High-precision semiconductor wafer thinning device

Abstract

The utility model discloses a high-precision semiconductor wafer thinning device, which relates to the technical field of wafer processing, and has the technical key points that the high-precision semiconductor wafer thinning device comprises a wafer thinning machine, the wafer thinning machine comprises a workbench, the workbench is provided with a mounting frame, the mounting frame is provided with a grinding assembly, the edge of the workbench is provided with a blocking assembly, and the blocking assembly is provided with a clamping groove. The stopping assembly comprises a fixing ring arranged on the periphery of the mounting frame in a sleeving mode, a plurality of flexible stopping pieces are connected to the lower portion of the fixing ring, the multiple flexible stopping pieces are combined to seal the gap between the fixing ring and the workbench, and a plurality of heat insulation blocks are fixedly arranged on the faces, facing the grinding assembly, of the flexible stopping pieces. The multiple heat insulation blocks on the same flexible blocking piece are movably attached in an end-to-end mode. According to the utility model, the protective capability can be provided, and potential safety hazards caused by splashing of chippings are reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer processing technical field especially is related to a high accuracy semiconductor wafer thinning device. BACKGROUND

[0002] In the wafer processing process, thinning work is a crucial link. This process step is usually carried out before integrated circuit packaging, the purpose is to remove the excess matrix material on the back of the wafer, to meet the requirements of chip packaging thickness size and surface roughness. Through thinning treatment, the packaging mounting height can be reduced, the chip packaging volume is reduced, and then the heat diffusion efficiency, electrical performance and mechanical performance of the chip are improved.

[0003] At present, there are various wafer thinning equipment in the market, wherein the thinning machine for chip wafer processing described in the No. CN202021985254.0 utility model patent shows good wafer thinning capacity. The thinning machine is designed uniquely, including bottom plate, side plate, T-shaped sliding block, rectangular plate, anti-cracking device, top plate and electric telescopic rod and other components, the piston rod of electric telescopic rod drives the mounting plate to carry out wafer thinning operation. The equipment not only has buffering effect, can effectively prevent the wafer from breaking in the processing process, reduces the production cost, but also can reduce the shaking generated by the electric motor, improves the processing precision, and reduces the roughness of wafer surface.

[0004] However, although the prior art such as No. CN202021985254.0 thinning machine has made significant progress in wafer thinning, there are still some potential safety hazards. Especially in the wafer grinding process, due to the friction between the high-speed rotating grinding disc and the wafer, a large amount of debris will be generated. These debris may splash out during grinding, posing a threat to the safety of the operator. SUMMARY

[0005] In order to solve the above technical problems, the purpose of the utility model is to provide a high-precision semiconductor wafer thinning device, which provides protection ability and reduces the safety hazards caused by debris splashing.

[0006] To achieve the above purpose, the utility model provides the following technical scheme:

[0007] A high-precision semiconductor wafer thinning device includes a wafer thinning machine. The wafer thinning machine includes a worktable, a mounting frame on the worktable, a grinding assembly on the mounting frame, and a blocking assembly at the edge of the worktable. The blocking assembly includes a fixing ring sleeved around the mounting frame, and multiple flexible blocking sheets connected below the fixing ring. The combination of the multiple flexible blocking sheets seals the gap between the fixing ring and the worktable. Multiple heat insulation blocks are fixedly mounted on the side of the flexible blocking sheet facing the grinding assembly. The multiple heat insulation blocks on the same flexible blocking sheet are movably fitted end to end to improve the protection capability.

[0008] Preferably, a transparent protective plate is provided on one side of the workbench above the fixing ring to improve protection and ensure safe observation.

[0009] Preferably, the transparent protective plate and the fixing ring are detachably connected to the mounting bracket. This detachable connection is achieved through bolt thread connection, which facilitates disassembly and assembly.

[0010] Preferably, the grinding assembly includes a lifting component fixedly connected to the top beam of the mounting frame, a grinding motor is fixedly mounted on the bottom movable part of the lifting component, and a grinding disc is fixedly mounted on the output shaft of the grinding motor, which can perform grinding and thinning work.

[0011] Preferably, the lifting component is an electric cylinder for easy control.

[0012] Preferably, the housing of the grinding motor is fixedly provided with a protective cover, which is used to cover the outer wall of the grinding disc to block flying debris and extend its service life.

[0013] This utility model has the following beneficial effects:

[0014] Design of the barrier component: This invention incorporates a barrier component at the edge of the worktable. This component consists of a fixing ring fitted around the mounting frame and multiple flexible barrier plates. These flexible barrier plates work together to seal the space between the fixing ring and the worktable, forming a physical barrier. The design of the flexible barrier plates not only effectively blocks the flying debris that may be generated during grinding but also absorbs or mitigates the impact force of the debris to a certain extent, thereby reducing the potential harm of debris to the surrounding environment and operators.

[0015] The function of the heat insulation blocks: Multiple heat insulation blocks fixedly installed on the flexible barrier sheet, through their movable fit at both ends, further enhance the protective capability of the barrier assembly. The heat insulation blocks not only block debris but also effectively isolate the heat generated during the grinding process, preventing adverse effects on operators or the surrounding environment.

[0016] Transparent protective plate installation: A transparent protective plate is installed above the fixing ring on one side of the workbench. This design not only provides an additional protective layer, but also ensures that the operator can monitor the grinding process in real time without affecting their vision.

[0017] The detachable connection between the transparent protective plate, the fixing ring, and the mounting bracket (via bolt thread connection) makes maintenance and replacement more convenient.

[0018] Protection of the grinding assembly: The grinding assembly includes a lifting component, a grinding motor, and a grinding disc. A protective cover is fixedly installed on the housing of the grinding motor. This cover directly covers the outer wall of the grinding disc, effectively preventing debris from splashing during the grinding process and further reducing safety hazards.

[0019] In summary, this invention effectively blocks and isolates debris and heat that may be generated during the grinding process by designing a barrier component, a heat insulation block, a transparent protective plate, and a protective cover for the grinding component. These designs not only improve operational safety but also reduce safety hazards caused by debris splashing, thereby ensuring the efficient, stable, and safe operation of the semiconductor wafer thinning process. Attached Figure Description

[0020] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a front view of the first embodiment of the present invention.

[0022] Figure 2 This is a cross-sectional view of the grinding assembly according to the second embodiment of the present invention.

[0023] In the diagram: 1. Workbench; 2. Mounting frame; 301. Fixing ring; 302. Flexible barrier plate; 303. Heat insulation block; 304. Transparent protective plate; 401. Lifting component; 402. Grinding motor; 403. Grinding disc; 404. Protective cover. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0025] First embodiment

[0026] like Figure 1 As shown, a high-precision semiconductor wafer thinning device includes a wafer thinning machine, which includes a worktable 1, a mounting frame 2 on the worktable 1, a grinding assembly on the mounting frame 2, and a blocking assembly at the edge of the worktable 1. The blocking assembly includes a fixing ring 301 sleeved around the mounting frame 2, and multiple flexible blocking sheets 302 connected below the fixing ring 301. The combination of the multiple flexible blocking sheets 302 closes the gap between the fixing ring 301 and the worktable 1. Multiple heat insulation blocks 303 are fixedly disposed on the side of the flexible blocking sheet 302 facing the grinding assembly, and the multiple heat insulation blocks 303 on the same flexible blocking sheet 302 are movably attached end to end.

[0027] like Figure 1 As shown, the wafer thinning machine is the main body of the entire device, used to perform the wafer thinning process. The worktable 1 is the foundation of the wafer thinning machine, used to support and fix the mounting frame 2 and the grinding assembly, ensuring the stability and accuracy of the grinding process. The mounting frame 2 is fixed on the worktable 1 and is used to mount and support the grinding assembly. The grinding assembly is a key part of wafer thinning, typically including a grinding disc 403 and a motor that drives the grinding disc 403 to rotate. During the wafer thinning process, the grinding disc 403 contacts and rotates with the wafer, thinning it to the required thickness through physical grinding. The barrier assembly mainly consists of a fixing ring 301 and multiple flexible barrier plates 302. The fixing ring 301 is sleeved around the mounting frame 2, serving to support and fix the flexible barrier plates 302. The flexible barrier plates 302 are connected below the fixing ring 301 and together seal the space between the fixing ring 301 and the worktable 1. This design forms a physical barrier to prevent debris from splashing during the grinding process. Multiple heat-insulating blocks 303 fixedly mounted on the flexible barrier plate 302 further enhance its protective capabilities. The heat-insulating blocks 303 are movable and fit together end-to-end, effectively isolating the heat generated during grinding and preventing adverse effects on the surrounding environment or operators. Simultaneously, the design of the heat-insulating blocks 303 also increases the rigidity and stability of the flexible barrier plate 302, enabling it to better block flying debris.

[0028] like Figure 1 As shown, a transparent protective plate 304 is provided on one side of the workbench 1 above the fixing ring 301. Located above the fixing ring 301, the transparent protective plate 304 forms an additional protective layer, effectively blocking any splashing debris or coolant that may be generated during the grinding process, protecting operators from potential injury. The choice of transparent material ensures that operators can clearly observe the wafer thinning process and status without directly contacting the grinding area, allowing for necessary monitoring and adjustments.

[0029] like Figure 1 As shown, both the transparent protective plate 304 and the retaining ring 301 are detachably connected to the mounting bracket 2 via bolt thread connection. Bolt thread connection is a simple and effective connection method, allowing operators to easily install the transparent protective plate 304 and retaining ring 301 onto the mounting bracket 2, or remove them as needed. This flexibility is crucial for routine equipment maintenance, cleaning, and potential upgrades or modifications. The tight fit of the threads provides a stable connection, preventing the transparent protective plate 304 or retaining ring 301 from loosening or falling off during grinding due to vibration or impact. This stability is essential for ensuring safe equipment operation and maintaining grinding accuracy. In the event of damage or wear to the transparent protective plate 304 or retaining ring 301, the bolt thread connection allows operators to quickly replace the parts, thereby reducing equipment downtime and improving overall production efficiency.

[0030] like Figure 1 As shown, the grinding assembly includes a lifting component 401 fixedly connected to the top beam of the mounting frame 2. A grinding motor 402 is fixedly mounted on the bottom movable part of the lifting component 401, and a grinding disc 403 is fixedly mounted on the output shaft of the grinding motor 402. The lifting component 401 is an electric cylinder. The grinding assembly and its lifting component 401 (electric cylinder) play a crucial role in the high-precision semiconductor wafer thinning device. Together, they ensure the accuracy, uniformity, and production efficiency of wafer thinning. The electric cylinder, as the choice of the lifting component 401, not only provides precise height control and stable support and drive, but is also easy to integrate and control, providing strong support for the entire wafer thinning process.

[0031] Second embodiment

[0032] like Figure 2As shown, a protective cover 404 is fixedly installed on the housing of the grinding motor 402. The protective cover 404 is used to cover the outer wall of the grinding disk 403 to block flying debris. During the grinding process, the friction between the wafer and the grinding disk 403 generates a large amount of debris. Under the action of the high-speed rotating grinding disk 403, these debris may be splashed into the surrounding air, posing a threat to the equipment and operators. The protective cover 404, as a physical barrier, can effectively block these flying debris near the grinding disk 403, preventing them from spreading to a wider area. The grinding motor 402 is a key component in the wafer thinning device, and its performance directly affects the grinding accuracy and efficiency. If flying debris directly contacts the housing or internal components of the grinding motor 402, it may damage the motor, thereby affecting its normal operation. The protective cover 404 effectively avoids this situation, protecting the safe and stable operation of the grinding motor 402. If the debris generated during the grinding process is scattered on the worktable 1 or the equipment, it will not only affect the normal operation of the equipment, but also increase the difficulty of cleaning and maintenance. The protective cover 404 collects these debris near the grinding disc 403, facilitating subsequent cleaning and handling, thus maintaining a clean and orderly working environment. Splashing debris can pose a safety threat to operators, especially during high-speed grinding. The protective cover 404 effectively reduces this risk, improving the safety and reliability of the operation.

[0033] The above are merely specific embodiments of this utility model, but the technical features of this utility model are not limited thereto. Any simple changes, equivalent substitutions, or modifications made based on this utility model to solve essentially the same technical problems and achieve essentially the same technical effects are all covered within the protection scope of this utility model.

Claims

1. A high-precision semiconductor wafer thinning apparatus, comprising a wafer thinning machine, the wafer thinning machine comprising a worktable (1), a mounting frame (2) disposed on the worktable (1), and a grinding assembly disposed on the mounting frame (2), characterized in that: The edge of the workbench (1) is provided with a barrier component. The barrier component includes a fixing ring (301) sleeved around the mounting frame (2). Multiple flexible barrier plates (302) are connected below the fixing ring (301). The combination of multiple flexible barrier plates (302) closes the space between the fixing ring (301) and the workbench (1). Multiple heat insulation blocks (303) are fixedly provided on the side of the flexible barrier plate (302) facing the grinding component. Multiple heat insulation blocks (303) on the same flexible barrier plate (302) are movably attached end to end.

2. The high-precision semiconductor wafer thinning device according to claim 1, characterized in that: A transparent protective plate (304) is provided on one side of the workbench (1) above the fixing ring (301).

3. The high-precision semiconductor wafer thinning device according to claim 2, characterized in that: The transparent protective plate (304) and the fixing ring (301) are detachably connected to the mounting bracket (2) by means of bolt thread connection.

4. The high-precision semiconductor wafer thinning device according to claim 3, characterized in that: The grinding assembly includes a lifting component (401) fixedly connected to the top beam of the mounting frame (2). A grinding motor (402) is fixedly installed on the bottom movable part of the lifting component (401), and a grinding disc (403) is fixedly installed on the output shaft of the grinding motor (402).

5. The high-precision semiconductor wafer thinning device according to claim 4, characterized in that: The lifting component (401) is an electric cylinder.

6. The high-precision semiconductor wafer thinning device according to claim 5, characterized in that: The outer casing of the grinding motor (402) is fixedly provided with a protective cover (404), which is used to cover the outer wall of the grinding disc (403) to block flying debris.

Images