit board of the server is limited, so that the wire is easy to contact the resistance, capacitor and other devices on the circuit board. In the humid, corrosive gas and other working environments, the resistance, capacitor and other devices on the circuit board are easy to corrode and fail. CONTENT OF THE UTILITY MODEL

[0003] Therefore, the server provided by the embodiments of the present application can reduce the possibility of corrosion between the wire and the circuit board.

[0004] An embodiment of the present application provides a server. The server comprises a circuit board, a wire and a wire management frame. The wire management frame comprises a wire management buckle and a supporting leg. The wire management buckle has a limiting area for fixing the wire. The supporting leg is connected to the wire management buckle. The supporting leg has a hydrophobic part. The hydrophobic part is located at least on the surface of the end of the supporting leg away from the limiting area. The supporting leg is used to be fixed to the circuit board through the hydrophobic part or to be placed on the circuit board movably, so that the wire is arranged spaced apart from the circuit board. And the hydrophobic part is located between the wire and the circuit board.

[0005] In the scheme, the wire can be fixed to the limiting area of the wire management buckle. The supporting leg supports the wire by supporting the wire management buckle, so that the wire and the circuit board are physically isolated, which is beneficial to avoid the wire from contacting the resistance, capacitor and other devices of the circuit board to cause electrochemical corrosion. The end of the supporting leg away from the limiting area is supported on the circuit board to support the wire. The surface of the end of the supporting leg away from the limiting area is the hydrophobic part, which is beneficial to prevent the contact between the supporting leg and the circuit board from becoming a moisture gathering point and reduce the occurrence of condensation, thereby reducing the possibility of corrosion of the circuit board caused by condensation.

[0006] In some embodiments of the present application, the supporting leg comprises an inner core and a covering layer. The inner core is connected to the wire management buckle. The covering layer covers at least the end of the inner core away from the limiting area. The covering layer is the hydrophobic part.

[0007] The hydrophobic part covers the inner core as a covering layer. The inner core and the covering layer can be produced separately and then combined, which is beneficial to plan the production of the inner core and the covering layer according to needs.

[0008] In some embodiments of the present application, the surface and the inside of at least the end of the supporting leg away from the limiting area are an integrally formed structure.

[0009] The hydrophobic part is manufactured as the supporting leg by using the integrally formed manner, which is beneficial to simplify the production process of the supporting leg.

[0010] In some embodiments of the present application, the support leg comprises a first support section and a second support section. The first support section is a hydrophobic part at least away from the surface of the limiting area. The second support section is connected to the cable management buckle. The first support section and the second support section are movably connected to enable the support leg to be telescopic deformed.

[0011] The relative movement of the first support section and the second support section enables the support leg to be telescopic, so as to change the height at which the cable management buckle and the wire are supported by the support leg, so as to change the space occupied by the cable management rack when in use, and facilitate to increase the use range of the cable management rack.

[0012] In some embodiments of the present application, the first support section is provided with a moving channel and a plurality of positioning holes. The plurality of positioning holes are in communication with the moving channel respectively. The plurality of positioning holes are distributed along the extension direction of the moving channel. The second support section is arranged in the moving channel. The support leg further comprises a limiting part and an elastic member. The limiting part is connected to the elastic member. The elastic member is connected to the second support section. The elastic member is used to apply an elastic force to the limiting part to move the limiting part to the positioning hole.

[0013] The elastic member can push the limiting part to move to the positioning hole, and by switching the positioning hole to which the limiting part is positioned, the second support section is relatively fixed to different positions of the first support section, so as to adjust the support height of the support leg. When the second support section moves in the moving channel, the elastic member can drive the limiting part to be separated from the positioning hole by elastic deformation, so as to follow the movement of the second support section. After the second support section is moved to the position, the limiting part is reset under the action of the elastic force, so as to extend into the corresponding positioning hole, so as to fix the second support section and the first support section.

[0014] In some embodiments of the present application, the support leg is provided with a support foot. The support foot is located at one end of the support leg away from the limiting area. The support foot is a spherical structure. The hydrophobic part is at least located on the surface of the support foot of the support leg.

[0015] The support leg is supported on the circuit board through the spherical support foot, which facilitates the free movement of the support foot relative to the circuit board, so as to facilitate the rapid change of the setting position of the support leg and improve the application range of the cable management rack.

[0016] In some embodiments of the present application, the support leg is provided with a support foot. The support foot is located at one end of the support leg away from the limiting area. The support foot is a cylindrical structure. The hydrophobic part is at least located on the surface of the support foot of the support leg.

[0017] In some embodiments of the present application, the support leg is provided with a support foot. The circuit board is provided with a jack. The support foot is inserted into the jack.

[0018] The support leg is inserted into the jack of the circuit board, so that the cable management rack can be fixed to the circuit board, thereby improving the stability of the wire support.

[0019] The support feet are supported on the circuit board by cylindrical feet, which makes it easy to insert and connect the feet to the circuit board, thereby improving the stability of the support feet.

[0020] In some embodiments of this application, multiple support feet are provided. The multiple support feet are respectively connected to the cable management clips and are spaced apart.

[0021] The multiple spaced support feet provide multi-point support for the cable clips relative to the circuit board, thereby improving the stability of the relative position of the cable clips and the cables being secured.

[0022] In some embodiments of this application, the number of support legs is at least three. The cable management rack also includes a connecting frame. The connecting frame is connected to the cable management clips. Multiple support legs are connected to the connecting frame respectively, so that the support points of the support legs are distributed in multiple straight lines.

[0023] Multiple support legs are connected to cable management clips via connecting brackets, so that the support points corresponding to each support leg are connected in multiple straight lines, which makes it easy for the cable management rack to be stably supported on the circuit board without the need for other structural assistance, thus improving the stability of the cable management rack setup. Attached Figure Description

[0024] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation on the scope.

[0025] Figure 1 This is a schematic diagram of the structure of a server provided in one embodiment of this application;

[0026] Figure 2 for Figure 1 A schematic diagram of the structure of the Zhongli thread buckle;

[0027] Figure 3 for Figure 1 A schematic diagram of another type of thread-locking buckle;

[0028] Figure 4 for Figure 1 A schematic diagram of another form of thread-locking buckle;

[0029] Figure 5 for Figure 1 A schematic diagram of another type of thread-locking buckle;

[0030] Figure 6 for Figure 1 Schematic diagram of the structure of the cable tray;

[0031] Figure 7 for Figure 1 Schematic diagram of the middle support leg;

[0032] Figure 8 for Figure 1 A schematic diagram of another type of support leg;

[0033] Figure 9 for Figure 1 A schematic diagram of another type of cable management frame;

[0034] Figure 10 for Figure 1 A schematic diagram of another type of cable management rack.

[0035] Explanation of key component symbols:

[0036] 100. Cable management rack;

[0037] 10. Cable management clip; 11. Limiting area; 12. Base; 13. Restraining arm;

[0038] 20. Support leg; 21. Inner core; 22. Covering layer; 23. First support section; 231. Moving channel; 232. Positioning hole; 24. Second support section; 25. Limiting part; 26. Elastic element; 27. Support leg;

[0039] 30. Connecting frame;

[0040] 200. Server; 201. Circuit board; 202. Wire. Detailed Implementation

[0041] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0042] Embodiments of this application provide a server. The server includes a circuit board, cables, and a cable management rack. The cable management rack includes cable clips and support feet. The cable clips have a limiting area for securing the cables. The support feet are connected to the cable clips. The support feet have a hydrophobic portion. The hydrophobic portion is located at least on the surface of the end of the support foot away from the limiting area. The support feet are used to be secured to the circuit board by the hydrophobic portion or movably placed on the circuit board, so that the cables are spaced apart from the circuit board. The hydrophobic portion is located between the cables and the circuit board.

[0043] The cable is secured to the limiting area of ​​the cable management clip. The support foot lifts the cable by supporting the clip, thus physically isolating the cable from the circuit board. This helps prevent the cable from contacting resistors, capacitors, and other components on the circuit board, which could lead to electrochemical corrosion. The end of the support foot furthest from the limiting area rests on the circuit board to support the cable. This end of the support foot is hydrophobic, which helps prevent moisture accumulation at the contact point with the circuit board, reducing condensation and thus lowering the possibility of corrosion caused by condensation.

[0044] Some embodiments of the present application will be described in detail with reference to the drawings. The following embodiments and features can be combined with each other, without conflict.

[0045] Referring to Figure 1 An embodiment of the present application provides a server 200.

[0046] In some embodiments, the server 200 comprises a circuit board 201, wires 202 and a wire management bracket 100. The wire management bracket 100 can be used in the server 200. The wire management bracket 100 can constrain the position of the wires 202 and prop up the wires 202 relative to the circuit board 201, so as to physically isolate the wires 202 from the circuit board 201, which is conducive to avoiding the wires 202 from contacting electronic devices of the circuit board 201 to cause electrochemical corrosion of the electronic devices. The wire management bracket 100 is fixed to the circuit board 201 or can be placed movably on the circuit board 201. In some embodiments, the electronic devices include resistors, capacitors. The electrochemical corrosion refers to a phenomenon that a metal surface reacts electrochemically with an electrolyte solution to cause metal corrosion.

[0047] As an exemplary example, the circuit board 201 can be a hard disk backboard or a fan backboard, and the wires 202 can be high-speed cables or low-speed cables.

[0048] It can be understood that the server can further comprise a cabinet and a mainboard, and the circuit board 201, the wires 202, the wire management bracket 100 and the mainboard are arranged in the cabinet.

[0049] The wires 202 are communication cables connecting two devices in the server, such as cables connecting between the mainboard and the hard disk backboard, cables connecting between the mainboard and the fan backboard, or cables connecting between the mainboard and other components, or cables connecting between two devices other than the mainboard.

[0050] In some embodiments, the wire management bracket 100 comprises a wire management buckle 10 and a supporting leg 20. The wire management buckle 10 has a limiting area 11 for fixing the wires 202. The wires 202 are fixed to the limiting area 11. The supporting leg 20 is connected to the wire management buckle 10. The supporting leg 20 is arranged on the circuit board 201, so that the wires 202 are arranged spaced apart from the circuit board 201. One limiting area 11 can constrain and fix one wire 202, or can constrain and fix multiple wires 202.

[0051] The wire 202 can be fixed to the limiting area 11 of the cable tie 10, and the supporting leg 20 supports the wire 202 by supporting the cable tie 10, so as to physically separate the wire 202 from the circuit board 201. The outer surface of the wire 202 is usually in the form of a woven bag, and condensation is easy to form. The cable management rack 100 physically separates the wire 202 from the circuit board 201, so as to reduce the possibility of condensation of the wire 202 corroding the circuit board 201.

[0052] Referring to Figure 2 In some embodiments, the cable tie 10 comprises a base 12 and a constraint arm 13. The base 12 is connected to the supporting leg 20. The constraint arm 13 is connected to the base 12. The constraint arm 13 and the base 12 form the limiting area 11. The constraint arm 13 can constrain the position of the wire 202, so as to fix the wire 202 relative to the base 12.

[0053] It can be understood that, in some embodiments, referring to Figure 2 The constraint arm 13 is arranged in a bent manner to form a hook structure, so as to constrain the relative position of the wire 202. In some embodiments, referring to Figures 2 to 4 The constraint arm 13 is arranged in a fixed manner relative to the base 12, and is provided with an opening for the wire 202 to enter the limiting area 11. In some embodiments, referring to Figure 5 The constraint arm 13 is arranged in a rotatable manner relative to the base 12 to form an opening for the wire 202 to enter the limiting area 11.

[0054] It can be understood that, in some embodiments, referring to Figure 2 and Figure 3 The cable tie 10 is provided with a plurality of limiting areas 11, so as to facilitate fixing different wires 202.

[0055] Referring to Figure 1 and Figure 6 In some embodiments, the supporting leg 20 and the constraint arm 13 are respectively connected to opposite sides of the base 12, so as to facilitate arranging the supporting leg 20 towards the circuit board 201, and arranging the constraint arm 13 away from the circuit board 201, so as to separate the wire 202 from the circuit board 201.

[0056] In some embodiments, the elastic modulus of the supporting leg 20 is 1 GPa to 10 GPa, so that the supporting leg 20 has a certain strength, so as to stably support the wire 202.

[0057] In some embodiments, the cross-sectional shape of the supporting leg 20 perpendicular to the supporting direction can be triangular, square or circular.

[0058] In some embodiments, the support leg 20 has a hydrophobic portion. The hydrophobic portion is located on the surface of the end of the support leg 20 away from the limiting area 11. The wire management rack 100 contacts the circuit board 201 through the hydrophobic portion. The support leg 20 is used to be fixed to the circuit board 201 or placed on the circuit board 201 through the hydrophobic portion. The hydrophobic portion is located between the wire 202 and the circuit board 201.

[0059] The support leg 20 supports the circuit board 201 to support the wire 202, so that the wire 202 and the circuit board 201 are spaced apart, and the possibility of condensation of the wire 202 causing corrosion of the circuit board 201 is reduced. And the surface of the end of the support leg 20 away from the limiting area 11 is a hydrophobic portion, and the support leg 20 contacts the circuit board 201 through the hydrophobic portion, which is beneficial to prevent the contact between the support leg 20 and the circuit board 201 from becoming a moisture gathering point, reduce the occurrence of condensation, thereby reducing the possibility of condensation causing corrosion of the circuit board 201. Among them, the hydrophobic portion can repel water molecules, reducing the possibility of water molecules adhering to the hydrophobic portion to form condensation.

[0060] Among them, the surface of the end of the support leg 20 away from the limiting area 11 is a hydrophobic portion, and the support leg 20 can also have a hydrophobic portion on the entire surface, or the surface and the inside of the end of the support leg 20 away from the limiting area 11 are hydrophobic portions, or the entire surface and the inside of the support leg 20 are hydrophobic portions.

[0061] In some embodiments, the material of the hydrophobic portion is a hydrophobic nano coating, an acrylic resin, an epoxy resin, polyethylene, polystyrene, polyvinyl chloride, polytetrafluoroethylene, polydimethylsiloxane, polyester, or polyurethane.

[0062] In some embodiments, the material of the wire management buckle 10 can also be the same as the material of the hydrophobic portion, or a metal material or a part of an organic polymer material, etc. Among them, the metal material includes but is not limited to aluminum, gold, copper or nickel; the organic polymer material includes but is not limited to fluorocarbon material or silicon material. When the material of the wire management buckle 10 is the same as the material of the hydrophobic portion, on the one hand, it can reduce the formation of condensation of the wire management buckle 10 itself, and on the other hand, it is also beneficial to prevent the contact between the wire 202 and the wire management buckle 10 from becoming a moisture gathering point, reducing the occurrence of condensation, thereby facilitating the avoidance of condensation flowing to the circuit board 201 through the wire management buckle 10, and reducing the possibility of condensation causing corrosion of the circuit board 201.

[0063] Reference Figure 6In some embodiments, the support leg 20 comprises an inner core 21 and a cover layer 22. The inner core 21 is connected with the wire management buckle 10. The cover layer 22 at least covers one end of the inner core 21 away from the limiting area 11. The cover layer 22 is a hydrophobic part. In some embodiments, the cover layer 22 can only cover one end of the inner core 21 away from the limiting area 11, or can cover the whole surface of the inner core 21 that can be exposed to air.

[0064] The hydrophobic part covers the inner core 21 as the cover layer 22. The inner core 21 and the cover layer 22 can be produced separately and then combined, so that the inner core 21, the cover layer 22 or the combination of the inner core 21 and the cover layer 22 can be replaced according to the actual maintenance needs, thereby saving costs.

[0065] It can be understood that, in some embodiments, the cover layer 22 can be sleeved on the inner core 21, or can be sprayed or coated on the surface of the inner core 21.

[0066] It can be understood that, in some embodiments, the material of the inner core 21 can be the same as that of the hydrophobic part, or a metal material or a part of an organic polymer material, etc. The metal material includes but is not limited to aluminum, gold, copper and nickel; the organic polymer material includes but is not limited to fluorocarbon material or silicon material. When the material of the inner core 21 is the same as that of the hydrophobic part, the hydrophobic and anti-condensation effect of the support leg 20 can be further improved.

[0067] Referring to Figures 7 to 10 In some embodiments, the surface and the inside of at least one end of the support leg 20 away from the limiting area 11 are an integrally formed structure. The hydrophobic part is manufactured as the support leg 20 by using the integrally formed manner, which is beneficial to simplify the production process of the support leg 20.

[0068] In some embodiments, the support leg 20 can be the integrally formed structure of the hydrophobic part only at one end away from the limiting area 11, thereby saving the material of the hydrophobic part, or can be the integrally formed structure of the hydrophobic part for the whole structure, thereby simplifying the production process of the support leg 20.

[0069] It can be understood that, in some embodiments, the integrally formed manner includes die casting or 3D printing.

[0070] Referring to Figure 1 , Figure 7 and Figure 8 In some embodiments, the support leg 20 comprises a first support section 23 and a second support section 24. The surface of the first support section 23 away from the limiting area 11 is a hydrophobic part. The second support section 24 is connected with the wire management buckle 10. The first support section 23 and the second support section 24 are movably connected, so that the support leg 20 can be deformed in an extending or contracting manner.

[0071] The first support section 23 and the second support section 24 are relatively moved to make the support leg 20 extend or retract, so as to change the height of the support leg 20 supporting the wire management buckle 10 and the wire 202, so as to change the space occupied by the wire management frame 100 in use, so as to increase the use range of the wire management frame 100, and facilitate the use of the wire management frame 100 in different internal structures of the server 200.

[0072] In some embodiments, the first support section 23 is provided with a moving channel 231 and positioning holes 232. The positioning holes 232 are provided in plurality and respectively communicated with the moving channel 231. The plurality of positioning holes 232 are distributed along the extension direction of the moving channel 231. The second support section 24 is arranged in the moving channel 231. The support leg 20 further comprises a limiting part 25 and an elastic member 26. The limiting part 25 is connected to the elastic member 26. The elastic member 26 is connected to the second support section 24. The elastic member 26 is used to apply an elastic force to the limiting part 25 to move the limiting part 25 to the positioning holes 232.

[0073] The elastic member 26 can push the limiting part 25 to move to the positioning holes 232, and by switching the positioning holes 232 to which the limiting part 25 is positioned, the second support section 24 is relatively fixed to different positions of the first support section 23, so as to adjust the support height of the support leg 20. When the second support section 24 moves in the moving channel 231, the elastic member 26 can drive the limiting part 25 to disengage from the positioning holes 232 by elastic deformation, so as to follow the movement of the second support section 24. After the second support section 24 is moved to the position, the limiting part 25 is reset under the action of the elastic force, so as to extend into the corresponding positioning hole 232, so as to fix the second support section 24 and the first support section 23.

[0074] It can be understood that, in some embodiments, referring to Figure 7 , the elastic member 26 can be a spring, one end of the spring is connected to the limiting part 25, and the other end of the spring is connected to the second support section 24. In the form of the spring, the elastic member 26 can produce stable elastic deformation every time the length of the support leg 20 needs to be adjusted, so as to facilitate the limiting part 25 to easily disengage from the positioning holes 232, and also facilitate the limiting part 25 to stably engage in the positioning holes 232; referring to Figure 8 , the elastic member 26 can be an elastic arm capable of producing elastic deformation. The elastic arm and the second support section 24 are integrally formed. The limiting part 25 is protruded from the elastic arm. In the form of the elastic arm, the number of parts that need to be assembled and matched by the support leg 20 can be reduced, so as to reduce the occupied space of the elastic member 26 and the second support section 24, so as to reduce the overall structure size of the wire management frame 100, and facilitate the flexible arrangement of the wire management frame 100 in the server 200.

[0075] Referring to Figure 7 and Figure 8In some embodiments, the support leg 20 is provided with a leg 27. The leg 27 is located at an end of the support leg 20 away from the limiting area 11. The hydrophobic part is located at least on the surface of the leg 27 of the support leg 20. Among them, the leg 27 is arranged in one of the first support section 23 and the second support section 24 which can move relative to the wire management buckle 10.

[0076] In some embodiments, the circuit board 201 is provided with a socket (not shown in the figure). The leg 27 is inserted into the socket. The support leg 20 is inserted into the socket of the circuit board 201 through the leg 27, so that the wire management rack 100 can be fixed to the circuit board 201, thereby improving the stability of supporting the wire 202 and reducing the possibility of the wire 202 contacting the circuit board 201 due to the wire management rack 100 falling down.

[0077] In some embodiments, the leg 27 is relatively freely placed on the circuit board 201, which facilitates flexible adjustment of the position of the wire management rack 100 on the circuit board 201, and facilitates wire management of the wire 202.

[0078] Referring to Figure 7 In some embodiments, the leg 27 is a spherical structure. The support leg 20 is supported on the circuit board 201 through the spherical leg 27, which facilitates the free movement of the leg 27 relative to the circuit board 201, thereby facilitating rapid change of the setting position of the support leg 20 and improving the application range of the wire management rack 100. In other embodiments, the shape of the socket of the circuit board 201 is matched with the shape of the spherical leg 27, and the spherical leg 27 can also be fixedly inserted into the socket of the circuit board 201.

[0079] Referring to Figure 8 In some embodiments, the leg 27 is a cylindrical structure. The support leg 20 is supported on the circuit board 201 through the cylindrical leg 27, which facilitates the plug-in cooperation of the leg 27 on the circuit board 201, thereby facilitating the improvement of the stability of the setting of the support leg 20. In other embodiments, the cylindrical leg 27 can not be inserted into the socket of the circuit board 201 and can move freely relative to the circuit board 201.

[0080] Referring to Figure 1 , Figure 9 and Figure 10 In some embodiments, the support leg 20 is provided with a plurality of support legs 20. The plurality of support legs 20 are respectively connected to the wire management buckle 10 and are arranged at intervals.

[0081] The plurality of support legs 20 arranged at intervals enable the wire management buckle 10 to be supported at multiple points relative to the circuit board 201, thereby improving the stability of the relative position of the wire management buckle 10 and improving the stability of the relative position of the fixed wire 202.

[0082] Referring to Figure 1 , Figure 9 and Figure 10In some embodiments, the number of support legs 20 is at least three. The cable management rack 100 also includes a connecting frame 30. The connecting frame 30 is connected to the cable management clip 10. The multiple support legs 20 are respectively connected to the connecting frame 30 so that the support points of the support legs 20 are distributed in multiple straight lines. The connecting frame 30 can be a triangular, square, circular, or other structure.

[0083] Multiple support feet 20 are connected to cable management clips 10 via connecting brackets 30, so that the support points corresponding to each support foot 20 are connected to form multiple straight lines, which makes it easy for the cable management rack 100 to be stably supported on the circuit board 201 without the need for other structural assistance, thus improving the stability of the cable management rack 100.

[0084] It is understood that, in some embodiments, see Figure 9 The connecting frame 30, cable management clip 10, and support foot 20 are integrally formed, facilitating quick assembly of the cable management frame 100. In some embodiments, see... Figure 10 The connecting frame 30 is assembled from multiple detachable structural components. The connecting frame 30 is detachably connected to the cable management buckle 10 and the supporting leg 20. This facilitates the cable management buckle 10 to cooperate with different supporting legs 20 and enables the supporting legs 20 to be combined into different support point configurations, thereby expanding the applicability of the cable management frame 100.

[0085] Furthermore, those skilled in the art should recognize that the above embodiments are merely illustrative of this application and are not intended to limit this application. Any appropriate changes and variations made to the above embodiments within the essential spirit and scope of this application fall within the scope of this application's disclosure.

Claims

1. A server, characterized by The application relates to a wire arrangement frame, which comprises a circuit board, a wire, and a wire arrangement frame, wherein the wire arrangement frame comprises a wire arrangement buckle and a supporting leg, the wire arrangement buckle has a limiting area for fixing the wire, the supporting leg is connected to the wire arrangement buckle, the supporting leg has a hydrophobic part, the hydrophobic part is located at least on the surface of the end of the supporting leg away from the limiting area, the supporting leg is used for being fixed to the circuit board through the hydrophobic part or being movably arranged on the circuit board, so that the wire is arranged in a spaced manner with the circuit board, and the hydrophobic part is located between the wire and the circuit board. The supporting leg comprises an inner core and a covering layer, the inner core is connected to the wire arrangement buckle, and the covering layer covers at least the end of the inner core away from the limiting area, and the covering layer is the hydrophobic part. The surface and the inside of at least the end of the supporting leg away from the limiting area are in an integral forming structure. The supporting leg comprises a first supporting section and a second supporting section, the surface of at least the end of the first supporting section away from the limiting area is the hydrophobic part, the second supporting section is connected to the wire arrangement buckle, and the first supporting section and the second supporting section are movably connected, so that the supporting leg can be elastically deformed. The first supporting section is provided with a moving channel and positioning holes, the positioning holes are communicated with the moving channel, the positioning holes are distributed in a spaced manner along the extension direction of the moving channel, the second supporting section is arranged in the moving channel, the supporting leg further comprises a limiting part and an elastic member, the limiting part is connected to the elastic member, the elastic member is connected to the second supporting section, and the elastic member is used for applying an elastic force to the limiting part to move the limiting part to the positioning holes.

2. The server of claim 1, wherein, The supporting leg is provided with a supporting leg, the supporting leg is located at the end of the supporting leg away from the limiting area, the supporting leg is in a spherical structure, and the hydrophobic part is located at least on the surface of the supporting leg.

3. The server of claim 1, wherein, The supporting leg is provided with a supporting leg, the supporting leg is located at the end of the supporting leg away from the limiting area, the supporting leg is in a cylindrical structure, and the hydrophobic part is located at least on the surface of the supporting leg.

4. The server of claim 1, wherein, The supporting leg is provided with a supporting leg, and the circuit board is provided with a jack, the supporting leg is inserted into the jack.

5. The server of claim 4, wherein, A plurality of supporting legs are arranged in a spaced manner.

6. The server of claim 1, wherein, The number of the supporting legs is at least three, the wire arrangement frame further comprises a connecting frame, the connecting frame is connected to the wire arrangement buckle, and the supporting legs are connected to the connecting frame, so that the supporting points of the supporting legs are arranged in a plurality of straight lines.

7. The server of claim 1, wherein, ​ 8. The server of claim 1, wherein, ​ 9. The server of any one of claims 1 to 8, characterized in that, ​ 10. The server of claim 9, wherein, ​