Detection device for semiconductor element

Abstract

The utility model relates to a detection device for a semiconductor element, which comprises a carrying outer box body, a constant temperature box and a detection box, and a carrying sucker is arranged in the carrying outer box body through a carrying bracket and a carrying push rod module; the constant-temperature positioning seat is provided with a constant-temperature positioning groove for placing an element; a detection head for detecting an element is arranged in the detection seat; and at least one stop lever is mounted at the bottom of the carrying suction cup mounting frame on the outer side of the carrying suction cup. According to the utility model, dry air is input into the carrying outer box body through the air duct, so that the problems of moisture condensation and the like on the surface of an element can be solved, the input amount of the dry air is greatly reduced, and the treatment effect is improved.

Description

Technical Field

[0001] This utility model relates to the technical field of semiconductor device processing, and in particular to a detection device for semiconductor devices. Background Technology

[0002] In the process of testing semiconductor components, the testing is generally carried out in a testing environment with a suitable temperature, such as a low temperature environment below zero degrees Celsius.

[0003] like Figure 1 Reference document 1, as shown, describes a conventional semiconductor component testing apparatus that includes a transport enclosure, a temperature control chamber, and a testing chamber, all of which are located within the enclosure. Since the transport enclosure is typically in a room-temperature environment, removing the component from the low-temperature temperature control chamber can cause condensation on the component surface due to the temperature difference. To avoid this, reference document 1 introduces dry air into the enclosure; however, this method requires a large amount of dry air and the treatment effect is not ideal.

[0004] In view of the above-mentioned shortcomings, the designer has actively researched and innovated in order to create a testing device for semiconductor components, making it more valuable for industrial applications. Utility Model Content

[0005] To solve the above-mentioned technical problems, the purpose of this utility model is to provide a detection device for semiconductor components.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A semiconductor component testing device includes a transport outer housing, a constant temperature chamber, and a testing chamber. The transport outer housing moves under the drive of a transport motion module via a transport adapter. A transport suction cup is installed inside the transport outer housing via a transport bracket and a transport push rod module. A constant temperature positioning seat is installed inside the constant temperature chamber via a constant temperature bracket, and a constant temperature positioning groove for placing components is provided on the constant temperature positioning seat. A testing seat is installed on a detector inside the testing chamber, and a testing head for testing components is provided inside the testing seat.

[0008] A suction cup mounting bracket is installed at the bottom of the transport push rod module. A transport suction cup is installed at the middle of the bottom of the suction cup mounting bracket. At least one stop bar is installed at the bottom of the suction cup mounting bracket outside the transport suction cup. An air duct is installed inside the transport outer box below the transport suction cup.

[0009] A clearance groove adapted to the aforementioned stop bar is provided on the constant temperature positioning seat outside the constant temperature positioning groove, and a clearance groove adapted to the aforementioned stop bar is provided on the detection seat outside the detection head.

[0010] The transport opening at the bottom of the transport box, the temperature control opening at the top of the temperature control chamber, and the test opening at the top of the test chamber are all equipped with sealed structures.

[0011] As a further improvement of this utility model, a material sensor is installed at the middle position of the bottom of the conveying suction cup.

[0012] As a further improvement of this utility model, a material sensor is installed in the middle of the constant temperature positioning groove.

[0013] As a further improvement of this utility model, the air duct is distributed around the lower outer side of the transport suction cup.

[0014] As a further improvement of this utility model, several nozzles installed on the air duct are all tilted towards the upward side of the transport suction cup.

[0015] As a further improvement of this utility model, the closed structure includes several closed membranes assembled together.

[0016] By means of the above solution, this utility model has at least the following advantages:

[0017] This invention introduces dry air into the outer casing of the transport container through an air duct, which solves the problem of condensation on the surface of components and greatly reduces the amount of dry air input, thus improving the treatment effect.

[0018] This invention opens the closed structure with a stop bar, and then the suction cup is used to handle the components. The closed structure is easy to open and close, and minimizes the impact on the components.

[0019] The above description is only an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, the following are the preferred embodiments of this utility model and are described in detail with reference to the accompanying drawings. Attached Figure Description

[0020] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a structural schematic diagram of prior art reference document 1;

[0022] Figure 2This is a schematic diagram of the structure of a detection device for semiconductor components according to this utility model;

[0023] Figure 3 yes Figure 2 Schematic diagram of the structure of the outer casing for transporting goods;

[0024] Figure 4 yes Figure 2 Schematic diagram of the structure of the constant temperature chamber;

[0025] Figure 5 yes Figure 2 Schematic diagram of the structure of the detection box;

[0026] Figure 6 yes Figures 3-5 A schematic diagram of a closed structure.

[0027] The meanings of the labels in the figures are as follows.

[0028] 1. Protective cover; 2. Transport motion module; 3. Transport adapter frame; 4. Transport outer box; 5. Transport support frame; 6. Transport push rod module; 7. Transport suction cup; 8. Transport opening; 9. Constant temperature chamber; 10. Constant temperature support; 11. Constant temperature positioning seat; 12. Constant temperature positioning groove; 13. Component; 14. Constant temperature opening; 15. Detector box; 16. Detector seat; 17. Detector head; 18. Detection opening; 19. Transport suction cup mounting frame; 20. Material sensor; 21. Baffle bar; 22. Air duct; 23. Enclosed structure; 24. Alternating groove; 25. Enclosed diaphragm; 26. Detailed Implementation

[0029] The specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit the scope of this utility model.

[0030] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0031] Example

[0032] like Figure 1Reference document 1 shows an existing semiconductor component testing device, which includes a transport housing 4, a constant temperature chamber 9, and a testing chamber 15, all of which are located inside a protective cover 1. To prevent condensation on the component surface, dry air needs to be introduced into the outer cover 1; however, this method results in a large amount of dry air being introduced.

[0033] like Figures 2-6 As shown,

[0034] The present invention provides a testing device for semiconductor components, comprising a transport outer housing 4, a constant temperature chamber 9, and a testing chamber 15. The transport outer housing 4 moves under the drive of the transport motion module 2 via a transport adapter 3.

[0035] 1. A transport suction cup 7 is installed inside the transport outer casing 4 via a transport bracket 5 and a transport push rod module 6. A transport suction cup mounting bracket 20 is installed at the bottom of the transport push rod module 6, and the transport suction cup 7 is installed at the bottom center of the transport suction cup mounting bracket 20. At least one stop bar 22 is installed at the bottom of the transport suction cup mounting bracket 20 outside the transport suction cup 7. An air duct 23 is installed inside the transport outer casing 4 below and outside the transport suction cup 7. The air duct 23 runs along the lower outer side of the transport suction cup 7, and several nozzles installed on the air duct 23 are all inclined towards the transport suction cup 7 on the upper side, which facilitates direct drying of the component and improves the drying effect.

[0036] A material sensor 12 is installed at the bottom center of the conveying suction cup 7 for sensing elements.

[0037] 2. A thermostatic positioning seat 11 is installed inside the thermostatic chamber 9 via a thermostatic bracket 10. A thermostatic positioning groove 12 for placing the component 13 is provided on the thermostatic positioning seat 11. An avoidance groove 25 adapted to the aforementioned stop bar 22 is provided on the thermostatic positioning seat 11 outside the thermostatic positioning groove 12.

[0038] A material sensor 12 is installed in the middle of the constant temperature positioning tank 12 for sensing elements.

[0039] 3. A detection seat 17 is installed on the detector 16 inside the detection box 15, and a detection head 18 for detecting the component 13 is provided inside the detection seat 17. A clearance groove 25 adapted to the aforementioned stop bar 22 is provided on the detection seat 17 outside the detection head 18.

[0040] A sealing structure 24 is installed at the transport opening 8 at the bottom of the transport outer box 4, the constant temperature opening 14 at the top of the constant temperature box 9, and the detection opening 19 at the top of the detection box 15.

[0041] One embodiment of the closed structure 24 is as follows:

[0042] The closed structure 24 includes several assembled diaphragms 26. The diaphragms 26 can be made of materials commonly found in the prior art, such as rubber, and can quickly open under pressure and quickly return to their closed state when the pressure is released. The length of the stop bar 22 is longer than that of the inner suction cup 7. The stop bar 22 first pushes open the diaphragms 26, allowing the suction cup 7 to pass through, thus preventing the diaphragms 26 from affecting the components on the suction cup 7. Simultaneously, when the stop bar 22 retracts, the diaphragms 26 naturally return to their closed state, making opening and closing convenient.

[0043] In addition, the closed structure 24 can also be a hinged door panel or other similar structure.

[0044] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0045] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0046] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A semiconductor component testing device, comprising a transport outer housing (4), a constant temperature chamber (9), and a testing chamber (15), wherein the transport outer housing (4) moves under the drive of a transport motion module (2) via a transport adapter (3), and a transport suction cup (7) is installed inside the transport outer housing (4) via a transport bracket (5) and a transport push rod module (6); a constant temperature positioning seat (11) is installed inside the constant temperature chamber (9) via a constant temperature bracket (10), and a constant temperature positioning groove (12) for placing a component (13) is provided on the constant temperature positioning seat (11); a testing seat (17) is installed on a detector (16) inside the testing chamber (15), and a testing head (18) for testing the component (13) is provided inside the testing seat (17); Its features are: A transport suction cup mounting bracket (20) is installed at the bottom of the transport push rod module (6), a transport suction cup (7) is installed at the middle position of the bottom of the transport suction cup mounting bracket (20), at least one stop bar (22) is installed at the bottom of the transport suction cup mounting bracket (20) outside the transport suction cup (7), and an air duct (23) is installed in the transport outer box (4) below the transport suction cup (7); A clearance groove (25) adapted to the above-mentioned stop bar (22) is provided on the constant temperature positioning seat (11) outside the constant temperature positioning groove (12), and a clearance groove (25) adapted to the above-mentioned stop bar (22) is provided on the detection seat (17) outside the detection head (18). A closed structure (24) is installed at the transport opening (8) at the bottom of the transport outer box (4), at the constant temperature opening (14) at the top of the constant temperature box (9), and at the detection opening (19) at the top of the detection box (15).

2. The detection device for semiconductor devices as described in claim 1, characterized in that, A material sensor (21) is installed at the middle of the bottom of the conveying suction cup (7).

3. The detection device for semiconductor devices as described in claim 1, characterized in that, A material sensor (21) is installed at the middle position of the constant temperature positioning groove (12).

4. The detection device for semiconductor devices as described in claim 1, characterized in that, The air duct (23) runs along the outer side of the lower part of the transport suction cup (7).

5. The detection device for semiconductor devices as described in claim 1, characterized in that, Several nozzles installed on the air duct (23) are all tilted towards the upper side of the transport suction cup (7).

6. The detection device for semiconductor devices as described in claim 1, characterized in that, The closed structure (24) includes a plurality of closed membranes (26) assembled together.

Images