Double-sided metal circuit board
By employing an oxide layer and a multi-layer metal layer design on a double-sided metal circuit board, the problems of low yield and high manufacturing difficulty were solved, achieving high yield and low cost manufacturing, while also improving heat dissipation and heat resistance.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-26
- Publication Date
- 2026-03-31
AI Technical Summary
In the existing technology, double-sided metal circuit boards have low yield and are difficult to manufacture, especially when conducting the upper and lower circuits on small circuit boards, they are prone to short circuits. The secondary drilling process is complex and costly.
An oxide layer is used to cover the surface of the substrate and the inner surface of the via. An insulating layer is formed by anodizing to prevent the conductive layer from contacting the substrate. The design of multiple metal layers and insulating layers simplifies the manufacturing process and avoids secondary drilling.
It improved the yield rate, reduced the manufacturing difficulty, simplified the process, reduced the cost, and improved heat dissipation and heat resistance.
Smart Images
Figure CN224068854U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to the technical field of circuit board, concretely relates to a double -sided metal circuit board. BACKGROUND
[0002] Metal baseplate has the advantages of fast heat dissipation speed, good heat resistance and not easy to deform, and is a popular baseplate in the current circuit board. Due to the reason that the metal plate itself can conduct electricity, when the upper and lower circuits of the baseplate need to be conducted, punching is carried out on the metal baseplate, then the hole is filled with resin and other insulating materials to form an insulating layer, and secondary punching is carried out on the insulating layer to fill the metal, complete the conduction of the upper and lower circuits, and prevent short circuit between the metal conducting the upper and lower circuits and the metal baseplate. However, such secondary punching process is extremely difficult in the process of manufacturing small circuit boards, has high manufacturing cost and low yield. In order to solve such problems, a double-sided metal circuit board is proposed. SUMMARY
[0003] The utility model aims at solving one of the technical problems existing in the prior art.
[0004] Therefore, the utility model provides a double-sided metal circuit board, which has the advantages of high yield and low manufacturing difficulty.
[0005] The double-sided metal circuit board according to the utility model embodiment comprises a baseplate, an oxidation layer and a first conductive layer; the baseplate is made of metal material, a through hole is formed on the baseplate along the thickness direction, and the oxidation layer covers the upper and lower surfaces of the baseplate and the inner surface of the through hole; the first conductive layer comprises a first metal layer, a second metal layer and a third metal layer; the first metal layer is arranged above the baseplate, the second metal layer is arranged below the baseplate, the third metal layer is arranged inside the through hole, the two ends of the third metal layer are connected with the first metal layer and the second metal layer respectively, and the oxidation layer is used for isolating the first conductive layer and the baseplate.
[0006] According to one embodiment of the utility model, a plurality of recessed holes are formed on the first metal layer and the second metal layer.
[0007] According to one embodiment of the utility model, the first insulating layer is filled in the plurality of recessed holes.
[0008] According to one embodiment of the utility model, a second insulating layer is formed on the first metal layer and the second metal layer.
[0009] According to one embodiment of the utility model, the first insulating layer and the second insulating layer are made of the same material.
[0010] According to one embodiment of the present application, the second insulating layer is formed with a first conductive hole, and the first conductive hole is used to expose part of the first metal layer or the second metal layer.
[0011] According to one embodiment of the present application, the second insulating layer is further formed with a second conductive hole, and the second conductive hole is used to expose another part of the first metal layer or the second metal layer.
[0012] According to one embodiment of the present application, the second insulating layer is formed with a fourth metal layer, and the second conductive hole is formed with a fifth metal layer, and the fifth metal layer is connected with the fourth metal layer.
[0013] According to one embodiment of the present application, the first conductive hole is formed with a solder pad protection layer.
[0014] According to one embodiment of the present application, the fourth metal layer and the fifth metal layer are formed with an ink protection layer.
[0015] The present application has the advantages that the oxide layer is used to cover the substrate, the contact between the first conductive layer and the substrate is avoided, and the short circuit effect is avoided.
[0016] Other features and advantages of the present application will be described in the following description, and some will become apparent from the description, or will be understood from the practice of the present application.
[0017] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the following preferred embodiments are described in detail below, and the accompanying drawings are described as follows. BRIEF DESCRIPTION OF DRAWINGS
[0018] The above and / or additional aspects and advantages of the present application will become apparent and more readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings, in which:
[0019] Figure 1 is a schematic view of the overall structure of the present application;
[0020] Reference signs:
[0021] 1, substrate; 11, through hole; 2, oxide layer; 31, first metal layer; 32, second metal layer; 33, third metal layer; 34, fourth metal layer; 35, fifth metal layer; 41, first insulating layer; 42, second insulating layer; 421, solder pad protection layer; 5, ink protection layer. DETAILED DESCRIPTION
[0022] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.
[0023] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, features defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.
[0024] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0025] The double-sided metal circuit board of this utility model is described in detail below with reference to the accompanying drawings.
[0026] like Figure 1 As shown, the double-sided metal circuit board according to an embodiment of the present invention includes: a substrate 1, an oxide layer 2, and a first conductive layer; the substrate 1 is made of metal material, and a through hole 11 is formed on the substrate 1 along the thickness direction; the oxide layer 2 covers the upper and lower surfaces of the substrate 1 and the inner surface of the through hole 11; the first conductive layer includes a first metal layer 31, a second metal layer 32, and a third metal layer 33; the first metal layer 31 is disposed above the substrate 1, the second metal layer 32 is disposed below the substrate 1, the third metal layer 33 is disposed inside the through hole 11, and the two ends of the third metal layer 33 are respectively connected to the first metal layer 31 and the second metal layer 32; the oxide layer 2 is used to isolate the first conductive layer and the substrate 1.
[0027] In the embodiment, the oxide layer 2 is used to cover the substrate 1, avoiding the contact between the first conductive layer and the substrate 1, and the oxide layer 2 has high insulation properties, achieving the effect of avoiding short circuit. In addition, since the substrate 1 is a metal material, the oxide layer 2 can be formed by an anodization process. For example, the substrate 1 can be an aluminum substrate, and an insulating ceramic layer is grown on the outer surface of the aluminum substrate by an anodization process. The oxide layer 2 has high dielectric strength and low conductive line, and can maintain stable insulation under high voltage. The preparation yield of the oxide layer 2 is high compared with the filling resin and punching method, and the thickness of the oxide layer 2 is controllable, which is convenient for leaving the required space of the third metal layer 33, avoiding the secondary punching process, reducing the manufacturing difficulty, and the thermal conductivity and heat resistance of the oxide layer 2 are higher than those of the insulating material such as resin, so the heat dissipation and heat resistance of the double-sided metal circuit board are also improved.
[0028] The diameter of the through hole 11 is greater than twice the thickness of the oxide layer 2, that is, after forming a ring of oxide layer 2 on the inner wall of the through hole 11, there is still a position for arranging the third metal layer 33 between the oxide layers 2.
[0029] The first metal layer 31 and the second metal layer 32 are both formed with a plurality of recessed holes, and the plurality of recessed holes are filled with a first insulating layer 41.
[0030] In the embodiment, the plurality of recessed holes form the first metal layer 31 or the second metal layer 32 into a conductive circuit, and the first insulating layer 41 is used to insulate the side wall of the conductive circuit.
[0031] The first metal layer 31 and the second metal layer 32 are both formed with a second insulating layer 42.
[0032] In the embodiment, the second insulating layer 42 is used to cover and insulate the position of the conductive circuit which does not need to be exposed.
[0033] The first insulating layer 41 and the second insulating layer 42 are made of the same material.
[0034] In the embodiment, by setting the first insulating layer 41 and the second insulating layer 42 to the same material, the first insulating layer 41 and the second insulating layer 42 can be prepared at the same time, so as to simplify the preparation process and reduce the production cost.
[0035] The second insulating layer 42 is formed with a first conductive hole for exposing part of the first metal layer 31 or the second metal layer 32, and the first conductive hole is formed with a pad protection layer 421.
[0036] In the embodiment, the first conductive hole can be set as multiple according to user demand, the first metal layer 31 and the second metal layer 32 can be provided with the first conductive hole, and the first conductive hole is used for subsequent connection with other products, and the solder pad protection layer 421 is used to protect the first metal layer 31 and the second metal layer 32 in the first conductive hole.
[0037] The second insulating layer 42 is further provided with a second conductive hole, and the second conductive hole is used to expose another part of the first metal layer 31 or the second metal layer 32.
[0038] The fourth metal layer 34 is formed on the second insulating layer 42, and the fifth metal layer 35 is formed in the second conductive hole and connected with the fourth metal layer 34.
[0039] In the embodiment, the fourth metal layer 34 and the fifth metal layer 35 are integrally formed as the second conductive layer to realize the effect of the multi-layer conductive line and complete the circuit board with complex circuit function; and the second conductive layer can be arranged on the first metal layer 31 and the second metal layer 32 according to user demand.
[0040] The ink protection layer 5 is formed on the fourth metal layer 34 and the fifth metal layer 35 to realize protection of the second conductive layer.
[0041] In the description of the present specification, the description of the terms “one embodiment”, “some embodiments”, “exemplary embodiment”, “example”, “specific example”, or “some examples” means that the specific features, structures, materials or characteristics described in combination with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the exemplary description of the above terms does not necessarily mean the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.
[0042] Although the embodiments of the present application have been shown and described, those skilled in the art can understand that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and purposes of the present application, and the scope of the present application is defined by the claims and their equivalents.
Claims
1. A double-sided metal wiring board, characterized by, The application relates to a substrate (1) made of metal material, wherein a through hole (11) is formed in the thickness direction of the substrate (1), an oxidation layer (2) covers the upper and lower surfaces of the substrate (1) and the inner surface of the through hole (11), a first conductive layer comprises a first metal layer (31), a second metal layer (32) and a third metal layer (33), the first metal layer (31) is arranged above the substrate (1), the second metal layer (32) is arranged below the substrate (1), the third metal layer (33) is arranged inside the through hole (11), and the two ends of the third metal layer (33) are connected with the first metal layer (31) and the second metal layer (32) respectively, the oxidation layer (2) is used for isolating the first conductive layer and the substrate (1), a plurality of recesses are formed in the first metal layer (31) and the second metal layer (32), the recesses are filled with a first insulation layer (41), a second insulation layer (42) is formed on the first metal layer (31) and the second metal layer (32), the first insulation layer (41) and the second insulation layer (42) are made of the same material, a first conductive hole is formed on the second insulation layer (42) and used for exposing part of the first metal layer (31) or the second metal layer (32), a second conductive hole is further formed on the second insulation layer (42) and used for exposing another part of the first metal layer (31) or the second metal layer (32), a fourth metal layer (34) is formed on the second insulation layer (42), a fifth metal layer (35) is formed in the second conductive hole and connected with the fourth metal layer (34), a pad protection layer (421) is formed in the first conductive hole, an ink protection layer (5) is formed on the fourth metal layer (34) and the fifth metal layer (35). The application relates to a substrate (1) made of metal material, wherein a through hole (11) is formed in the thickness direction of the substrate (1), an oxidation layer (2) covers the upper and lower surfaces of the substrate (1) and the inner surface of the through hole (11), a first conductive layer comprises a first metal layer (31), a second metal layer (32) and a third metal layer (33), the first metal layer (31) is arranged above the substrate (1), the second metal layer (32) is arranged below the substrate (1), the third metal layer (33) is arranged inside the through hole (11), and the two ends of the third metal layer (33) are connected with the first metal layer (31) and the second metal layer (32) respectively, the oxidation layer (2) is used for isolating the first conductive layer and the substrate (1), a plurality of recesses are formed in the first metal layer (31) and the second metal layer (32), the recesses are filled with a first insulation layer (41), a second insulation layer (42) is formed on the first metal layer (31) and the second metal layer (32), the first insulation layer (41) and the second insulation layer (42) are made of the same material, a first conductive hole is formed on the second insulation layer (42) and used for exposing part of the first metal layer (31) or the second metal layer (32), a second conductive hole is further formed on the second insulation layer (42) and used for exposing another part of the first metal layer (31) or the second metal layer (32), a fourth metal layer (34) is formed on the second insulation layer (42), a fifth metal layer (35) is formed in the second conductive hole and connected with the fourth metal layer (34), a pad protection layer (421) is formed in the first conductive hole, an ink protection layer (5) is formed on the fourth metal layer (34) and the fifth metal layer (35). 2. The double-sided metal wiring board according to claim 1, wherein 3. The double-sided metal wiring board according to claim 2, wherein 4. The double-sided metal wiring board according to claim 3, wherein 5. The double-sided metal wiring board according to claim 4, wherein 6. The double-sided metal wiring board according to claim 5, wherein 7. The double-sided metal wiring board according to claim 6, wherein 8. The double-sided metal wiring board according to claim 7, wherein 9. The double-sided metal wiring board according to claim 6, wherein 10. The double-sided metal wiring board according to claim 8, wherein