Semiconductor component inspection system

By using air ducts to input dry air and designing baffles and flexible suction cups in the semiconductor component inspection system, the problem of condensation on the component surface was solved, achieving efficient drying and component protection.

CN224084043UActive Publication Date: 2026-04-03HON PRECISION TECH (SUZHOU) LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-03-27
Publication Date
2026-04-03

AI Technical Summary

Technical Problem

When existing semiconductor devices are tested under temperature difference conditions, condensation easily forms on the device surface. Existing dry air inputs are large and the treatment effect is not ideal.

Method used

Dry air is introduced into the outer casing through an air duct, and the design of baffles and flexible suction cups reduces the amount of dry air input and minimizes component damage.

Benefits of technology

It effectively solves the problem of condensation on the surface of components, reduces the amount of dry air input, and reduces damage to components.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to a semiconductor component inspection system, which comprises a carrying outer box body, a constant temperature box and a detection box, the carrying outer box body moves under the driving of a carrying motion module through a carrying transfer frame, and a carrying sucker is arranged in the carrying outer box body through a carrying support and a carrying push rod module; a stop lever is mounted at the bottom of the carrying suction cup mounting frame on the left side of the carrying suction cup; an air duct is mounted in the carrying outer box body on the outer side below the carrying suction cup; and closed structures are mounted at a carrying opening in the bottom of the carrying outer box body, a constant-temperature opening in the top of the constant-temperature box and a detection opening in the top of the detection box. According to the utility model, dry air is input into the carrying outer box body through the air duct, so that the problems of moisture condensation and the like on the surface of an element can be solved, the input amount of the dry air is greatly reduced, and the treatment effect is improved.
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Description

Technical Field

[0001] This utility model relates to the technical field of semiconductor component processing, and in particular to a semiconductor component inspection system. Background Technology

[0002] In the process of testing semiconductor components, the testing is generally carried out in a testing environment with a suitable temperature, such as a low temperature environment below zero degrees Celsius.

[0003] like Figure 1 Reference document 1, as shown, describes a conventional semiconductor component testing apparatus that includes a transport enclosure, a temperature control chamber, and a testing chamber, all of which are located within the enclosure. Since the transport enclosure is typically in a room-temperature environment, removing the component from the low-temperature temperature control chamber can cause condensation on the component surface due to the temperature difference. To avoid this, reference document 1 introduces dry air into the enclosure; however, this method requires a large amount of dry air and the treatment effect is not ideal.

[0004] In view of the above-mentioned shortcomings, the designer has actively researched and innovated in order to create a semiconductor component inspection system that has greater industrial application value. Utility Model Content

[0005] To address the aforementioned technical problems, the purpose of this utility model is to provide a semiconductor component inspection system.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A semiconductor component inspection system includes a transport outer housing, a constant temperature chamber, and a testing chamber. The transport outer housing moves under the drive of a transport motion module via a transport adapter. A transport suction cup is installed inside the transport outer housing via a transport bracket and a transport push rod module. A constant temperature positioning seat is installed inside the constant temperature chamber via a constant temperature bracket, and a constant temperature positioning groove for placing components is provided on the constant temperature positioning seat. A testing seat is installed on a detector inside the testing chamber, and a testing head for testing components is provided inside the testing seat.

[0008] A suction cup mounting bracket is installed at the bottom of the transport push rod module, a transport suction cup is installed at the bottom of the suction cup mounting bracket, a stop bar is installed at the bottom of the suction cup mounting bracket on the left side of the transport suction cup, and an air duct is installed in the transport outer box below the transport suction cup.

[0009] A closed structure is installed at the transport opening at the bottom of the transport box, the constant temperature opening at the top of the constant temperature chamber, and the test opening at the top of the test chamber.

[0010] A suction cup mounting cavity is provided at the bottom of the suction cup mounting bracket directly above the suction cup. A suction cup movable through hole is provided at the bottom of the suction cup mounting cavity for the suction cup to pass through freely. The top of the suction cup is connected to several elastic structural components installed in the suction cup mounting cavity.

[0011] As a further improvement of this utility model, a clearance groove adapted to the above-mentioned stop bar is provided on the constant temperature positioning seat outside the constant temperature positioning groove.

[0012] As a further improvement of this utility model, a clearance groove adapted to the aforementioned stop bar is provided on the detection seat on the outside of the detection head.

[0013] As a further improvement of this utility model, a material sensor is installed at the middle position of the bottom of the conveying suction cup.

[0014] As a further improvement of this utility model, a material sensor is installed in the middle of the constant temperature positioning groove.

[0015] As a further improvement of this utility model, the air duct is distributed around the lower outer side of the transport suction cup.

[0016] As a further improvement of this utility model, several nozzles installed on the air duct are all tilted towards the upward side of the transport suction cup.

[0017] As a further improvement of this utility model, limiting blocks are provided on both the left and right sides of the top of the transport suction cup, which are engaged with the suction cup mounting cavity.

[0018] By means of the above solution, this utility model has at least the following advantages:

[0019] This invention introduces dry air into the outer casing of the transport container through an air duct, which solves the problem of condensation on the surface of components and greatly reduces the amount of dry air input, thus improving the treatment effect.

[0020] This invention opens the closed structure with a stop bar, and then the suction cup is used to handle the components. The closed structure is easy to open and close, and minimizes the impact on the components.

[0021] This invention uses a flexible suction cup to move components, reducing the damage to components and even equipment caused by the suction cup.

[0022] The above description is only an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, the following are the preferred embodiments of this utility model and are described in detail with reference to the accompanying drawings. Attached Figure Description

[0023] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a structural schematic diagram of prior art reference document 1;

[0025] Figure 2 This is a schematic diagram of the structure of a semiconductor component inspection system according to the present invention;

[0026] Figure 3 yes Figure 2 Schematic diagram of the structure of the outer casing for transporting goods;

[0027] Figure 4 yes Figure 2 Schematic diagram of the structure of the constant temperature chamber;

[0028] Figure 5 yes Figure 2 Schematic diagram of the structure of the detection box;

[0029] Figure 6 yes Figure 3 A schematic diagram of the structure of the transfer suction cup and the mounting bracket for the transfer suction cup.

[0030] The meanings of the labels in the figures are as follows.

[0031] 1. Protective cover; 2. Transport motion module; 3. Transport adapter frame; 4. Transport outer box; 5. Transport support; 6. Transport push rod module; 7. Transport suction cup; 8. Transport opening; 9. Constant temperature chamber; 10. Constant temperature support; 11. Constant temperature positioning seat; 12. Constant temperature positioning groove; 13. Component; 14. Constant temperature opening; 15. Detection box; 16. Detection seat; 17. Detection head; 18. Detection opening; 19. Transport suction cup mounting frame; 20. Baffle bar; 21. Air duct; 22. Enclosed structure; 23. Alternating groove; 24. Material sensor; 25. Suction cup mounting cavity; 26. Suction cup movable through hole; 27. Elastic structural component; 28. Limiting block; 29. Detailed Implementation

[0032] The specific embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit its scope.

[0033] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0034] Example

[0035] like Figure 1 The existing semiconductor component testing device consists of a transport housing 4, a constant temperature chamber 9, and a testing chamber 15, all of which are located inside a protective cover 1. To prevent condensation on the component surface, dry air needs to be introduced into the outer cover 1; however, this method results in a large amount of dry air being introduced.

[0036] like Figures 2-6 As shown,

[0037] A semiconductor component inspection system includes a transport outer housing 4, a constant temperature chamber 9, and a testing chamber 15. The transport outer housing 4 moves under the drive of the transport motion module 2 via a transport adapter 3.

[0038] 1. Inside the outer casing 4, a transport suction cup 7 is installed via a transport bracket 5 and a transport push rod module 6. A transport suction cup mounting bracket 20 is installed at the bottom of the transport push rod module 6, and the transport suction cup 7 is installed at the bottom of the transport suction cup mounting bracket 20. A stop bar 21 is installed at the bottom of the transport suction cup mounting bracket 20 on the left side of the transport suction cup 7. The length of the stop bar 21 is longer than that of the transport suction cup 7, and the closed structure 23 can be opened by using the stop bar 21.

[0039] An air duct 22 is installed inside the outer casing 4 below the transport suction cup 7. The air duct 22 is distributed around the lower outer side of the transport suction cup 7. Several nozzles installed on the air duct 22 are all tilted towards the transport suction cup 7 on the upper side, which facilitates direct drying of the components and improves the drying effect.

[0040] 2. A suction cup mounting cavity 26 is provided at the bottom of the suction cup mounting bracket 20 directly above the suction cup 7. A suction cup movable through hole 27 is provided at the bottom of the suction cup mounting cavity 26 for the suction cup 7 to pass through freely. The top of the suction cup 7 is connected to several elastic structural members 28 installed inside the suction cup mounting cavity 26. These elastic structural members 28 can be springs or other structural components, allowing the suction cup 7 to have a certain degree of elasticity during operation, reducing damage to components.

[0041] On the top left and right sides of the transport suction cup 7, there are limiting blocks 29 that are engaged in the suction cup mounting cavity 26. The transport suction cup 7 is engaged in the suction cup mounting cavity 26 above the suction cup movable through hole 27 by the limiting blocks 29.

[0042] 3. A constant temperature positioning seat 11 is installed inside the constant temperature chamber 9 via a constant temperature bracket 10, and a constant temperature positioning groove 12 for placing the component 13 is provided on the constant temperature positioning seat 11.

[0043] A clearance groove 24 adapted to the aforementioned stop bar 21 is provided on the thermostatic positioning seat 11 outside the thermostatic positioning groove 12.

[0044] 4. A detection seat 17 is installed on the detector 16 inside the detection box 15, and a detection head 18 for detecting the component 13 is provided inside the detection seat 17.

[0045] A clearance groove 24 adapted to the aforementioned stop bar 21 is provided on the detection seat 17 outside the detection head 18.

[0046] 5. A closed structure 23 is installed at the transport opening 8 at the bottom of the transport outer box 4, the constant temperature opening 14 at the top of the constant temperature box 9, and the test opening 19 at the top of the test box 15.

[0047] One implementation of the closed structure 23:

[0048] The closed structure 23 is a door panel hinged to the opening on the left side. A tension spring and other structural components are also installed at the hinge for the door panel to return to its closed state after opening. During descent, the stop lever 21 first contacts the door panel, thus opening it. The suction cup 7 then passes through, preventing direct contact between the suction cup 7 and the door panel and reducing impact on components. When the stop lever 21 retracts, the process is reversed, allowing the door panel to naturally return to its closed state.

[0049] In addition, a material sensor 25 is installed at the center of the bottom of the transfer suction cup 7, and a material sensor 25 is installed at the center of the constant temperature positioning tank 12 for sensing elements.

[0050] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0051] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0052] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A semiconductor component inspection system, comprising a carrying outer box (4), a thermostat box (9) and a detection box (15), the carrying outer box (4) is moved under the drive of a carrying motion module (2) through a carrying transfer frame (3), a carrying suction disc (7) is installed in the carrying outer box (4) through a carrying support (5) and a carrying push rod module (6); a thermostat positioning seat (11) is installed in the thermostat box (9) through a thermostat support (10), a thermostat positioning groove (12) for placing a component (13) is arranged on the thermostat positioning seat (11); a detection seat (17) is installed on a detector (16) in the detection box (15), a detection head (18) for detecting the component (13) is arranged in the detection seat (17); Characterized in that: A carrying suction disc mounting frame (20) is installed at the bottom of the carrying push rod module (6), the carrying suction disc (7) is installed at the bottom of the carrying suction disc mounting frame (20), a blocking rod (21) is installed at the bottom of the carrying suction disc mounting frame (20) on the left side of the carrying suction disc (7), an air duct (22) is installed in the carrying outer box (4) outside the carrying suction disc (7); A closing structure (23) is installed at the carrying opening (8) at the bottom of the carrying outer box (4), at the thermostat opening (14) at the top of the thermostat box (9) and at the detection opening (19) at the top of the detection box (15); A suction disc mounting cavity (26) is arranged at the bottom of the carrying suction disc mounting frame (20) directly above the carrying suction disc (7), a suction disc movable through hole (27) is arranged at the bottom of the suction disc mounting cavity (26) for the free passage of the carrying suction disc (7), the top of the carrying suction disc (7) is connected with a plurality of elastic structure members (28) installed in the suction disc mounting cavity (26).

2. A semiconductor component inspection system as claimed in claim 1, characterized in that An avoidance groove (24) is arranged on the thermostat positioning seat (11) outside the thermostat positioning groove (12) and matched with the blocking rod (21).

3. A semiconductor device inspection system as claimed in claim 1, characterized in that An avoidance groove (24) is arranged on the detection seat (17) outside the detection head (18) and matched with the blocking rod (21).

4. A semiconductor device inspection system as claimed in claim 1, characterized in that A material sensor (25) is installed at the middle of the bottom of the carrying suction disc (7).

5. A semiconductor device inspection system as claimed in claim 1, characterized in that A material sensor (25) is installed at the middle of the thermostat positioning groove (12).

6. A semiconductor device inspection system as claimed in claim 1, characterized in that The air duct (22) is distributed around the outside below the carrying suction disc (7).

7. A semiconductor device inspection system as claimed in claim 1, characterized in that A plurality of nozzles installed on the air duct (22) are all inclined towards the carrying suction disc (7) on the upper side.

8. A semiconductor device inspection system as claimed in claim 1, characterized in that Limiting clamping blocks (29) are arranged at the top of the carrying suction disc (7) on both sides and clamped in the suction disc mounting cavity (26).