Transmission cable

Abstract

The transmission cable provided by the utility model comprises a cable group and a first connector arranged at a first end of the cable group. The first connector includes a first connector circuit board having a wire set connection pad set, and an active chip disposed on the first connector circuit board. Wherein the first power supply port of the active chip is electrically connected to the VCONN connecting pads of the wire group connecting pad group. The wire group includes a first signal transmission unit. The first signal transmission unit is provided with a first signal transmission line and a first drain wire. The first signal transmission line is electrically connected to the first signal transmission pad of the line group connection pad group. The first drain wire is electrically connected to the VCONN connection pad.

Description

Technical Field

[0001] This application relates to a transmission cable, and more particularly to a transmission cable optimized for voltage drop at both ends of the transmission cable. Background Technology

[0002] With advancements in technology, the functional differences between various transmission cables are significant. Even cables using the same connector can exhibit vastly different functionalities due to configuration or chip selection. Take USB Type-C cables as an example: they can be configured to provide different power outputs (e.g., 3-5 amps or 5-20 volts), support video transmission, or offer different transmission speeds. Because a single USB Type-C cable may have varying capability configurations, an active chip (E-marker) is required to record various capability attributes of the transmission cable, such as power delivery capabilities, data transfer capabilities, video transmission capabilities, and identifiers.

[0003] The power supply for the active chip in the transmission cable may come from a device at one end of the cable. For example, please refer to... Figure 1 , Figure 1 The connection configuration of the active chip P11 for the conventional transmission cable P1 is described. The conventional transmission cable P1 may include a first connector P10, a second connector P30 at both ends, and a cable assembly P20 connecting the first connector P10 and the second connector P30. The active chip P11 of the conventional transmission cable P1 can be configured in one or both connectors P10 and P20, and is powered through connectors P10 and P20. Specifically, the active chip P11 may have two power supply ports, VCONN1 and VCONN2, which are connected to the VCONN terminals of the first connector P10 and the second connector P20, respectively. When the conventional transmission cable is connected to the first device P2 and the second device P3, the first device P2 and the second device P3 can determine the data flow (e.g., downlink (DFP), uplink (UFP), or dual-purpose data (DRD)) or power supply mode through the configuration control (CC) port of the active chip P11. Then, the protocol powers the active chip through either the first or second device.

[0004] In practical applications, the cable assemblies are easily constrained by the physical limitations of the cable itself. The electrical impedance of the cable assemblies can lead to energy loss, and voltage drops can occur at both ends of the cable (e.g., between the VBUS or VCONN terminals of a power bus), causing signal level shifts or inaccuracies, resulting in malfunctions or abnormal operation. For example, if the power supply to the active chip becomes unstable due to excessive voltage drop, the active chip will fail and cannot achieve its intended function. These problems become even more pronounced during long-distance transmission.

[0005] Traditionally, increasing the wire diameter within the cable assembly can overcome voltage drop or signal loss caused by electrical impedance. However, this adjustment may increase the rigidity of the transmission cable, leading to problems such as difficulty in bending, making cable installation challenging for users / installers. It should be noted that voltage drop is not limited to long-distance transmission. For short-distance applications, using smaller cross-sectional area wires can achieve advantages such as reduced cost and increased flexibility.

[0006] Therefore, how to reduce signal and / or energy attenuation caused by the impedance of transmission cables without increasing the wire diameter of the transmission cables, or with the desire to reduce the wire diameter of transmission cables, will be a major issue in the field of transmission cable research and development. Utility Model Content

[0007] One of the purposes of this application is to reduce the voltage drop at both ends of the transmission line in order to avoid failure of the active chip or loss of function of the transmission cable due to the voltage drop.

[0008] This application provides a transmission cable. The transmission cable includes a wire assembly and a first connector disposed at a first end of the wire assembly. The first connector includes a first connector circuit board having a wire assembly connection pad assembly and an active chip disposed on the first connector circuit board. A first power supply port of the active chip is electrically connected to a VCONN connection pad of the wire assembly connection pad assembly. The wire assembly includes a first signal transmission unit. The first signal transmission unit has a first signal transmission line and a first drain line. The first signal transmission line is electrically connected to a first signal transmission pad of the wire assembly connection pad assembly. The first drain line is electrically connected to a VCONN connection pad.

[0009] In one embodiment, the wire assembly further includes a shielding layer that at least partially covers the signal transmission unit and is electrically connected to the grounding pad of the wire assembly connection pad assembly.

[0010] In one embodiment, the first drain line is disposed on the auxiliary VCONN connecting pad of the online connecting pad assembly and is electrically connected to the VCONN connecting pad via the conductor lines of the first connector circuit board.

[0011] In one embodiment, the auxiliary VCONN connection pad is disposed adjacent to the first signal transmission pad.

[0012] In one embodiment, an auxiliary VCONN connector pad is disposed at a corner of the first connector circuit board.

[0013] In one embodiment, the line group further includes a VCONN transmission line disposed on the VCONN connection pad and electrically connected to a first power supply port of the active chip.

[0014] In one embodiment, the wire assembly further includes a power transmission unit electrically connected to a power transmission pad of the wire assembly connection pad assembly.

[0015] In one embodiment, the line assembly further includes a second signal transmission unit. The second signal transmission unit has a second signal transmission pad and a second signal transmission line electrically connected to the line assembly connecting pad assembly, and a second drain line electrically connected to the power transmission pad of the line assembly connecting pad assembly.

[0016] In one embodiment, the configuration port of the active chip is electrically connected to the configuration connection pad of the line group connection pad group; and the line group also includes configuration transmission lines disposed on the configuration connection pad.

[0017] In one embodiment, the first connector further includes a plug end. The plug end has a VCONN terminal electrically coupled to a second power supply port of the active chip.

[0018] This application provides a transmission cable. The transmission cable includes a wire assembly and a first connector disposed at a first end of the wire assembly. The first connector includes a first connector circuit board having a wire assembly connection pad assembly and an active chip disposed on the first connector circuit board. The first power supply port of the active chip is electrically connected to a VCONN connection pad in the wire assembly connection pad assembly. The wire assembly includes a first drain line electrically connected to the VCONN connection pad and a second drain line electrically connected to a power transmission pad in the wire assembly connection pad assembly.

[0019] In one embodiment, a first drain line is disposed on an auxiliary VCONN connecting pad of the online connection pad assembly and is electrically connected to the VCONN connecting pad via a first conductor line of the first connector circuit board. A second drain line is disposed on an auxiliary power transmission pad of the online connection pad assembly and is electrically connected to the power transmission pad via a second conductor line of the first connector circuit board.

[0020] In one embodiment, an auxiliary VCONN connection pad is disposed at a first corner of the first connector circuit board, and an auxiliary power transmission pad is disposed at a second corner of the first connector circuit board.

[0021] In one embodiment, the line group further includes a VCONN transmission line disposed on the VCONN connection pad and electrically connected to a first power supply port of the active chip.

[0022] In one embodiment, the configuration port of the active chip is electrically connected to the configuration connection pad of the line group connection pad group. The line group also includes configuration transmission lines disposed on the configuration connection pads.

[0023] In one embodiment, the first connector further includes a plug end. The plug end has a VCONN terminal electrically coupled to a second power supply port of the active chip.

[0024] This application provides a transmission cable. The transmission cable includes a wire assembly and a USB Type-C connector disposed at a first end of the wire assembly. The USB Type-C connector includes a connector circuit board having a wire assembly connection pad assembly. The wire assembly includes a first signal transmission unit. The first signal transmission unit has a first signal transmission line electrically connected to a first signal transmission pad of the wire assembly connection pad assembly, and a first drain line electrically connected to a power transmission pad of the wire assembly connection pad assembly.

[0025] In one embodiment, the wire assembly further includes a power transmission unit electrically connected to a power transmission pad of the wire assembly connection pad assembly.

[0026] In one embodiment, the first drain line is disposed on the auxiliary power transmission pad of the online connection pad assembly and is electrically connected to the power transmission pad via the conductor lines of the connector circuit board.

[0027] In one embodiment, an auxiliary power transmission pad is disposed at a corner of the connector circuit board.

[0028] As described above, drain lines can serve as auxiliary power transmission lines for transmitting VCONN voltage in DC applications. Furthermore, because the function of drain lines in eliminating and / or diverting interference signals is applied in high-frequency applications, they can still achieve the desired effect in high-frequency applications. This reduces the voltage drop across the transmission line, thereby preventing active chip failure or loss of transmission cable functionality due to voltage drop. Attached Figure Description

[0029] The accompanying drawings are provided to help describe various aspects of this application. To simplify the drawings and highlight their intended meaning, well-known structures or components may be depicted in a simplified schematic manner or omitted. For example, the number of components may be singular or plural. These drawings are provided merely to illustrate these aspects and not to limit them.

[0030] Figure 1 A circuit diagram for configuring traditional transmission cables and active chips.

[0031] Figure 2 This is a schematic diagram of a transmission cable in one embodiment of this application.

[0032] Figure 3 This is a schematic diagram of the circuit board of the active chip and the connector circuit board in one embodiment of this application.

[0033] Figure 4 This is a cross-sectional schematic diagram of a line group in one embodiment of this application.

[0034] Figure 5 This is a schematic diagram of the circuit board of the active chip and the connector circuit board in one embodiment of this application.

[0035] Figure 6 This is a schematic diagram of the circuit board of the active chip and the connector circuit board in one embodiment of this application.

[0036] Figure 7A and Figure 7B This is a schematic diagram of the connector circuit board configuration in one embodiment of this application.

[0037] Figure 8 This is a schematic diagram of a transmission cable in one embodiment of this application.

[0038] Figure 9 This is a schematic diagram of the connector circuit board configuration in one embodiment of this application.

[0039] Figure label:

[0040] P1: Traditional transmission cable;

[0041] P2: First device;

[0042] P3: Second device;

[0043] P10: First connector;

[0044] P11: Active chip;

[0045] P20: Line set;

[0046] P30: Second connector;

[0047] 10: Transmission cables;

[0048] 100: First connector;

[0049] 110: First connector circuit board;

[0050] 111: Line assembly connection pads;

[0051] 111-1: VCONN Connector Pad

[0052] 111-2: First signal transmission pad;

[0053] 111-3: Auxiliary VCONN connector pad;

[0054] 111-4: Power transmission pad;

[0055] 111-5: Configure the connection pad;

[0056] 111-6: Second signal transmission pad;

[0057] 111-7: Auxiliary power transmission pad;

[0058] 112: Chip connection pad assembly;

[0059] 112-1: First power supply pad;

[0060] 120: Active chip;

[0061] 130: Plug end;

[0062] 200: Line group;

[0063] 201: First end;

[0064] 202: Second end;

[0065] 210: First signal transmission unit;

[0066] 211+, 211-: First signal transmission line;

[0067] 212: First row of streamlines;

[0068] 213: Insulation layer;

[0069] 220: Second signal transmission unit;

[0070] 221: Second signal transmission line;

[0071] 222: Second row of streamlines;

[0072] 230: VCONN transmission line;

[0073] 240: Shielding layer;

[0074] 250: Insulation coating layer;

[0075] 260: Power transmission unit;

[0076] 270: Configure the transmission line;

[0077] 300: Second connector. Detailed Implementation

[0078] Any references to components named such as "first," "second," etc., used herein do not generally limit the number or order of these components. Rather, these names are used herein as a convenient way to distinguish two or more components or instances of components. Therefore, it should be understood that the names "first," "second," etc., in a request do not necessarily correspond to the same names in the written description. Furthermore, it should be understood that references to the first and second components do not imply that only two components can be used or that the first component must precede the second component. The terms "comprising," "including," "having," "containing," etc., as used herein are open-ended, meaning they include but are not limited to.

[0079] The term "coupled" is used in this document to refer to a direct or indirect electrical coupling between two structures. For example, in one example of indirect electrical coupling, one structure may be coupled to another structure via a passive component such as a resistor, capacitor, or inductor.

[0080] In this application, the terms "exemplary" and "for example" are used to mean "serving as an example, instance, or illustration." Any implementation or aspect described herein as "exemplary" or "for example" is not necessarily to be construed as preferred or advantageous over other aspects of this application. As used herein with respect to specified values ​​or characteristics, the terms "about" and "approximately" are intended to mean within a certain value (e.g., 10%) of the specified value or characteristic.

[0081] A transmission cable is provided in a specific embodiment of this application. Please refer to... Figure 2 The transmission cable 10 includes a cable assembly 200 and a first connector 100 disposed at a first end 201 of the cable assembly 200. The first connector 100 includes a first connector circuit board 110 having a cable assembly connection pad assembly 111 and an active chip 120 disposed on the first connector circuit board 110. The first power supply port VCONN1 of the active chip 120 is electrically connected to the VCONN connection pad 111-1 of the cable assembly connection pad assembly 111. The cable assembly 200 includes a first signal transmission unit 210. The first signal transmission unit 210 has a first signal transmission line 211 and a first drain line 212. The first signal transmission line 211 is electrically connected to the first signal transmission pad 111-2 of the cable assembly connection pad assembly 111. The first drain line 212 is electrically connected to the VCONN connection pad 111-1.

[0082] The transmission cable 10 can connect two devices for data transmission, charging (e.g., based on the USB PD protocol), and / or audio / video transmission. The transmission cable 10 consists of a cable assembly 200, a first connector 100 disposed at a first end 201 of the cable assembly 200, and a second connector 300 disposed at a second end 202 of the cable assembly 200. The cable assembly 200 can be mounted on a first connector circuit board 110 of the first connector 100 by means of soldering or other methods, but is not limited thereto.

[0083] The first connector 100 also includes a plug end 130, which can be any conventional plug, such as HDMI, DisplayPort (DP), USB (Type-C), etc., and has a corresponding outer housing. The outer housing is preferably electrically connected to a ground point, but is not limited thereto. The outer housing can serve as a protective mechanism to protect the terminals inside the plug end 130, or as a foolproof mechanism when the plug end 130 is inserted into a corresponding socket. For example, the configuration of the outer housing can be formed to correspond to the configuration of the socket to avoid problems such as inserting into the wrong socket or incorrect orientation during installation, but is not limited thereto. The various electrical terminals of the plug end 130 can be electrically connected to the first connector circuit board 110 through conventional connection methods.

[0084] Taking the first connector circuit board 110 as an example, the first connector circuit board 110 can be a printed circuit board (PCB) or any suitable circuit carrier. The first connector circuit board 110 has a wire connection pad assembly 111 and a chip connection pad assembly 112. Figure 2 (Underneath the active chip 120). The wire assembly connection pad 111 and the chip connection pad 112 are conductive sheets disposed on the surface of the first connector circuit board 110. The conductive sheets for connection can be formed on the conductive substrate by conventional processes such as engraving, photolithography, or etching. Various wires in the wire assembly 200 can be disposed on the wire assembly connection pad 111 by means of soldering or the like, and the active chip 120 can also be disposed on the chip connection pad 112 by means of surface soldering or pin soldering.

[0085] Please refer to Figure 3 The line connection pad assembly 111 includes a VCONN connection pad 111-1 and a first signal transmission pad 111-2. The chip connection pad assembly 112 includes a first power supply pad 112-1 that provides a first power supply port VCONN1 to the active chip 120. The VCONN connection pad 111-1 and the first power supply pad 112-1 are electrically connected to each other via a conductor path (path1) pre-set in the first connector circuit board 110. When the VCONN connection pad 111-1 receives chip power (VC) from the second connector 300 via the VCONN transmission line 230, it can provide it to the active chip 120 through the conductor path (path1).

[0086] The active chip 120 may be, for example, an electronic tag chip (E-Marker) for electronic identification tags or a relay chip (redriver) for signal relay processing, but is not limited to these. The active chip 120 may be disposed at one or both ends of the transmission cable 10. In other words, the active chip 120 may be disposed only on the first connector 100 or the same or different active chips 120 may be disposed on the second connector 300.

[0087] When the active chip 120 needs to operate and requires power, it can obtain the necessary chip power (VC) via the plug end 130 of the first connector 100 or the second connector 300. Specifically, the first power supply port VCONN1 of the active chip 120 is electrically connected to the VCONN connector pad 111-1 and receives chip power (VC) from the second connector 300. Alternatively, the active chip 120 can also be connected to the plug end 130 of the first connector 100 and receive chip power (VC) from the plug end 130 of the first connector 100.

[0088] The wire assembly 200 can be formed by covering various types of core wires (single-core wire, coaxial cable, twisted pair, multi-twisted wire) with an insulation layer. It should be noted that the number and type of core wires in the wire assembly 200 are not limited. Preferably, the core wires of the wire assembly 200 can be selected according to the specifications of the first connector 100 and / or the second connector 300, but are not limited thereto. It should also be noted that, as will be known to those skilled in the art, the wire assembly 200 may also contain other wires or layers, as illustrated below.

[0089] The first signal transmission unit 210 of the wire assembly 200 has a first signal transmission line 211 and a first drain line 212. The first signal transmission line 211 is used to transmit signals and is electrically connected to the first signal transmission pad 111-2 of the wire assembly connection pad group 111. For example, when the first signal transmission unit 210 is configured to transmit differential signals, the first signal transmission line 211 can be one strand of a twisted pair (211+ / 211-) for transmitting differential signals. The first drain line 212 is a bare conductor wire (i.e., without insulation) and is preferably wound around the first signal transmission line 211 and covered by an insulation layer 213. The exemplary function of the first drain line 212 is to exclude and / or divert interference signals from the first signal transmission unit 210. Interference signals from the first signal transmission unit 210 can be noise generated by the interaction of the first signal transmission line 211 with other wires (e.g., crosstalk noise) or noise coupled into the first signal transmission line 211 from outside the first signal transmission unit 210. The first drain line 212 is electrically connected to the VCONN connection pad 111-1 so that in DC applications, the first drain line 212 can be used to transmit the chip power supply (VC) (e.g., DC 5V / 3.3V) required to the active chip 120. This reduces the required wire diameter of the VCONN transmission line 230 transmitting the chip power supply (VC) in the line group 200, thereby reducing the voltage drop across the transmission cable 10 to the chip power supply (VC). In other words, compared to conventional configurations, with the same length requirement, the configuration of this application can reduce the required wire diameter of the VCONN transmission line 230 transmitting the chip power supply (VC) in the line group 200, or achieve a smaller voltage drop when using the same wire diameter VCONN transmission line 230. On the other hand, in high-frequency applications (e.g., signals above 1 GHz), the first drain line 212 can still perform its original function, such as eliminating interference signals from the first signal transmission unit 210 from the VCONN connection pad 111-1.

[0090] Cable set 200 may also include other cable types. Please refer to [reference needed]. Figure 4 , Figure 4 This is an example cross-sectional structure of the wire assembly 200. In one embodiment, the wire assembly 200 may further include a shielding layer 240 that at least partially covers the first signal transmission unit 210. For example, the shielding layer 240 is a conductor such as aluminum foil or copper mesh, disposed on the outermost layer of the wire assembly 200. When the cross-section of the wire assembly 200 is annular, the outermost layer may be an insulating covering layer 250 followed by the shielding layer 240. The cross-section of the shielding layer 240 may be annular to form a cavity (A), in which the first signal transmission unit 210 and other wires in the wire assembly 200 are disposed. It should be noted that... Figure 4The chamber (A) shown is for illustrative purposes only. The size of chamber (A) may be only slightly larger than the cross-sectional area of ​​the first signal transmission unit 210 because the shielding layer 240 and the insulating covering layer 250 tightly cover the first signal transmission unit 210 or other wires. On the other hand, the shielding layer 240 is electrically connected to the ground terminal through the first connector circuit board 110. The shielding layer 240 can also be electrically connected to the ground terminal through the outer housing or other electrically grounded parts. The electrical connection of the shielding layer 240 to the ground terminal enables the shielding layer 240 to shield the external noise of the wire assembly 200 to avoid interference with the internal signal transmission of the wire assembly 200. Compared to the traditional configuration of electrically connecting the drain line to the grounding terminal, the grounding terminals at both ends of the transmission cable 10 can be effectively electrically connected through the shielding layer 240. Since the impedance of the shielding layer 240 itself is much smaller than that of other wires in the cable group 200, the drain line can be electrically connected to the VCONN connection pad 111-1 to transmit the chip power supply (VC) required by the active chip 120 without affecting the grounding at both ends of the transmission cable 10 (or with very little impact).

[0091] In one embodiment, please refer to Figure 5 The cable assembly 200 also includes a power delivery unit 260, which is electrically connected to a power supply terminal (VBUS) via power delivery pads 111-4 of the cable assembly connection pads 111 of the first connector circuit board 110. The power delivery unit 260 is, for example, a power-transmitting wire (e.g., a copper wire) in the cable assembly 200. The power delivery unit 260 is electrically coupled to the power supply terminal (VBUS) through the power delivery pads 111-4, so that the power delivery unit 260 can act as the primary carrier for power transmission. The power supply terminal (VBUS) originates, for example, from the device on which the first connector 100 is located. In one application example, the power delivery unit 260 can perform power transmission after the transmission cable 10 completes the PD protocol.

[0092] In one embodiment, the line group 200 further includes a configuration transmission line 270 disposed on configuration connection pads 111-5. The configuration port (CC) of the active chip 120 is electrically connected to the configuration connection pads 111-5 of the line group connection pads 111. Specifically, the device connected to the transmission cable 10 can send a request message to the active chip 120 through the configuration transmission line 270. Upon receiving the request message through the configuration port (CC), the active chip 120 in the transmission cable 10 can provide relevant information about the active chip 120 or the transmission cable 10 to facilitate subsequent transmission.

[0093] In one embodiment, the active chip 120 also has a second power supply port (VCONN2). Please refer to... Figure 6The second power supply port (VCONN2) is electrically connected to the VCONN terminal of the plug end 130. In this embodiment, the first power supply port VCONN1 of the active chip 120 is configured to receive chip power (VC) from the connected device at the second connector 300 end. The second power supply port (VCONN2) of the active chip 120 is configured to receive chip power (VC) from the connected device at the first connector 100 end. When the active chip 120 determines the source device of the chip power (VC) through a protocol (e.g., PD protocol), it can select either the first power supply port VCONN1 or the second power supply port (VCONN2) as the power supply for the active chip 120.

[0094] In the embodiment where the first connector circuit board 110 is connected to the wire group 200, please refer to Figure 7A and 7B The first drain line 212 is disposed on the auxiliary VCONN connecting pad 111-3 of the online connecting pad group 111, and is electrically connected to the VCONN connecting pad 111-1 via the conductor line (path 1) of the first connector circuit board 110. Figure 7A In the illustrated embodiment, the auxiliary VCONN connector pad 111-3 is disposed adjacent to the first signal transmission pad 111-2. Figure 7B In the illustrated embodiment, the auxiliary VCONN connector pad 111-3 is disposed at a corner (C1) of the first connector circuit board 110. The auxiliary VCONN connector pad 111-3 can reduce interference in the electrical connection between the first drain line 212 and the VCONN connector pad 111-1, and the auxiliary VCONN connector pad 111-3 and the VCONN connector pad 111-1 can be arranged close to or far apart according to different circuit requirements.

[0095] In one embodiment, the remaining drain lines in the line group 200 can be selectively electrically connected to a ground terminal, a power supply terminal (VBUS), or a VCONN terminal. For example, please refer to... Figure 8The transmission cable 10 includes a cable assembly 200 and a first connector 100 disposed at a first end 201 of the cable assembly 200. The first connector 100 includes a first connector circuit board 110 having a cable assembly connection pad assembly 111 and an active chip 120 disposed on the first connector circuit board 110. The first power supply port VCONN1 of the active chip 120 is electrically connected to the VCONN connection pad 111-1 of the cable assembly connection pad assembly 111. The cable assembly 200 includes a first drain line 212 electrically connected to the VCONN connection pad 111-1 and a second drain line 222 electrically connected to the power transmission pads 111-4 in the cable assembly connection pad assembly 111. Specifically, the cable assembly 200 also includes a second signal transmission unit 220. The second signal transmission unit 220 has a second signal transmission line 221 electrically connected to the second signal transmission pads 111-6 of the cable assembly connection pad assembly 111 and a second drain line 222 electrically connected to the power transmission pads 111-4 of the cable assembly connection pad assembly 111. By electrically connecting the second drain line 222 to the power supply terminal (VBUS), the required wire diameter of the power transmission unit 260 can be reduced simultaneously, thereby reducing the voltage drop across the power transmission unit 260.

[0096] In this embodiment, for an example of the first connector circuit board 110 being connected to the wire group 200, please refer to... Figure 9 .like Figure 9 As shown, the first drain line 212 is disposed on the auxiliary VCONN connecting pad 111-3 of the line group connecting pad group 111, and is electrically connected to the VCONN connecting pad 111-1 via the first conductor line of the first connector circuit board 110. The second drain line 222 is disposed on the auxiliary power transmission pad 111-7 of the line group connecting pad group 111, and is electrically connected to the power transmission pad 111-4 via the second conductor line of the first connector circuit board 110. The auxiliary VCONN connecting pad 111-3 is disposed at the first corner position (C1) of the first connector circuit board 110, and the auxiliary power transmission pad 111-7 is disposed at the second corner position (C2) of the first connector circuit board 110. This effectively distinguishes the auxiliary power transmission pad 111-7 used for power transmission from the auxiliary VCONN connecting pad 111-3 used for transmitting VCONN power, reducing soldering difficulties.

[0097] In one embodiment, this application provides a transmission cable. The transmission cable includes a wire assembly and a USB Type-C connector disposed at a first end of the wire assembly. The USB Type-C connector includes a connector circuit board having a wire assembly connection pad assembly. The wire assembly includes a first signal transmission unit. The first signal transmission unit has a first signal transmission line electrically connected to a first signal transmission pad of the wire assembly connection pad assembly, and a first drain line electrically connected to a power transmission pad of the wire assembly connection pad assembly. By using the first drain line as a power supply terminal (VBUS), the required wire diameter of the power transmission unit can be reduced simultaneously, thereby reducing the voltage drop across the power transmission unit.

[0098] As described above, the drain line can serve as an auxiliary power transmission line for transmitting VCONN voltage in DC applications. Furthermore, because the drain line's function of eliminating and / or diverting interference signals is applied in high-frequency applications, it can still achieve the desired effect in high-frequency applications. This reduces the voltage drop across the transmission line, thereby preventing the active chip 120 from malfunctioning or the transmission cable 10 from losing its function due to voltage drop.

[0099] The preceding description of this application is provided to enable those skilled in the art to make or implement this application. Various modifications to this application will be apparent to those skilled in the art, and the general principles defined herein can be applied to other variations without departing from the spirit or scope of this application. Therefore, this application is not intended to be limited to the examples described herein, but rather to be accorded the widest scope consistent with the principles and novel features of the application herein.

Claims

1. A transmission cable, characterized in that, Include: A first connector, comprising: A first connector circuit board having a wire group of connection pads; and An active chip is disposed on the first connector circuit board, wherein a first power supply port of the active chip is electrically connected to a VCONN connection pad of the wire connection pad assembly; and A wire assembly, wherein the first connector is disposed at a first end of the wire assembly, the wire assembly comprising: A first signal transmission unit, having: A first signal transmission line, electrically connected to a first signal transmission pad of the line group connection pad group; and A first drain line is electrically connected to the VCONN connection pad.

2. The transmission cable according to claim 1, characterized in that, The wire set also includes: A shielding layer that at least partially covers the first signal transmission unit and is electrically connected to a grounding pad of the wire connection pad group.

3. The transmission cable according to claim 1, characterized in that, The first drain line is disposed on an auxiliary VCONN connecting pad of the line group connecting pad group, and is electrically connected to the VCONN connecting pad via a conductor line of the first connector circuit board.

4. The transmission cable according to claim 3, characterized in that, The auxiliary VCONN connector pad is disposed adjacent to the first signal transmission pad.

5. The transmission cable according to claim 3, characterized in that, The auxiliary VCONN connector pad is located in one corner of the first connector circuit board.

6. The transmission cable according to claim 1, characterized in that, The wire set also includes: A VCONN transmission line is disposed on the VCONN connection pad and electrically connected to the first power supply port of the active chip.

7. The transmission cable according to claim 1, characterized in that, The wire set also includes: A power transmission unit is electrically connected to a power transmission pad of the line group connection pad group.

8. The transmission cable according to claim 1, characterized in that, The wire set also includes: A second signal transmission unit, having: A second signal transmission line, electrically connected to a second signal transmission pad of the line group connection pad group; and A second row of lines is electrically connected to a power transmission pad of the line group connection pad group.

9. The transmission cable according to claim 1, characterized in that, A configuration port of the active chip is electrically connected to a configuration connection pad of the line group connection pad group; and the line group further includes a configuration transmission line disposed on the configuration connection pad.

10. The transmission cable according to claim 1, characterized in that, The first connector further includes: One plug terminal has: A VCONN terminal is electrically coupled to a second power supply port of the active chip.

11. A transmission cable, characterized in that, Include: A first connector, comprising: A first connector circuit board having a wire group of connection pads; and An active chip is disposed on the first connector circuit board, wherein a first power supply port of the active chip is electrically connected to a VCONN connection pad of the wire connection pad assembly; and A wire assembly, wherein the first connector is disposed at a first end of the wire assembly, the wire assembly comprising: A first drain line is electrically connected to the VCONN connection pad; and A second drain line is electrically connected to a power transmission pad in the line group connection pad group.

12. The transmission cable according to claim 11, characterized in that, The first drain line is disposed on an auxiliary VCONN connecting pad of the wire group connecting pad assembly and is electrically connected to the VCONN connecting pad via a first conductor line of the first connector circuit board; and wherein the second drain line is disposed on an auxiliary power transmission pad of the wire group connecting pad assembly and is electrically connected to the power transmission pad via a second conductor line of the first connector circuit board.

13. The transmission cable according to claim 12, characterized in that, The auxiliary VCONN connector pad is disposed at a first corner of the first connector circuit board, and the auxiliary power transmission pad is disposed at a second corner of the first connector circuit board.

14. The transmission cable according to claim 11, characterized in that, The wire set also includes: A VCONN transmission line is disposed on the VCONN connection pad and electrically connected to the first power supply port of the active chip.

15. The transmission cable according to claim 11, characterized in that, A configuration port of the active chip is electrically connected to a configuration connection pad of the line group connection pad group; and the line group further includes a configuration transmission line disposed on the configuration connection pad.

16. The transmission cable according to claim 11, characterized in that, The first connector further includes: One plug terminal has: A VCONN terminal is electrically coupled to a second power supply port of the active chip.

17. A transmission cable, characterized in that, Include: A USB Type-C connector, comprising: A connector circuit board having a wire assembly of connection pads; and A cable assembly, wherein the USB Type-C connector is disposed at a first end of the cable assembly, the cable assembly comprising: A first signal transmission unit, having: A first signal transmission line, electrically connected to a first signal transmission pad of the line group connection pad group; and A first drain line is electrically connected to a power transmission pad of the line group connection pad group.

18. The transmission cable according to claim 17, characterized in that, The wire set also includes: A power transmission unit is electrically connected to the power transmission pad of the wire connection pad assembly.

19. The transmission cable according to claim 17, characterized in that, The drain line is disposed on an auxiliary power transmission pad of the line group connection pad group and is electrically connected to the power transmission pad via a conductor line of the connector circuit board.

20. The transmission cable according to claim 19, characterized in that, The auxiliary power transmission pad is located in one corner of the connector circuit board.

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