Thickness control device for copper plating of PCB (Printed Circuit Board)
By combining a servo motor-driven threaded rod with an air pump box, scraper, and air nozzle, precise control of the copper plating thickness on PCB circuit boards is achieved. This solves the problem that traditional copper plating methods cannot adapt to circuit boards of different shapes, and improves the uniformity of copper plating and the performance of the circuit boards.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-12
- Publication Date
- 2026-04-07
AI Technical Summary
Traditional PCB copper plating methods are difficult to adjust for different shapes and sizes of circuit boards, resulting in uneven copper plating thickness, which cannot meet the high precision and personalization requirements of modern electronic products.
By employing a servo motor-driven threaded rod and transmission gear set, combined with an air pump box, scraper, and air blowing port, the thickness of copper plating can be precisely controlled by adjusting the position of the thickness control mechanism and the airflow direction.
It achieves uniformity and precision in copper layer thickness, improves the electrical performance and reliability of circuit boards, adapts to the copper plating requirements of circuit boards of different specifications, and reduces the cost of replacing equipment.
Smart Images
Figure CN224092043U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to PCB circuit board processing technical field especially relates to a thickness control device for PCB circuit board copper plating. BACKGROUND
[0002] In the manufacturing process of PCB circuit board, copper plating is a crucial process, and the thickness of the copper layer directly affects the conductivity, mechanical strength and service life of the PCB circuit board. With the development of electronic equipment towards miniaturization and high performance, the uniformity and precision of the copper layer thickness on the PCB circuit board are increasingly required. The traditional PCB circuit board copper plating method uses electroplating tank and fixed electroplating parameters, which is difficult to adjust according to the shape, size and copper plating area of the PCB circuit board. For some circuit boards with different shapes, the copper plating effect is difficult to guarantee, and it cannot meet the high-precision and personalized needs of modern electronic products. Therefore, the present application proposes a thickness control device for PCB circuit board copper plating. SUMMARY
[0003] The utility model aims at the problem of unable to guarantee the copper plating thickness according to the circuit board with different shapes in the background art, and proposes a thickness control device for PCB circuit board copper plating.
[0004] The technical scheme of the utility model: a thickness control device for PCB circuit board copper plating, including support leg, the inner wall transmission of a plurality of support legs is provided with transmission mechanism, the outer wall both sides of transmission mechanism are provided with adjusting mechanism, adjusting mechanism includes the transmission seat one that sets up in the outer wall both sides of transmission mechanism, the outer wall side of two transmission seat one is fixedly connected with servo motor, and the top of two transmission seat one is rotatably connected with threaded rod through the transmission groove that sets up, one end of two threaded rods is fixedly connected with servo motor, and the output end of servo motor is penetrated with transmission gear set one, and two threaded rods are driven connection through transmission gear set one.
[0005] Optionally, the thickness control mechanism includes a crossbar fixed between the drive seats, the inner wall of the crossbar is drivingly connected with a transmission seat two through a transmission gear set two, the outer wall of the transmission seat two is fixedly connected with a gas pump box, and the outer wall of the gas pump box is fixedly connected with a plurality of air flow ducts.
[0006] Optionally, the bottom end of the gas pump box is fixedly connected with a fixed seat, and the bottom end of the fixed seat is fixedly connected with a scraper through a connecting block.
[0007] Optionally, the outer wall of the scraper is fixedly connected with two connecting joints, and the inner wall of the two connecting joints is rotatably connected with a connecting frame plate.
[0008] Optionally, the top end of the connecting frame plate penetrates a plurality of air outlets, and the top end of the plurality of air outlets is fixedly connected with an airflow duct.
[0009] Optionally, the circuit board positioning mechanism comprises a plurality of supports arranged on one side of the top end of the transmission seat, the top end of the plurality of supports is fixedly connected with a sliding groove rod, and the inner wall of the two sliding groove rods is slidably connected with a sliding seat.
[0010] Optionally, the two ends of the two sliding groove rods are fixedly connected with an electric telescopic rod, the output end of the two electric telescopic rods is fixedly connected with a sliding seat, and the outer wall of the two electric telescopic rods penetrates a sliding groove rod, and the outer wall of the plurality of sliding seats is fixedly connected with an adjusting rod.
[0011] Compared with the prior art, the present application has at least one of the following beneficial technical effects: when the device is used, the position of the thickness control mechanism is accurately adjusted by the adjusting mechanism, and the synergistic effect of the air pump box, the scraper and the air outlet and other components can effectively remove the excess plating solution on the surface of the PCB circuit board, so that the copper layer thickness deviation control is low, the plating copper demand of high-precision PCB circuit board is met, the electrical performance and reliability of the circuit board are improved, the adjusting mechanism can flexibly adjust the position of the thickness control mechanism and the circuit board positioning mechanism according to the size of different specifications of PCB circuit board, whether it is a small circuit board or a large circuit board, accurate copper plating thickness control and stable positioning can be realized, the versatility and applicability of the device are improved, and the cost of enterprises due to replacement of equipment is reduced. BRIEF DESCRIPTION OF DRAWINGS
[0012] Figure 1 It is a three-dimensional structure schematic diagram of a thickness control device for PCB circuit board copper plating;
[0013] Figure 2 It is a multi-angle three-dimensional structure schematic diagram of a thickness control device for PCB circuit board copper plating;
[0014] Figure 3 It is a connecting structure schematic diagram of a transmission gear set two of a thickness control device for PCB circuit board copper plating;
[0015] Figure 4 It is a sliding seat connecting structure schematic diagram of a thickness control device for PCB circuit board copper plating.
[0016] Label: 1, leg; 2, transmission mechanism; 3, transmission seat one; 4, servo motor; 5, transmission gear set one; 6, transmission groove; 7, threaded rod; 8, drive seat; 9, cross rack; 10, transmission gear set two; 11, transmission seat two; 12, air pump box; 13, air flow guide pipe; 14, fixed seat; 15, connecting block; 16, scraper; 17, connecting joint; 18, connecting rack plate; 19, air blowing port; 20, support; 21, sliding groove rod; 22, sliding seat; 23, electric telescopic rod; 24, adjusting rod. DETAILED DESCRIPTION
[0017] The technical solutions of the present application will be described clearly and completely below in combination with the drawings. Obviously, the described embodiments are only some of the embodiments of the present application, not all the embodiments.
[0018] The components of the embodiments of the present application generally described and shown in the drawings can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed application, but only represents selected embodiments of the present application.
[0019] Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.
[0020] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", "third" are only for descriptive purposes and cannot be understood as indicating or implying relative importance.
[0021] It should be noted that the terms "include", "contain" or any other variants thereof are intended to cover non-exclusive inclusion, so that the processes, methods, articles or devices including a series of elements not only include those elements, but also include other elements not explicitly listed or inherent to such processes, methods, articles or devices. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the described specific features, structures, materials or characteristics can be combined in any one or more embodiments or examples in a suitable manner.
[0022] In the description of the utility model, it is necessary to explain, unless another explicit provision and limitation, term " install " " link " " connection " should do broad sense understanding, for example, can be fixed connection, also can be detachable connection, or integrally connected, can be mechanical connection, also can be electrical connection, can be direct connection, also can be indirectly connected through intermediate medium, can be two element internal intercommunication. For ordinary skilled person in the art, the specific meaning of the above-mentioned term in the utility model can be understood according to specific circumstances. Embodiments
[0023] As Figure 1 shown, the utility model provides a thickness control device for PCB circuit board copper plating, including support 1, the inner wall transmission of multiple support 1 is provided with transmission mechanism 2, the outer wall both sides of transmission mechanism 2 are provided with adjusting mechanism, and adjusting mechanism includes the transmission seat no. 3 of setting in the outer wall both sides of transmission mechanism 2, the outer wall side of two transmission seat no. 3 is all fixedly connected with servo motor 4, and the top of two transmission seat no. 3 is all rotationally connected with threaded rod 7 through the transmission groove 6 of setting, and one end of two threaded rods 7 is all fixedly connected with servo motor 4, and the output end of servo motor 4 is penetrated with transmission gear set no. 5, and two threaded rods 7 are all transmission connection through transmission gear set no. 5, by setting transmission seat no. 3 fixed installation in the outer wall both sides of transmission mechanism 2, provide installation base for servo motor 4 and threaded rod 7 etc. component, servo motor 4 is installed in the outer wall side of transmission seat no. 3, can control the rotation angle and speed of threaded rod 7, and then adjust the position of thickness control mechanism, to adapt to the copper plating demand of different specifications PCB circuit board, and the transmission gear set no. 5 of servo motor 4 output end penetration, is composed of multiple intermeshing gears, and the power of servo motor 4 is transmitted to threaded rod 7 through gear transmission, realizes the accurate control of the rotation speed of threaded rod 7.
[0024] It needs to be supplemented that, as Figure 1 and Figure 2 shown, the outer wall of two threaded rods 7 is all screw connected with drive seat 8, and two threaded rods 7 are transmission connection through transmission gear set no. 5, and are screw connected drive seat 8, when servo motor 4 drives threaded rod 7 to rotate, the rotation of threaded rod 7 is converted into the linear motion of drive seat 8, by accurately controlling the rotation direction and number of turns of threaded rod 7, the accurate movement of drive seat 8 in horizontal direction can be realized, so as to adjust the relative position between thickness control mechanism and PCB circuit board, satisfy different copper plating thickness control requirements.
[0025] In addition, as Figure 2 and Figure 3As shown, the two drive seats 8 are provided with a thickness control mechanism, the thickness control mechanism includes a cross frame rod 9 fixed between the drive seats 8, the inner wall of the cross frame rod 9 is drivenly connected with a transmission seat two 11 through a transmission gear set two 10, by setting the cross frame rod 9 fixed between the two drive seats 8, as a horizontal support component of the thickness control mechanism, using high-strength metal material, having good rigidity, can ensure stable support of components such as air pump box 12 during work, without deformation, the inner wall of the cross frame rod 9 is drivingly connected with the transmission seat two 11 through the transmission gear set two 10, the transmission gear set two 10 can transmit power to the transmission seat two 11, realize the movement of the transmission seat two 11 on the cross frame rod 9, thereby driving the components such as air pump box 12 to adjust the position in the horizontal direction, to adapt to the copper plating demand of PCB circuit boards of different widths, the outer wall of the transmission seat two 11 is fixedly connected with the air pump box 12, the outer wall of the air pump box 12 is fixedly connected with a plurality of airflow ducts 13, by setting the air pump box 12 fixed on the outer wall of the transmission seat two 11, internally installed with an air pump, can produce stable airflow, the plurality of airflow ducts 13 connected on the outer wall of the air pump box 12, deliver the airflow generated by the air pump to the air outlet 19 on the connecting frame plate 18.By controlling the power of the air pump and the air outlet of the air flow conduit 13, the size and direction of the air flow can be adjusted. During the copper plating process of the PCB circuit board, the air flow is used to blow the copper plated surface, which can remove the excess plating solution on the copper plated surface, avoid the accumulation of plating solution, and cause uneven copper layer thickness. On the other hand, the blowing effect of the air flow can also make the plating solution more evenly distributed on the surface of the PCB circuit board, thereby achieving precise control of the copper plating thickness. The bottom end of the air pump box 12 is fixedly connected with a fixed seat 14, the bottom end of the fixed seat 14 is fixedly connected with a scraper 16 through a connecting block 15, the outer wall of the scraper 16 is fixedly connected with two connecting joints 17, the fixed seat 14 at the bottom end of the air pump box 12 is fixedly connected with the scraper 16 through the connecting block 15, the fixed seat 14 and the connecting block 15 ensure the stable connection between the scraper 16 and the air pump box 12, the scraper 16 is made of wear-resistant and corrosion-resistant material, and its shape and size are designed according to the specifications of the PCB circuit board. During the copper plating process, the scraper 16 maintains a certain distance from the surface of the PCB circuit board, which can remove the excess plating solution on the surface of the PCB circuit board, further control the copper plating thickness, and make the copper layer thickness more uniform and accurate. The inner wall of the two connecting joints 17 is rotatably connected with a connecting frame plate 18, the top end of the connecting frame plate 18 penetrates a plurality of air blowing ports 19, the top end of the plurality of air blowing ports 19 is fixedly connected with the air flow conduit 13, the two connecting joints 17 on the outer wall of the scraper 16 are rotatably connected with the connecting frame plate 18, so that the connecting frame plate 18 can rotate within a certain range to adapt to PCB circuit boards of different shapes and surface conditions. The plurality of air blowing ports 19 at the top end of the connecting frame plate 18 are connected with the air flow conduit 13, the air flow uniformly blows to the surface of the PCB circuit board through the air blowing ports 19, cooperates with the scraping effect of the scraper 16, can effectively control the copper plating thickness, and can also accelerate the drying of the plating solution, improve the copper plating efficiency and quality.
[0026] It should be noted that, as Figure 2 and Figure 4As shown, the top end of the transmission seat one 3 is provided with a circuit board positioning mechanism, the circuit board positioning mechanism includes a plurality of supports 20 arranged at one side of the top end of the transmission seat one 3, the top end of the plurality of supports 20 is fixedly connected with a sliding groove rod 21, the inner wall of the two sliding groove rods 21 is slidably connected with a sliding seat 22, the two ends of the two sliding groove rods 21 are fixedly connected with an electric telescopic rod 23, the output end of the two electric telescopic rods 23 is fixedly connected with a sliding seat 22, and the outer wall of the two electric telescopic rods 23 penetrates the sliding groove rod 21, the outer wall of the plurality of sliding seats 22 is fixedly connected with an adjusting rod 24, a plurality of supports 20 are arranged at one side of the top end of the transmission seat one 3 to provide support for the sliding groove rod 21, the sliding groove rod 21 is fixed at the top end of the support 20 to provide a sliding track for the sliding seat 22, so that the sliding seat 22 can smoothly slide in the sliding groove rod 21, thereby realizing the position adjustment of the PCB circuit board in the horizontal direction, the output end of the electric telescopic rod 23 at both ends of the sliding groove rod 21 is fixedly connected with the sliding seat 22, the electric telescopic rod 23 can control the position of the sliding seat 22 on the sliding groove rod 21, the sliding seat 22 can be accurately positioned by adjusting the telescopic length of the electric telescopic rod 23, thereby adjusting the position of the PCB circuit board fixed on the sliding seat 22, ensuring that the PCB circuit board is in the correct position during the copper plating process, avoiding uneven copper plating thickness caused by position deviation, the adjusting rod 24 fixedly connected with the outer wall of the plurality of sliding seats 22 is used for fixing and adjusting the position of the PCB circuit board. The adjusting rod 24 can be adjusted according to the size and shape of the PCB circuit board, and the PCB circuit board is stably fixed in the appropriate position by contacting or cooperating with the edge of the PCB circuit board, so that the PCB circuit board will not be displaced during the copper plating process, providing protection for accurate copper plating.
[0027] The above specific embodiments are only several optional embodiments of the present application, and based on the technical scheme of the present application and the related inspiration of the above embodiments, those skilled in the art can make various alternative improvements and combinations on the above specific embodiments.
Claims
1. A thickness control device for copper plating on a PCB circuit board, comprising legs (1), a transmission mechanism (2) being provided on the inner wall of a plurality of legs (1), and an adjustment mechanism being provided on both sides of the outer wall of the transmission mechanism (2), characterized in that: The adjustment mechanism includes transmission seats (3) on both sides of the outer wall of the transmission mechanism (2). A servo motor (4) is fixedly connected to one side of the outer wall of each of the two transmission seats (3). The top of each of the two transmission seats (3) is rotatably connected to a threaded rod (7) through a transmission groove (6). One end of each of the two threaded rods (7) is fixedly connected to a servo motor (4). The output end of the servo motor (4) is penetrated by a transmission gear set (5). The two threaded rods (7) are connected by transmission gear set (5). The outer walls of the two threaded rods (7) are threadedly connected to drive seats (8), and a thickness control mechanism is provided between the two drive seats (8); The top of the transmission seat (3) is provided with a circuit board positioning mechanism.
2. The thickness control device for copper plating on a PCB circuit board according to claim 1, characterized in that, The thickness control mechanism includes a crossbar (9) fixed between drive seats (8). The inner wall of the crossbar (9) is connected to a transmission seat (11) via a transmission gear set (10). An air pump box (12) is fixedly connected to one side of the outer wall of the transmission seat (11). Multiple airflow ducts (13) are fixedly connected to one side of the outer wall of the air pump box (12).
3. The thickness control device for copper plating on a PCB circuit board according to claim 2, characterized in that, The bottom end of the air pump box (12) is fixedly connected to a fixed seat (14), and the bottom end of the fixed seat (14) is fixedly connected to a scraper (16) via a connecting block (15).
4. The thickness control device for copper plating on a PCB circuit board according to claim 3, characterized in that, Two connecting sections (17) are fixedly connected to one side of the outer wall of the scraper (16), and a connecting frame plate (18) is rotatably connected to the inner wall of the two connecting sections (17).
5. The thickness control device for copper plating on a PCB circuit board according to claim 4, characterized in that, The top of the connecting frame plate (18) has multiple air inlets (19), and the top of the multiple air inlets (19) is fixedly connected to an airflow duct (13).
6. The thickness control device for copper plating on a PCB circuit board according to claim 1, characterized in that, The circuit board positioning mechanism includes multiple brackets (20) disposed on one side of the top of the transmission seat (3). The top of the multiple brackets (20) is fixedly connected to a sliding rod (21), and the inner walls of the two sliding rods (21) are slidably connected to a sliding seat (22).
7. The thickness control device for copper plating on a PCB circuit board according to claim 6, characterized in that, Both ends of the two sliding rods (21) are fixedly connected to electric telescopic rods (23), and the output ends of the two electric telescopic rods (23) are fixedly connected to sliding seats (22). The outer walls of the two electric telescopic rods (23) are penetrated by the sliding rods (21), and one side of the outer wall of the multiple sliding seats (22) is fixedly connected to an adjusting rod (24).