Device for quickly cooling plastic product of injection mold

Abstract

The utility model relates to the technical field of plastic part cooling devices, in particular to a device for quickly cooling plastic products by an injection mold, which comprises a mold main body, a cooling cavity arranged on the back of the mold main body, a snake-shaped heat exchange pipe arranged in the cooling cavity, a delivery pump connected to one end of the snake-shaped heat exchange pipe, a suction pipe fixedly mounted at the water inlet end of the delivery pump, and a water outlet of the suction pipe. A storage barrel is arranged at the end of the suction pipe, a plurality of semiconductor chilling plates are fixedly installed on a top plate body of the storage barrel, a spiral heat dissipation pipe is fixedly installed at the other end of the snake-shaped heat exchange pipe, a liquid outlet pipe is fixedly installed at the end of the spiral heat dissipation pipe, a heat dissipation hopper is arranged at the end of the liquid outlet pipe, and a conical hopper is fixedly installed at the bottom end of the heat dissipation hopper. The conical hopper is communicated with the storage barrel through a backflow pipe, a spiral flow slowing ring is fixedly installed on the inner wall of the heat dissipation hopper, a water flowing groove is formed in the spiral flow slowing ring, and the liquid outlet pipe is communicated with the water flowing groove. According to the utility model, high-efficiency heat dissipation operation can be carried out, and molding preparation of plastic parts is facilitated.

Description

Technical Field

[0001] This utility model relates to the technical field of plastic part cooling devices, specifically to a device for rapidly cooling plastic products using injection molds. Background Technology

[0002] Injection molds, as key tools in the production of plastic products, play a vital role in the plastic product manufacturing industry. Their working principle is to inject molten plastic into the mold cavity under high pressure through an injection molding machine. After cooling and solidification, plastic products with specific structures and precise dimensions are obtained. In the entire injection molding process, the cooling process has an undeniable impact on improving production efficiency, ensuring product quality, and reducing production costs.

[0003] Currently, after the injection mold is formed, the product and mold are usually at a high temperature because the material has not cooled completely. This not only prevents the material from cooling and solidifying quickly, which seriously reduces processing efficiency, but may also shorten the mold life due to prolonged high temperature, increasing maintenance costs in the production process.

[0004] Existing mold cooling methods mostly rely on coolant circulation to remove heat from the mold and the material within the cavity. Specifically, the coolant circulates in the flow channel, cooling the mold and material through heat exchange. While coolant circulation has a certain cooling effect, most coolant circulation devices, after heat exchange, simply transport the cooled coolant to a storage tank via pipes. During storage, the coolant relies on heat exchange with the outside air for cooling, which is slow and lacks effective heat dissipation and cooling measures. This causes the coolant temperature to gradually rise, ultimately affecting its cooling effect on the mold and impacting the production of plastic parts. Therefore, we propose a device for rapidly cooling plastic products from injection molds. Utility Model Content

[0005] The purpose of this invention is to provide a device for rapidly cooling plastic products using injection molds, thereby addressing the deficiencies mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A device for rapidly cooling plastic products from injection molds includes a mold body. A cooling cavity is provided on the back of the mold body. A serpentine heat exchange tube is provided inside the cooling cavity. One end of the serpentine heat exchange tube is connected to a delivery pump. A suction pipe is fixedly installed at the water inlet end of the delivery pump. A storage cylinder is provided at the end of the suction pipe. Multiple semiconductor cooling chips are fixedly installed on the top plate of the storage cylinder. A spiral heat dissipation tube is fixedly installed at the other end of the serpentine heat exchange tube. A liquid outlet pipe is fixedly installed at the end of the spiral heat dissipation tube. A heat dissipation hopper is provided at the end of the liquid outlet pipe. A conical hopper is fixedly installed at the bottom end of the heat dissipation hopper. The conical hopper is connected to the storage cylinder through a return pipe. A spiral flow-slowing ring is fixedly installed on the inner wall of the heat dissipation hopper. A water flow channel is provided inside the spiral flow-slowing ring. The liquid outlet pipe is connected to the water flow channel.

[0008] Preferably, the cooling end of the thermoelectric cooler is inserted into the storage cylinder, and the heat dissipation end of the thermoelectric cooler is located outside the storage cylinder.

[0009] Preferably, the spiral heat dissipation pipe is spiral-shaped, and a flow-slowing pipe is fixedly installed at the end of the liquid outlet pipe near the spiral flow-slowing ring, with the end of the flow-slowing pipe inserted into the water tank.

[0010] Preferably, a drain pipe is fixedly installed on the bottom cylinder of the storage cylinder, and a drain valve is fixedly installed on the drain pipe.

[0011] Preferably, the top surface of the storage cylinder is provided with an adding hole, and a cover plate is hinged to the top surface of the storage cylinder.

[0012] Preferably, the cover plate covers the addition hole after being closed, and a handle is fixedly installed on the side of the cover plate.

[0013] Preferably, a base is fixedly mounted on each of the plurality of semiconductor cooling chips, and the base is fixedly mounted on the top surface of the storage cylinder by a plurality of fastening screws.

[0014] Preferably, a dust cover is hinged to the top surface of the heat dissipation chamber, and multiple heat dissipation fins arranged in a ring at equal intervals are fixedly installed on the annular side of the heat dissipation chamber.

[0015] Compared with the prior art, the beneficial effects of this utility model are:

[0016] 1. This utility model pre-cools the coolant in the storage cylinder by setting a semiconductor cooling chip, and achieves rapid cooling of the mold by combining the efficient heat exchange of the serpentine heat exchange tube in the cooling cavity of the mold body. The spiral heat dissipation tube and the spiral slow flow ring extend the heat dissipation path of the coolant and enhance the heat dissipation effect, thereby shortening the cooling time of plastic products and improving production efficiency.

[0017] 2. This utility model utilizes a drain pipe and drain valve to promptly remove impurities from the storage cylinder. The addition of holes and a cover plate facilitates the replenishment of coolant. Combined with the stable design of the base for fixing the semiconductor cooling chip, it achieves convenient maintenance and stable operation of the device. The dust cover and heat sink not only prevent foreign objects from entering the heat sink but also enhance heat dissipation, ensuring long-term reliable operation of the device and enabling the coolant to perform better heat dissipation and cooling operations. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0019] Figure 2 This is one of the partial structural schematic diagrams of this utility model;

[0020] Figure 3 This is the second partial structural schematic diagram of the present utility model;

[0021] Figure 4 This is the third partial structural schematic diagram of this utility model;

[0022] The meanings of the labels in the diagram are as follows:

[0023] 1. Mold body; 10. Cooling cavity;

[0024] 2. Transfer pump; 20. Suction pipe; 21. Storage cylinder; 22. Drain pipe; 221. Drain valve; 23. Addition hole; 231. Cover plate; 232. Handle; 24. Semiconductor cooling chip; 241. Base; 25. Serpentine heat exchange tube; 26. Spiral heat dissipation tube; 27. Liquid outlet pipe; 271. Slow flow tube; 28. Heat dissipation hopper; 281. Spiral slow flow ring; 282. Water trough; 283. Heat dissipation fin; 284. Dust cover; 29. ​​Conical hopper; 291. Return pipe. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] Please see Figures 1-4This utility model provides a technical solution: a device for rapidly cooling plastic products from injection molds, including a mold body 1, a cooling cavity 10 on the back of the mold body 1, and a serpentine heat exchange tube 25 inside the cooling cavity 10, so that the coolant forms an efficient heat exchange path on the back of the mold body 1. The serpentine structure increases the contact area with the mold and enhances the heat exchange efficiency, allowing the coolant in the serpentine heat exchange tube 25 to exchange heat with the mold body 1, further realizing the cooling operation of the plastic parts in the molding cavity on the front of the mold body 1; one end of the serpentine heat exchange tube 25 is connected to a delivery pump 2, which drives the coolant circulation to ensure that heat is carried away in time, realizes rapid cooling of the mold, and shortens the cooling cycle of the plastic products;

[0027] Specifically, a suction pipe 20 is fixedly installed at the inlet end of the delivery pump 2, and a storage cylinder 21 is provided at the end of the suction pipe 20. Multiple semiconductor cooling chips 24 are fixedly installed on the top plate of the storage cylinder 21. The cooling end of the semiconductor cooling chip 24 is inserted into the storage cylinder 21, and the heat dissipation end of the semiconductor cooling chip 24 is located outside the storage cylinder 21. The cooling end of the semiconductor cooling chip 24 is inserted into the cylinder to pre-cool the coolant, and the external heat dissipation end ensures the cooling efficiency and provides a low temperature source for the circulating coolant. A spiral heat dissipation pipe 26 is fixedly installed at the other end of the serpentine heat exchange tube 25. The spiral heat dissipation pipe 26 is spiral in shape. A liquid outlet pipe 27 is fixedly installed at the end of the spiral heat dissipation pipe 26. A heat dissipation hopper 28 is provided at the end of the liquid outlet pipe 27. A conical hopper 29 is fixedly installed at the bottom of the heat dissipation hopper 28. The conical hopper 29 is connected to the storage cylinder 21 through a return pipe 291. A spiral flow-slowing ring 281 is fixedly installed on the inner wall of the heat dissipation hopper 28. A water flow channel 282 is provided inside the spiral flow-slowing ring 281. The liquid outlet pipe 27 is connected to the water flow channel 282. When the flow-slowing pipe 271 is inserted into the water flow channel 282 of the spiral flow-slowing ring 281, the flow rate of the coolant is slowed down, the heat is fully released, and the heat dissipation effect is improved.

[0028] In this embodiment, a flow-slowing pipe 271 is fixedly installed at the end of the outlet pipe 27 near the spiral flow-slowing ring 281. The end of the flow-slowing pipe 271 is inserted into the water channel 282 to achieve the effect of slowing down the flow and protecting the coolant, so that the coolant can flow better along the water channel 282.

[0029] Specifically, a drain pipe 22 is fixedly installed on the bottom cylinder of the storage cylinder 21, and a drain valve 221 is fixedly installed on the drain pipe 22, which can periodically discharge impurities and ensure the cleanliness of the coolant.

[0030] Furthermore, an addition hole 23 is provided on the top surface of the storage cylinder 21, and a cover plate 231 is hinged to the top surface of the storage cylinder 21 to facilitate the addition of coolant; when the cover plate 231 is closed, it covers the addition hole 23, and a handle 232 is fixedly installed on the side of the cover plate 231.

[0031] In addition, a base 241 is fixedly mounted on multiple semiconductor cooling chips 24. The base 241 is fixedly mounted on the top surface of the storage cylinder 21 by multiple fastening screws, which facilitates the fixing, installation and disassembly operations.

[0032] It is worth noting that a dust cover 284 is hinged to the top surface of the heat dissipation hopper 28 to prevent foreign objects from entering; multiple heat dissipation fins 283 arranged in a ring at equal intervals are fixedly installed on the annular side of the heat dissipation hopper 28 to enhance the heat dissipation effect.

[0033] Finally, it should be noted that the components involved in this utility model, such as the delivery pump 2 and the semiconductor cooling chip 24, are all general standard parts or components known to those skilled in the art. Their structures and principles can be learned by those skilled in the art through technical manuals or conventional experimental methods. In the idle space of this device, all the above-mentioned electrical components, which refer to power elements, electrical components, and the matching controller and power supply, are connected by wires. The specific connection methods should refer to the working principle of this utility model. The electrical connections between each electrical component are completed in the order of operation. The detailed connection methods are all technologies known in the art.

[0034] When using the device for rapidly cooling plastic products from injection molds, coolant is first injected into the storage cylinder 21 through the addition hole 23 and cover plate 231. Then, the semiconductor cooling chip 24 is activated, with its cooling end inserted into the cylinder to pre-cool the coolant and its heat dissipation end externally to ensure cooling efficiency.

[0035] Turn on the delivery pump 2, and the suction pipe 20 draws the low-temperature coolant from the storage cylinder 21 and sends it into the serpentine heat exchange tube 25. The serpentine heat exchange tube 25 is in the cooling cavity 10 on the back of the mold body 1. Due to the serpentine structure, the contact area is increased, the heat exchange is enhanced, and the plastic part in the molding cavity on the front of the mold body 1 is cooled.

[0036] After absorbing heat, the coolant flows into the spiral heat dissipation pipe 26. Its spiral structure extends the heat dissipation path. It enters the spiral slow flow ring 281 water channel 282 on the inner wall of the heat dissipation tank 28 via the outlet pipe 27 and the slow flow pipe 271. The slow flow pipe 271 slows down the flow rate. Together with the heat dissipation fins 283 on the side of the heat dissipation tank 28 and the spiral slow flow ring 281, the coolant dissipates heat fully. The coolant flows back to the storage cylinder 21 via the conical bucket 29 and the return pipe 291, completing the circulation.

[0037] During use, impurities in the storage cylinder 21 can be periodically discharged through the drain pipe 22 and drain valve 221. When coolant needs to be added, open the cover plate 231. After operation, close the dust cover 284 to prevent foreign objects from entering.

[0038] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A device for rapidly cooling plastic products using an injection mold, comprising a mold body (1), characterized in that: A cooling chamber (10) is provided on the back of the mold body (1). A serpentine heat exchange tube (25) is provided in the cooling chamber (10). One end of the serpentine heat exchange tube (25) is connected to a delivery pump (2). A suction pipe (20) is fixedly installed at the water inlet end of the delivery pump (2). A storage cylinder (21) is provided at the end of the suction pipe (20). Multiple semiconductor cooling chips (24) are fixedly installed on the top plate of the storage cylinder (21). A spiral heat dissipation pipe (26) is fixedly installed at the other end of the serpentine heat exchange tube (25). A liquid outlet pipe (27) is fixedly installed at the end of the heat dissipation pipe (26). A heat dissipation funnel (28) is provided at the end of the liquid outlet pipe (27). A conical funnel (29) is fixedly installed at the bottom of the heat dissipation funnel (28). The conical funnel (29) is connected to the storage cylinder (21) through a return pipe (291). A spiral flow-slowing ring (281) in a spiral shape is fixedly installed on the inner wall of the heat dissipation funnel (28). A water flow trough (282) is provided inside the spiral flow-slowing ring (281). The liquid outlet pipe (27) is connected to the water flow trough (282).

2. The apparatus for rapidly cooling plastic products from injection molds according to claim 1, characterized in that: The cooling end of the semiconductor cooling chip (24) is inserted into the storage cylinder (21), and the heat dissipation end of the semiconductor cooling chip (24) is located outside the storage cylinder (21).

3. The apparatus for rapidly cooling plastic products from injection molds according to claim 1, characterized in that: The spiral heat dissipation pipe (26) is spiral in shape, and the liquid outlet pipe (27) is fixedly installed with a flow-slowing pipe (271) at the end near the spiral flow-slowing ring (281). The end of the flow-slowing pipe (271) is inserted into the water tank (282).

4. The apparatus for rapidly cooling plastic products from injection molds according to claim 1, characterized in that: A drain pipe (22) is fixedly installed on the bottom cylinder of the storage cylinder (21), and a drain valve (221) is fixedly installed on the drain pipe (22).

5. The apparatus for rapidly cooling plastic products from injection molds according to claim 4, characterized in that: The storage cylinder (21) has an addition hole (23) on its top surface, and a cover plate (231) is hinged to the top surface of the storage cylinder (21).

6. The apparatus for rapidly cooling plastic products from injection molds according to claim 5, characterized in that: When the cover plate (231) is closed, it covers the addition hole (23) and a handle (232) is fixedly installed on the side of the cover plate (231).

7. The apparatus for rapidly cooling plastic products from injection molds according to claim 1, characterized in that: A base (241) is fixedly mounted on a plurality of the semiconductor cooling chips (24), and the base (241) is fixedly mounted on the top surface of the storage cylinder (21) by a plurality of fastening screws.

8. The apparatus for rapidly cooling plastic products from injection molds according to claim 1, characterized in that: A dust cover (284) is hinged to the top surface of the heat dissipation hopper (28), and a plurality of heat dissipation fins (283) are fixedly installed on the annular side surface of the heat dissipation hopper (28) in a ring-shaped and equally spaced manner.

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