Chip surface defect detection equipment

Abstract

The utility model provides chip surface defect detection equipment, which relates to the technical field of chip manufacturing and comprises a support frame, a touch screen is fixedly connected to the front side of the top of the support frame, an appearance detection assembly is fixedly connected to the rear side of the top of the support frame, and a transmission support is rotatably connected to the middle of the outer surface of the support frame. A recycling box is arranged on the rear side of the supporting frame and arranged at the bottom of the rear side of the transmission support. According to the utility model, through mutual cooperation among the sliding columns, the L-shaped sliding clamping plates, the jacking springs and the pulling ring, an operator only needs to pull the pulling ring, so that the sliding columns can be driven to slide in the sliding grooves, the plurality of L-shaped sliding clamping plates can slide synchronously, a plurality of chips can be fixed and disassembled at the same time, and the working efficiency is improved. Compared with the prior art that each chip needs to be controlled by an independent telescopic motor, the chip fixing and dismounting efficiency is greatly improved, and the equipment cost is reduced.

Description

Technical Field

[0001] This utility model relates to the field of chip manufacturing technology, and in particular to a chip surface defect detection device. Background Technology

[0002] A chip, as the core component of modern electronic devices, is a miniaturized circuit module that integrates a large number of microelectronic components onto a semiconductor wafer. It has indispensable applications in many fields such as computers, communications, and consumer electronics.

[0003] During chip manufacturing, due to the complexity of the process and the influence of the production environment, various defects such as scratches, cracks, and impurities are easily generated on the chip surface. These defects can seriously affect the performance and reliability of the chip, and even lead to chip scrapping. Therefore, it is necessary to use surface defect detection equipment to inspect the chip surface in order to detect and remove defective chips in a timely manner. Surface defect detection equipment is a device used to check whether there are defects such as flaws and damages on the surface of a product. Through specific detection methods, it can accurately identify various abnormalities on the product surface.

[0004] In the prior art, such as Chinese Patent Publication No. CN219694936U, a chip surface defect detection structure is disclosed. It includes a box body with a cavity on the top of the box body. A placement plate is placed in the cavity, and a connecting plate is provided on the side of the placement plate. A servo motor is provided on the side of the box body. Multiple placement slots are evenly distributed on the placement plate. A first telescopic motor is provided on the side of the placement slot. The drive rod of the first telescopic motor is connected to a clamping plate. A slide rail is symmetrically distributed on the back of the placement plate near the side. A slide rod is slidably connected in the slide rail. Multiple stops corresponding to the placement slots are evenly distributed on the slide rod. A support is provided on the top of the box body on the side of the cavity. By placing the chip in the placement slot, the first telescopic motor can be used to push the clamping plate to hold the chip after placement. Then, the second telescopic motor can be used to push the stops away from the chip, and then the detection can be performed. After the detection is completed, the servo motor drives the placement plate to flip, and then the detection is performed again, thereby realizing double-sided detection of the chip.

[0005] Although the aforementioned patent achieves double-sided chip inspection by using a servo motor to drive the placement plate to flip, each chip requires a separate telescopic motor to control its fixing and disassembly. In actual large-scale inspection, this not only results in high equipment costs but also cumbersome operation and low efficiency. Furthermore, the patent lacks a convenient way to handle defective chips detected, requiring manual collection and processing, which is not conducive to improving the overall smoothness of the inspection process. Utility Model Content

[0006] This invention proposes a chip surface defect detection device. By optimizing the chip fixing and disassembly methods and adding an automatic defect chip recycling structure, it improves chip detection efficiency and the convenience of defective chip processing, thereby solving the problems mentioned in the background art.

[0007] To achieve the above objectives, the present invention adopts the following technical solution: a chip surface defect detection device, comprising a support frame, a touch screen fixedly connected to the top front side of the support frame, an appearance inspection component fixedly connected to the top rear side of the support frame, a transmission bracket rotatably connected to the middle of the outer surface of the support frame, and a recycling bin disposed at the rear side of the support frame, the recycling bin being disposed at the bottom rear side of the transmission bracket.

[0008] The transmission bracket includes a rotating plate, which is rotatably connected to the middle of the outer surface of the support frame. Several vertically penetrating placement slots are provided on both the front and rear sides of the rotating plate. Grooves are provided on both the left and right sides of the inner surface of the placement slots. An L-shaped rotating baffle is rotatably connected to the lower rear side of the inner surface of the placement slots. Fixing components are slidably connected to both the front and rear sides of the rotating plate.

[0009] Preferably, the support frame has a movable groove on its left side, a drive motor is fixedly connected to the top of the inner wall of the movable groove, and a transmission gear is fixedly connected to the output shaft of the drive motor.

[0010] Preferably, a transmission gear ring is meshed with the outer surface of the transmission gear, and the transmission gear ring is fixedly connected to the middle of the transmission bracket.

[0011] Preferably, the fixing component includes a sliding column, the rotating plate has a sliding groove inside, the sliding column is slidably connected to the inner surface of the sliding column, and the front end of the sliding column extends through to the front side of the rotating plate and is fixedly connected to a pull ring.

[0012] Preferably, L-shaped sliding clamps are fixedly connected to both the left and right sides of the sliding column. The L-shaped sliding clamps are slidably connected to the lower front side of the inner surface of the placement groove. A tightening spring is fixedly connected to the front side of the L-shaped sliding clamps, and the front end of the tightening spring is fixedly connected to the inner wall of the sliding groove.

[0013] Preferably, the bottom left and right sides of the rotating plate are provided with connecting grooves, and an electric motor is fixedly connected inside the connecting groove. The output shaft of the electric motor passes through the inside of the placement groove and is fixedly connected to the L-shaped rotating baffle.

[0014] Due to the adoption of the above technical solution, the technological progress achieved by this utility model compared to the prior art is as follows:

[0015] 1. In this utility model, through the cooperation between the sliding column, the L-shaped sliding clamp, the tightening spring and the pulling ring, the operator only needs to pull the pulling ring to drive the sliding column to slide in the sliding groove, thereby enabling multiple L-shaped sliding clamps to slide synchronously, realizing the simultaneous fixing and disassembly of multiple chips. Compared with the prior art, where each chip requires a separate telescopic motor control, this greatly improves the efficiency of chip fixing and disassembly and reduces equipment costs.

[0016] 2. In this utility model, through the cooperation between the electric motor, the L-shaped rotating baffle and the recycling bin, when the appearance inspection component detects a defect in the chip, the electric motor starts and drives the L-shaped rotating baffle to rotate, so that the defective chip falls directly into the recycling bin. This structure facilitates the centralized processing of defective chips, avoids the tedious process of manually collecting defective chips separately, and improves the smoothness of the overall inspection work. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of a chip surface defect detection device according to the present invention;

[0018] Figure 2 This is a cross-sectional structural diagram of the support frame of this utility model;

[0019] Figure 3 This is a partial structural schematic diagram of the transmission bracket of this utility model;

[0020] Figure 4 This is a cross-sectional structural diagram of the transmission bracket of this utility model.

[0021] Legend: 1. Support frame; 11. Drive motor; 12. Transmission gear; 13. Transmission gear ring; 2. Touch screen; 3. Appearance inspection component; 4. Transmission bracket; 41. Rotating plate; 42. Placement slot; 43. Groove; 44. L-shaped rotating baffle; 441. Electric motor; 45. Fixing component; 451. Sliding column; 452. Pulling ring; 453. L-shaped sliding clamp; 454. Tightening spring; 5. Recycling bin. Detailed Implementation

[0022] To better understand the above-mentioned objectives, features, and advantages of this utility model, the present utility model will be further described below with reference to the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0023] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the present invention is not limited to the specific embodiments disclosed in the following specification.

[0024] Example 1: As Figure 1 and Figure 2 As shown, this utility model provides a technical solution: including a support frame 1, a touch screen 2 fixedly connected to the top front side of the support frame 1, an appearance inspection component 3 fixedly connected to the top rear side of the support frame 1, multiple cameras are set at the bottom of the appearance inspection component 3 to inspect the chip, a transmission bracket 4 is rotatably connected to the middle of the outer surface of the support frame 1, a recycling box 5 is set at the rear side of the support frame 1, the recycling box 5 is set at the bottom of the rear side of the transmission bracket 4, an active groove is opened on the left side of the support frame 1, a drive motor 11 is fixedly connected to the top of the inner wall of the active groove, a transmission gear 12 is fixedly connected to the output shaft of the drive motor 11, a transmission gear ring 13 is meshed with the outer surface of the transmission gear 12, and the transmission gear ring 13 is fixedly connected to the middle of the transmission bracket 4;

[0025] The effect achieved by the entire embodiment 1 is as follows: after the drive motor 11 starts, it drives the transmission gear 12 to rotate through the output shaft. Since the transmission gear 12 meshes with the transmission gear ring 13, it can drive the transmission bracket 4 to rotate around the middle of the support frame 1, which can transport the chip under the appearance inspection component 3 for inspection, so that the chip can be picked up and inspected at the same time.

[0026] Example 2: As Figure 3 and Figure 4 As shown, this utility model provides a technical solution: the transmission bracket 4 includes a rotating plate 41, which is rotatably connected to the middle of the outer surface of the support frame 1. Several vertically penetrating placement slots 42 are provided on both the front and rear sides of the rotating plate 41. Grooves 43 are provided on both the left and right sides of the inner surface of the placement slots 42. An L-shaped rotating baffle 44 is rotatably connected to the lower rear side of the inner surface of the placement slots 42. Fixing components 45 are slidably connected to both the front and rear sides of the rotating plate 41. The fixing components 45 include sliding columns 451. A sliding groove is provided inside the rotating plate 41, and the sliding column 451 is slidably connected to the inner surface of the sliding column 451. The front end of 51 extends through to the front side of the rotating plate 41 and is fixedly connected to a pull ring 452. L-shaped sliding clamps 453 are fixedly connected to both the left and right sides of the sliding column 451. The L-shaped sliding clamps 453 are slidably connected to the lower front side of the inner surface of the placement groove 42. A clamping spring 454 is fixedly connected to the front side of the L-shaped sliding clamps 453. The front end of the clamping spring 454 is fixedly connected to the inner wall of the sliding groove. Connecting grooves are opened on both the left and right sides of the bottom of the rotating plate 41. An electric motor 441 is fixedly connected inside the connecting groove. The output shaft of the electric motor 441 extends through the inside of the placement groove 42 and is fixedly connected to the L-shaped rotating baffle 44.

[0027] The overall effect of Embodiment 2 is as follows: When placing the chip, the operator pulls the pull ring 452, causing the sliding column 451 to slide forward in the sliding groove. This causes the L-shaped sliding clamp 453 to move forward against the elastic force of the top spring 454, increasing the space in the placement groove 42. This makes it easier to place the chip into the placement groove 42 and place it on the L-shaped rotating baffle 44. After the chip is in place, the pull ring 452 is released. Under the action of the top spring 454, the L-shaped sliding clamp 453 slides backward to fix the chip. When the appearance inspection component 3 inspects the chip, if a defect is detected, the appearance inspection component 3 transmits a signal to the equipment control system. The control system controls the electric motor 441 to start. The output shaft of the electric motor 441 drives the L-shaped rotating baffle 44 to rotate, causing the defective chip to fall from the placement groove 42 into the recycling box 5. This achieves automatic recycling of defective chips, greatly improving the efficiency and convenience of chip fixing, inspection, and defective chip processing.

[0028] The working principle of the entire device is as follows: First, the operator turns on the device via the touch screen 2, starting the drive motor 11. The drive motor 11 drives the transmission gear 12 to rotate, which in turn drives the transmission gear ring 13 that meshes with it, thereby causing the transmission bracket 4 to rotate around the center of the support frame 1. Before the transmission bracket 4 rotates, the operator pulls the pull ring 452 on the fixing component 45, causing the L-shaped sliding clamp 453 to slide forward, placing the chip in the placement slots 42 on both sides of the rotating plate 41 of the transmission bracket 4. Then, the operator releases the pull ring 452, and the L-shaped sliding clamp 453 fixes the chip under the action of the top spring 454. As the transmission bracket 4 rotates, the chips in the placement slots 42 sequentially enter the area below the appearance inspection component 3. Multiple cameras at the bottom of the appearance inspection component 3 capture images of the chip surface from different angles and transmit the captured images to the image processing system inside the device. The image processing system compares and analyzes the captured images against preset standard images of the chip surface to determine whether there are defects such as scratches, cracks, or impurities on the chip surface. If a defect is detected, the appearance inspection component 3 transmits the detection result to the control system. The control system immediately starts the electric motor 441. The output shaft of the electric motor 441 rotates, driving the L-shaped rotating baffle 44 to rotate around its connection point with the placement slot 42, opening the bottom of the placement slot 42, so that the defective chip falls directly into the recycling box 5 under the action of gravity. For chips that pass the inspection, as the transmission bracket 4 continues to rotate, they leave the detection range of the appearance inspection component 3, and the operator can remove the chip. This cycle is repeated to achieve efficient detection of chip surface defects and convenient handling of defective chips.

[0029] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments for application in other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present utility model without departing from the technical solution of the present utility model shall still fall within the protection scope of the technical solution of the present utility model.

Claims

1. A chip surface defect detection equipment, comprising a support frame (1), the top front side of the support frame (1) is fixedly connected with a touch screen (2), and the top rear side of the support frame (1) is fixedly connected with an appearance detection assembly (3), characterized in that: The outer surface middle part of the support frame (1) is rotationally connected with a transmission support (4), the rear side of the support frame (1) is provided with a recycling box (5), and the recycling box (5) is arranged at the rear side bottom of the transmission support (4); The transmission support (4) comprises a rotating plate (41), the rotating plate (41) is rotationally connected to the outer surface middle part of the support frame (1), a plurality of upper and lower through placing grooves (42) are formed in the front and rear sides of the rotating plate (41), recesses (43) are formed in the left and right sides of the inner surface of the placing groove (42), an L-shaped rotating baffle (44) is rotationally connected to the lower rear side of the inner surface of the placing groove (42), and a fixing assembly (45) is slidingly connected to the front and rear sides of the rotating plate (41).

2. The chip surface defect inspection apparatus according to claim 1, characterized by: The left side of the support frame (1) is provided with a movable groove, the inner wall top end of the movable groove is fixedly connected with a driving motor (11), and the output shaft of the driving motor (11) is fixedly connected with a transmission gear (12).

3. The chip surface defect inspection apparatus according to claim 2, characterized by: The outer surface of the transmission gear (12) is meshingly connected with a transmission gear ring (13), and the transmission gear ring (13) is fixedly connected to the middle part of the transmission support (4).

4. The chip surface defect inspection apparatus according to claim 1, characterized by: The fixing assembly (45) comprises a sliding column (451), a sliding groove is formed in the inner part of the rotating plate (41), the sliding column (451) is slidingly connected to the inner surface of the sliding column (451), and the front end of the sliding column (451) penetrates to the front side of the rotating plate (41) and is fixedly connected with a pulling ring (452).

5. The chip surface defect inspection apparatus according to claim 4, characterized by: The left and right sides of the sliding column (451) are fixedly connected with L-shaped sliding clamping plates (453), the L-shaped sliding clamping plates (453) are slidingly connected to the lower front side of the inner surface of the placing groove (42), the front side of the L-shaped sliding clamping plate (453) is fixedly connected with a tension spring (454), and the front end of the tension spring (454) is fixedly connected with the inner wall of the sliding groove.

6. The chip surface defect inspection apparatus according to claim 1, characterized by: The bottom left and right sides of the rotating plate (41) are provided with connecting grooves, the inner part of the connecting groove is fixedly connected with an electric motor (441), the output shaft of the electric motor (441) penetrates to the inner part of the placing groove (42) and is fixedly connected with the L-shaped rotating baffle (44).

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