Aluminum substrate

Abstract

The utility model discloses an aluminum substrate which comprises a metal base layer, a heat-conducting insulating layer and a circuit layer which are sequentially laminated along the vertical direction, and the metal base layer is an aluminum plate; the metal base layer is provided with a first waste area and a second waste area, the second waste area surrounds the first waste area, the first waste area is provided with a first filler, the second waste area is provided with a second filler, the second waste area is provided with a diversion trench, one end of the diversion trench is communicated with the second waste area, and the other end of the diversion trench is communicated with the outside.

Description

Technical Field

[0001] This utility model relates to the field of aluminum substrate production technology, and in particular to an aluminum substrate. Background Technology

[0002] Aluminum substrate is the same as PCB, which stands for Printed Circuit Board. The difference is that the material used for the circuit board is aluminum alloy. Aluminum substrates generally consist of three layers: a circuit layer (copper foil), an insulating layer, and a metal base layer. High-end applications may use double-sided designs with a structure of circuit layer, insulating layer, aluminum base, insulating layer, and circuit layer again. Very few applications use multilayer boards, which can be formed by laminating ordinary multilayer boards with insulating and aluminum base layers. However, because double-sided aluminum substrates use thermally conductive polypropylene (PP) for lamination, and PP has poor fluidity due to its high filler content, and large areas without copper at the board edges and router slots, abnormal pressure can easily occur at the board edges after lamination, leading to quality problems in the finished PCB. Utility Model Content

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes an aluminum substrate of good quality that can improve the service life of the aluminum substrate.

[0004] An aluminum substrate according to an embodiment of the present invention includes: a metal base layer, a thermally conductive insulating layer and a circuit layer stacked sequentially in a vertical direction, wherein the metal base layer is an aluminum plate;

[0005] The metal base layer is provided with a first waste area and a second waste area. The second waste area surrounds the first waste area. The first waste area is provided with a first filler and the second waste area is provided with a second filler. The second waste area is provided with a guide channel. One end of the guide channel is connected to the second waste area and the other end is connected to the outside.

[0006] An aluminum substrate according to an embodiment of the present invention has at least the following beneficial effects: The aluminum substrate of this application is composed of a metal base layer, a thermally conductive insulating layer, and a circuit layer stacked sequentially in a vertical direction. During production, when the molten thermally conductive insulating layer is pressed with the metal base layer, the thermally conductive insulating layer can fill the waste area generated by the metal base layer after the milling process. Specifically, the first and second waste areas of the metal base layer of this application are respectively provided with a first filler and a second filler. Due to the poor fluidity of the thermally conductive insulating layer, the filler reduces the space of the waste area, allowing the molten thermally conductive insulating layer to better fill the waste area, reducing the presence of voids in the waste area. Simultaneously, after pressing, because the guide groove is connected to the outside, it improves the situation where abnormal pressure occurs at the edge of the aluminum substrate, effectively improving the quality of the aluminum substrate.

[0007] According to an embodiment of the present invention, an aluminum substrate has a guide groove that is inclined.

[0008] According to an embodiment of the present invention, an aluminum substrate has a first filler being a copper block.

[0009] According to an embodiment of the present invention, an aluminum substrate has a first gap between the outer peripheral wall of the first filler and the inner peripheral wall of the first waste area.

[0010] According to an embodiment of the present invention, an aluminum substrate has a first gap of 0.3 mm.

[0011] According to an embodiment of the present invention, an aluminum substrate has a second filler consisting of a copper strip.

[0012] According to an embodiment of the present invention, an aluminum substrate has a second gap between the outer wall of the second filler and the inner wall of the second waste area.

[0013] According to an embodiment of the present invention, an aluminum substrate has a second gap of 0.3 mm.

[0014] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0015] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0016] Figure 1 This is a cross-sectional schematic diagram of an aluminum substrate according to an embodiment of the present utility model;

[0017] Figure 2 This is a schematic diagram of the structure of the metal base layer according to an embodiment of the present invention;

[0018] Figure 3 for Figure 2 Enlarged view of the image marked A.

[0019] Explanation of reference numerals in the attached figures:

[0020] Metal base layer 100; First waste area 110; Second waste area 120; First filler 130; Second filler 140; Guide channel 150;

[0021] Thermally conductive insulating layer 200;

[0022] Circuit layer 300. Detailed Implementation

[0023] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0024] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0025] In the description of a utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. If the terms "first" and "second" are used, they are merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly specifying the number of indicated technical features or the order of the indicated technical features.

[0026] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0027] Reference Figures 1 to 3 This utility model embodiment provides an aluminum substrate, including a metal base layer 100, a thermally conductive insulating layer 200, and a circuit layer 300 stacked sequentially in a vertical direction. The metal base layer 100 is an aluminum plate. The metal base layer 100 is provided with a first waste area 110 and a second waste area 120. The second waste area 120 surrounds the first waste area 110. The first waste area 110 is provided with a first filler 130. The second waste area 120 is provided with a second filler 140. The second waste area 120 is provided with a flow channel 150. One end of the flow channel 150 is connected to the second waste area 120, and the other end is connected to the outside.

[0028] The aluminum substrate of this application is composed of a metal base layer 100, a thermally conductive insulating layer 200, and a circuit layer 300 stacked sequentially in a vertical direction. During production, when the molten thermally conductive insulating layer 200 is pressed with the metal base layer 100, the thermally conductive insulating layer 200 can fill the waste area generated by the metal base layer 100 after milling. Specifically, the first waste area 110 and the second waste area 120 of the metal base layer 100 of this application are respectively provided with a first filler 130 and a second filler 140. Due to the poor fluidity of the thermally conductive insulating layer 200, the filler reduces the space of the waste area, allowing the molten thermally conductive insulating layer 200 to better fill the waste area, reducing the presence of voids in the waste area. Simultaneously, after pressing, because the guide groove 150 is connected to the outside, it improves the situation where abnormal pressure occurs at the edge of the aluminum substrate, effectively improving the quality of the aluminum substrate.

[0029] According to some embodiments of this application, the guide channel 150 is inclined.

[0030] According to some embodiments of this application, the first filler 130 is a copper block. A first gap is maintained between the outer peripheral wall of the first filler 130 and the inner peripheral wall of the first waste area 110. Preferably, the first gap is 0.3 mm.

[0031] According to some embodiments of this application, the second filler 140 is a copper strip. A second gap is left between the outer wall of the second filler 140 and the inner wall of the second waste area 120. Preferably, the second gap is 0.3 mm.

[0032] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0033] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. An aluminum substrate, characterized by, Comprise: A metal base layer, a heat-conducting insulation layer and a circuit layer are sequentially stacked in a vertical direction, the metal base layer is an aluminum plate; The metal base layer is provided with a first waste area and a second waste area, the second waste area surrounds the first waste area, the first waste area is provided with a first filler, the second waste area is provided with a second filler, the second waste area is provided with a flow guide groove, one end of the flow guide groove is communicated with the second waste area, and the other end is communicated with the outside.

2. The aluminum substrate of claim 1, wherein A plurality of the flow guide grooves are arranged at intervals around the first waste area.

3. The aluminum substrate of claim 1, wherein The flow guide groove is arranged obliquely.

4. The aluminum substrate of claim 1, wherein The first filler is a copper block.

5. The aluminum substrate of claim 4, wherein A first gap is left between the outer peripheral wall of the first filler and the inner peripheral wall of the first waste area.

6. The aluminum substrate of claim 5, wherein, The first gap is 0.3mm.

7. The aluminum substrate of claim 1, wherein The second filler is a copper strip.

8. The aluminum substrate of claim 7, wherein, A second gap is left between the outer wall of the second filler and the inner wall of the second waste area.

9. The aluminum substrate of claim 8, wherein, The second gap is 0.3mm.

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