Laser diode chip transfer transmission device with air suction and dust removal mechanism

Abstract

The utility model provides a laser diode chip transfer transmission device with an air suction and dust removal mechanism, which relates to the technical field of laser diode chip assembly and pickup and comprises a mechanical arm, an opening is formed in the side surface of a sheath, a protective tube is arranged at the bottom of the sheath, and an air inlet joint and an air suction joint are symmetrically arranged at the bottom of the protective tube; a telescopic mechanism is arranged at the top of the supporting pipe, the telescopic end of the telescopic mechanism is movably arranged in the supporting pipe, the bottom of the telescopic end is connected with a picking pipe, and a negative pressure connector corresponding to the opening is arranged on the side face of the upper end of the picking pipe. When the chip pick-up device is used, a chip picked up by the pick-up tube can be retracted into the protective tube, and the air inlet joint blows air towards the bottom of the protective tube, so that the blown clean air blows away original air and fine sundries at the bottom of the protective tube, and the bottom of the protective tube is kept clean; meanwhile, the air suction connector sucks air outwards at the moment, original air and fine sundries are sucked away, and the chip is kept clean all the time when the chip is assembled.

Description

Technical Field

[0001] This utility model relates to the field of laser diode chip assembly and pickup technology, specifically a laser diode chip transfer and transmission device with a suction and dust removal mechanism. Background Technology

[0002] The laser diode chip is the core component of a laser diode and is commonly referred to as a laser chip. A laser diode chip is a miniaturized device used to generate laser light. It is made of semiconductor materials and features miniaturization, high efficiency, and high precision. Common laser diode chip sizes include 3.5mm × 2.5mm and 5.6mm × 3.6mm.

[0003] Laser diode chips are small in size, and during their production, they need to be picked up by a robotic arm. However, existing robotic arms cannot remove impurities from the chips after picking them up because there are microparticles in the environment that are invisible to the human eye. These microparticles can significantly affect chip assembly. To address this issue, we propose a laser diode chip transfer and transmission device with an air suction and dust removal mechanism. Utility Model Content

[0004] This invention provides a laser diode chip transfer device with a suction and dust removal mechanism, which has the advantages of picking up and cleaning chips, and solves the problems mentioned in the background art.

[0005] The technical solution of this utility model is implemented as follows: A laser diode chip transfer and transmission device with a suction and dust removal mechanism includes a robotic arm. This utility model also includes a support tube installed on the free end of the robotic arm; the bottom of the support tube is provided with a protective sleeve, the side of the protective sleeve is provided with an opening, the bottom of the protective sleeve is provided with a protective tube, and the bottom of the protective tube is symmetrically provided with an air inlet and a suction inlet; the top of the support tube is provided with a telescopic mechanism, the telescopic end of the telescopic mechanism is movably placed inside the support tube, the bottom of the telescopic end is connected to a pickup tube, the upper side of the pickup tube is provided with a negative pressure connector corresponding to the opening, and the lower end of the pickup tube is movably placed inside the protective tube. In the initial state, the pickup tube is stopped above the air inlet and suction inlet under the drive of the telescopic mechanism.

[0006] Preferably, the negative pressure connector is connected to the solenoid valve via a pipe, the solenoid valve is connected to the negative pressure device via a pipe, and a pressure sensor is installed on the pipe between the negative pressure connector and the solenoid valve.

[0007] Preferably, the air inlet connector is connected to the air blowing device via a pipe, and a flow solenoid valve and an air filter are installed on the pipe.

[0008] Preferably, the suction connector is connected to the suction device via a pipe, and a flow solenoid valve is installed on the pipe.

[0009] Preferably, the robotic arm, solenoid valve, flow solenoid valve, air blowing device, air suction device, and negative pressure device are each connected to the controller.

[0010] Preferably, a piston is provided on the pickup tube located inside the protective tube, and the piston is located above the air inlet and air intake joints.

[0011] Preferably, the bottom of the pickup tube is equipped with a protective suction cup.

[0012] Compared with the prior art, in use, the chip picked up by the pickup tube retracts into the protective tube, and the air inlet blows air towards the bottom of the protective tube, allowing the clean air to blow away the original air and small debris at the bottom of the protective tube, keeping the bottom of the protective tube clean; at the same time, the air intake outlet draws air outward, sucking away the original air and small debris, so that the chip remains clean during chip assembly. Attached Figure Description

[0013] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0014] Figure 1 This is a schematic diagram of the structure of the present utility model. Figure 1 .

[0015] Figure 2 This is a schematic diagram of the structure of the present utility model. Figure 2 .

[0016] Figure 3 This is the front view of the present utility model.

[0017] Figure 4 This is a cross-sectional view of the present invention.

[0018] Figure 5 This is a partial structural diagram of the present invention. Figure 1 .

[0019] Figure 6 This is a partial structural diagram of the present invention. Figure 2 .

[0020] In the diagram: 1. Assembly table; 2. Air inlet connector; 3. Suction connector; 4. Protective tube; 5. Negative pressure connector; 6. Opening; 7. Sheath; 8. Support tube; 9. Telescopic mechanism; 10. Robotic arm; 11. Pickup tube; 12. Piston; 13. Protective suction cup. Detailed Implementation

[0021] The technical solution of this utility model will be clearly and completely described below with reference to its embodiments. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0022] Reference Figures 1 to 6 This utility model provides a technical solution: a laser diode chip transfer and transmission device with a suction and dust removal mechanism, including a robotic arm 10. The robotic arm 10 can be a two-axis, three-axis, four-axis, five-axis, six-axis, or multi-axis truss robotic arm. Regardless of the number of axes of the robotic arm 10, a support tube 8 must be installed on the free end of the robotic arm 10. Specifically, a support is provided on the side of the support tube 8, and the support is installed on the free end of the robotic arm 10 by bolts.

[0023] The bottom of the support tube 8 is provided with a protective sleeve 7, which is threaded to the bottom of the support tube 8 or connected by a flange, so that the protective sleeve 7 can be easily disassembled. The side of the protective sleeve 7 is provided with an opening 6, which is a strip-shaped opening.

[0024] A protective tube 4 is located at the bottom of the sheath 7. The diameter of the protective tube 4 is actually smaller than the diameter of the sheath 7 because the inner diameter of the protective tube 4 needs to correspond to the chip size. Therefore, the diameter of the protective tube 4 cannot be too large; it can only accommodate one chip. Symmetrically located at the bottom of the protective tube 4 are an air inlet connector 2 and an air intake connector 3. Specifically, the air inlet connector 2 is connected to the blowing device via a pipe, on which a flow solenoid valve and an air filter are installed. The air intake connector 3 is connected to the suction device via a pipe, on which a flow solenoid valve is installed. The flow solenoid valves are used to detect the flow rate of the suction and blowing air, and control the flow rates of the suction and blowing air within a preset range.

[0025] Immediately afterwards, such as Figure 1 and Figure 2 As shown, a telescopic mechanism 9 is provided at the top of the support tube 8. The telescopic mechanism 9 is a cylinder, an electric cylinder, or an electric telescopic rod. The telescopic end of the telescopic mechanism 9 is movably placed inside the support tube 8. The bottom of the telescopic end is connected to the pickup tube 11. The bottom of the telescopic end is threaded to the pickup tube 11 or connected through a flange, which facilitates the disassembly of the pickup tube 11.

[0026] like Figure 1As shown, a negative pressure connector 5 corresponding to the opening 6 is provided on the upper side of the pickup tube 11. The opening 6 allows the negative pressure connector 5 to be exposed to the outside, while the negative pressure connector 5 moves inside the opening 6 when the telescopic mechanism 9 extends and retracts. The lower end of the pickup tube 11 is movably placed inside the protective tube 4. In the initial state, the pickup tube 11 stays above the air inlet connector 2 and the air intake connector 3 under the drive of the telescopic mechanism 9.

[0027] The negative pressure connector 5 is connected to the solenoid valve via a pipe, and the solenoid valve is connected to the negative pressure device via a pipe. A pressure sensor is installed on the pipe between the negative pressure connector 5 and the solenoid valve. This pressure sensor is used to detect the adsorption force of the pickup tube 11 on the chip, preventing excessive adsorption force. The specific operation process is as follows: During installation, the robotic arm 10, solenoid valve, flow solenoid valve, air blowing device, air suction device, and negative pressure device are each connected to a controller. The controller can be a PLC logic control module, a control motherboard, or a host computer, allowing the controller to control each component to operate according to the set parameters.

[0028] like Figure 1 and Figure 2 As shown, the robotic arm 10 is placed on the laser diode assembly stage 1. The chip is then placed on one side of the assembly stage 1. The robotic arm 10 then moves the pickup tube 11 above the chip. The telescopic mechanism 9 then lowers the pickup tube 11 and extends it from below the protective tube (as shown). Figure 6 As shown), the negative pressure device generates suction in the negative pressure connector 5, allowing the bottom of the pickup tube 11 to pick up the chip. In order to protect the chip, a protective suction cup 13 can be provided at the bottom of the pickup tube 11.

[0029] Then the chip is retracted above the air intake connector 2 and the air intake connector 3 by the pickup tube 11 (e.g., Figure 5 As shown), at this time, the air inlet 2 blows air into the bottom of the protective tube 4, while the air intake 3 continuously draws air outward. This can remove the dust remaining under the chip, and the gas blown out from the air inlet 2 can form a protective layer under the chip to prevent the chip from being affected by the external environment. Then, the robotic arm 10 drives the chip to the assembly position, and the pick-up tube 11 extends again to drive the chip to be assembled in the preset position.

[0030] During this process, the blowing speed of the air inlet connector 2 and the suction speed of the air inlet connector 3 must not interfere with the stability of the chip. Furthermore, when the pickup tube 11 extends from the bottom of the protective tube 4, the air inlet connector 2 and the air inlet connector 3 shall stop operating simultaneously.

[0031] Based on the above embodiments, a piston 12 is provided on the pickup tube 11 located inside the protective tube 4. The piston 12 is located above the air inlet connector 2 and the air intake connector 3. The piston 12 can prevent the protective tube 4 from leaking air.

[0032] Based on the above embodiments, it should be further explained that the air filter connected to the air inlet connector 2 is to remove particulate matter in the air and prevent these particulate matter from affecting the cleanliness of the chip.

[0033] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A laser diode chip transfer device with a suction and dust removal mechanism, comprising a robotic arm (10), characterized in that, It also includes a support tube (8) installed on the free end of the robotic arm (10); The support tube (8) is provided with a protective sleeve (7) at the bottom, and an opening (6) is provided on the side of the protective sleeve (7). The protective tube (4) is provided at the bottom of the protective sleeve (7), and an air inlet connector (2) and an air intake connector (3) are symmetrically provided at the bottom of the protective tube (4). The top of the support tube (8) is provided with a telescopic mechanism (9). The telescopic end of the telescopic mechanism (9) is movably placed inside the support tube (8). The bottom of the telescopic end is connected to the pickup tube (11). The upper side of the pickup tube (11) is provided with a negative pressure connector (5) corresponding to the opening (6). The lower end of the pickup tube (11) is movably placed inside the protective tube (4). In the initial state, the pickup tube (11) stays above the air inlet connector (2) and the air intake connector (3) under the drive of the telescopic mechanism (9).

2. The laser diode chip transfer and transmission device with a suction and dust removal mechanism as described in claim 1, characterized in that, The negative pressure connector (5) is connected to the solenoid valve through a pipe, and the solenoid valve is connected to the negative pressure device through a pipe. A pressure sensor is installed on the pipe between the negative pressure connector (5) and the solenoid valve.

3. The laser diode chip transfer and transmission device with a suction and dust removal mechanism as described in claim 2, characterized in that, The air inlet connector (2) is connected to the air blowing device through a pipe, on which a flow solenoid valve and an air filter are installed.

4. The laser diode chip transfer and transmission device with a suction and dust removal mechanism as described in claim 3, characterized in that, The suction connector (3) is connected to the suction device through a pipe, and a flow solenoid valve is installed on the pipe.

5. The laser diode chip transfer and transmission device with a suction and dust removal mechanism as described in claim 4, characterized in that, The robotic arm (10), solenoid valve, flow solenoid valve, air blowing device, air suction device and negative pressure device are respectively connected to the controller.

6. The laser diode chip transfer and transmission device with a suction and dust removal mechanism as described in any one of claims 1-5, characterized in that, A piston (12) is provided on the pickup tube (11) located inside the protective tube (4), and the piston (12) is located above the air inlet connector (2) and the air intake connector (3).

7. The laser diode chip transfer and transmission device with a suction and dust removal mechanism as described in claim 6, characterized in that, The bottom of the pickup tube (11) is equipped with a protective suction cup (13).

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