Printed circuit board, display module and display device

Abstract

The utility model provides a printed circuit board, a display module and a display device, belongs to the technical field of display, and can solve the problem that pins in an existing printed circuit board are misaligned with pins in a flexible circuit board to be bound and connected due to expansion of the existing printed circuit board in the binding process. The printed circuit board is provided with a binding area and comprises a substrate and a plurality of pins which are located on the substrate and arranged in the binding area side by side. The binding area is divided into a middle binding area and two side binding areas; the distance between the adjacent pins in the binding areas on the two sides is gradually decreased in the direction away from the center of the substrate, and the maximum value of the distance between the adjacent pins in the binding areas on the two sides is smaller than the minimum value of the distance between the adjacent pins in the middle binding area.

Description

Technical Field

[0001] This disclosure belongs to the field of display technology, specifically relating to a printed circuit board, a display module, and a display device. Background Technology

[0002] Organic light-emitting diodes (OLEDs) are light-emitting devices that use organic solid-state semiconductors as light-emitting materials. Due to their advantages such as simple fabrication process, low cost, low power consumption, high brightness, and wide operating temperature range, they have broad application prospects.

[0003] With the continuous development of OLED technology, flexible OLED display modules have been gradually applied to medium and large-sized display products. However, during the production process, due to the structure of the printed circuit board and flexible circuit board in the flexible OLED display module, the bonding accuracy between the two is prone to deviation, resulting in signal transmission failure and affecting the display effect. Utility Model Content

[0004] This disclosure aims to at least solve one of the technical problems existing in the prior art, and provides a printed circuit board, a display module, and a display device.

[0005] In a first aspect, embodiments of this disclosure provide a printed circuit board having a bonding area, the printed circuit board comprising: a substrate, and a plurality of pins located on the substrate and arranged side by side in the bonding area; the bonding area is divided into a middle bonding area and two side bonding areas;

[0006] The spacing between adjacent pins in the two side bonding areas gradually decreases in the direction away from the center of the substrate, and the maximum value of the spacing between adjacent pins in the two side bonding areas is less than the minimum value of the spacing between adjacent pins in the middle bonding area.

[0007] In some embodiments, the spacing difference between adjacent pins in the two bonding areas is arranged according to a first arithmetic sequence.

[0008] In some embodiments, in the bonding regions on both sides, starting from a first reference point, the spacing between adjacent pins gradually decreases in a direction away from the center of the substrate; the pins include: bonding pins and redundant pins; the first reference point is the redundant pin near the center of the substrate.

[0009] In some embodiments, the spacing between adjacent pins in the intermediate binding region is equal.

[0010] In some embodiments, the spacing between adjacent pins in the intermediate bonding region gradually decreases in a direction away from the center of the substrate.

[0011] In some embodiments, the spacing difference between adjacent pins in the intermediate binding area is arranged according to a second arithmetic sequence.

[0012] In some embodiments, the common difference of the second arithmetic sequence is less than or equal to the common difference of the first arithmetic sequence.

[0013] In some embodiments, in the central bonding region, starting from a second reference point, the spacing between adjacent pins gradually decreases in a direction away from the center of the substrate; the pins include: bonding pins and redundant pins; the second reference point is the redundant pin near the center of the substrate.

[0014] In some embodiments, the width of the middle binding area is less than or equal to half the width of the two side binding areas.

[0015] Secondly, this disclosure provides a display module including a printed circuit board as provided in the first aspect.

[0016] In some embodiments, the display module further includes: a flexible circuit board, a driver chip, and a display panel;

[0017] The driver chip is located on the printed circuit board;

[0018] The printed circuit board is located on the backlight side of the display panel and is bonded to the display panel via the flexible circuit board.

[0019] Thirdly, embodiments of this disclosure provide a display device, the display device including the display module as provided in the second aspect. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of an exemplary printed circuit board.

[0021] Figure 2 for Figure 1 The diagram shows the structure of a printed circuit board under high temperature conditions.

[0022] Figure 3 A schematic diagram of a printed circuit board provided for the implementation of this disclosure.

[0023] Figure 4 This is a schematic diagram of another printed circuit board structure provided in an embodiment of this disclosure.

[0024] Figure 5This is a schematic diagram of the structure of a display module provided in an embodiment of this disclosure. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this disclosure, and not all of them. The components of the embodiments of this disclosure described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this disclosure provided in the accompanying drawings is not intended to limit the scope of the claimed disclosure, but merely represents selected embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the embodiments of this disclosure without inventive effort are within the scope of protection of this disclosure. Without conflict, the various embodiments of this disclosure and the features in the embodiments can be combined with each other.

[0026] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an,” “a,” or “the,” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “comprising,” “including,” or “including,” and similar terms mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects.

[0027] In this disclosure, "multiple or several" refers to two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone. The character " / " generally indicates that the preceding and following related objects have an "or" relationship.

[0028] Figure 1 This is a schematic diagram of an exemplary printed circuit board structure, such as... Figure 1 As shown, the printed circuit board 1 has a bonding area BD. The printed circuit board 1 includes: a substrate 101 and a plurality of pins 102 located on the substrate 101 and arranged side by side in the bonding area BD; the spacing between adjacent pins 102 is equal.

[0029] The substrate 101 can provide good support for the pins 102 on it. The pins 102 can be bonded to the flexible circuit board to be bonded, so that the display signal transmitted in the printed circuit board 1 can be transmitted to the display panel through the flexible circuit board to realize the display function.

[0030] In a standard configuration, the spacing between adjacent pins 102 in the printed circuit board 1 is equal, for example, the spacing between adjacent pins 102 is A. Each printed circuit board 1 can be bonded to multiple flexible circuit boards (the area within the solid line box in the figure). Correspondingly, each flexible circuit board also has multiple pins (not shown in the figure), and the spacing between adjacent pins in the flexible circuit board is also A. The pins 102 in the printed circuit board 1 can be bonded to the pins in the flexible circuit board.

[0031] The bonding process between the printed circuit board 1 and the flexible circuit board needs to be carried out in a high-temperature environment. Figure 2 for Figure 1 The schematic diagram shown is of the printed circuit board structure under high temperature conditions. Figure 2 As shown, in a high-temperature environment, the substrate 101 in the printed circuit board 1 is prone to thermal expansion, causing the position of the pins 102 on it to shift. As a result, the spacing A between adjacent pins 102 increases to a spacing A1. When bonding with the flexible circuit board, the change in the spacing between adjacent pins 102 in the printed circuit board 1 causes misalignment between the pins 102 in the printed circuit board 1 and the pins in the flexible circuit board, which can easily cause abnormal display signal transmission, resulting in poor display and affecting the display effect.

[0032] To at least solve one of the aforementioned technical problems, this disclosure provides a printed circuit board, a display module, and a display device. The printed circuit board, display module, and display device provided in this disclosure will be described in further detail below with reference to the accompanying drawings and specific embodiments.

[0033] In a first aspect, embodiments of this disclosure provide a printed circuit board. Figure 3 A schematic diagram of a printed circuit board provided for embodiments of this disclosure, such as... Figure 3 As shown, the printed circuit board 1 has a bonding area BD. The printed circuit board 1 includes: a substrate 101 and a plurality of pins 102 located on the substrate 101 and arranged side by side in the bonding area BD. The bonding area BD is divided into a middle bonding area BD1 and two side bonding areas BD2. The spacing between adjacent pins 102 in the two side bonding areas BD1 gradually decreases in the direction away from the center of the substrate 101, and the maximum value of the spacing between adjacent pins 102 in the two side bonding areas BD2 is less than the minimum value of the spacing between adjacent pins 102 in the middle bonding area BD1.

[0034] The substrate 101 provides good support for the pins 102 and other structures on it, and also provides good insulation. In practical applications, the substrate 101 can be made of epoxy resin with added glass fiber. The epoxy resin has high rigidity, which meets the requirements for supporting other structures on it. The glass fiber can further increase the strength of the substrate 101, preventing the substrate 101 from deforming under external force and affecting the performance of the pins 102.

[0035] Of course, the substrate 101 can also be made of flexible materials such as polyimide (PI), which can improve the overall bending and tensile resistance of the substrate 101 and prevent the substrate 101 from breaking due to stress generated during bending, stretching, and twisting, thus avoiding poor open circuit. Alternatively, the substrate 101 can also be made of other organic materials such as polytetrafluoroethylene. In practical applications, the material of the substrate 101 can be rationally selected according to actual needs to ensure that the printed circuit board 1 has good performance.

[0036] Pin 102 is a key component for connecting other electronic components (such as flexible circuit boards). Its material balances conductivity, mechanical strength, corrosion resistance, and solderability, and can be made of at least one of the following metals: copper (Cu), iron (Fe), gold (Au), silver (Ag), and aluminum (Al). For example, copper (Cu), gold (Au), and silver (Ag) are preferred when high-frequency signals require high electrical performance. To reduce costs, copper (Cu), iron (Fe), and aluminum (Al) are generally used in mass production.

[0037] The surface of pin 102 needs to be specially treated to further improve conductivity and corrosion resistance. For example, tin plating (Sn) can be used, which is low-cost and suitable for conventional soldering; silver plating (Ag) can improve conductivity and corrosion resistance, which is suitable for high frequency or high reliability requirements; gold plating (Au) has strong oxidation resistance and is suitable for pluggable connectors or harsh environments; or electroless nickel immersion gold (ENIG) plating has high reliability and is suitable for surface mount devices (SMD).

[0038] It should be noted that the binding area BD is divided into a middle binding area BD1 and two side binding areas BD2. The two side binding areas BD2 can be located on both sides of the middle binding area BD1. The specific boundaries of the middle binding area BD1 and the two side binding areas BD2 are not fixed. The binding area BD is divided for ease of understanding. In actual use, there is no actual middle binding area BD1 and two side binding areas BD2. The binding area BD is a unified whole area.

[0039] In the printed circuit board 1 provided in this embodiment, the spacing between adjacent pins 102 in the two bonding areas BD1 gradually decreases in the direction away from the center of the substrate 101, and the maximum value of the spacing between adjacent pins 102 in the two bonding areas BD2 is less than the minimum value of the spacing between adjacent pins 102 in the middle bonding area BD1. For example, the spacing between adjacent pins 102 around the center of the substrate 101 is A, and the spacing between adjacent pins 102 further away from the center of the substrate 101 is smaller, for example, it can be A2. In the bonding process between the printed circuit board 1 and the flexible circuit board, due to the outer In the high-temperature environment of the substrate 101, the substrate 101 can expand, and the expansion is more severe the farther away from the center of the substrate 101. This increases the spacing between adjacent pins 102 on the substrate 101 in the high-temperature environment, for example, from A2 to A. In this way, the spacing between adjacent pins 102 in the printed circuit board 1 can be consistent with the spacing between pins in the flexible circuit board to be bonded. Therefore, misalignment between the pins 102 in the printed circuit board 1 and the pins in the flexible circuit board can be avoided, ensuring the normal transmission of display signals, thereby avoiding display defects and improving the display effect.

[0040] It should be further noted that the reduction in the spacing between adjacent pins 102 in the bonding areas BD2 on both sides is set according to the expansion of the substrate 101 under high temperature conditions. The sum of the reduction in the spacing between each adjacent pin 102 is equal to the expansion of the substrate 101 under high temperature conditions. This can further improve the bonding accuracy between the printed circuit board 1 and the flexible circuit board.

[0041] In some embodiments, the spacing difference between adjacent pins 102 in the two-sided binding areas BD2 is arranged according to a first arithmetic sequence.

[0042] The substrate 101 has a width of W0 under normal conditions and a width of W1 after thermal expansion under high temperature. Therefore, the expansion amount of the substrate 101 is W1 - W0, and the reduction in spacing between adjacent pins 102 is S = W1 - W0. Taking the equal spacing between adjacent pins 102 in the middle bonding area BD1 as an example, the spacing between adjacent pins 102 in the two bonding areas BD2 is n. The spacing between adjacent pins 102 in the two bonding areas BD2 decreases according to the first arithmetic sequence, satisfying the formula for the summation of the first arithmetic sequence: S = n × a1 + n(n-1)d1 / 2, where a1 = d1. The first common difference d1 of the reduced first arithmetic sequence can then be calculated.

[0043] like Figure 3As shown, assuming the standard design value of the spacing between adjacent pins 102 is A, the first spacing value is A-d1, the second spacing is designed to decrease by an arithmetic progression of d1, that is, the second spacing value is A-2d1, the third spacing is designed to decrease by A-3d1, ..., and the last spacing value is A-nd1. For example, if the substrate 101 needs to be reduced by an amount S = 70 μm, and the number of pitches between adjacent pins 102 in the bonding areas BD1 on both sides is n = 500, then d1 = 0.00056 μm. If the normal design value of the pitch between adjacent pins 102 in the bonding areas BD2 on both sides is 140 μm, then the actual design value of the first pitch is 140 - 0.00056 = 139.99944 μm, the actual design value of the second pitch is 140 - 0.00056 × 2 = 139.99888 μm, the actual design value of the third pitch is 140 - 0.00056 × 3 = 139.99832 μm, ..., and the last pitch value is 140 - 0.00056 × 500 = 139.72 μm.

[0044] In a high-temperature environment, the spacing between adjacent pins 102 on the substrate 101 is increased, for example, from 139.72um to 140um, or from 139.99832um to 140um. In this way, the spacing between adjacent pins 102 in the printed circuit board 1 can be consistent with the spacing between pins in the flexible circuit board to be bonded. Therefore, misalignment between the pins 102 in the printed circuit board 1 and the pins in the flexible circuit board can be avoided, ensuring the normal transmission of display signals, thereby avoiding display defects and improving the display effect.

[0045] In some embodiments, such as Figure 3 As shown, in the bonding areas BD2 on both sides, starting from the first reference point, the spacing between adjacent pins 102 gradually decreases in the direction away from the center of the substrate 101; the pins 102 include: bonding pins 1021 and redundant pins 1022; the first reference point is the redundant pin 1022 near the center of the substrate 101.

[0046] Pin 102 may include a bonding pin 1021 and a redundant pin 1022. The bonding pin 1021 is the pin 102 that is actually bonded to the flexible circuit board, and the redundant pin 1022 is an unused pin 102, which is generally located at a corresponding position between two flexible circuit boards. The bonding pin 1021 can transmit display signals normally, while the redundant pin 102 does not transmit display signals.

[0047] The first reference point is the first pin 102 corresponding to the point where the spacing between adjacent pins 102 begins to decrease. The redundant pin 1022 closest to the center of the substrate 101 can be selected as the first reference point. Starting from the first reference point, the spacing between adjacent pins 102 gradually decreases in the direction away from the center of the substrate 101. This can avoid the amount of spacing reduction between adjacent pins 102 near the first reference point being too small, which would affect the bonding connection effect.

[0048] In some embodiments, such as Figure 3 As shown, the spacing between adjacent pins 102 in the intermediate binding area BD2 is equal.

[0049] Due to the high external temperature environment, the substrate 101 can expand. The expansion of the substrate 101 is not obvious in the area corresponding to the central bonding region BD1, and the expansion is more severe the farther away from the center of the substrate 101. In practical applications, the spacing between adjacent pins 102 in the central bonding region BD1 can be set to keep the conventional design value unchanged. For example, the spacing between adjacent pins 102 in the middle bonding region BD2 is equal, and the spacing between adjacent pins 102 in the two bonding regions BD1 is gradually reduced in the direction away from the center of the substrate 101. This can ensure that the spacing between adjacent pins 102 in the two bonding regions BD1 has a large reduction. In this way, the spacing between adjacent pins 102 in the printed circuit board 1 can be consistent with the spacing between pins in the flexible circuit board to be bonded. Therefore, misalignment of pins 102 in the printed circuit board 1 and pins in the flexible circuit board can be avoided, ensuring normal transmission of display signals, thereby avoiding display defects and improving display effect.

[0050] Figure 4 This is a schematic diagram of another printed circuit board structure provided in an embodiment of the present disclosure, such as... Figure 4 As shown, the spacing between adjacent pins 102 in the intermediate bonding region BD1 gradually decreases in the direction away from the center of the substrate 101.

[0051] Figure 4 The printed circuit board 1 shown is Figure 3 The difference in the printed circuit board 1 shown is that, Figure 3 In the printed circuit board 1 shown, the spacing between adjacent pins 102 in the intermediate bonding area BD2 is equal. Figure 4In the printed circuit board 1 shown, the spacing between adjacent pins 102 in the intermediate bonding area BD1 gradually decreases in the direction away from the center of the substrate 101. Considering the expansion of the substrate 101 corresponding to the intermediate bonding area BD1, while reducing the spacing between adjacent pins 102 in the two bonding areas BD2, the spacing between adjacent pins 102 in the intermediate bonding area BD1 is also reduced. Therefore, misalignment between the pins 102 in the printed circuit board 1 and the pins in the flexible circuit board can be avoided, further improving the bonding connection accuracy between the printed circuit board 1 and the flexible circuit board.

[0052] In some embodiments, the spacing difference between adjacent pins 102 in the intermediate binding region BD1 is arranged according to a second arithmetic sequence.

[0053] The substrate 101 has a width of W0 under normal conditions and a width of W1 after thermal expansion at high temperatures. Therefore, the expansion amount of the substrate 101 is W1 - W0, and the reduction in spacing between adjacent pins 102 is S = W1 - W0. The total number of spacings between adjacent pins in the middle bonding area BD1 and the two side bonding areas BD2 is n. The spacing between adjacent pins 102 in the two side bonding areas BD2 decreases according to a first arithmetic progression, and the spacing between adjacent pins 102 in the middle bonding area BD1 decreases according to a second arithmetic progression. When the common difference of the first arithmetic progression equals the common difference of the second arithmetic progression, that is, when the spacing between adjacent pins 102 in both the middle bonding area BD1 and the two side bonding areas BD2 decreases according to the first arithmetic progression, satisfying the formula for the summation of the first arithmetic progression, S = n × a1 + n(n-1)d1 / 2, where a1 = d1, the first common difference d1 of the reduced first arithmetic progression can be calculated.

[0054] like Figure 4 As shown, assuming the standard design value of the spacing between adjacent pins 102 is A, the first spacing value is A-d1, the second spacing is designed to decrease by an arithmetic progression of d1, that is, the second spacing value is A-2d1, the third spacing is designed to decrease by A-3d1, ..., and the last spacing value is A-nd1. For example, if the substrate 101 needs to be reduced by an amount S = 70 μm, and the number of pitches between adjacent pins 102 in the bonding areas BD1 on both sides is n = 500, then d1 = 0.00056 μm. If the normal design value of the pitch between adjacent pins 102 in the bonding areas BD2 on both sides is 140 μm, then the actual design value of the first pitch is 140 - 0.00056 = 139.99944 μm, the actual design value of the second pitch is 140 - 0.00056 × 2 = 139.99888 μm, the actual design value of the third pitch is 140 - 0.00056 × 3 = 139.99832 μm, ..., and the last pitch value is 140 - 0.00056 × 500 = 139.72 μm.

[0055] In a high-temperature environment, the spacing between adjacent pins 102 on the substrate 101 is increased, for example, from 139.72um to 140um, or from 139.99832um to 140um. In this way, the spacing between adjacent pins 102 in the printed circuit board 1 can be consistent with the spacing between pins in the flexible circuit board to be bonded. Therefore, misalignment between the pins 102 in the printed circuit board 1 and the pins in the flexible circuit board can be avoided, ensuring the normal transmission of display signals, thereby avoiding display defects and improving the display effect.

[0056] It is understandable that in printed circuit board 1, the expansion is more severe at locations farther from the center of the substrate 101. The tolerance of the second arithmetic progression can also be smaller than the tolerance of the first arithmetic progression; the specific calculation process will not be detailed here. When the tolerance of the second arithmetic progression is 0, the spacing between adjacent pins 102 in the intermediate bonding area BD1 is equal, and its structure can be referenced... Figure 3 As shown.

[0057] In some embodiments, such as Figure 4 As shown, in the central bonding area BD1, starting from the second reference point, the spacing between adjacent pins 102 gradually decreases in the direction away from the center of the substrate 101; the pins 102 include: bonding pins 1021 and redundant pins 1022; the second reference point is the redundant pin 1022 near the center of the substrate 101.

[0058] Pin 102 may include a bonding pin 1021 and a redundant pin 1022. The bonding pin 1021 is the pin 102 that is actually bonded to the flexible circuit board, and the redundant pin 1022 is an unused pin 102, which is generally located at a corresponding position between two flexible circuit boards. The bonding pin 1021 can transmit display signals normally, while the redundant pin 102 does not transmit display signals.

[0059] The second reference point is the first pin 102 corresponding to the point where the spacing between adjacent pins 102 begins to decrease. The redundant pin 1022 closest to the center of the substrate 101 can be selected as the second reference point. Starting from the second reference point, the spacing between adjacent pins 102 gradually decreases in the direction away from the center of the substrate 101. This can avoid the amount of spacing reduction between adjacent pins 102 near the second reference point being too small, which would affect the bonding connection effect.

[0060] In some implementations, such as Figure 3 and Figure 4 As shown, the width of the middle binding area BD1 is less than or equal to half the width of the two binding areas BD2.

[0061] In the printed circuit board 1, the expansion is more severe at locations farther from the center of the substrate 101. Therefore, the width of the central bonding area BD1 can be set relatively small, while the widths of the two side bonding areas BD2 can be set relatively large. This ensures that the spacing between adjacent pins 102 on the substrate 101 after expansion under high-temperature conditions remains consistent with the spacing between pins in the flexible circuit board to be bonded. This prevents misalignment between the pins 102 in the printed circuit board 1 and the pins in the flexible circuit board, ensuring normal transmission of display signals, thus avoiding display defects and improving display quality. For example, the width of the central bonding area BD1 can be less than or equal to half the width of the two side bonding areas BD2.

[0062] It should be noted that the pins 102 on the substrate 101 can be divided into multiple segments depending on the number of flexible circuit boards to be bonded. For example, when the number of flexible circuit boards to be bonded is 1, 2, 3, 4, 5, or 6, the number of segments of pin 102 will be 1, 2, 3, 4, 5, or 6 respectively. Different segments of pin 102 can be set in the middle bonding area BD1 and the two side bonding areas BD2. The implementation principle is similar to that described above and will not be detailed here.

[0063] Secondly, embodiments of this disclosure provide a display module. Figure 5 This is a schematic diagram of the structure of a display module provided in an embodiment of the present disclosure, such as... Figure 5 As shown, the display module includes a printed circuit board 1 as provided in any of the above embodiments, and further includes a flexible circuit board 2, a driver chip 3, and a display panel 4. The driver chip 3 is located on the printed circuit board 1. The printed circuit board 1 is located on the backlight side of the display panel 4 and is bonded to the display panel 4 through the flexible circuit board 2. The driver chip 3 can provide display signals and is connected to the display panel 4 through the printed circuit board 1 and the flexible circuit board 2 to transmit display signals to the display panel 4 to realize the display function. It should be noted here that... Figure 5 The display module shown is a structural diagram of the flexible circuit board 2 in the unfolded state. In practical applications, the flexible circuit board 2 can be bent to the back of the display panel 4 (i.e., the non-light-emitting side) to place the printed circuit board 1 and the driving chip 3 and other devices on it on the back of the display panel 4, thereby reducing the bottom bezel of the display panel and improving the display effect.

[0064] The implementation principle and beneficial effects of the display module provided in this embodiment are similar to those of the printed circuit board provided in any of the above embodiments, and will not be described in detail here.

[0065] Thirdly, this disclosure provides a display device, which includes a display module as provided in any of the above embodiments. Specifically, the display device can be any product or component with display function, such as a mobile phone, tablet computer, television, computer monitor, laptop computer, digital photo frame, or navigator. Its implementation principle and beneficial effects are the same as those of the above-mentioned display module, and will not be repeated here.

[0066] It should be noted that the dimensions of layers and regions may be exaggerated in the accompanying drawings for clarity. Furthermore, it is understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element, or there may be intermediate layers. Additionally, it is understood that when an element or layer is referred to as being "below" another element or layer, it can be directly below the other element, or there may be more than one intermediate layer or element. Furthermore, it is also understood that when a layer or element is referred to as being "between" two layers or two elements, it can be the only layer between the two layers or two elements, or there may be more than one intermediate layer or element. Similar reference numerals throughout indicate similar elements.

[0067] In the several embodiments provided in this disclosure, it should be understood that the disclosed apparatus can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the positions of the components shown are only logical functional positions, and in actual implementation, they may be arranged in other positions.

[0068] It is understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of this disclosure, and this disclosure is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and substance of this disclosure, and these modifications and improvements are also considered to be within the scope of protection of this disclosure.

Claims

1. A printed circuit board having a bonding area, characterized by, The printed circuit board comprises a substrate, a plurality of pins arranged side by side on the substrate and in the binding area; the binding area is divided into a middle binding area and two side binding areas; The distance between adjacent pins in the two side binding areas gradually decreases in a direction away from the center of the substrate, and the maximum distance between adjacent pins in the two side binding areas is less than the minimum distance between adjacent pins in the middle binding area.

2. The printed circuit board of claim 1, wherein, The difference between the distances between adjacent pins in the two side binding areas is arranged in a first arithmetic sequence.

3. The printed circuit board of claim 1, wherein, In the two side binding areas, the distance between adjacent pins gradually decreases in a direction away from the center of the substrate starting from a first reference point; the pins comprise binding pins and redundant pins; the first reference point is the redundant pin close to the center of the substrate.

4. The printed circuit board of claim 2, wherein, The distance between adjacent pins in the middle binding area is equal.

5. The printed circuit board of claim 2, wherein, The distance between adjacent pins in the middle binding area gradually decreases in a direction away from the center of the substrate.

6. The printed circuit board of claim 5, wherein, The difference between the distances between adjacent pins in the middle binding area is arranged in a second arithmetic sequence.

7. The printed circuit board of claim 6, wherein, The common difference of the second arithmetic sequence is less than or equal to the common difference of the first arithmetic sequence.

8. The printed circuit board of claim 5, wherein, In the center binding area, the distance between adjacent pins gradually decreases in a direction away from the center of the substrate starting from a second reference point; the pins comprise binding pins and redundant pins; the second reference point is the redundant pin close to the center of the substrate.

9. The printed circuit board of claim 1, wherein, The width of the middle binding area is less than or equal to half the width of the two side binding areas.

10. A display module, characterized by The display module comprises the printed circuit board according to any one of claims 1 to 9.

11. The display module of claim 10, wherein, The display module further comprises a flexible circuit board, a driving chip, and a display panel; The driving chip is located on the printed circuit board; The printed circuit board is located on the backlight side of the display panel and is bound to the display panel through the flexible circuit board.

12. A display device, characterized by comprising: The display device comprises the display module according to claim 10 or 11.

Images