Radiator and electronic equipment assembly

Abstract

The utility model discloses a radiator and an electronic equipment assembly. The radiator comprises a radiating main body and a clamping mechanism, the heat dissipation main body is connected with the clamping mechanism, the clamping mechanism comprises a first clamping part and a second clamping part which can rotate relatively, and the first clamping part and the second clamping part are located on the two opposite sides of the heat dissipation main body respectively; the clamping mechanism has a first state and a second state; when the clamping mechanism is in the first state, the clamping tail end of the first clamping part and the clamping tail end of the second clamping part are close to each other and form a clamping space for clamping the electronic equipment, so that the heat dissipation main body is attached to a heat dissipation area of the electronic equipment; and when the clamping mechanism is in the second state, the clamping tail end of the first clamping part and the clamping tail end of the second clamping part are far away from each other so as to loosen the electronic equipment. When the radiator is assembled with the electronic equipment, whether the electronic equipment supports magnetic attraction installation or not does not need to be distinguished, so that the adaptation range of the radiator is widened.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and more particularly to a heat sink and electronic equipment component. Background Technology

[0002] With the rapid development of electronic devices, people's performance requirements for these devices are also increasing. The heat dissipation performance of electronic devices directly affects important parameters such as operating speed and stability. In related technologies, to improve the heat dissipation performance of electronic devices, external heat sinks are used to assist in heat dissipation. These external heat sinks are magnetically attached to the metal backplate of the electronic device, and then heat is carried away from the metal backplate through heat exchange, thus achieving heat dissipation.

[0003] In the above solution, since the back panel of some electronic devices is made of non-metallic materials, such as ceramic or leather, the heat sink cannot be installed by magnetic attraction, which limits the compatibility of the heat sink. Utility Model Content

[0004] This application discloses a heat sink and an electronic device component to solve the problem of limited compatibility of heat sinks in related technologies.

[0005] To solve the above-mentioned technical problems, this application is implemented as follows:

[0006] In a first aspect, embodiments of this application disclose a heat sink for electronic devices, the heat sink comprising a heat dissipation body and a clamping mechanism;

[0007] The heat dissipation body is connected to the clamping mechanism, which includes a first clamping part and a second clamping part that can rotate relative to each other. The first clamping part and the second clamping part are located on opposite sides of the heat dissipation body.

[0008] The clamping mechanism has a first state and a second state;

[0009] When the clamping mechanism is in the first state, the clamping ends of the first clamping part and the clamping ends of the second clamping part approach each other and form a clamping space for clamping the electronic device, so as to attach the heat dissipation body to the heat dissipation area of ​​the electronic device.

[0010] When the clamping mechanism is in the second state, the clamping ends of the first clamping part and the clamping ends of the second clamping part move away from each other to release the electronic device.

[0011] Secondly, embodiments of this application disclose an electronic device assembly, which includes an electronic device and the aforementioned heat sink. The heat sink is configured to clamp the electronic device and attach the heat sink body to the heat dissipation area of ​​the electronic device when the clamping mechanism is in the first state, and to release the electronic device when the clamping mechanism is in the second state.

[0012] The technical solution adopted in this application can achieve the following technical effects:

[0013] The heat sink disclosed in this application improves upon related technologies by providing a clamping mechanism on the heat sink. The first and second clamping parts of the clamping mechanism can be used to clamp the electronic device, allowing the heat sink to be smoothly attached to the heat dissipation area of ​​the electronic device, thereby improving the heat dissipation performance of the electronic device. Since there is no need to distinguish whether the electronic device supports magnetic installation when assembling the heat sink with the electronic device, the compatibility range of the heat sink is expanded. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the assembly structure of the first heat sink and electronic device disclosed in the embodiments of this application;

[0015] Figure 2 This is a schematic diagram of the structure of the first type of heat sink disclosed in the embodiments of this application;

[0016] Figure 3 This is a schematic diagram of the structure of the first clamping part disclosed in the embodiment of this application;

[0017] Figure 4 This is an exploded view of the first clamping part disclosed in the embodiments of this application;

[0018] Figure 5 This is a schematic diagram of the assembly structure of the first clamping part and the heat dissipation body disclosed in the embodiments of this application;

[0019] Figure 6 This is an exploded view of the first clamping part and the heat dissipation body disclosed in the embodiments of this application;

[0020] Figure 7 This is a schematic diagram showing the first sliding connector and the second sliding connector in a second relative position as disclosed in the embodiments of this application;

[0021] Figure 8 This is a schematic diagram showing the first sliding connector and the second sliding connector in a first relative position as disclosed in the embodiments of this application;

[0022] Figure 9 This is one of the schematic diagrams of the second type of heat sink and electronic device assembly structure disclosed in the embodiments of this application;

[0023] Figure 10 This is a second schematic diagram of the assembly structure of a heat sink and electronic device disclosed in the embodiments of this application;

[0024] Figure 11 This is one of the structural schematic diagrams of the second type of heat sink disclosed in the embodiments of this application;

[0025] Figure 12 This is a second schematic diagram of the structure of the second type of heat sink disclosed in the embodiments of this application;

[0026] Figure 13 This is an exploded view of the second type of heat sink disclosed in the embodiments of this application;

[0027] Figure 14 This is a schematic diagram of the structure in which the mounting bracket and the third sliding connector are close to each other, as disclosed in the embodiments of this application;

[0028] Figure 15 This is a schematic diagram of the structure in which the mounting bracket and the third sliding connector are far apart from each other, as disclosed in the embodiments of this application.

[0029] Explanation of reference numerals in the attached figures:

[0030] 100-Radiator, 110-Radiator body, 111-Snap-fit ​​part, 112-Mounting hole, 120-First clamping part, 121-Claw clamp, 1211-First constraint part, 1212-Second constraint part, 1213-Third constraint part, 122-Rotating shaft, 123-Torsion spring, 1231-First helical segment, 1232-Second helical segment, 130-Second clamping part, 140-Connecting part, 141-First connecting part, 1411-First sliding connector, 1412-Second sliding connector, 1413-Stop, 142-Second connecting part, 143-Mounting bracket, 1431-First limiting part, 144-Third sliding connector, 1441-Second limiting part, 145-Elastic element,

[0031] 200 - Electronic devices. Detailed Implementation

[0032] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below in conjunction with specific embodiments and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0033] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0034] The technical solutions disclosed in the various embodiments of this application are described in detail below with reference to the accompanying drawings.

[0035] Please refer to Figures 1 to 15 This application discloses a heat sink 100, which can be used to assist in heat dissipation of an electronic device 200, thereby improving the heat dissipation efficiency of the electronic device 200. The electronic device 200 may be a mobile phone, tablet computer, e-book reader, game console, wearable device, etc., and this application does not limit the specific type of electronic device 200.

[0036] The aforementioned heat sink 100 may include a heat sink body 110 and a clamping mechanism. The heat sink body 110 may be a cooling fan, a heat sink, etc. The heat sink body 110 can remove the heat generated by the electronic device 200 through heat exchange. In actual installation, taking a mobile phone or tablet as an example, the heat sink body 110 can be installed in close contact with the heat dissipation area of ​​the back panel of the electronic device 200. Since the chips, batteries, and other components of the electronic device 200 generate a large amount of heat, the heat dissipation area may be the area of ​​the back panel opposite to the chips or batteries.

[0037] The heat dissipation body 110 is connected to the clamping mechanism, and the specific connection method can be snap-fit, bolt connection, etc. The clamping mechanism can include a first clamping part 120 and a second clamping part 130 that can rotate relative to each other. The first clamping part 120 and the second clamping part 130 are located on opposite sides of the heat dissipation body 110. In addition, the clamping mechanism can also include a mounting carrier for mounting the first clamping part 120 and the second clamping part 130, such as a bracket, mounting plate, etc. The clamping mechanism is regarded as a whole, and at least one of the first clamping part 120 and the second clamping part 130 is rotatably connected to the mounting carrier, so that the first clamping part 120 and the second clamping part 130 can rotate relative to each other.

[0038] The clamping mechanism has a first state and a second state. In the first state, the first clamping part 120 and the second clamping part 130 can rotate relative to each other so that the clamping ends of the first clamping part 120 and the second clamping part 130 approach each other and form a clamping space for clamping the electronic device 200. Specifically, the first clamping part 120 and the second clamping part 130 can clamp the frame of the electronic device 200. When the first clamping part 120 and the second clamping part 130 clamp the electronic device 200, the heat dissipation body 110 can be attached to the heat dissipation area of ​​the electronic device 200, thereby enabling auxiliary heat dissipation of the electronic device 200.

[0039] It should be noted that the clamping end of the first clamping part 120 is the area where the first clamping part 120 contacts the electronic device 200 when the clamping mechanism clamps the electronic device 200. Similarly, the clamping end of the second clamping part 130 is the area where the second clamping part 130 contacts the electronic device 200 when the clamping mechanism clamps the electronic device 200. To prevent the electronic device 200 from slipping off the clamping mechanism, anti-slip structures, such as anti-slip teeth or anti-slip pads, can be provided at the clamping ends of the first clamping part 120 and the second clamping part 130, respectively. When the clamping mechanism is in the second state, the clamping ends of the first clamping part 120 and the second clamping part 130 are separated from each other, thereby allowing the electronic device 200 to be released and the heat sink 100 to be removed from the electronic device 200.

[0040] As described above, the heat sink 100 disclosed in this application improves upon related technologies. By providing a clamping mechanism on the heat sink 100, the electronic device 200 can be clamped using the first clamping part 120 and the second clamping part 130 of the clamping mechanism. This allows the heat sink body 110 to be smoothly attached to the heat dissipation area of ​​the electronic device 200, thereby improving the heat dissipation performance of the electronic device 200. Since the heat sink 100 does not need to distinguish whether the electronic device 200 supports magnetic installation when assembling with the electronic device 200, the compatibility range of the heat sink 100 is improved.

[0041] like Figure 1As shown, the clamping mechanism may further include a connecting portion 140, which is detachably connected to the heat dissipation body 110, for example, by snap-fit ​​or bolt connection. At least one of the first clamping portion 120 and the second clamping portion 130 is rotatably connected to the connecting portion 140, specifically through a rotating shaft, flexible connector, or other structure. When at least one of the first clamping portion 120 and the second clamping portion 130 rotates relative to the connecting portion 140, the first clamping portion 120 and the second clamping portion 130 can rotate relative to each other, thereby enabling the clamping mechanism to switch between a first state and a second state. In other words, when the first clamping portion 120 and the second clamping portion 130 rotate relative to each other, the clamping ends of the first clamping portion 120 and the second clamping portion 130 can move closer to or further away from each other to clamp or release the electronic device 200.

[0042] Since the connecting part 140 and the heat dissipation body 110 are assembled in a detachable manner, the applicability of the heat sink 100 can be further improved. Depending on the specific application scenario, the heat dissipation body 110 itself can be equipped with magnetic components. When the back panel of the electronic device 200 is made of metal, the clamping mechanism can be separated from the heat dissipation body 110, and the heat dissipation body 110 can be magnetically attached to the back panel of the electronic device 200. When the back panel of the electronic device 200 is made of non-metallic material, the clamping mechanism can be connected to the heat dissipation body 110, and the heat dissipation body 110 can be attached to the back panel of the electronic device 200 using the clamping mechanism. Of course, when the back panel of the electronic device 200 is made of metal, a dual installation method of magnetic attachment and clamping can also be used to further improve the stability of the assembly between the heat sink and the electronic device.

[0043] like Figure 3 and Figure 4 As shown, the first clamping part 120 and the second clamping part 130 can have the same structure, and both include a jaw clamp 121, a rotating shaft 122, and a torsion spring 123. The jaw clamp 121 and the connecting part 140 can each be provided with shaft holes. The jaw clamp 121 and the connecting part 140 can be rotatably connected via the rotating shaft 122. The torsion spring 123 is sleeved on the rotating shaft 122, and the first arm of the torsion spring 123 abuts against the jaw clamp 121, while the second arm of the torsion spring 123 abuts against the connecting part 140. When the clamping mechanism is in the first state, the torsion spring 123 can apply a preload force to the jaw clamp 121 through its first arm, so that the jaw clamp 121 can firmly clamp the electronic device 200.

[0044] In an optional embodiment of this application, the connecting portion 140 may include a first connecting portion 141 and a second connecting portion 142. The heat dissipation body 110 has locking portions 111 on its opposite first and second sides. The first clamping portion 120 can be engaged with the locking portion 111 on the first side of the heat dissipation body 110 via the first connecting portion 141, and the second clamping portion 130 can be engaged with the locking portion 111 on the second side of the heat dissipation body 110 via the second connecting portion 142. This design of the first connecting portion 141 and the second connecting portion 142 facilitates the removal of the first clamping portion 120 and the second clamping portion 130.

[0045] The jaws 121 of the first clamping part 120 are rotatably connected to the first connecting part 141 via the pivot 122 of the first clamping part 120, and the torsion spring 123 of the first clamping part 120 is sleeved on the pivot 122 of the first clamping part 120. Similarly, the jaws 121 of the second clamping part 130 are rotatably connected to the second connecting part 142 via the pivot 122 of the second clamping part 130, and the torsion spring 123 of the second clamping part 130 is sleeved on the pivot 122 of the second clamping part 130.

[0046] like Figures 5 to 8 As shown, the first connecting part 141 and the second connecting part 142 can have the same structure, and both include a first sliding connector 1411 and a second sliding connector 1412. The first sliding connector 1411 and the second sliding connector 1412 are respectively sleeved on the rotating shaft 122 and can slide along the axial direction of the rotating shaft 122. The torsion spring 123 is located between the first sliding connector 1411 and the second sliding connector 1412. The first and second opposite sides of the heat dissipation body 110 are respectively provided with through holes and snap-fit ​​parts 111 located at the openings of the through holes.

[0047] The first sliding connector 1411 and the second sliding connector 1412 have a first relative position that is close to each other and a second relative position that is far apart from each other. For example... Figure 8 As shown, when the first sliding connector 1411 and the second sliding connector 1412 are in the first position, they approach each other. The entire assembly formed by the first sliding connector 1411 and the second sliding connector 1412 can extend into the heat dissipation body 110 through the through hole. At this time, the torsion spring 123 is in a compressed state. The first sliding connector 1411 and the second sliding connector 1412 can be manually controlled to approach each other, or they can be automatically driven to approach each other by a motor, cylinder, or other driving components.

[0048] After the force applied to the first sliding connector 1411 and the second sliding connector 1412, which brought them closer together, is removed, the first sliding connector 1411 and the second sliding connector 1412 can move away from each other under the action of the torsion spring 123, thereby enabling them to engage with the locking part 111. It should be noted that the first sliding connector 1411 and the second sliding connector 1412 can be engaged with the locking part 111 by an interference fit, with the torsion spring 123 applying the preload force for the interference fit.

[0049] In conjunction with the above solutions, to further improve the stability of the fit between the first sliding connector 1411, the second sliding connector 1412, and the snap-fit ​​part 111, such as... Figures 6 to 8 As shown, a stop 1413 can be provided at the end of the first sliding connector 1411 that extends into the heat dissipation body 110, and / or a stop 1413 can be provided at the end of the second sliding connector 1412 that extends into the heat dissipation body 110. The stop 1413 can be used to engage with the snap-fit ​​part 111. Unlike the interference fit described above, the stop 1413 can prevent the first sliding connector 1411 and the second sliding connector 1412 from coming out of the through hole of the heat dissipation body 110, thereby further improving the reliability of the assembly.

[0050] like Figure 3 and Figure 4 As shown, the jaw clamp 121 has a first constraint part 1211, a second constraint part 1212 and a third constraint part 1213. The first constraint part 1211, the second constraint part 1212 and the third constraint part 1213 are arranged at intervals along the axial direction of the rotating shaft 122, and the third constraint part 1213 is located between the first constraint part 1211 and the second constraint part 1212. The first constraint part 1211, the second constraint part 1212 and the third constraint part 1213 are all provided with shaft holes, and the rotating shaft 122 passes through the first constraint part 1211, the second constraint part 1212 and the third constraint part 1213 respectively.

[0051] The torsion spring 123 has a first helical segment 1231 and a second helical segment 1232. The first sliding connector 1411 and the first helical segment 1231 are located between the first constraint portion 1211 and the third constraint portion 1213. The first helical segment 1231 can abut against the first sliding connector 1411 and the third constraint portion 1213 respectively. The second sliding connector 1412 and the second helical segment 1232 are located between the second constraint portion 1212 and the third constraint portion 1213. The second helical segment 1232 can abut against the second sliding connector 1412 and the third constraint portion 1213 respectively.

[0052] The first arm of the first helical segment 1231 abuts against the jaw clamp 121, the second arm of the first helical segment 1231 abuts against the first sliding connector 1411, the first arm of the second helical segment 1232 abuts against the jaw clamp 121, and the second arm of the second helical segment 1232 abuts against the second sliding connector 1412. In practical applications, the torsion spring can provide preload not only to the jaw clamp 121 but also to the first sliding connector 1411 and the second sliding connector 1412. Specifically, the first helical segment 1231 and the second helical segment 1232 can respectively apply a preload force to the jaw clamp 121 through the first support arm, so that the jaw clamp 121 can reliably clamp the electronic device 200. The type of preload force applied to the jaw clamp 121 is the torsional force provided by the torsion spring 123. In addition, during the process of controlling the first sliding connector 1411 and the second sliding connector 1412 to move closer to each other, the first sliding connector 1411 will compress the first helical segment 1231, so the first helical segment 1231 can apply a spring force to the first sliding connector 1411; the second sliding connector 1412 will compress the second helical segment 1232, so the second helical segment 1232 can apply a spring force to the second sliding connector 1412. Under the action of the first helical segment 1231 and the second helical segment 1232, the first sliding connector 1411 and the second sliding connector 1412 can be stably assembled with the snap-fit ​​part 111.

[0053] To avoid the problem of asynchrony between the first helical segment 1231 and the second helical segment 1232, such as Figure 3 and Figure 4 As shown, the first arm of the first helical segment 1231 is connected to the first arm of the second helical segment 1232, which can also further enhance the connection strength of the torsion spring 123. Furthermore, the first helical segment 1231 and the second helical segment 1232 can not only provide torsional force when the jaw 121 rotates, but also provide elastic force to the first sliding connector 1411 and the second sliding connector 1412 respectively, achieving a dual-purpose effect, thereby simplifying the structure of the clamping mechanism and reducing material and assembly costs.

[0054] In one optional embodiment of this application, the heat dissipation body 110, the first clamping part 120, and the second clamping part 130 can also be assembled in the following manner, specifically, as follows: Figures 9 to 15As shown, the connecting part 140 may include a mounting bracket 143 and a third sliding connector 144. The third sliding connector 144 is slidably connected to the mounting bracket 143. A groove may be provided on one of the third sliding connector 144 and the mounting bracket 143, and a slider may be provided on the other. A stable sliding connection is achieved by the cooperation of the groove and the slider. The first clamping part 120 is rotatably connected to the mounting bracket 143, and the second clamping part 130 is rotatably connected to the third sliding connector 144. The specific rotatable connection method can be referred to the assembly method of the first clamping part 120 and the first connecting part 141 described above, which will not be repeated here in this embodiment.

[0055] like Figures 10 to 15 As shown, the mounting bracket 143 has a first limiting part 1431 on the side near the heat dissipation body 110, and the third sliding connector 144 has a second limiting part 1441 on the side near the heat dissipation body 110. The first and second opposite sides of the heat dissipation body 110 are respectively provided with mounting holes 112. When the mounting bracket 143 and the third sliding connector 144 are relatively close to each other through relative sliding, such as... Figure 14 As shown, the first limiting part 1431 and the second limiting part 1441 can respectively extend into the mounting holes 112 on both sides of the heat dissipation body 110. The first limiting part 1431 can be limited and engaged with the mounting hole 112 on the first side of the heat dissipation body 110, and the first limiting part 1431 can be limited and engaged with the mounting hole 112 on the second side of the heat dissipation body 110, thereby fixing the heat dissipation body 110 under the whole formed by the mounting bracket 143 and the third sliding connector 144. Combined with the clamping action of the first clamping part 120 and the second clamping part 130 on the electronic device 200, the heat dissipation body 110 can be attached to the heat dissipation area of ​​the electronic device 200, thereby achieving auxiliary heat dissipation for the electronic device 200.

[0056] When it is necessary to separate the clamping mechanism from the heat dissipation body 110, such as Figure 15 As shown, the mounting bracket 143 or the third sliding connector 144 can be pulled apart to disengage the first limiting part 1431 from the mounting hole 112. Then, by moving the heat dissipation body 110 or the clamping mechanism, the heat dissipation body 110 can be separated from the clamping mechanism. It should be noted that, to prevent accidental sliding of the mounting bracket 143 and the third sliding connector 144, which could lead to separation of the clamping mechanism from the heat dissipation body 110, the mounting bracket 143 and the third sliding connector 144 can be designed to have significant frictional damping, so that their relative positions can be maintained under the action of friction.

[0057] To ensure that the first limiting part 1431 and the second limiting part 1441 can respectively form a stable limiting fit with the mounting hole 112, such as Figure 12 and Figure 13 As shown, the connecting part 140 also includes an elastic element 145, which can be a metal spring, a silicone spring, etc. The elastic element 145 is located between the mounting bracket 143 and the third sliding connector 144, and both ends of the elastic element 145 are connected to the mounting bracket 143 and the third sliding connector 144 respectively. The elastic element 145 can provide elastic preload when the mounting bracket 143 and the third sliding connector 144 are far apart from each other.

[0058] In specific usage scenarios, when assembling the clamping mechanism with the heat dissipation body 110, the third sliding connector 144 and the mounting bracket 143 can be pulled apart to move them away from each other, at which point the elastic element 145 is in a stretched state; then the clamping mechanism is moved to a predetermined position on the heat dissipation body 110, so that the first limiting part 1431 and the second limiting part 1441 are respectively aligned with the mounting hole 112 on the heat dissipation body 110; then the third sliding connector 144 and the mounting bracket 143 are released, and under the pre-tightening force of the elastic element 145, the third sliding connector 144 and the mounting bracket 143 move closer to each other, and the first limiting part 1431 and the second limiting part 1441 respectively extend into the mounting hole 112 on the heat dissipation body 110 to achieve assembly.

[0059] Similarly, when it is necessary to separate the clamping mechanism from the heat dissipation body 110, the third sliding connector 144 and the mounting bracket 143 can be pulled to move them away from each other. After the first limiting part 1431 and the second limiting part 1441 are respectively dislodged from the mounting hole 112 on the heat dissipation body 110, they can be separated.

[0060] Please refer to Figures 1 to 15 This application also discloses an electronic device component, which may include an electronic device 200 and the aforementioned heat sink 100. The heat sink 100 is configured to clamp the electronic device 200 and attach the heat sink body 110 to the heat sink area of ​​the electronic device 200 when the clamping mechanism is in a first state, and to release the electronic device 200 when the clamping mechanism is in a second state, so that the heat sink 100 is separated from the electronic device 200.

[0061] As described above, the electronic device assembly disclosed in this application uses the aforementioned heat sink 100. The heat sink 100 improves upon related technologies by providing a clamping mechanism. The first clamping part 120 and the second clamping part 130 of the clamping mechanism can clamp the electronic device 200, thereby smoothly attaching the heat sink body 110 to the heat dissipation area of ​​the electronic device 200, thus improving the heat dissipation performance of the electronic device 200. Since the heat sink 100 does not need to distinguish whether the electronic device 200 supports magnetic installation when assembling with the electronic device 200, the compatibility range of the heat sink 100 is improved, thereby enhancing the heat dissipation performance of the electronic device 200.

[0062] The above embodiments of this application focus on describing the differences between the various embodiments. As long as the different technical features between the various embodiments are not contradictory, they can be combined to form more specific embodiments. For the sake of brevity, they will not be described in detail here.

[0063] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A heat sink for use in electronic equipment (200), characterized in that, The radiator (100) includes a heat dissipation body (110) and a clamping mechanism; The heat dissipation body (110) is connected to the clamping mechanism, which includes a first clamping part (120) and a second clamping part (130) that can rotate relative to each other. The first clamping part (120) and the second clamping part (130) are located on opposite sides of the heat dissipation body (110). The clamping mechanism has a first state and a second state; When the clamping mechanism is in the first state, the clamping end of the first clamping part (120) and the clamping end of the second clamping part (130) approach each other and form a clamping space for clamping the electronic device (200) so as to attach the heat dissipation body (110) to the heat dissipation area of ​​the electronic device (200). When the clamping mechanism is in the second state, the clamping end of the first clamping part (120) and the clamping end of the second clamping part (130) move away from each other to release the electronic device (200).

2. The radiator according to claim 1, characterized in that, The clamping mechanism further includes a connecting part (140), which is detachably connected to the heat dissipation body (110). At least one of the first clamping part (120) and the second clamping part (130) is rotatably connected to the connecting part (140) so that the clamping mechanism can switch between the first state and the second state.

3. The radiator according to claim 2, characterized in that, The first clamping part (120) and the second clamping part (130) have the same structure, and both include a claw clamp (121), a rotating shaft (122) and a torsion spring (123). The claw (121) and the connecting part (140) are rotatably connected through the rotating shaft (122). The torsion spring (123) is sleeved on the rotating shaft (122), and the first arm of the torsion spring (123) abuts against the claw (121), and the second arm of the torsion spring (123) abuts against the connecting part (140).

4. The radiator according to claim 3, characterized in that, The connecting part (140) includes a first connecting part (141) and a second connecting part (142). The heat dissipation body (110) has a snap-fit ​​part (111) on its opposite first and second sides. The first clamping part (120) is snapped into the snap-fit ​​part (111) on the first side through the first connecting part (141), and the second clamping part (130) is snapped into the snap-fit ​​part (111) on the second side through the second connecting part (142).

5. The radiator according to claim 4, characterized in that, The first connecting part (141) and the second connecting part (142) have the same structure, and both include a first sliding connector (1411) and a second sliding connector (1412). The first sliding connector (1411) and the second sliding connector (1412) are respectively sleeved on the rotating shaft (122) and can slide along the axial direction of the rotating shaft (122). The torsion spring (123) is located between the first sliding connector (1411) and the second sliding connector (1412). The first sliding connector (1411) and the second sliding connector (1412) have a first relative position close to each other and a second relative position far apart from each other. The first sliding connector (1411) and the second sliding connector (1412) are configured to allow insertion into the heat dissipation body (110) when in the first relative position and to engage with the snap-fit ​​portion (111) when in the second relative position. The torsion spring (123) is used to provide an elastic preload when the first sliding connector (1411) and the second sliding connector (1412) are in the second relative position.

6. The radiator according to claim 5, characterized in that, The end of the first sliding connector (1411) that extends into the heat dissipation body (110) is provided with a stop (1413), and / or the end of the second sliding connector (1412) that extends into the heat dissipation body (110) is provided with a stop (1413), the stop (1413) being used to engage with the snap-fit ​​part (111).

7. The radiator according to claim 5, characterized in that, The jaw clamp (121) has a first constraint part (1211), a second constraint part (1212) and a third constraint part (1213). The first constraint part (1211), the second constraint part (1212) and the third constraint part (1213) are spaced apart along the axial direction of the rotating shaft (122), and the third constraint part (1213) is located between the first constraint part (1211) and the second constraint part (1212). The rotating shaft (122) passes through the first constraint part (1211), the second constraint part (1212) and the third constraint part (1213) respectively. The torsion spring (123) has a first helical segment (1231) and a second helical segment (1232), the first sliding connector (1411) and the first helical segment (1231) are located between the first constraint part (1211) and the third constraint part (1213), and the second sliding connector (1412) and the second helical segment (1232) are located between the second constraint part (1212) and the third constraint part (1213); The first arm of the first helical segment (1231) abuts against the claw (121), the second arm of the first helical segment (1231) abuts against the first sliding connector (1411), the first arm of the second helical segment (1232) abuts against the claw (121), the second arm of the second helical segment (1232) abuts against the second sliding connector (1412), and the first arm of the first helical segment (1231) is connected to the first arm of the second helical segment (1232).

8. The radiator according to claim 2 or 3, characterized in that, The connecting part (140) includes a mounting bracket (143) and a third sliding connector (144). The third sliding connector (144) is slidably connected to the mounting bracket (143), the first clamping part (120) is rotatably connected to the mounting bracket (143), and the second clamping part (130) is rotatably connected to the third sliding connector (144). The mounting bracket (143) has a first limiting part (1431) on the side near the heat dissipation body (110), and the third sliding connector (144) has a second limiting part (1441) on the side near the heat dissipation body (110). The first and second opposite sides of the heat dissipation body (110) are respectively provided with mounting holes (112). The mounting bracket (143) and the third sliding connector (144) are configured to fix the heat dissipation body (110) by limiting and cooperating with the mounting holes (112) through the first limiting part (1431) and the second limiting part (1441) respectively when they are close to each other.

9. The radiator according to claim 8, characterized in that, The connecting part (140) further includes an elastic element (145), which is located between the mounting bracket (143) and the third sliding connector (144). Both ends of the elastic element (145) are connected to the mounting bracket (143) and the third sliding connector (144) respectively, and are used to provide elastic preload when the mounting bracket (143) and the third sliding connector (144) are far apart from each other.

10. An electronic device component, characterized in that, The device includes an electronic device (200) and a heat sink (100) according to any one of claims 1-9, the heat sink (100) being configured to clamp the electronic device (200) in the first state and attach the heat sink body (110) to the heat sink area of ​​the electronic device (200), and to release the electronic device (200) in the second state of the clamping mechanism.

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