Power supply inductance lead fixing device and power supply

Abstract

The embodiment of the utility model provides a power supply inductance lead fixing device and a power supply, and belongs to the field of power supplies. The power supply inductance wire fixing device comprises a wire bunching plate which is used for being arranged on the surface of a radiator; the wire bunching plate is provided with a lead groove used for leading out an inductance lead, and the lead groove is located above the opening of the containing cavity of the radiator. A plurality of wire clamping grooves for fixing inductance leads are formed in the upper surface of the wire bunching plate; the upper surface of the wire bunching plate is provided with a plurality of limiting grooves used for placing terminal blocks of lead terminals connected with inductance leads. And the upper surface of the wire bunching plate is provided with a plurality of buckling pieces which are matched with the terminal through holes of the lead terminals. The inductance lead is folded between the printed circuit board and the radiator through the fixing device, so that the interior of the power supply is neat and attractive. The inductance lead does not cause electromagnetic interference to components on the printed circuit board, and the EMC test passing rate of the power supply can be improved.

Description

Technical Field

[0001] This application relates to the field of power supplies, and more particularly to a power supply inductor lead fixing device and a power supply. Background Technology

[0002] In existing power supplies, inductor leads are typically fixed directly to the printed circuit board (PCB) via their lead terminals. While this method is simple and straightforward, it has some significant drawbacks in practical applications, limiting the power supply's performance and reliability.

[0003] This mounting method requires pre-drilled holes for inductor leads on the PCB, increasing PCB design complexity and leading to insufficient PCB space, thus limiting the layout of other electronic components. Directly fixing the inductor leads to a messy appearance, affecting the aesthetics of the power supply enclosure and increasing maintenance and repair difficulties. Furthermore, the inductor leads cause electromagnetic interference to other components on the PCB, impacting the power supply's electromagnetic compatibility (EMC) test pass rate. When the inductor is located on the side of the power supply enclosure, this mounting method also results in excessively long inductor leads, increasing costs and hindering structural optimization.

[0004] To meet the requirements of PCB design rationality, neat and aesthetically pleasing inductor leads inside the power supply, and that inductor leads do not interfere with electronic components on the PCB, the industry urgently needs to develop a power supply inductor lead fixing device and power supply. Utility Model Content

[0005] This application provides a power inductor wire fixing device and a power supply, which solves the technical problems of PCB design complexity, messy inductor leads on the PCB surface, and electromagnetic interference to components on the PCB.

[0006] The first aspect of this application provides a power inductor lead fixing device, wherein the power supply includes an inductor and a heat sink, the inductor is disposed in a receiving cavity of the heat sink, and the receiving cavity is located between two fins of the heat sink;

[0007] The power inductor lead fixing device includes:

[0008] A cable management plate is provided on the surface of the heat sink; the cable management plate is provided with a lead groove for leading out inductor leads, the lead groove being located above the opening of the receiving cavity; the upper surface of the cable management plate is provided with a plurality of wire-clamping grooves for fixing the inductor leads; the upper surface of the cable management plate is provided with a plurality of limiting grooves for inserting the terminal blocks of the lead terminals connected to the inductor leads; the upper surface of the cable management plate is provided with a plurality of fasteners for engaging with the terminal through holes of the lead terminals.

[0009] Preferably, the limiting groove includes a first retaining wall, a connecting retaining wall, and a second retaining wall, with one end of the first retaining wall connected to one end of the connecting retaining wall, and the other end of the connecting retaining wall connected to one end of the second retaining wall.

[0010] Preferably, the power inductor lead fixing device further includes an insulating film for placement above the cable tray; the insulating film has a plurality of first through holes through which screws pass to connect the printed circuit board to the terminal block.

[0011] Preferably, the upper surface of the wire harness plate is provided with a plurality of insulating film mounting posts;

[0012] The insulating film also has multiple second through holes through which a snap-fit ​​structure passes to fix the insulating film to the insulating film mounting post.

[0013] Preferably, the diameter of the second through hole is smaller than the diameter of the upper surface of the insulating film mounting post.

[0014] Preferably, the insulating film mounting post is provided with a groove; the snap-fit ​​structure passes through the corresponding second through hole and snaps into the groove of the corresponding insulating film mounting post, so that the insulating film is fixed on the cable tray.

[0015] Preferably, the upper surface of the wire harness plate is provided with a plurality of partition walls for separating two adjacent inductor leads.

[0016] Preferably, the cable tray has multiple positioning holes, which are fitted onto corresponding positioning posts, wherein the positioning posts are disposed on the surface of the heat sink.

[0017] A second aspect of this application provides a power source, comprising:

[0018] Printed circuit boards;

[0019] A radiator, the radiator including a receiving cavity and two fins, wherein the receiving cavity is located between the two fins;

[0020] Inductor, the inductor being placed within the accommodating cavity; and

[0021] The power inductor lead fixing device described above is disposed between the surfaces of the printed circuit board and the heat sink.

[0022] Preferably, the cable tray is fixed to the surface of the heat sink.

[0023] Preferably, the printed circuit board is connected to the terminal block by a screw, and the terminal block is provided with a groove with internal threads, wherein the external threads of the screw and the internal threads of the terminal block engage.

[0024] The beneficial effects of the embodiments of this application include:

[0025] The power inductor wire fixing device of this application includes a wire harness plate for mounting on the surface of a heat sink. The wire harness plate has lead slots for leading out inductor wires, located above the opening of the heat sink's accommodating cavity. The upper surface of the wire harness plate has multiple wire-clamping slots for fixing the inductor wires. The upper surface of the wire harness plate also has multiple limiting slots for inserting terminal blocks of the lead terminals connected to the inductor wires. The upper surface of the wire harness plate also has multiple fasteners for engaging with the through holes of the lead terminals. The inductor wires are neatly gathered between the printed circuit board and the heat sink using the fixing device, resulting in a cleaner and more aesthetically pleasing internal power supply while ensuring power supply safety. The inductor wires do not cause electromagnetic interference to components on the printed circuit board and also improve the power supply's EMC test pass rate.

[0026] Placing the inductor in the middle of the power supply enclosure reduces the length of the inductor leads, lowers costs, and optimizes the overall power supply structure.

[0027] The wire slot can effectively secure the inductor lead, and the fastener passing through the terminal through hole of the lead terminal and locking the side wall of the terminal through hole can effectively limit the position of the lead terminal. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0029] Figure 1 This is a schematic diagram of the structure of a wire harness board according to an embodiment of this application;

[0030] Figure 2 for Figure 1 A magnified view of part A in the image;

[0031] Figure 3 This is a schematic diagram of the structure of a cable tray that gathers some of the inductor leads according to an embodiment of this application;

[0032] Figure 4 for Figure 3 A magnified view of part B in the image;

[0033] Figure 5 This is a schematic diagram of the structure of an insulating film according to an embodiment of this application;

[0034] Figure 6 This is a top view of the cable management board fixed to the heat sink according to an embodiment of this application;

[0035] Figure 7 This is a schematic diagram of a wire harness plate with an insulating film fixed to it being installed on a heat sink according to an embodiment of this application.

[0036] Figure 8 This is a schematic diagram of the structure of the power inductor lead fixing device with a printed circuit board fixed to the heat sink according to an embodiment of this application.

[0037] Figure 9 A side view of a power inductor lead fixing device with a printed circuit board fixed to a heat sink, as described in an embodiment of this application.

[0038] Figure 10 This is a cross-sectional view of a power inductor lead fixing device with a printed circuit board fixed to a heat sink, according to an embodiment of this application.

[0039] Figure 11 for Figure 10 A magnified view of part C. Detailed Implementation

[0040] The technical solutions of this application will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0041] The various embodiments or implementation methods described in this specification are presented in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referred to each other.

[0042] Generally speaking, terms should be understood at least in part by their use in context. For example, at least in part by context, the term "one or more" as used in the text can be used to describe any feature, structure, or characteristic of the singular meaning, or a combination of features, structures, or characteristics of the plural meaning. Similarly, at least in part by context, terms such as "a" or "the" can also be understood to convey either singular or plural usage.

[0043] It should be readily understood that the terms “on,” “above,” and “on top of” in this disclosure should be interpreted in the broadest possible sense, such that “on” means not only “directly on something” but also “on something” with an intermediate feature or layer therebetween, and that “above” or “on top of” means not only “on top of something” but also “on top of something” without an intermediate feature or layer therebetween (i.e., directly on something).

[0044] Furthermore, for ease of explanation, spatially relative terms such as "below," "below," "under," "above," and "above" may be used to describe the relationship of one element or feature relative to other elements or features as shown in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation other than those shown in the figures. The device may have other orientations (rotated 90 degrees or in other orientations), and the spatially relative descriptive terms used herein may be interpreted accordingly.

[0045] With the continuous miniaturization and performance improvement of power supplies, compact design and high power density have become important development directions for modern power supply technology. Compact design aims to reduce the size and weight of power supply systems, while high power density requires achieving higher power output within a limited space.

[0046] To reduce the size of the power supply, the inductor can be placed in the middle of the power supply box, making it easier to lead the inductor's leads to the inverter and boost structures on both sides of the inductor.

[0047] Figure 1 This is a schematic diagram of the structure of a wire harness board according to an embodiment of this application. Figure 2 for Figure 1 A magnified view of part A in the image. Figure 3 This is a schematic diagram of the structure of a cable management board for gathering some of the inductor leads according to an embodiment of this application. Figure 4 for Figure 3 A magnified view of part B in the image. Figure 5 This is a schematic diagram of the structure of an insulating film according to an embodiment of this application. Figure 6 This is a top view of the cable management board fixed to the heat sink according to an embodiment of this application. Figure 7This is a schematic diagram of a wire harness plate with an insulating film fixed to it, installed on a heat sink according to an embodiment of this application. Figure 8 This is a schematic diagram of the structure of the power inductor lead fixing device with a printed circuit board fixed to it, which is installed on a heat sink according to an embodiment of this application. Figure 9 This is a side view of a power inductor lead fixing device with a printed circuit board mounted on a heat sink, according to an embodiment of this application. Figure 10 This is a cross-sectional view of a power inductor lead fixing device with a printed circuit board fixed to it, as described in an embodiment of this application, mounted on a heat sink. Figure 11 for Figure 10 A magnified view of part C.

[0048] like Figure 9 As shown, the power supply includes an inductor 9 and a heatsink 4. The heatsink 4 is located in the middle of the power supply chassis, facilitating the routing of the inductor leads for use in the power supply's inverter and boost structures. This minimizes the power supply's size and reduces the length of the inductor leads, lowering costs and optimizing the structure. The heatsink 4 includes a housing 42 and two fins 41, with the housing 42 located between the two fins 41. The housing 42 and the two fins 41 are located on the same side of the heatsink 4. The heatsink 4 also includes a heat-conducting plate. The housing 42 extends inward from the upper surface of the heat-conducting plate, and the two fins 41 are fixedly connected to the lower surface of the heat-conducting plate. The housing 42 and the heat-conducting plate are integrally formed from a substrate, and the two fins 41 are fixedly connected to the lower surface of the heat-conducting plate by fasteners, such as screws, or by welding. In some embodiments, the housing 42, the heat-conducting plate, and the two fins 41 are integrally formed from a substrate using a machining process. Inductor 9 is disposed within accommodating cavity 42. Inductor 9 may include one or more inductors. The number of inductors can be set as needed and is not limited here.

[0049] In one embodiment of this utility model, a power inductor lead fixing device is provided. For details, please refer to [link / reference needed]. Figures 1-7 The power inductor lead fixing device includes a cable tie plate 1, which is used to mount on the surface of the heat sink 4. Specifically, the cable tie plate 1 is mounted on the upper surface of the heat-conducting plate of the heat sink 4. The lower surface of the cable tie plate 1 faces the upper surface of the heat-conducting plate. The cable tie plate 1 is made of insulating material.

[0050] The cable tray 1 is provided with a lead groove 10 for leading out inductor leads 24, and the lead groove 10 is located above the opening of the receiving cavity 42. The lead groove 10 can be a through groove that extends through the upper and lower surfaces. Specifically, each inductor has at least two inductor leads 24, which extend from the lead groove 10 to the upper surface of the cable tray 1. The lead groove 10 can be an elongated through groove, and the length of the lead groove 10 can be approximately equal to the length of the receiving cavity 42, wherein the length of the lead groove 10 refers to the distance between the two ends of the lead groove 10 along the long side of the cable tray 1. In this embodiment, the length of the lead groove 10 is determined by the number of inductors or the length of the inductor leads on the upper surface of the cable tray 1, and there is no limitation on the specific length of the lead groove 10.

[0051] like Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 6 As shown, the upper surface of the cable management plate 4 is provided with a plurality of wire-clamping slots 3 for fixing the inductor leads 24. Specifically, after the inductor leads 24 are led out from the lead slot 10, they are clamped in the wire-clamping slots 3, which serves to fix the inductor leads and make the inductor leads neat and aesthetically pleasing on the cable management plate.

[0052] The upper surface of the cable tray 1 is provided with multiple limiting grooves 6 for inserting the terminal blocks 21 of the lead terminals 2 connected to the inductor leads 24; the upper surface of the cable tray 1 is provided with multiple fasteners 7 for engaging with the terminal through holes 22 of the lead terminals 2. Specifically, the lead terminal 2 includes interconnected terminal blocks 21, connecting pieces, and crimping parts 23. The end of the inductor lead 11 is connected, for example, by crimping. At one end of the crimping part 23, the inductor lead 24 is fixed to the lead terminal 2. The other end of the crimping part 23 is connected to one end of the connecting piece, and the other end of the connecting piece is connected to the terminal block 21. The connecting piece has terminal through holes 22. The terminal block 21, connecting piece, and crimping part 23 can be integrally formed, or the terminal block 21, connecting piece, and crimping part can be welded together sequentially by a welding process. The terminal block 21 is provided with a groove, which extends inward from the upper surface of the terminal block 21. The inner wall of the groove is provided with internal threads to facilitate subsequent engagement with screws. The upper surface of the cable tray 1 is provided with multiple fasteners 7, such as inverted fasteners. Each terminal block 21 is placed into the limiting groove 6, allowing the inverted fastener to pass through the terminal through hole 22, so that the upper end of the inverted fastener is fastened to the side wall of the terminal through hole 22, which effectively limits the lead terminal and prevents the lead terminal from popping out of the inverted fastener.

[0053] Furthermore, the cable tray 1 can be L-shaped. The shape of the cable tray can be determined according to the specific situation. The shape of the cable tray 1 can be determined by the position of the limiting groove 10 provided on the upper surface of the cable tray 1. The limiting groove 10 can be determined according to the position of the inductor connection terminals in the boost structure and inverter structure on both sides of the long side of the cable tray 1. There is no specific limitation on the shape of the cable tray here.

[0054] Continue to refer to Figure 1 The limiting groove 6 includes a first retaining wall 61, a connecting retaining wall 62, and a second retaining wall 63. One end of the first retaining wall 61 is connected to one end of the connecting retaining wall 62, and the other end of the connecting retaining wall 62 is connected to one end of the second retaining wall 63, forming a U-shaped structure. The first retaining wall 61, the connecting retaining wall 62, and the second retaining wall 63 are integrally formed. The shape of the inner surface of the connecting retaining wall 62 matches the shape of the outer surface of the terminal block 21, that is, the outer surface of the terminal block 21 is in partial contact with the inner surface of the connecting retaining wall 62. In this embodiment, the inner surface of the connecting retaining wall can be arc-shaped, and the outer surface of the terminal block 21 is also arc-shaped, so that the connecting retaining wall and the terminal block match. In other embodiments, the outer surface of the terminal block 21 is a hexagonal structure, and the inner surface of the connecting retaining wall can be a rectangle. The shape of the inner surface of the connecting retaining wall can be determined by the shape of the outer surface of the terminal block 21, and there is no limitation on the shape of the inner surface of the connecting retaining wall.

[0055] In this embodiment, the length of the first barrier 61 is greater than the length of the second barrier 63, wherein the length of the first barrier 61 is the distance between its two ends, and the length of the second barrier 63 is the distance between its two ends. The first barrier 61 can prevent the inductor leads 24 on both sides from contacting each other, and can effectively reduce electromagnetic interference between the inductor leads 24.

[0056] like Figure 5 , Figure 7 , Figure 9 , Figure 10 and Figure 11As shown, the power inductor lead fixing device also includes an insulating film 5, which is disposed above the cable tray 1. The insulating film 5 has multiple first through holes 51 through which screws 17 pass to connect the printed circuit board 18 to the terminal block 21. Each of the multiple first through holes 51 corresponds one-to-one with a terminal block 21. Specifically, when the insulating film 5 is disposed above the cable tray 1, the first through holes 51 are located directly above the terminal block 21, and the printed circuit board 18 is disposed above the insulating film 5. The connection between the printed circuit board 18 and the lead terminal 2 of the inductor lead 24 is achieved through the engagement of the external thread of the screw 17 and the internal thread of the groove in the terminal block 21. The insulating film 5 prevents the pins of the printed circuit board 18 from damaging the inductor lead 24 on the cable tray 1 and also increases the insulation effect.

[0057] like Figure 1 , Figure 3 , Figure 6 and Figure 7 As shown, the upper surface of the cable tray 1 is provided with a plurality of insulating film mounting posts 12; the insulating film 5 is also provided with a plurality of second through holes 52 through which a snap-fit ​​structure 16 passes to fix the insulating film 5 to the insulating film mounting posts 12. The plurality of second through holes 52 correspond one-to-one with the plurality of insulating film mounting posts 12.

[0058] Furthermore, the insulating film mounting post 12 is provided with a groove, and the snap-fit ​​structure 16, such as a protruding nail or a snap fastener, passes through the corresponding second through hole 52 and is snapped into the groove of the corresponding insulating film mounting post 12, so that the insulating film 5 is fixed on the cable tray 1. The groove on the insulating film mounting post 12 extends inward from the upper surface of the insulating film mounting post 12.

[0059] The diameter of the second through hole 52 is smaller than the diameter of the upper surface of the insulating film mounting post 12. The diameter of the second through hole 52 can be equal to the diameter of the groove of the insulating film mounting post 12, so that the insulating film 5 is located on the upper surface of the insulating film mounting post 12.

[0060] The upper surface of the cable tray 1 is provided with a plurality of partition walls 8 for separating two adjacent inductor leads, so as to prevent two adjacent inductor leads 24 from contacting each other.

[0061] like Figure 1 and Figure 6 As shown, the cable management plate 4 has multiple positioning holes 11, which are fitted onto corresponding positioning posts 15, wherein the positioning posts 15 are disposed on the surface of the heat sink 4. When the cable management plate 1 is installed onto the heat sink 4, it can be quickly placed on the heat sink for positioning, and then connected, making assembly convenient.

[0062] Furthermore, the cable tray 1 is provided with a clearance hole 13 to avoid components connected to the heat sink.

[0063] In one embodiment of this utility model, a power supply is provided, specifically as shown in the figure. Figure 8-11 As shown, the power supply includes a printed circuit board 18, a heat sink 4, an inductor 9, and the aforementioned power inductor lead fixing device. The heat sink 4 includes a receiving cavity 42, two fins 41, and a heat-conducting plate. The receiving cavity 42 extends inward from the upper surface of the heat-conducting plate, and the two fins 41 are fixedly connected to the lower surface of the heat-conducting plate, wherein the receiving cavity 42 is located between the two fins 41.

[0064] The inductor 9 is placed inside the accommodating cavity 42.

[0065] The aforementioned power inductor lead fixing device is disposed between the surfaces of the printed circuit board 18 and the heat sink 4. The description of the power inductor lead fixing device has been described above and will not be repeated here.

[0066] Furthermore, the cable tray 1 is fixed to the surface of the heat sink 4.

[0067] Furthermore, the printed circuit board 18 is connected to the terminal block 21 by a screw 17. The terminal block 21 has a groove with an internal thread, and the external thread of the screw 17 engages with the internal thread of the groove in the terminal block 21. After the external thread of the screw 17 and the internal thread of the terminal block 21 engage, the printed circuit board 18 is connected to the lead terminal 2 of the inductor lead 24.

[0068] In this embodiment, the inductor leads are neatly arranged between the printed circuit board and the heatsink using a fixing device, resulting in a cleaner and more aesthetically pleasing internal structure of the power supply while ensuring its safety. The inductor leads do not cause electromagnetic interference to components on the printed circuit board and also improve the power supply's EMC test pass rate. Furthermore, placing the inductor in the center of the power supply enclosure reduces the length of the inductor leads, lowers costs, and optimizes the overall power supply structure.

[0069] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A power inductor lead fixing device, characterized in that, The power supply includes an inductor (9) and a heat sink (4). The inductor (9) is disposed in a cavity (42) of the heat sink (4), which is located between two fins (41) of the heat sink (4). The power inductor lead fixing device includes: A cable tray (1) is provided on the surface of the heat sink (4); the cable tray (1) is provided with a lead groove (10) for leading out the inductor lead (24), the lead groove (10) is located above the opening of the receiving cavity (42); the upper surface of the cable tray (1) is provided with a plurality of wire clamping grooves (3) for fixing the inductor lead (24); the upper surface of the cable tray (1) is provided with a plurality of limiting grooves (6) for placing the terminal block (21) of the lead terminal (2) connected to the inductor lead (24) into place; the upper surface of the cable tray (1) is provided with a plurality of fasteners (7) for cooperating with the terminal through hole (22) of the lead terminal (2).

2. The power inductor lead fixing device according to claim 1, characterized in that, The limiting groove (6) includes a first retaining wall (61), a connecting retaining wall (62) and a second retaining wall (63). One end of the first retaining wall (61) is connected to one end of the connecting retaining wall (62), and the other end of the connecting retaining wall (62) is connected to one end of the second retaining wall (63).

3. The power inductor lead fixing device according to claim 1, characterized in that, The power inductor lead fixing device also includes an insulating film (5) for being disposed above the cable tray (1); the insulating film (5) has a plurality of first through holes (51) through which screws (17) pass to connect the printed circuit board (18) to the terminal block (21).

4. The power inductor lead fixing device according to claim 3, characterized in that, The upper surface of the wire harness plate (1) is provided with a plurality of insulating film mounting posts (12). The insulating film (5) is also provided with a plurality of second through holes (52) through which a snap fastener (16) passes to fix the insulating film (5) to the insulating film mounting post (12).

5. The power inductor lead fixing device according to claim 4, characterized in that, The diameter of the second through hole (52) is smaller than the diameter of the upper surface of the insulating film mounting post (12).

6. The power inductor lead fixing device according to claim 4, characterized in that, The insulating film mounting post (12) is provided with a groove, and the snap-fit ​​structure (16) passes through the corresponding second through hole (52) and snaps into the groove of the corresponding insulating film mounting post (12), so that the insulating film (5) is fixed on the cable tray (1).

7. The power inductor lead fixing device according to claim 1, characterized in that, The upper surface of the cable tray (1) is provided with a plurality of partition walls (8) for separating two adjacent inductor leads.

8. The power inductor lead fixing device according to claim 1, characterized in that, The cable tray (1) has multiple positioning holes (11) which are fitted onto corresponding positioning posts (15), wherein the positioning posts (15) are disposed on the surface of the radiator (4).

9. A power supply, characterized in that, include: Printed circuit board (18); The radiator (4) includes a cavity (42) and two fins (41), wherein the cavity (42) is located between the two fins (41); Inductor (9), said inductor (9) being placed within said accommodating cavity (42); and The power inductor lead fixing device as described in any one of claims 1-8 is disposed between the surfaces of the printed circuit board (18) and the heat sink (4).

10. The power supply according to claim 9, characterized in that, The cable tray (1) is fixed to the surface of the radiator (4).

11. The power supply according to claim 9, characterized in that, The printed circuit board (18) is connected to the terminal block (21) by a screw (17). The terminal block (21) has a groove with an internal thread, and the external thread of the screw (17) engages with the internal thread of the terminal block (21).

Images