Novel lamp bead with built-in IC and conductive platform

Abstract

The utility model discloses a novel lamp bead with a built-in IC (integrated circuit) and a conductive platform, which relates to the technical field of LEDs (light-emitting diodes) and comprises a support body, an embedding groove is arranged at the top of the support body, and a first conductive pad, a second conductive pad, a third conductive pad and a fourth conductive pad are respectively mounted at four corners inside the embedding groove. An IC wafer is welded to the top of the first conductive pad, two sets of IC electrodes are arranged on the IC wafer, and a conductive platform and a chip are welded to the top of the third conductive pad. According to the utility model, through arranging the conductive platform, the conductive platform can be used as a middle connection point for concentrated wire welding, a plurality of wires are concentrated to a single connection point, and then the conductive platform is connected to a chip through one wire, so that the number of times of directly welding a chip electrode can be reduced, the wire welding difficulty is reduced, and multiple wire welding of the same electrode is avoided; the risk of poor bonding wires is reduced, and the stability and yield of products are improved.

Description

Technical Field

[0001] This utility model relates to the field of LED technology, and in particular to a novel LED bead with a built-in IC and conductive platform. Background Technology

[0002] In the field of LED technology, the design and manufacturing of IC-added LED chips has always been a key focus of technological development. Currently, most LED chips on the market use the conventional IC-plus-chip die bonding method. This method can meet basic performance requirements in most cases. However, when it comes to some specially designed IC-added LED chips, the traditional die bonding method has exposed some significant problems. These special models of LED chips often require multiple wire bonding operations on the same electrode, or multiple wires to be laid out in an interlaced manner in the same area for wire bonding operations. The difficulty of wire bonding is significantly increased. This not only increases the complexity of the process, but may also lead to the risk of poor wire bonding, thereby affecting the reliability and stability of the product. Utility Model Content

[0003] To address the shortcomings of existing technologies, this invention provides a novel LED bead with a built-in IC and conductive platform, solving the technical problems mentioned in the background section.

[0004] To solve the above-mentioned technical problems, this utility model provides the following technical solution: a novel LED bead with a built-in IC and conductive platform, comprising a bracket body, an embedding groove on the top of the bracket body, and a first conductive pad, a second conductive pad, a third conductive pad, and a fourth conductive pad respectively installed at the four corners of the embedding groove. An IC chip is soldered to the top of the first conductive pad, and two sets of IC electrodes are disposed on the IC chip. A conductive platform and a chip are soldered to the top of the third conductive pad, and chip electrodes are disposed on the chip. One set of IC electrodes is electrically connected to the conductive platform through multiple wires, the conductive platform is electrically connected to the positive electrode of the chip electrode through a wire, and the negative electrode of the chip electrode is electrically connected to the third conductive pad through a wire.

[0005] Furthermore, the other set of IC electrodes is provided with four, and the four IC electrodes are electrically connected to the first conductive pad, the second conductive pad, the third conductive pad and the fourth conductive pad respectively through wires.

[0006] Furthermore, the conductor is made of pure gold wire.

[0007] Furthermore, the IC wafer, conductive platform, and chip are arranged in parallel.

[0008] Furthermore, a pair of pins are provided on both sides of the bracket body.

[0009] Furthermore, a polarity marking notch is provided at the corner of the support body.

[0010] By employing the above technical solution, this utility model provides a novel LED bead with a built-in IC and conductive platform, which has at least the following beneficial effects:

[0011] 1. By setting up a conductive platform, this utility model can use the conductive platform as an intermediate connection point for centralized wire bonding, realizing the concentration of multiple wires to a single connection point, and then connecting them to the chip through a single wire from the conductive platform. This can reduce the number of times the chip electrodes are directly soldered, reduce the difficulty of wire bonding, avoid multiple soldering of the same electrode, reduce the risk of wire bonding defects, and improve the stability and yield of the product.

[0012] 2. By arranging the IC chip, conductive platform, and chip in a parallel configuration, the wires can be arranged in a straight line when connecting the IC chip, conductive platform, and chip, forming a compact and orderly layout, avoiding wire crossing, and further reducing the difficulty of wire bonding. Attached Figure Description

[0013] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0014] Figure 1 This is a schematic diagram of the die bonding of the support body of this utility model;

[0015] Figure 2 This is a schematic diagram of the welding wires of the bracket body of this utility model;

[0016] Figure 3 This is a schematic diagram of the support structure of this utility model.

[0017] In the diagram: 1. Support body; 101. Embedded groove; 102. First conductive pad; 103. Second conductive pad; 104. Third conductive pad; 105. Fourth conductive pad; 106. Polarity marking notch; 2. IC chip; 201. IC electrode; 3. Conductive platform; 4. Chip; 401. Chip electrode; 5. Wire; 6. Pin. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0019] Currently, most LED chips on the market use the conventional IC chip bonding method. This method can meet basic performance requirements in most cases. However, when it comes to special-designed IC chips, these special models often require multiple wire bonding operations on the same electrode or multiple wires to be laid out in the same area for wire bonding operations. The difficulty of wire bonding increases significantly, which may lead to the risk of poor wire bonding, thereby affecting the reliability and stability of the product.

[0020] Example 1

[0021] To resolve the defects encountered during the wire bonding process of the IC-added LEDs mentioned above, please refer to [link / reference]. Figures 1-3 This utility model provides a novel LED bead with a built-in IC and conductive platform, which can concentrate multiple bonding wires to a single connection point, reducing the risk of bonding wire defects. The LED chip uses a support body 1 as its base. The top of the support body 1 has an embedding groove 101. Four conductive pads 102, 103, 104, and 105 are respectively installed at the four corners of the embedding groove 101. The support body 1 serves as the basic support structure for the LED chip. The design of the embedding groove 101 facilitates the positioning and installation of the four conductive pads. The four conductive pads are located at the four corners of the embedding groove 101 and are used for electrical connection and signal transmission. An IC chip 2 is soldered to the top of the first conductive pad 102. Two sets of IC electrodes 201 are provided on the IC chip 2. The IC electrodes 201 are used for electrical signal input and output, enabling the IC chip 2 to integrate and control the LED chip. A conductive platform 3 and a chip 4 are soldered to the top of the third conductive pad 104. Chip electrodes 401 are provided on the chip 4. One set of IC electrodes 201 is electrically connected to the conductive platform 3 through multiple wires 5. The other set of IC electrodes 201 consists of four wires. The conductive wires 5 are electrically connected to the first conductive pad 102, the second conductive pad 103, the third conductive pad 104, and the fourth conductive pad 105, respectively. The conductive platform 3 is electrically connected to the positive electrode of the chip electrode 401 through a conductive wire 5, and the negative electrode of the chip electrode 401 is electrically connected to the third conductive pad 104 through a conductive wire 5. The chip 4 provides high-efficiency photoelectric conversion performance to ensure the luminous efficiency of the LED. Another set of IC electrodes 201 is set to four, and the four IC electrodes 201 are electrically connected to the first conductive pad 102, the second conductive pad 103, the third conductive pad 104, and the fourth conductive pad 105, respectively, through conductive wires 5. This solution introduces the conductive platform 3, which is used as an intermediate connection point for centralized wire bonding. This allows multiple conductive wires 5 to be concentrated to a single connection point, and then connected to the chip 4 through a single conductive wire 5 from the conductive platform 3. This reduces the number of times the chip electrode 401 is directly soldered, reduces the difficulty of wire bonding, avoids multiple solderings of the same electrode, reduces the risk of poor wire bonding, and improves the stability and yield of the product.

[0022] To ensure the reliability of the connection between IC chip 2, conductive platform 3 and chip 4, the wire 5 is made of pure gold wire. Pure gold wire has excellent conductivity and oxidation resistance. Using pure gold wire to connect IC electrode 201, conductive platform 3 and chip electrode 401 can ensure the stability and durability of the electrical connection and reduce the degradation or failure of electrical performance caused by problems with the material of wire 5.

[0023] Since the LED beads need to be electrically connected and fixed to the outside through the bracket body 1, a pair of pins 6 are provided on both sides of the bracket body 1 to facilitate the installation and soldering of the LED beads with other circuit boards.

[0024] To provide clear polarity markings for staff, a polarity marking notch 106 is provided at the corner of the bracket 1. The polarity marking notch 106 is used to mark the positive and negative directions of the LED beads, avoiding circuit failures caused by incorrect polarity during installation.

[0025] Example 2

[0026] When adding a conductive platform 3 to the conductive pad, the position of the conductive platform 3 also needs to be properly divided. Please refer to [reference needed]. Figure 2 As shown, the IC chip 2, conductive platform 3, and chip 4 are arranged side by side. This allows the wires 5 to be arranged in a straight line when connecting the IC chip 2, conductive platform 3, and chip 4, forming a compact and orderly layout. This avoids the wires 5 crossing and further reduces the difficulty of wire bonding.

[0027] The control method of this utility model is automatic control through a controller. The control circuit of the controller can be implemented by simple programming by those skilled in the art. The power supply is also common knowledge in the field. Since this utility model is mainly used to protect mechanical devices, the control method and circuit connection will not be explained in detail.

[0028] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0029] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A novel LED bead with a built-in IC and conductive platform, comprising a support body (1), characterized in that: The top of the support body (1) is provided with an embedding groove (101). The four corners inside the embedding groove (101) are respectively equipped with a first conductive pad (102), a second conductive pad (103), a third conductive pad (104) and a fourth conductive pad (105). An IC chip (2) is soldered to the top of the first conductive pad (102). Two sets of IC electrodes (201) are provided on the IC chip (2). A conductive platform (3) and a chip (4) are soldered to the top of the third conductive pad (104). A chip electrode (401) is provided on the chip (4). One set of IC electrodes (201) is electrically connected to the conductive platform (3) through multiple wires (5). The conductive platform (3) is electrically connected to the positive electrode of the chip electrode (401) through a wire (5). The negative electrode of the chip electrode (401) is electrically connected to the third conductive pad (104) through a wire (5).

2. The novel LED bead with built-in IC and conductive platform according to claim 1, characterized in that: The other set of IC electrodes (201) is provided with four, and the four IC electrodes (201) are electrically connected to the first conductive pad (102), the second conductive pad (103), the third conductive pad (104) and the fourth conductive pad (105) respectively through wires (5).

3. The novel LED bead with built-in IC and conductive platform according to claim 1, characterized in that: The conductor (5) is made of pure gold wire.

4. The novel LED bead with built-in IC and conductive platform according to claim 1, characterized in that: The IC wafer (2), conductive platform (3) and chip (4) are arranged in parallel.

5. The novel LED bead with built-in IC and conductive platform according to claim 1, characterized in that: A pair of pins (6) are provided on both sides of the bracket (1).

6. The novel LED bead with built-in IC and conductive platform according to claim 1, characterized in that: The support body (1) is provided with a polarity marking notch (106) at the corner.

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