Mobile phone shell capable of cooling mobile phone
By combining vertical and horizontal cooling grooves, heat conduction plates, and hydrogel films in the design of the phone casing, the problem of insufficient heat dissipation in existing phone casings is solved, achieving targeted cooling of the CPU area and overall heat dissipation effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-04
- Publication Date
- 2026-04-03
AI Technical Summary
Existing phone cases have poor heat dissipation for the phone itself, leading to CPU overheating and affecting the phone's lifespan.
Design a phone case that can cool down the phone, including vertical and horizontal cooling grooves, heat conduction plate and cooling back plate, combined with hydrogel film for heat management, heat is conducted to the cooling back plate through the heat conduction plate and the heat is absorbed by the evaporation of hydrogel film, and heat is dissipated through the external grooves.
It enables positioning and adjustment of the CPU position for different mobile phone models, improves the heat conduction and heat dissipation of the phone casing, and enhances the overall cooling effect of the phone.
Smart Images
Figure CN224083572U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of mobile phone case technology, and in particular to a mobile phone case that can cool down the mobile phone. Background Technology
[0002] A smartphone is a portable device that integrates multiple functions. It combines the features of traditional mobile phones and PDAs, providing users with a wealth of functions and a convenient user experience.
[0003] When a mobile phone is in use, it generates heat. The CPU on the circuit board inside the phone is the main source of heat. When the phone starts up and uses a large program, both the phone body and the CPU will generate a lot of heat.
[0004] Currently, the CPU of a mobile phone is generally located in the lower middle part of the circuit board, while some CPUs are located in the center of the circuit board. However, the existing mobile phone casings are not very effective at cooling and heat dissipation, which greatly reduces the lifespan of the mobile phone.
[0005] Therefore, a phone case that can cool down the phone is needed to solve the above problems. Utility Model Content
[0006] The purpose of this invention is to address the aforementioned shortcomings in the existing technology by proposing a mobile phone case that can cool down the phone.
[0007] To achieve the above objectives, the present invention adopts the following technical solution:
[0008] Design a phone case that can cool down a mobile phone, including a phone case with a vertical cooling groove and a horizontal cooling groove, a first heat-conducting plate and a second heat-conducting plate, an adjustment groove, a cooling back plate inside the adjustment groove, a first screw groove and a second screw groove, a back heat dissipation groove and a hole on the cooling back plate, and a cooling film layer on the back heat dissipation groove;
[0009] A locking pin is provided inside the socket, and a disassembly groove is provided on the locking pin;
[0010] The cooling back panel is provided with a finger-loop groove and a positioning groove.
[0011] Furthermore, the longitudinal cooling groove is a rectangular opening groove in two symmetrical groups, with sixteen grooves arranged vertically in each group, and the transverse cooling groove is a rectangular opening groove in two symmetrical groups, with eight grooves arranged horizontally in each group.
[0012] Furthermore, the first heat-conducting plate and the second heat-conducting plate are embedded and fixedly disposed on the mobile phone casing, and the first screw groove and the second screw groove are two symmetrical pieces.
[0013] Furthermore, the cooling back plate is generally rectangular in shape, and the back heat dissipation grooves are eight arranged horizontally and penetrate the cooling back plate vertically. The cooling film layer is evenly distributed along the inner wall of each back heat dissipation groove.
[0014] Furthermore, the locking pins are two symmetrical ones that pass through the insertion hole, and the disassembly groove is an equilateral hexagonal groove.
[0015] Furthermore, the finger buckle groove is a semi-circular groove, and there are two finger buckle grooves that are symmetrical from left to right.
[0016] Furthermore, the positioning groove is located at the end of the cooling back plate facing the phone casing, and the positioning groove is a rectangular inner groove.
[0017] The mobile phone case proposed in this utility model that can cool down the mobile phone has the following advantages:
[0018] 1. This utility model provides a horizontal and vertical cooling groove on the phone casing, along with a first and second heat-conducting plate. It also includes an adjustment groove with a cooling backplate, and a back heat dissipation groove with a cooling film layer on the cooling backplate. This allows for adjustable positioning of the cooling backplate for different phone models' CPU locations, achieving targeted heat conduction and cooling for the CPU. Combined with the external horizontal and vertical cooling grooves on the phone casing, this design significantly improves the overall heat conduction and cooling performance of the phone casing for the CPU and the phone as a whole.
[0019] 2. This utility model uses symmetrical finger-loop grooves on the cooling back plate to facilitate the removal of the cooling back plate from the adjustment groove, thereby making it easier to adjust the position of the cooling back plate during installation. Attached Figure Description
[0020] Figure 1 This is a three-dimensional schematic diagram of the cooling backplate of this utility model in its uninstalled state;
[0021] Figure 2 This is a three-dimensional schematic diagram of the cooling backplate of this utility model already installed on the first screw groove.
[0022] Figure 3 For the present utility model Figure 1 A second-view stereoscopic diagram of a mobile phone casing;
[0023] Figure 4 For the present utility model Figure 1 A second-view 3D schematic diagram of the cooling backplate;
[0024] Figure 5 This is a front view of the cooling backplate of this utility model installed on the first screw groove.
[0025] Figure 6 This is a front view schematic diagram of the cooling back plate of this utility model installed on the second screw groove.
[0026] In the diagram: 1. Phone casing; 11. Vertical cooling groove; 12. Horizontal cooling groove; 2. Adjustment groove; 3. First heat conduction plate; 31. First screw groove; 4. Second heat conduction plate; 41. Second screw groove; 5. Cooling back plate; 51. Finger buckle groove; 52. Positioning groove; 6. Insertion hole; 61. Locking screw; 62. Disassembly groove; 7. Back heat dissipation groove; 71. Cooling film layer. Detailed Implementation
[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.
[0028] Reference Figure 1-6 A mobile phone case for cooling down a mobile phone includes a mobile phone case 1, on which a vertical cooling groove 11 and a horizontal cooling groove 12 are provided, a first heat-conducting plate 3 and a second heat-conducting plate 4 are provided, an adjustment groove 2 is provided on the mobile phone case 1, a cooling back plate 5 is provided in the adjustment groove 2, a first screw groove 31 and a second screw groove 41 are provided on the mobile phone case 1, a back heat dissipation groove 7 and a hole 6 are provided on the cooling back plate 5, and a cooling film layer 71 is provided on the back heat dissipation groove 7;
[0029] A locking pin 61 is provided inside the insertion hole 6, and a disassembly groove 62 is provided on the locking pin 61;
[0030] The cooling back plate 5 is provided with a finger-loop groove 51 and a positioning groove 52.
[0031] The longitudinal cooling groove 11 is a rectangular opening groove in two symmetrical groups, with sixteen grooves arranged vertically in each group. The transverse cooling groove 12 is a rectangular opening groove in two symmetrical groups, with eight grooves arranged horizontally in each group.
[0032] The first heat-conducting plate 3 and the second heat-conducting plate 4 are embedded and fixedly disposed on the mobile phone housing 1. The first screw groove 31 and the second screw groove 41 are two symmetrical pieces. The first heat-conducting plate 3, the second heat-conducting plate 4 and the mobile phone housing 1 are all made of aluminum alloy, which has excellent thermal conductivity and is impact-resistant and does not deform.
[0033] The cooling backplate 5 has a rectangular structure and is made of red copper, which has excellent thermal conductivity and is durable.
[0034] The back heat dissipation grooves 7 are eight arranged horizontally and extend vertically through the cooling back plate 5. The cooling film layer 71 is evenly distributed along the inner wall of each back heat dissipation groove 7. The cooling film layer 71 is a hydrogel film. When the CPU of the mobile phone is working and generates heat, the heat is quickly transferred to each back heat dissipation groove 7 on the cooling back plate 5 through the first heat conduction plate 3 or the second heat conduction plate 4. At this time, the preset moisture in the hydrogel film will evaporate, absorbing heat and reducing the temperature of the mobile phone. When not in use, the hydrogel film will automatically absorb moisture from the air to achieve self-circulation.
[0035] The locking screws 61 are two symmetrical ones that pass through the insertion hole 6. The disassembly groove 62 is an equilateral hexagonal groove. The locking screws 61 are higher than the cooling back plate 5. When the back of the mobile phone case 1 is placed flat on the table, the back of the mobile phone case 1 has a certain heat dissipation gap, thereby ensuring the normal flow of air and heat dissipation effect.
[0036] The finger-holding groove 51 is a semi-circular groove, and there are two finger-holding grooves 51 that are symmetrical from left to right. The semi-circular groove structure improves the comfort of finger insertion.
[0037] The positioning groove 52 is located at the end of the cooling back plate 5 facing the mobile phone housing 1. The positioning groove 52 is a rectangular inner groove. When the cooling back plate 5 is engaged with the first heat-conducting plate 3 or the second heat-conducting plate 4 through the positioning groove 52, the locking screw 61 can be aligned with the first screw groove 31 or the second screw groove 41.
[0038] Working method: For example, see Figure 5 The CPU of the currently required mobile phone model is located in the center of the phone's circuit board. The positioning groove 52 on the cooling backplate 5 can be aligned and fitted onto the first heat-conducting plate 3. Then, take an Allen wrench and insert it into the disassembly groove 62. Next, turn the Allen wrench clockwise, causing the locking screw 61 to rotate clockwise and achieve threaded locking with the first screw groove 31. This achieves the locking installation of the cooling backplate 5. When using the current mobile phone model, the CPU in its center generates heat, which is quickly transferred to the cooling backplate 5 through the first heat-conducting plate 3. Then, through the copper cooling backplate 5, the heat is quickly transferred to each back heat dissipation groove 7, forming and accumulating high-temperature heat. This accumulated high-temperature heat causes the moisture in the cooling film layer 71 to evaporate, absorbing heat and lowering the phone's temperature. Similarly, refer to... Figure 6If the CPU of the current model mobile phone is located in the lower center of the mobile phone circuit board, the cooling back plate 5 can be installed on the second heat conduction plate 4 to achieve targeted heat conduction and cooling effect. At the same time, the vertical cooling groove 11 and the horizontal cooling groove 12 can effectively dissipate the remaining heat of the mobile phone from the outside.
[0039] The above-mentioned cooling backplate 5 can be installed and positioned to target the CPU position on different mobile phone models, thereby achieving a targeted heat conduction and cooling effect on the CPU position. Combined with the horizontal cooling groove 12 and vertical cooling groove 11 on the outer side of the mobile phone casing 1, the overall heat conduction and cooling performance of the mobile phone casing 1 for the CPU and the mobile phone as a whole is improved.
[0040] In addition, by using the symmetrical finger-loop grooves 51 on the cooling back plate 5, two fingers of one hand can be inserted into the finger-loop grooves 51 on both sides at the same time, so as to easily remove the cooling back plate 5 from the adjustment groove 2, making it convenient to adjust the position of the cooling back plate 5.
[0041] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.
Claims
1. A mobile phone case capable of cooling down a mobile phone, comprising a mobile phone casing (1), characterized in that: The mobile phone shell (1) is provided with longitudinal cooling grooves (11) and transverse cooling grooves (12), the mobile phone shell (1) is provided with first heat-conducting plates (3) and second heat-conducting plates (4), the mobile phone shell (1) is provided with adjusting grooves (2), the adjusting grooves (2) are provided with cooling back plates (5), the mobile phone shell (1) is provided with first screw grooves (31) and second screw grooves (41), the cooling back plates (5) are provided with back heat dissipation grooves (7) and jacks (6), the back heat dissipation grooves (7) are provided with cooling film layers (71); The jacks (6) are provided with locking screw pins (61), the locking screw pins (61) are provided with dismounting grooves (62); The cooling back plates (5) are provided with finger buckle grooves (51) and positioning grooves (52).
2. The phone case capable of cooling the phone according to claim 1, characterized in that: The longitudinal cooling grooves (11) are overall rectangular open grooves and are left-right symmetrical two groups, each group is sixteen in vertical arrangement, the transverse cooling grooves (12) are overall rectangular open grooves and are upper-lower symmetrical two groups, each group is eight in horizontal arrangement.
3. The phone case capable of cooling the phone according to claim 1, characterized in that: The first heat-conducting plates (3) and the second heat-conducting plates (4) are inlaid and fixed on the mobile phone shell (1), the first screw grooves (31) and the second screw grooves (41) are both left-right symmetrical two.
4. The phone case capable of cooling the phone according to claim 1, characterized in that: The cooling back plates (5) are overall rectangular structures, the back heat dissipation grooves (7) are eight in horizontal arrangement and longitudinally penetrate the cooling back plates (5), the cooling film layers (71) are evenly arranged along the inner groove wall surfaces of each back heat dissipation groove (7).
5. The phone case capable of cooling the phone according to claim 1, characterized in that: The locking screw pins (61) are symmetrical two and are provided in the jacks (6), the dismounting grooves (62) are equilateral internal hexagonal grooves.
6. The phone case capable of cooling the phone according to claim 1, characterized in that: The finger buckle grooves (51) are overall semicircular grooves, and the finger buckle grooves (51) are left-right symmetrical two.
7. The phone case capable of cooling the phone according to claim 1, characterized in that: The positioning grooves (52) are provided at one end of the cooling back plates (5) facing the mobile phone shell (1), and the positioning grooves (52) are overall rectangular internal grooves.