SOP32 plastic package structure
By improving the rib design and heat dissipation channels of the SOP32 molding compound, the problem of low bonding strength between the ribs and the chip island was solved, improving mechanical strength and heat dissipation performance, extending the chip's lifespan, and enhancing the reliability of soldering and assembly.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-28
- Publication Date
- 2026-03-31
AI Technical Summary
In the existing SOP32 molding compound structure, the connecting ribs are flat, which causes the connecting ribs and the chip island to shift when the molding compound is subjected to slight vibration, resulting in low bonding strength and short lifespan of the chip molding compound.
The design incorporates a ribbed design with a bending section and a stabilizing section. The lower surface of the stabilizing section has a wave-shaped structure. Combined with the mechanical stress dispersion design of the horizontal, first inclined, and vertical sections, the substrate island has a heat dissipation channel filled with thermally conductive material. The external leads are designed with a vertical structure and bosses, and positioning holes are set on the plastic package.
It enhances the bonding strength between the reinforcing ribs and the encapsulation, improves mechanical strength, enhances heat dissipation, ensures the stability and lifespan of the chip encapsulation, and improves the reliability of welded connections and the precision of automated assembly.
Smart Images
Figure CN224069094U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of encapsulation technology, and in particular to an SOP32 encapsulation structure. Background Technology
[0002] The existing SOP32 molding compound structure includes a chip island, connecting ribs, and a molding compound. The chip is connected to the chip island, and connecting ribs are connected to the left and right sides of the chip island. The molding compound encapsulates the outer sides of the chip island and connecting ribs. When the chip molding compound is soldered onto the PCB board for operation, the chip generates heat. If the operation time is too long, gaps will form between the molding compound and the chip island. Most of the connecting ribs are flat. If the molding compound is subjected to slight vibration, the connecting ribs and the chip island will shift within the molding compound. The bonding strength between the chip island and the molding compound is low, resulting in a short lifespan for the chip molding compound.
[0003] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this disclosure, and therefore may include information that does not constitute prior art known to those skilled in the art. Utility Model Content
[0004] To address the shortcomings of existing technologies, this utility model discloses an SOP32 molding compound structure to solve the problem that most of the connecting ribs are flat, and if the molding compound is subjected to slight vibration, the connecting ribs and the chip island will shift within the molding compound, resulting in low bonding strength between the chip island and the molding compound and a short lifespan for the chip molding compound.
[0005] The technical solution adopted in this utility model is as follows:
[0006] An SOP32 molding compound includes:
[0007] A wafer carrier island, on which a chip is mounted, and sixteen external pins are respectively arranged on the upper and lower sides of the wafer carrier island, and thirty-two external pins are bonded to the chip;
[0008] The connecting rib has two sections, each including a bent section and a stabilizing section. The two bent sections are symmetrically located at the left and right ends of the slide island, and the stabilizing section is located at the end of the bent section away from the slide island. The lower surface of the stabilizing section is a wave-shaped structure extending along the length of the slide island.
[0009] A molding compound, which is molded onto the outside of the substrate island, the connecting ribs, and a portion of the outer leads.
[0010] A further technical solution is that the bending section includes a horizontal part, a first inclined part, and a vertical part. The two horizontal parts are symmetrically located at the left and right ends of the slide island. The first inclined part is located at the end of the horizontal part away from the slide island. The first inclined part is inclined downward in the direction away from the slide island. The lower side of the vertical part is connected to the end of the first inclined part away from the slide island. The stabilizing section is located on the upper side of the vertical part.
[0011] A further technical solution is that the connecting rib further includes a tail section, the tail section including a second inclined portion and a forked portion, the second inclined portion being disposed at one end of the stable section away from the slide island, the second inclined portion being inclined upward in the direction away from the slide island, and the forked portion being disposed at one end of the second inclined portion away from the slide island.
[0012] A further technical solution is that the lower side of the substrate island is exposed outside the encapsulation body, the outer pin is located outside the encapsulation body at one end away from the substrate island, and the forked portion of the connecting rib is located outside the encapsulation body at one end away from the substrate island.
[0013] A further technical solution is that a heat dissipation channel is provided inside the carrier island, and the heat dissipation channel is filled with a thermally conductive material.
[0014] A further technical solution is that the outer pins are located on the outer part of the plastic package and have a vertical structure.
[0015] A further technical solution is that the outer pin is provided with protrusions on both sides on the outer part of the plastic package.
[0016] A further technical solution is that a bonding area is set on one end of the 32 external pins on both sides of the wafer island, and the bonding area is bonded to the chip on the wafer island through bonding wires.
[0017] A further technical solution is that the encapsulated body has several positioning holes.
[0018] The beneficial effects of this utility model embodiment are as follows:
[0019] (I) An SOP32 molding compound structure includes a chip island, connecting ribs, and a molding compound body. The chip island is provided with a chip. Two bent sections are symmetrically located at the left and right ends of the chip island. When the chip island, external leads, chip, and connecting ribs are placed into a mold and molding compound material is filled for molding, the molding compound body is molded on the outside of the chip island, connecting ribs, and part of the external leads. The connecting ribs include bent sections and stabilizing sections. The stabilizing sections are located at the end of the bent sections away from the chip island. When the molding compound material is filled and the mold is closed, the lower surface of the stabilizing section is a wavy structure extending along the length of the chip island. The molding compound material wraps around the connecting ribs along the wavy stabilizing sections, increasing the contact area between the connecting ribs and the molding compound body, improving the bonding strength between the chip island and the molding compound body, and extending the service life of the chip molding compound body.
[0020] (II) Further, the bending section includes a horizontal section, a first inclined section, and a vertical section. Two horizontal sections are symmetrically located at the left and right ends of the substrate island. The first inclined section is located at the end of the horizontal section furthest from the substrate island, and it slopes downwards in the direction furthest from the substrate island. The lower side of the vertical section is connected to the end of the first inclined section furthest from the substrate island, and a stabilizing section is located on the upper side of the vertical section. Through the coordinated design of the horizontal section, the first inclined section, and the vertical section, the three-section bending disperses mechanical stress in different directions, enhancing the overall mechanical strength of the structure, making the stress distribution more uniform, reducing stress accumulation caused by temperature differences, and avoiding damage caused by localized stress concentration.
[0021] (III) Furthermore, the lower side of the substrate island is exposed outside the molding compound, and a heat dissipation channel is formed inside the substrate island, filled with thermally conductive material. Specifically, the heat dissipation channel is a serpentine channel, and the thermally conductive material is high thermal conductivity silicone grease. Through the combination of the exposed design of the substrate island and the serpentine heat dissipation channel, the heat dissipation effect of the substrate island is significantly improved. The filling of high thermal conductivity silicone grease further optimizes the heat conduction path, ensuring that heat can be quickly conducted from the substrate island to the outside, preventing excessive temperature from affecting system performance. Attached Figure Description
[0022] Figure 1 This is a front view schematic diagram of the SOP32 plastic sealing structure of this utility model.
[0023] Figure 2 This is a schematic diagram of the internal structure of the SOP32 plastic encapsulation structure of this utility model.
[0024] Figure 3 This is a front view schematic diagram of the substrate tray in the SOP32 plastic encapsulation structure of this utility model.
[0025] Figure 4 for Figure 3 Enlarged view at point A.
[0026] Figure 5 This is a bottom view of the SOP32 plastic sealing structure of this utility model.
[0027] In the picture:
[0028] 100, Sputtering island; 110, External pin; 111, Boss; 112, Bonding area; 120, Heat dissipation channel; 200, Connecting rib; 210, Bending section; 211, Horizontal section; 212, First inclined section; 213, Vertical section; 220, Stabilizing section; 230, Tail section; 231, Second inclined section; 232, Forked section; 300, Molded body; 301, Positioning hole. Detailed Implementation
[0029] The specific embodiments of this utility model are described below with reference to the accompanying drawings.
[0030] To make the objectives, technical solutions, and advantages of this utility model clearer, the device proposed by this utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. The advantages and features of this utility model will become clearer according to the following description. It should be noted that the accompanying drawings are in a very simplified form and use non-precise proportions, only used to conveniently and clearly assist in illustrating the purpose of the embodiments of this utility model. Please refer to the accompanying drawings to make the objectives, features, and advantages of this utility model more apparent and understandable. It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are only used to complement the content disclosed in the specification, for those skilled in the art to understand and read, and are not intended to limit the implementation conditions of this utility model. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportional relationships, or adjustments to the size, without affecting the effects and objectives that this utility model can produce, should still fall within the scope of the technical content disclosed in this utility model.
[0031] Example:
[0032] Figure 1 This is a front view schematic diagram of the SOP32 plastic sealing structure of this utility model. Figure 2 This is a schematic diagram of the internal structure of the SOP32 plastic encapsulation structure of this utility model. (See attached diagram.) Figures 1-2 As shown, an SOP32 molding compound includes a wafer island 100, connecting ribs 200, and a molding compound 300. A chip is mounted on the wafer island 100, and sixteen external leads 110 are respectively disposed on the upper and lower sides of the wafer island 100, with thirty-two external leads 110 bonded to the chip. For example, a bonding area 112 is disposed on one end of the thirty-two external leads 110 on both sides of the wafer island 100 near the wafer island 100, and the bonding area 112 is bonded to the chip on the wafer island 100 via bonding wires.
[0033] like Figures 1-2As shown, there are two connecting ribs 200, each including a bent section 210 and a stabilizing section 220. The two bent sections 210 are symmetrically located at the left and right ends of the substrate island 100, and the stabilizing section 220 is located at the end of the bent section 210 away from the substrate island 100. The lower surface of the stabilizing section 220 has a wavy structure extending along the length of the substrate island 100. The encapsulating body 300 is encapsulated on the outside of the substrate island 100, the connecting ribs 200, and part of the outer leads 110.
[0034] Figure 3 This is a front view schematic diagram of the substrate tray in the SOP32 plastic encapsulation structure of this utility model. Figure 4 for Figure 3 A magnified view at point A. (See image below.) Figures 3-4 As shown, the bending section 210 further includes a horizontal section 211, a first inclined section 212, and a vertical section 213. The two horizontal sections 211 are symmetrically located at the left and right ends of the substrate island 100. The first inclined section 212 is located at the end of the horizontal section 211 away from the substrate island 100, and it slopes downwards in the direction away from the substrate island 100. The lower side of the vertical section 213 is connected to the end of the first inclined section 212 away from the substrate island 100. The stabilizing section 220 is located on the upper side of the vertical section 213. Through the coordinated design of the horizontal section 211, the first inclined section 212, and the vertical section 213, the three-section bending disperses the mechanical stress to different directions, enhancing the mechanical strength of the entire structure, making the stress distribution more uniform, reducing stress accumulation caused by temperature differences, and avoiding damage caused by localized stress concentration.
[0035] like Figures 2-4 As shown, the connecting rib 200 further includes a tail section 230, which includes a second inclined portion 231 and a forked portion 232. The second inclined portion 231 is located at one end of the stabilizing section 220 away from the substrate island 100, and the second inclined portion 231 is inclined upward in the direction away from the substrate island 100. The forked portion 232 is located at one end of the second inclined portion 231 away from the substrate island 100. For example, the portion of the outer lead 110 away from the substrate island 100 is located outside the molding compound 300, and the portion of the forked portion 232 of the connecting rib 200 away from the substrate island 100 is also located outside the molding compound 300. The second inclined portion 231 can effectively disperse the stress transmitted from the carrier island 100 or the outer lead 110 to the tail section 230, avoid local stress concentration, and help the whole structure remain stable. The forked portion 232 provides a larger contact area, which allows the tail section 230 to form a stronger connection with the encapsulation body 300 and the outer lead 110, enhances the bonding strength between the connecting rib 200 and the encapsulation body 300, and reduces the risk of detachment or loosening.
[0036] Figure 5 This is a bottom view of the SOP32 plastic sealing structure of this utility model. Figure 5As shown, the lower side of the substrate island 100 is exposed outside the molding compound 300. A heat dissipation channel 120 is formed within the substrate island 100, and the heat dissipation channel 120 is filled with a thermally conductive material. Specifically, the heat dissipation channel 120 is a serpentine channel, and the thermally conductive material is high thermal conductivity silicone grease. Through the combination of the exposed design of the substrate island 100 and the serpentine heat dissipation channel 120, the heat dissipation effect of the substrate island 100 is significantly improved. The filling of high thermal conductivity silicone grease further optimizes the heat conduction path, ensuring that heat can be quickly conducted from the substrate island 100 to the outside, preventing excessive temperature from affecting system performance.
[0037] like Figure 5 As shown, the external pins 110 are located outside the molding compound 300 and are divided into vertical structures. During the molding process of the chip, the same upper and lower molds can be used by the operator. The operator does not need to design additional asymmetrical upper and lower molds, which improves the molding speed and saves the cost of mold manufacturing.
[0038] like Figure 5 As shown, furthermore, the outer pin 110 located outside the molding compound 300 is provided with protruding bosses 111 on both sides. The bosses 111 provide additional support surfaces for the pins, which helps to stabilize the soldering connection between the pins and the circuit board. The bosses 111 prevent the pins from bending or deforming excessively during soldering, increasing the strength and stability of the solder joint, and preventing the outer pin 110 from slipping or shifting during soldering, thereby reducing the risk of poor contact or soldering errors and enhancing the connection reliability of the package.
[0039] like Figure 5 As shown, the molding compound 300 further includes several positioning holes 301. These positioning holes 301 enable precise alignment between the molding compound 300 and circuit boards or other components in an automated production line, ensuring that the molding compound 300 does not shift during assembly, thereby improving the alignment accuracy of the automated equipment.
[0040] In this embodiment, during the plastic sealing process:
[0041] The chip is connected to the chip carrier island 100. The bonding area 112 of the external lead 110 is bonded to the chip carrier island 100 through bonding wires. Then, the chip carrier island 100, the connecting rib 200 and the external lead 110 are placed into the molding die. The preheated molding material is injected into the mold. The flowing molding material completely wraps the chip and the chip carrier island 100, filling the entire mold cavity. The molding material is further cured by heating, so that it changes from a semi-solid to a solid molding body 300, thus completing the molding of the SOP32 molding structure.
[0042] In this embodiment, when the molding compound is filled and the mold is closed, the lower surface of the stabilizing section 220 is a wave-shaped structure extending along the length of the chip island 100. The molding compound wraps around the connecting rib 200 along the wave-shaped stabilizing section 220, which increases the contact area between the connecting rib 200 and the molding compound 300, improves the bonding strength between the chip island 100 and the molding compound 300, and extends the service life of the chip molding compound 300.
[0043] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0044] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.
Claims
1. A SOP32 plastic package structure, characterized in that, The utility model relates to a chip carrier island and its manufacturing method, and belongs to the field of chip carrier island manufacturing. Chip carrier island (100) is provided with chip, and the upper and lower sides of chip carrier island (100) are respectively provided with sixteen outer pins (110), and thirty-two outer pins (110) are bonded with chip; Web (200) has two, and web (200) includes bending section (210) and stable section (220), two bending sections (210) are symmetrically arranged at the left and right ends of chip carrier island (100), stable section (220) is arranged at the end of bending section (210) away from chip carrier island (100), and the lower surface of stable section (220) is wave-shaped structure extending along the length direction of chip carrier island (100); Plastic package (300) is plasticly sealed on the outer side of chip carrier island (100), web (200) and part of outer pin (110).
2. The SOP32 plastic package structure of claim 1, wherein: Bending section (210) includes horizontal part (211), first inclined part (212) and vertical part (213), two horizontal parts (211) are symmetrically arranged at the left and right ends of chip carrier island (100), first inclined part (212) is arranged at the end of horizontal part (211) away from chip carrier island (100), first inclined part (212) is inclined downward in the direction away from chip carrier island (100), and the upper side of vertical part (213) is arranged at the end of first inclined part (212) away from chip carrier island (100).
3. The SOP32 plastic package structure of claim 2, wherein: Web (200) further includes tail section (230), tail section (230) includes second inclined part (231) and forked part (232), second inclined part (231) is arranged at the end of stable section (220) away from chip carrier island (100), second inclined part (231) is inclined upward in the direction away from chip carrier island (100), and forked part (232) is arranged at the end of second inclined part (231) away from chip carrier island (100).
4. The SOP32 plastic package structure of claim 3, wherein: The lower side of chip carrier island (100) is exposed outside plastic package (300), and the end of outer pin (110) away from chip carrier island (100) is partially located outside plastic package (300), and the end of forked part (232) of web (200) away from chip carrier island (100) is partially located outside plastic package (300).
5. The SOP32 plastic package structure of claim 4, wherein: Chip carrier island (100) is provided with heat dissipation channel (120), and heat dissipation channel (120) is filled with heat conductive material.
6. The SOP32 plastic package structure of claim 1, wherein: The outer pin (110) located outside the plastic package (300) is a vertical structure.
7. The SOP32 plastic package structure of claim 1, wherein: The outer pin (110) located outside the plastic package (300) is further provided with a boss (111) protruding to both sides.
8. The SOP32 plastic package structure of claim 1, wherein: The thirty-two outer pins (110) on both sides of the chip carrier island (100) are provided with a bonding area (112) near one end of the chip carrier island (100), and the bonding area (112) is bonded with the chip on the chip carrier island (100) through a bonding wire.
9. The SOP32 plastic package structure of claim 1, wherein: A plurality of positioning holes (301) are formed on the plastic package (300).