Device for filtering fine particles in degumming solution

Abstract

The utility model discloses a degumming solution fine particle filtering device which comprises a device body, and a filter, a filtering water pipe and a filtering box which are arranged in the device body, one side of the device body is provided with a potassium permanganate solution input port, a drain outlet, a neutralizer input port, a DI water input port, a diaphragm pump air inlet, a compressed air input port and a degumming solution output port, the potassium permanganate solution input port and the drain outlet are respectively communicated with a filter, and the filter is internally provided with a high-precision filter membrane bag of which the filter hole size is 0.1-1.0 mu m; the high-precision filter membrane bag is communicated with the filter box through a filter water pipe, a diaphragm pump is arranged in the filter box, an air inlet of the diaphragm pump and a degumming solution output port are respectively communicated with the diaphragm pump, and a neutralizer input port and a DI water input port are respectively communicated with the filter. According to the utility model, fine particles in the potassium permanganate degumming liquid medicine can be effectively removed, and the cleanliness of the liquid medicine is ensured, so that the copper plating consistency of a PCB (Printed Circuit Board) is ensured.

Description

Technical Field

[0001] This utility model relates to a filtration device, specifically a filtration device for removing fine particles from a solution containing adhesive residue. Background Technology

[0002] During PCB manufacturing, drilling produces resin residue, which mainly comes from epoxy resin residue, chemical reaction byproducts, and organic contaminants. The particle size is typically 0.1-50μm or even larger, with a focus on removing fine particles smaller than 1μm. If this residue is not thoroughly removed, it will affect the quality and performance of the PCB.

[0003] Potassium permanganate is a widely used method for removing solder slag in PCB hole cleaning processes, offering advantages such as good stability, cost-effectiveness, and ease of operation. During the removal process, potassium permanganate decomposes and removes solder slag through oxidation, thus ensuring the cleanliness of the PCB hole walls.

[0004] Potassium permanganate descaling solutions contain various chemicals to remove the adhesive residue generated during drilling. If particles are present in the solution, they may become trapped on the hole walls or board surface after descaling, affecting the quality of subsequent copper plating. When particles adhere to the hole walls, they hinder copper ion deposition, leading to uneven copper plating, with localized thin copper areas or even no copper at all. Potassium permanganate descaling solutions, by filtering out these fine particles, provide a relatively clean surface for copper ion deposition, resulting in a more uniform and dense copper plating layer.

[0005] Existing filtration processes for potassium permanganate descaling solutions, such as chemical cleaning, high-pressure water washing, and filter cartridge or core separation, have low efficiency in removing fine particles, which can easily lead to rough PCB hole walls or poor copper plating. Residue can also clog holes, hindering the exchange of the solution and increasing the scrap rate. Utility Model Content

[0006] The purpose of this invention is to overcome the shortcomings of the prior art and provide a micro-particle filtration device for removing adhesive residue solution. This device can effectively remove micro-particles from potassium permanganate adhesive residue removal solution, ensuring the cleanliness of the solution and thus guaranteeing the consistency of copper plating on PCBs.

[0007] The technical solution of this utility model is as follows:

[0008] A microparticle filtration device for removing adhesive residue solution includes a device body and a filter, a filter water pipe, and a filter box disposed within the device body. One side of the device body is provided with a potassium permanganate solution inlet, a drain outlet, a neutralizing agent inlet, a DI water inlet, a diaphragm pump air inlet, a compressed air inlet, and an adhesive residue solution outlet. The potassium permanganate solution inlet and the drain outlet are respectively connected to the filter. A first pneumatic valve is installed on the potassium permanganate solution inlet, and a second pneumatic valve is installed on the drain outlet. The filter has a high-precision filter with a pore size of 0.1–1.0 μm. The high-precision filter bag is connected to a filter box via a filter water pipe. A diaphragm pump is installed inside the filter box. The air inlet and the degumming solution outlet of the diaphragm pump are connected to the diaphragm pump. A third pneumatic valve is installed on the degumming solution outlet. A neutralizing agent inlet and a DI water inlet are connected to the filter. A fourth pneumatic valve is installed on the neutralizing agent inlet. A fifth pneumatic valve is installed on the DI water inlet. The compressed air inlet is connected to the first, second, third, fourth, and fifth pneumatic valves.

[0009] Furthermore, the potassium permanganate solution inlet uses a DN40 clamp connector.

[0010] Furthermore, the drain outlet adopts a DN50pp union.

[0011] Furthermore, the neutralizing agent inlet uses an SS316 D12 hose connector.

[0012] Furthermore, the DI water inlet uses a UPVC DN25 union connector.

[0013] Furthermore, the diaphragm pump inlet uses a D12 flexible air pipe connector.

[0014] Furthermore, the compressed air inlet uses a D12 flexible air hose connector.

[0015] Furthermore, the outlet of the degumming solution adopts a DN40 clamp connector.

[0016] Compared with existing technologies, the beneficial effects of this invention are as follows: This invention uses a high-precision filter membrane bag with a pore size of 0.1-1.0μm, which can intercept more than 99% of the fine glue residue particles (especially resin debris and organic matter <1μm) in the potassium permanganate descaling solution. After filtration, the solution is extracted by a diaphragm pump, making the purity of the solution close to 100%, ensuring the consistency of copper plating on the PCB. The potassium permanganate descaling solution filtered by this invention can greatly reduce the roughness of the PCB hole walls, reducing the hole wall roughness (Ra) to <0.8μm (compared to about 1.2μm in traditional processes, where microparticles adhering to the hole walls easily lead to uneven deposition during chemical copper plating), and improving the uniformity of the plating layer inside the holes. At the same time, it can avoid voids inside the PCB holes, and the blind hole filling rate after filtration is increased to >98% (compared to about 90% in traditional processes, where glue residue clogging blind holes easily forms copper plating blind areas), thereby reducing the risk of subsequent open circuits. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 A three-dimensional structural diagram of a microparticle filtration device for removing adhesive residue solution provided by this utility model;

[0019] Figure 2 An internal cross-sectional view of a microparticle filtration device for removing glue residue solution provided by this utility model. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0021] To illustrate the technical solution described in this utility model, specific embodiments are described below.

[0022] Example

[0023] Please see Figure 1 , Figure 2This embodiment provides a microparticle filtration device for removing glue residue solution, including a device body 1 and a filter 2, a filter water pipe 3, and a filter box 4 disposed within the device body 1. One side of the device body 1 is provided with a potassium permanganate solution inlet 11, a drain outlet 12, a neutralizing agent inlet 13, a DI water inlet 14, a diaphragm pump air inlet 15, a compressed air inlet 16, and a glue residue solution outlet 17. The potassium permanganate solution inlet 11 and the drain outlet 12 are respectively connected to the filter 2. A first pneumatic valve 111 is provided on the potassium permanganate solution inlet 11, and a second pneumatic valve 121 is provided on the drain outlet 12. The filter 2 has a high-precision filter with a pore size of 0.1–1.0 μm. The high-precision filter bag 21 is connected to the filter box 4 via the filter water pipe 3. The filter box 4 is equipped with a diaphragm pump 41. The air inlet 15 and the degumming solution outlet 17 of the diaphragm pump are respectively connected to the diaphragm pump 41. The degumming solution outlet 17 is equipped with a third pneumatic valve 171. The neutralizing agent inlet 13 and the DI water inlet 14 are respectively connected to the filter 2. The neutralizing agent inlet 13 is equipped with a fourth pneumatic valve 131. The DI water inlet 14 is equipped with a fifth pneumatic valve 141. The compressed air inlet 16 is connected to the first pneumatic valve 111, the second pneumatic valve 121, the third pneumatic valve 171, the fourth pneumatic valve 131 and the fifth pneumatic valve 141 respectively.

[0024] The potassium permanganate solution inlet 11 uses a DN40 clamp connector.

[0025] The sewage outlet 12 is a DN50pp union.

[0026] The neutralizer inlet 13 uses an SS316 D12 hose connector.

[0027] The DI water inlet 14 uses a UPVC DN25 union.

[0028] The diaphragm pump inlet 15 uses a D12 flexible air pipe connector.

[0029] The compressed air inlet 16 uses a D12 flexible air hose connector.

[0030] The degumming solution outlet 17 uses a DN40 clamp connector.

[0031] Its working principle is as follows: Compressed air is input through the compressed air inlet 16 to control the opening and closing of the first pneumatic valve 111, the second pneumatic valve 121, the third pneumatic valve 171, the fourth pneumatic valve 131, and the fifth pneumatic valve 141. Potassium permanganate solution is input into the filter through the potassium permanganate solution inlet 11. More than 99% of the fine glue residue particles in the potassium permanganate solution are intercepted by the high-precision filter membrane bag 21. The filtered pure potassium permanganate solution enters the filter box 4 through the filter water pipe 3. At the same time, neutralizing agent and DI water are input into the filter box 4 through the neutralizing agent inlet 13 and the DI water inlet 14 to mix with the pure potassium permanganate solution to obtain potassium permanganate glue residue removal solution. Finally, the potassium permanganate glue residue removal solution in the filter box 4 is output from the glue residue removal solution outlet 17 through the diaphragm pump 41.

[0032] The purity of the potassium permanganate descaling solution obtained by this micro-particle filtration device can approach 100%, thus ensuring the consistency of copper plating on the PCB. It can greatly reduce the roughness of the PCB hole walls, reducing the hole wall roughness (Ra) to <0.8μm (compared to about 1.2μm in traditional processes, where microparticles adhering to the hole walls can easily lead to uneven deposition during chemical copper plating), and improve the uniformity of the plating layer inside the holes. At the same time, it can avoid voids inside the PCB holes, and the blind via filling rate after filtration is increased to >98% (compared to about 90% in traditional processes, where descaling can easily form copper plating blind areas when blind vias are blocked), thereby reducing the risk of subsequent open circuits.

[0033] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A device for filtering fine particles from a solution containing adhesive residue, characterized in that: The device comprises a device body, a filter, a filter water pipe and a filter box arranged in the device body, one side of the device body is provided with a potassium permanganate solution input port, a sewage outlet, a neutralizing agent input port, a DI water input port, a diaphragm pump air inlet, a compressed air input port and a deslagging solution output port, the potassium permanganate solution input port and the sewage outlet are communicated with the filter respectively, the potassium permanganate solution input port is provided with a first pneumatic valve, the sewage outlet is provided with a second pneumatic valve, the inside of the filter is provided with a high-precision filter membrane bag with a filter hole size of 0.1-1.0 μm, the high-precision filter membrane bag is communicated with the filter box through the filter water pipe, the inside of the filter box is provided with a diaphragm pump, the diaphragm pump air inlet and the deslagging solution output port are communicated with the diaphragm pump respectively, the deslagging solution output port is provided with a third pneumatic valve, the neutralizing agent input port and the DI water input port are communicated with the filter respectively, the neutralizing agent input port is provided with a fourth pneumatic valve, the DI water input port is provided with a fifth pneumatic valve, and the compressed air input port is communicated with the first pneumatic valve, the second pneumatic valve, the third pneumatic valve, the fourth pneumatic valve and the fifth pneumatic valve respectively.

2. The device according to claim 1, wherein: The potassium permanganate solution input port adopts a DN40 clamp joint.

3. The device according to claim 1, wherein: The sewage outlet adopts a DN50 pp live joint.

4. The device of claim 1, wherein: The neutralizing agent input port adopts an SS316 D12 hose joint.

5. The device of claim 1, wherein: The DI water input port adopts a UPVC DN25 live joint.

6. The device of claim 1, wherein: The diaphragm pump air inlet adopts a D12 soft air pipe joint.

7. The device of claim 1, wherein: The compressed air input port adopts a D12 soft air pipe joint.

8. The device of claim 1, wherein: The deslagging solution output port adopts a DN40 clamp joint.

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