A multi-gradient porous ceramic chuck for wafer thinning and a preparation method thereof

By fabricating a multi-gradient porous ceramic chuck, the problem of insufficient edge adsorption force during wafer thinning was solved, achieving uniformity of adsorption force distribution and improved processing yield, making it suitable for industrial applications of large-size wafers.

CN122404017APending Publication Date: 2026-07-17NINGBO JIANGFENG TONGCHUANG SPECIAL CERAMICS TECHNOLOGY CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
NINGBO JIANGFENG TONGCHUANG SPECIAL CERAMICS TECHNOLOGY CO LTD
Filing Date
2026-04-20
Publication Date
2026-07-17

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Abstract

本发明提供一种晶圆减薄用多梯度多孔陶瓷吸盘及其制备方法,所述制备方法包括如下步骤:(1)混合碳化硅颗粒、烧结添加剂和烧结助剂形成混合原料,依次进行冷压成型和素坯加工,得到素坯多孔陶瓷;(2)将所述素坯多孔陶瓷放入模具中心位置,素坯多孔陶瓷周围空腔区域装填不同粒径的碳化硅颗粒和烧结助剂形成的混合料,填粉高度与素坯多孔陶瓷的高度一致,进行热压烧结,得到晶圆减薄用多梯度多孔陶瓷吸盘。本发明所述制备方法操作简单,制备成本较低,得到了径向从内至外孔隙率和孔径逐渐增大的多梯度多孔陶瓷吸盘,解决了边缘吸附力不足问题。
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