Wafer taking and placing jig
By designing the sliding part and limiting transfer plate of the wafer pick-and-place fixture, the problems of low wafer transfer efficiency and scratches were solved, and stable, non-overlapping, and highly efficient wafer transfer was achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-09
- Publication Date
- 2026-04-03
AI Technical Summary
In existing technologies, wafer transfer efficiency is low. Conventional robotic arms or pneumatic finger grippers have low transfer efficiency, which can easily lead to wafer scratches and overlay.
Design a wafer pick-and-place fixture that guides the wafer to slide into the wafer box's compartments by setting multiple sliding parts on the transfer assembly. The transfer plate limits and guides the wafer on both sides to prevent swaying and oblique insertion, thus achieving layered placement.
It improves the stability and efficiency of wafer transfer, reduces the risk of scratches, prevents overlay, ensures accurate wafer insertion into the interlayer, and enhances the stability and efficiency of operations.
Smart Images
Figure CN224084024U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of wafer handling technology, and in particular to a wafer box handling fixture. Background Technology
[0002] A wafer is a silicon wafer used to make silicon semiconductor circuits. It is the basic material for manufacturing semiconductor chips. Because of its circular shape, it is called a wafer. A wafer box is a tool used in semiconductor production to place, transport and store wafers. Neatly storing wafers in a wafer box makes them easy to handle and store, and simplifies the transportation process.
[0003] During wafer transfer, wafers need to be stacked in layers within the wafer cassette. The conventional approach is to use grippers such as robotic arms or pneumatic fingers to place the wafers layer by layer into the compartments of the wafer cassette, which results in low transfer efficiency. Utility Model Content
[0004] In order to overcome the shortcomings of the prior art, the purpose of this utility model is to provide a wafer pick-and-place fixture, which can guide the wafer to slide toward the wafer box in the clamping area through multiple sliding parts provided on the transfer component of the transfer area, thereby realizing the transfer and clamping of the wafer.
[0005] The objective of this utility model is achieved through the following technical solution:
[0006] A wafer pick-and-place fixture, comprising,
[0007] A base; the base is provided with a transfer area and a clamping area distributed in a transfer direction; the clamping area is used to place a wafer cassette.
[0008] A transfer assembly is installed in the transfer area. The transfer assembly includes two oppositely arranged transfer plates; a transfer space is formed between the two transfer plates; the transfer plates are provided with a plurality of sliding parts, which are spaced apart in the height direction of the transfer plates; the sliding parts are used to slide and engage with the side of the wafer to guide the wafer to slide along the transfer direction to the clamping area.
[0009] Furthermore, the transfer plate is provided with a sliding groove for sliding engagement with the side of the wafer; both sides of the bottom end of the base are provided with support edges, which gradually slope upward from the transfer area to the clamping area.
[0010] Furthermore, the transfer area is provided with a first positioning part, and the transfer plate is provided with a second positioning part. The first positioning part and the second positioning part are slidably engaged so that the transfer space between the two transfer plates is adjustable.
[0011] Furthermore, the first positioning part includes a positioning groove disposed in the transfer area, and the second positioning part includes a positioning seat disposed at the bottom end of the transfer plate, wherein the positioning seat is slidably engaged with the positioning groove.
[0012] Furthermore, the first positioning part also includes a first sliding member, and the positioning grooves are provided on both sides of the transfer area. The two ends of the first sliding member extend to the positioning grooves on both sides. The bottom end of the positioning seat is provided with a second sliding member, and the positioning seats of the two transfer plates slide in cooperation with the first sliding member through the second sliding member.
[0013] Furthermore, the positioning groove is provided with a limiting seat, which is used to insert into the positioning groove to prevent the positioning seat from sliding within the positioning groove.
[0014] Furthermore, the outer peripheral surface of the positioning seat is provided with a first guide slope; the bottom outer peripheral surface of the limiting seat is provided with a second guide slope, the second guide slope being used to cooperate with the first guide slope after the limiting seat is inserted into the positioning groove, and to press against the first guide slope.
[0015] Furthermore, the first sliding member includes a slide rail, and the second sliding member includes a sliding block, the sliding block being slidably engaged with the slide rail.
[0016] Furthermore, positioning baffles are provided on both sides of the clamping area, and the two positioning baffles are detachably installed in the clamping area.
[0017] Furthermore, a limiting baffle is provided at the end of the clamping area away from the transfer area, and the limiting baffle is detachably installed in the clamping area.
[0018] Compared with the prior art, the beneficial effects of this utility model are as follows:
[0019] 1. This application uses two transfer plates of the transfer assembly to limit and guide the wafer on both sides. The sliding part guides the wafer to slide layer by layer into the wafer cassette, reducing scratches caused by the robotic arm during the transfer process. The transfer plates on both sides can limit the swaying of the wafer during the transfer process. This limited transfer makes the transfer process stable and facilitates the insertion into the wafer cassette. Furthermore, the sliding part at different heights guides the wafer layer by layer, preventing wafer stacking and improving wafer transfer efficiency.
[0020] 2. Because the sliding parts on the transfer plates on both sides are arranged in a one-to-one correspondence, when the two edges of the wafer are placed on the same layer of the two sliding parts, the wafer can be smoothly guided into the corresponding compartment of the wafer cassette. However, when the two edges of the wafer are placed on sliding parts on different layers, the wafer is tilted and cannot be smoothly inserted into the compartment of the wafer cassette, thus achieving the purpose of preventing tilting insertion. Attached Figure Description
[0021] Figure 1 This is a schematic diagram of the wafer pick-and-place fixture of this utility model;
[0022] Figure 2 This is a schematic diagram of the wafer pick-and-place fixture of this utility model from another perspective.
[0023] Figure 3 This is a schematic diagram of the structure of the limiting seat of the wafer pick-and-place fixture of this utility model after disassembly.
[0024] Figure 4 This is a schematic diagram of the transfer component of this utility model;
[0025] Figure 5 This is a schematic diagram of the structure of the limiting seat of this utility model;
[0026] Figure 6 This is a schematic diagram of the limiting baffle of this utility model.
[0027] In the diagram: 10, base; 11, transfer area; 111, positioning groove; 12, clamping area; 30, transfer plate; 31, sliding groove; 32, slider; 33, positioning seat; 40, limit seat; 41, second guide slope; 50, positioning baffle; 60, limit baffle; 61, mounting hole; 70, slide rail. Detailed Implementation
[0028] The present invention will now be further described in conjunction with the accompanying drawings and specific embodiments:
[0029] In the description of this utility model, it should be noted that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
[0031] like Figures 1-6A wafer pick-and-place fixture is shown, comprising a base 10 and a transfer assembly. The base 10 has a transfer area 11 and a clamping area 12, which are distributed along a transfer direction. A wafer cassette can be placed in the clamping area 12. The transfer assembly is mounted on the transfer area 11 and includes two opposing transfer plates 30, with a transfer space formed between them. Each transfer plate 30 has multiple sliding portions, which are spaced apart along its height. These sliding portions are used to slide against the sides of the wafer to guide it along the transfer direction to the clamping area 12.
[0032] Based on the above structure, when using the wafer pick-and-place fixture of this utility model, when placing the wafer, the wafer box can be clamped in the clamping area 12 first, and the storage space inside the wafer box can correspond to the transfer space, and the multiple partitions can correspond to the multiple sliding parts of the transfer plate 30.
[0033] When placing the wafer, the wafer can be placed in the transfer space of two transfer plates 30, and the edges on both sides of the wafer can correspond to the sliding parts of the transfer plates 30 respectively. When the side edges of the wafer slide with the sliding parts, the sliding parts on both sides can guide the wafer to slide to the corresponding compartment of the wafer box in the clamping area 12 for storage.
[0034] It should be noted that each time a wafer is placed into a wafer cassette, the two sides of the wafer can be supported by the sliding parts of the corresponding compartments within the wafer cassette. That is, when the wafer is placed into the bottom compartment of the wafer cassette, the edges on both sides of the wafer can be guided by the sliding parts at the bottom of the transfer plate 30. Similarly, the sliding parts of each compartment guide the wafer to different compartments within the wafer cassette. After the wafer cassette is full, the full wafer cassette is removed, and then the next wafer cassette is placed in the clamping area 12.
[0035] This application uses two transfer plates 30 of the transfer assembly to limit and guide the wafer on both sides. The sliding part guides the wafer to slide layer by layer into the wafer cassette, reducing scratches caused by the robotic arm during the transfer process. The transfer plates 30 on both sides can limit the swaying of the wafer during the transfer. This limited transfer makes the transfer process stable, facilitates alignment with the wafer cassette, and allows for layered placement by sliding parts at different heights, preventing wafer stacking and improving wafer transfer efficiency.
[0036] Because the sliding parts on the transfer plates on both sides are arranged in a one-to-one correspondence, when the two edges of the wafer are placed on the same layer of the two sliding parts, the wafer can be smoothly guided into the corresponding compartment of the wafer cassette. However, when the two edges of the wafer are placed on sliding parts on different layers, the wafer is tilted and cannot be smoothly inserted into the compartment of the wafer cassette, thus achieving the purpose of preventing tilting.
[0037] Furthermore, in this embodiment, a sliding groove 31 can be provided on the transfer plate 30. The sliding groove 31 is used to slide and engage with the side of the wafer. Specifically, support edges are provided on both sides of the bottom end of the base, and the support edges gradually slope upward from the transfer area to the clamping area. In this way, when the base is placed on a table or the ground, it is supported by the support edges. The end of the support edge located in the transfer area is at the bottom, and the end near the clamping area is at the top. When placed, the transfer area to the clamping area formed by the top surface of the base can slope downward, and the wafer in the sliding groove at the transfer area can slide smoothly into the wafer box in the clamping area and be transferred by its own gravity.
[0038] Because there are multiple sliding sections, there are also multiple corresponding sliding grooves. This allows two sliding grooves for each layer to guide the sliding of one wafer, preventing wafer stacking. Furthermore, when clamping the wafer cassette, the cassette's partition can be lower than the bottom wall of the sliding groove in the transfer area. This way, after a wafer is placed in the cassette's sliding groove, it can block the next wafer, also achieving the anti-stacking function.
[0039] Of course, the sliding groove can also be machined into an inclined structure. For example, the sliding groove 31 can gradually slope downwards from the end away from the clamping area 12 to the end near the clamping area 12. In this way, after the wafer is placed in the sliding groove 31, the side edge of the wafer can be guided by the inclined sliding groove 31 and then inserted into the partition of the wafer cassette. In some other embodiments, a ball bearing or other structure can be provided in the sliding groove 31. When the side edge of the wafer contacts the ball bearing or other structure, sliding guidance can also be achieved. In addition, the bottom wall of the sliding groove 31 can be set as a plane, and the bottom end of the base 10 as a whole can be inclined downwards from the transfer area 11 to the clamping area 12. In this way, after the wafer is placed in the sliding part, it can also be guided by the inclined surface.
[0040] Furthermore, a first positioning part can be provided in the transfer area 11, and a second positioning part can be provided on the transfer plate 30. The first positioning part and the second positioning part are slidably engaged so that the transfer space between the two transfer plates 30 is adjustable. In this way, by the slidable engagement between the second positioning part of the transfer plate 30 and the first positioning part of the transfer area 11, the transfer space between the two transfer plates 30 can be increased or decreased, so that the transfer space between the two transfer plates 30 can be adapted to transfer wafers of different sizes, thereby improving the application scenarios.
[0041] Specifically, the first positioning part includes a positioning groove 111, and the corresponding second positioning part includes a positioning seat 33. The positioning groove 111 is set in the transfer area 11, and the positioning seat 33 is set at the bottom of the transfer plate 30. Of course, the size of the positioning groove 111 needs to be larger than the size of the positioning seat 33, so that the positioning seat 33 can have sliding adjustment space in the positioning groove 111. When the positioning seat 33 slides to different positions in the positioning groove 111, the distance between the transfer space between the two transfer plates 30 can be adjusted.
[0042] Furthermore, to ensure smoother sliding between the positioning seat 33 and the positioning groove 111, the first positioning part also includes a first sliding member. Positioning grooves 111 are provided on both sides of the transfer area 11, and the two ends of the first sliding member extend into the positioning grooves 111 on both sides. A second sliding member is provided at the bottom of the positioning seat 33, and the positioning seats 33 of the two transfer plates 30 slide in cooperation with the first sliding member through the second sliding member. Thus, when adjusting the size of the transfer space between the two transfer plates 30, the sliding guidance between them can be achieved through the sliding cooperation of the second sliding member and the first sliding member, resulting in a smooth sliding process and reducing the occurrence of jamming.
[0043] Furthermore, since the transfer plate 30 slides into the positioning groove 111 via the positioning seat 33, after sliding into position, the positioning seat 33 of the transfer plate 30 needs to be positioned to prevent the transfer plate 30 from shifting during wafer transfer. Therefore, a limiting seat 40 can be provided in the positioning groove 111. That is, when the positioning seat 33 slides relative to the positioning groove 111, the limiting seat 40 can be removed. After the transfer plate 30 is adjusted into position, the limiting seat 40 is inserted into the positioning groove 111. The limiting seat 40 can abut against the side of the positioning seat 33 and the inner wall of the positioning groove 111, which can prevent the positioning seat 33 from sliding again, thereby stabilizing the position of the transfer plate 30.
[0044] Of course, the positioning of the positioning seat 33 can be achieved by using the limiting seat 40. Different sizes of limiting seats 40 can be set. When the positioning seat 33 slides to different positions of the positioning groove 111, the distance between the positioning seat 33 and the positioning groove 111 is different. Therefore, the space that the limiting seat 40 can achieve after insertion is different. So, the fitting can be achieved by using limiting seats 40 of different sizes.
[0045] Furthermore, a first guide slope can be provided on the outer peripheral surface of the positioning seat 33, and a second guide slope 41 can be provided on the bottom outer peripheral surface of the limiting seat 40. When the limiting seat 40 limits the positioning seat 33, the limiting seat 40 can be inserted into the positioning groove 111, so that the second guide slope 41 on the limiting seat 40 cooperates with the first guide slope and is pressed against the first guide slope. That is, forces are applied to the positioning seat 33 in both the longitudinal and transverse directions, so that the limiting structure is more stable.
[0046] Alternatively, a spring-loaded pin structure can be provided on the positioning seat 33, with a corresponding pin hole structure provided in the positioning groove 111. When the positioning seat 33 slides to different positions in the positioning groove 111, the spring-loaded pin automatically pops out into the corresponding pin hole to achieve positioning. When readjusting the position of the transfer plate 30, simply press the spring-loaded pin to disengage it from the pin hole.
[0047] Furthermore, the first sliding member includes a slide rail 70, and the second sliding member includes a sliding block. The sliding block is slidably engaged with the slide rail 70, that is, the sliding engagement between the positioning seat 33 and the positioning groove 111 can be achieved through the sliding engagement between the sliding block and the slide rail 70. Of course, the first sliding member may also include a slide rod, and the corresponding second sliding member may include a slide sleeve, with the slide sleeve fitted onto the outside of the slide rod to achieve sliding guidance.
[0048] Furthermore, positioning baffles 50 are provided on both sides of the clamping area 12. The two positioning baffles 50 are detachably installed in the clamping area 12. In this way, when clamping the wafer cassette, the two sides of the wafer cassette can be limited to the left and right by the two positioning baffles 50, thus preventing the wafer cassette from shifting after clamping. Of course, since the two positioning baffles 50 are detachably assembled in the clamping area 12, the distance between the two positioning baffles 50 is adjustable, and clamping can be performed according to the size of the wafer cassette.
[0049] Furthermore, a limiting baffle 60 can be provided at the end of the clamping area 12 away from the transfer area 11. The limiting baffle 60 is detachably installed in the clamping area 12. In this way, the limiting baffle 60 can abut against the rear end of the wafer cassette and abut against the two transfer plates 30 at the front end of the wafer cassette, thus preventing the wafer cassette from moving back and forth.
[0050] Specifically, multiple positioning holes can be provided in the clamping area, and mounting holes 61 can be provided on the limiting baffle and the positioning baffle. By passing pins, screws, rivets and other structures through the mounting holes 61 of the positioning baffle or the limiting baffle, the components can be inserted and fitted into the positioning holes at the corresponding positions in the clamping area during assembly.
[0051] For those skilled in the art, various other corresponding changes and modifications can be made based on the technical solutions and concepts described above, and all such changes and modifications should fall within the protection scope of the claims of this utility model.
Claims
1. A wafer pick-and-place fixture, characterized in that, The utility model relates to a wafer transfer device, including, A base is provided with a transfer area and a clamping area distributed in a transfer direction on the base, and the clamping area is used for placing a wafer box; A transfer assembly is installed on the transfer area, and the transfer assembly includes two oppositely arranged transfer plates, and a transfer space is formed between the two transfer plates; A plurality of sliding parts are arranged on the transfer plate and are distributed at intervals in the height direction of the transfer plate, and the sliding parts are used for sliding cooperation with the side of the wafer to guide the wafer to slide to the clamping area along the transfer direction.
2. The wafer pick-and-place tool of claim 1, wherein A sliding groove is arranged on the transfer plate and is used for sliding cooperation with the side of the wafer, and the bottom end of the base is provided with a support edge on both sides, and the support edge gradually inclines upward from the transfer area to the clamping area.
3. The wafer pick-and-place tool of claim 1, wherein The transfer area is provided with a first positioning part, and the transfer plate is provided with a second positioning part, and the first positioning part and the second positioning part are in sliding cooperation to adjust the transfer space between the two transfer plates.
4. The wafer pick-and-place tool of claim 3, wherein, The first positioning part includes a positioning groove arranged on the transfer area, and the second positioning part includes a positioning seat arranged at the bottom end of the transfer plate, and the positioning seat and the positioning groove are in sliding cooperation.
5. The wafer pick-and-place tool of claim 4, wherein, The first positioning part further includes a first sliding member, both sides of the transfer area are provided with the positioning groove, and both ends of the first sliding member extend to the positioning grooves on both sides; the bottom end of the positioning seat is provided with a second sliding member, and the positioning seats of the two transfer plates are in sliding cooperation with the first sliding member through the second sliding member.
6. The wafer pick-and-place tool of claim 5, wherein, The positioning groove is provided with a limiting seat, and the limiting seat is inserted into the positioning groove to prevent the positioning seat from sliding in the positioning groove.
7. The wafer pick-and-place tool of claim 6, wherein, The outer circumferential surface of the positioning seat is provided with a first guide inclined surface, and the bottom end of the limiting seat is provided with a second guide inclined surface, and the second guide inclined surface is used for cooperating with the first guide inclined surface after the limiting seat is inserted into the positioning groove and is pressed tightly to the first guide inclined surface.
8. The wafer pick-and-place tool of claim 5, wherein, The first sliding member includes a sliding rail, and the second sliding member includes a sliding block, and the sliding block is in sliding cooperation with the sliding rail.
9. The wafer pick-and-place tool of any of claims 1-8, wherein, Both sides of the clamping area are provided with positioning baffle plates, and the two positioning baffle plates are detachably installed on the clamping area.
10. The wafer pick-and-place tool of claim 9, wherein, The end of the clamping area away from the transfer area is provided with a limiting baffle plate, and the limiting baffle plate is detachably installed on the clamping area.