Flaky wafer thinning processing lossless fixing device

Abstract

The utility model relates to the technical field of thinning processing lossless fixing devices, in particular to a sheet wafer thinning processing lossless fixing device which comprises a device body used for bearing a wafer and an electric adsorption disc used for adsorbing and fixing the wafer, and the electric adsorption disc is embedded in the surface of the device body. A plurality of annularly arranged grooves are formed in the surface of the device main body, moving assemblies are arranged in the grooves, each moving assembly comprises a moving block, a guide rod, a limiting groove, a moving plate, a clamping block and a spring ring, the guide rods are fixedly connected in the grooves, and the moving blocks are connected to the outer sides of the guide rods in a sliding mode. Through the arrangement of the plurality of limiting rings and the moving assembly, upward movement and storage of the limiting rings are facilitated, the plurality of limiting rings with different diameters can be suitable for wafers with different diameters, the universality of the device main body is improved, and through the arrangement of the lifting assembly, vertical movement of the limiting rings is conveniently controlled.

Description

Technical Field

[0001] This utility model relates to the technical field of non-destructive fixing devices for thinning processing, specifically a non-destructive fixing device for thinning sheet wafers. Background Technology

[0002] A wafer is a thin sheet material used to manufacture integrated circuits (ICs). It is mainly made of high-purity single-crystal silicon. The wafer is usually circular in shape. Wafer thinning is the main process step to achieve miniaturization of integrated circuits. During the thinning process, it is usually necessary to use a non-destructive wafer surface fixing device to fix it, so as to facilitate thinning.

[0003] Before thinning, the wafer needs to be placed on the surface of a fixing device and fixed by an adsorption plate. To avoid wafer position displacement caused by the inertial force generated by the high-speed rotation of the thinning device and the fixing device during the thinning process, the adsorption plate is usually used in conjunction with a limiting ring to further limit the wafer position. However, the limiting ring is usually fixedly connected to the fixing device, which makes the fixing device only applicable to wafers of the same diameter, resulting in low versatility of the fixing device. Therefore, a non-destructive fixing device for wafer thinning is proposed to address the above problems. Utility Model Content

[0004] The purpose of this invention is to provide a non-destructive fixing device for thinning wafers, so as to solve the problem that the fixing device is only applicable to wafers of the same diameter, resulting in low versatility.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A non-destructive fixing device for thinning wafers includes a main body for supporting the wafer and an electric adsorption disk for adsorbing and fixing the wafer. The electric adsorption disk is embedded in the surface of the main body, and several annular grooves are formed on the surface of the main body. A moving component is provided in each groove. The moving component includes a moving block, a guide rod, a limiting groove, a moving plate, a locking block, and a spring ring. The guide rod is fixedly connected in the groove, and the moving block is slidably connected to the outside of the guide rod. A limiting ring is fixedly connected to the top of the moving block, and a limiting groove is formed in the moving block. The moving plate is slidably connected in the limiting groove. A hemispherical locking block is fixedly connected to one end of the moving plate, and a spring ring is provided at the other end of the moving plate.

[0007] Preferably, there are four hemispherical recesses on the surface of the guide rod, and two of the recesses on the guide rod are in close contact with the locking blocks on both sides of the moving block.

[0008] Preferably, the spring ring is disposed between the inner wall of the moving plate and the limiting groove, and a through hole is provided on one side of both the limiting ring and the moving block, and the through hole provided by the limiting ring and the moving block fits with the guide rod.

[0009] Preferably, the surface of the limiting ring is provided with a storage groove with one side arc-shaped, and a lifting assembly is provided in the storage groove. The lifting assembly includes a spring telescopic rod, a rotating shaft and a rubber layer.

[0010] Preferably, a rotating shaft is fixedly connected inside the storage slot, and a spring telescopic rod is rotatably connected to the outside of the rotating shaft. A rubber layer is fixedly connected to one end of the spring telescopic rod, and the rubber layer is tightly fitted to the inner wall of the storage slot.

[0011] Compared with the prior art, the beneficial effects of this utility model are:

[0012] In this invention, a device body, an electric suction plate, limiting rings, grooves, a moving component, a moving block, a guide rod, a limiting groove, a moving plate, a locking block, and a spring ring are provided. Several limiting rings of different diameters that can move up and down can be stored on the same plane as the device body. By controlling the upward movement of the limiting rings of different diameters, the purpose of limiting wafers of different specifications can be achieved, increasing the versatility of the device body. The lifting component, spring telescopic rod, rotating shaft, and storage groove are provided. The storage groove, which is arc-shaped at one end, makes it easy for the user to rotate the spring telescopic rod out, thereby facilitating the control of the up and down movement of the limiting rings. The rubber layer increases the friction between the spring telescopic rod and the inner wall of the storage groove, making it less likely to move after storage, while also protecting one end of the spring telescopic rod from wear. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0014] Figure 2 This utility model Figure 1 A schematic diagram of the structure at point A;

[0015] Figure 3 This is a schematic diagram of the installation structure of the limiting ring of this utility model;

[0016] Figure 4 This utility model Figure 3 A schematic diagram of the structure at point B;

[0017] Figure 5 This utility model Figure 3 A schematic diagram of the structure at point C.

[0018] In the diagram: 1. Main body of the device; 2. Electric suction plate; 3. Limiting ring; 4. Groove; 5. Moving component; 51. Moving block; 52. Guide rod; 53. Limiting groove; 54. Moving plate; 55. Locking block; 56. Spring ring; 6. Lifting component; 61. Spring telescopic rod; 62. Rotating shaft; 63. Rubber layer; 7. Storage groove. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0021] Please see Figure 1-5 This utility model provides a technical solution:

[0022] A non-destructive fixing device for thinning wafers includes a main body 1 for supporting the wafer and an electric adsorption plate 2 for adsorbing and fixing the wafer. The electric adsorption plate 2 is embedded in the surface of the main body 1. Several annularly arranged grooves 4 are formed on the surface of the main body 1. A moving component 5 is provided in the groove 4. The moving component 5 includes a moving block 51, a guide rod 52, a limiting groove 53, a moving plate 54, a locking block 55, and a spring ring 56. The guide rod 52 is fixedly connected in the groove 4, and the moving block 51 is slidably connected to the outside of the guide rod 52. A limiting ring 3 is fixedly connected to the top of the moving block 51. A limiting groove 53 is opened in the moving block 51. A moving plate 54 is slidably connected in the limiting groove 53. A hemispherical locking block 55 is fixedly connected to one end of the moving plate 54. A spring ring 56 is provided at the other end of the moving plate 54. With the setting of several limiting rings 3 and moving components 5, it is convenient for the limiting rings 3 to move upward and be stored. Several limiting rings 3 of different diameters can be used for wafers of different diameters, which improves the versatility of the main body 1 of the device. The lifting component 6 is set to facilitate the control of the up and down movement of the limiting rings 3.

[0023] There are four hemispherical recesses on the surface of the guide rod 52. Two of the recesses on the guide rod 52 fit tightly with the locking blocks 55 on both sides of the moving block 51, which facilitates easy fixation of the moving block 51 after it moves. The spring ring 56 is set between the inner wall of the moving plate 54 and the limiting groove 53. The limiting ring 3 and the moving block 51 both have through holes on one side. The through holes of the limiting ring 3 and the moving block 51 fit with the guide rod 52, which facilitates the movement of the moving block 51. The surface of the limiting ring 3 has a storage groove 7 with one side arc-shaped. The storage groove 7 has a lifting assembly 6. The lifting assembly 6 includes a spring telescopic rod 61, a rotating shaft 62 and a rubber layer 63, which facilitates the removal of the spring telescopic rod 61. The rotating shaft 62 is fixedly connected in the storage groove 7. The spring telescopic rod 61 is rotatably connected to the outside of the rotating shaft 62. One end of the spring telescopic rod 61 is fixedly connected to the rubber layer 63. The rubber layer 63 fits tightly with the inner wall of the storage groove 7, which facilitates the storage of the spring telescopic rod 61.

[0024] Workflow: In use of the non-destructive fixing device for wafer thinning, the main body 1 is positioned below the thinning device. A suitable diameter limiting ring 3 is selected based on the wafer diameter. The user inserts their finger into the arc-shaped position of the receiving groove 7 on the limiting ring 3, and then pulls out one end of the spring telescopic rod 61. At this time, the other end of the spring telescopic rod 61 rotates outside the rotating shaft 62. After the spring telescopic rod 61 is pulled out, the user holds it and moves it upwards. The spring telescopic rod 61 acts as a handle, causing the limiting ring 3 and the moving block 51 to move upwards simultaneously. The moving block 51 moves outside the guide rod 52. During this movement, the locking block 55 moves towards the limiting groove 53 within the moving block 51, causing the moving plate 54 to move in the same direction within the limiting groove 53. The spring ring 56 is compressed. After moving to the appropriate position on the guide rod 52, the locking block 55 pops out again, pressing against the hemispherical recess on the other part of the guide rod 52, thus supporting the upward movement. The limiting ring 3 effectively limits the movement of the wafer. Then, the user retracts and rotates the spring telescopic rod 61 to store it in the storage groove 7. At this time, the rubber layer 63 is tightly attached to the inner wall of the storage groove 7. The elasticity of the spring telescopic rod 61 and the rubber layer 63 work together to make it difficult to move after storage. At this time, the wafer is placed directly above the electric adsorption plate 2. The thickness of the wafer is greater than the height of the limiting ring 3. The external power supply of the electric adsorption plate 2 is turned on to make it work and adsorb and fix the wafer. At the same time, the limiting ring 3 further limits the wafer. Then, the thinning device and the main body 1 are started to make it rotate at high speed while grinding and thinning the wafer. The setting of several limiting rings 3 and moving components 5 facilitates the upward movement and storage of the limiting rings 3. Several limiting rings 3 of different diameters can be used for wafers of different diameters, improving the versatility of the main body 1. The setting of the lifting component 6 facilitates the control of the up and down movement of the limiting rings 3.

[0025] Contents not described in detail in this specification are existing technologies known to those skilled in the art. Standard parts used in this invention can all be purchased commercially, and irregularly shaped parts can be custom-made according to the description and drawings. The specific connection methods for each part all employ conventional methods such as bolts, rivets, and welding, which are already mature technologies. The machinery, parts, and equipment all use conventional models from the prior art, and the circuit connections also employ conventional connection methods from the prior art, which will not be detailed here.

[0026] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A sheet wafer thinning processing non-destructive fixing device, comprising a device main body (1) for carrying a wafer and an electric adsorption disc (2) for adsorbing and fixing the wafer, characterized in that: The device body (1) surface embedded with electric adsorption disc (2), the device body (1) surface is provided with a plurality of annular recess (4) is set, the recess (4) is equipped with moving assembly (5), the moving assembly (5) includes moving block (51), guide rod (52), limit slot (53), moving plate (54), clamping block (55) and spring ring (56), the recess (4) is fixedly connected with guide rod (52), the outer side of guide rod (52) is slidably connected with moving block (51), the moving block (51) top is fixedly connected with limit ring (3), the moving block (51) is provided with limit slot (53), the limit slot (53) is slidably connected with moving plate (54), the moving plate (54) one end is fixedly connected with the clamping block (55) of half spherical shape, the other end of moving plate (54) is equipped with spring ring (56).

2. The wafer thinning processing non-destructive fixing device according to claim 1, wherein: The four spherical recesses are set on the surface of the guide rod (52), and the two recesses of the guide rod (52) are tightly fitted with the clamping blocks (55) on both sides of the moving block (51).

3. The wafer thinning processing non-destructive fixing device according to claim 1, wherein: The spring ring (56) is arranged between the moving plate (54) and the inner wall of the limit slot (53), the limit ring (3) and the moving block (51) are provided with through holes, and the through holes of the limit ring (3) and the moving block (51) are fitted with the guide rod (52).

4. The wafer thinning processing non-destructive fixing device according to claim 1, wherein: The limit ring (3) is provided with a receiving groove (7) with one side being arc-shaped, the receiving groove (7) is provided with a pulling assembly (6), and the pulling assembly (6) comprises a spring telescopic rod (61), a rotating shaft (62) and a rubber layer (63).

5. The wafer thinning processing non-destructive fixing device according to claim 4, wherein: The rotating shaft (62) is fixedly connected in the receiving groove (7), the spring telescopic rod (61) is rotatably connected outside the rotating shaft (62), one end of the spring telescopic rod (61) is fixedly connected with the rubber layer (63), and the rubber layer (63) is tightly fitted with the inner wall of the receiving groove (7).

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