Structure for fixing optical fiber on TO laser heat sink

Abstract

The embodiment of the utility model provides a structure for fixing an optical fiber on a TO laser heat sink, and the structure comprises a TO laser, and an L-shaped optical fiber pedestal is disposed at the heat sink position of the TO laser in an attached manner. And the optical fiber is fixed on the L-shaped optical fiber base and is aligned with the chip of the TO laser through the L-shaped optical fiber base. An L-shaped optical fiber fixing base is additionally arranged at the front end of a TO diode laser heat sink, and the problem of precise fixing of optical fibers is effectively solved. The design structure is simple, the reliability is good, the manufacture is convenient, and the problem of coupling failure caused by external vibration or environment temperature change of optical fiber coupling is well solved.

Description

Technical Field

[0001] This utility model relates to the field of fiber-coupled laser packaging technology, and to a fiber fixing and laser coupling alignment structure, which has the characteristics of simplicity, flexibility and long-term reliability. In particular, it relates to a structure for fixing an optical fiber on a TO laser heat sink. Background Technology

[0002] Most commercially available TO diode lasers use a window lens for direct output and generally lack fiber optic coupling. However, in many applications, it is necessary to couple the laser output from the TO diode into a thin optical fiber, similar to the thickness of a human hair. After the laser travels a certain distance through the fiber, it can maintain good beam quality and power levels. The other end of the fiber output can achieve flexible applications, avoiding the problems of beam divergence, power loss degradation, and inflexible installation encountered in direct TO laser applications.

[0003] like Figure 2 As shown, in the prior art, the heat sink on a TO laser lacks a substrate for fixing the optical fiber, making it impossible to suspend the fiber in mid-air. Due to the small size of a TO laser, the output aperture of a single-mode semiconductor laser is only on the order of 1–2 μm, and the output laser has a relatively large divergence angle (20–30°). The core mode field diameter of the optical fiber is generally less than 10 μm. After alignment with the chip's output port, the optical fiber needs to be securely fixed. Because of the aforementioned structure, the optical fiber inside the TO laser can shift due to movement or external temperature changes, and a 1 μm shift can typically lead to a 20%–50% power change. Therefore, this application proposes a structure for fixing the optical fiber on the heat sink of a TO laser to at least partially solve the above problems. Utility Model Content

[0004] In view of the above problems, this utility model is proposed to provide a structure for fixing an optical fiber on a TO laser heat sink to overcome or at least partially solve the above problems.

[0005] This application provides a structure for fixing an optical fiber on a TO laser heat sink, involving an optical fiber fixing and laser coupling alignment structure. This solves the problem of difficulty in installing and fixing optical fibers on existing TO lasers, and features simplicity, flexibility, and long-term reliability. The structure includes:

[0006] The TO laser has an L-shaped fiber optic base attached to its heat sink position;

[0007] An optical fiber is fixed to the L-shaped optical fiber base and aligned with the chip of the TO laser through the L-shaped optical fiber base.

[0008] Optionally, the optical fiber is connected to the L-shaped optical fiber base by adhesive, and the core of the optical fiber is aligned with the chip.

[0009] Optionally, the thickness of the L-shaped fiber optic base is 10 times the thickness of the outer fiber.

[0010] Optionally, the L-shaped fiber optic base is bonded to the heat sink with adhesive or soldered.

[0011] Optionally, the L-shaped fiber optic base is made of ceramic, glass, or Kovar alloy.

[0012] Optionally, the TO laser further includes: a base and a plurality of electrodes penetrating the base;

[0013] A heat sink is attached to the base, and an electrode is electrically connected to the heat sink.

[0014] The heat sink is provided with a chip base, and the chip base is provided with a chip for exciting laser; the chip base and the chip are respectively electrically connected to the electrode through conductor lines.

[0015] Optionally, the conductor wire is a gold wire.

[0016] Optionally, the base has a groove on its side.

[0017] The present invention has the following advantages:

[0018] In this embodiment of the invention, an L-shaped fiber optic base is fitted to the heat sink of a TO laser. The optical fiber is fixed to the L-shaped fiber optic base and aligned with the chip of the TO laser via the L-shaped fiber optic base. Adding an L-shaped fiber optic fixing base at the front end of the heat sink of the TO diode laser effectively solves the problem of precise fiber fixation. This design is simple in structure, highly reliable, easy to manufacture, and effectively solves the problem of fiber coupling failure caused by external vibration or changes in ambient temperature. Attached Figure Description

[0019] To more clearly illustrate the technical solution of this utility model, the drawings used in the description of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of a structure for fixing an optical fiber on a TO laser heat sink according to an embodiment of the present invention;

[0021] Figure 2 This is a schematic diagram of the existing technology structure;

[0022] Figure 3 This is a top-view schematic diagram of a structure for fixing an optical fiber on a TO laser heat sink according to an embodiment of the present invention.

[0023] Figure 4 This is a disassembled schematic diagram of a structure for fixing an optical fiber on a TO laser heat sink according to an embodiment of the present invention.

[0024] Explanation of icon numbers:

[0025] 1. TO laser; 2. L-shaped fiber optic base; 3. Fiber optic cable; 101. Base; 102. Electrode; 103. Heat sink; 104. Chip; 105. Conductor wire; 106. Groove. Detailed Implementation

[0026] To make the above-mentioned objectives, features, and advantages of this utility model more apparent and understandable, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0027] Reference Figure 1 , Figure 3 and Figure 4 The diagram illustrates a structure for fixing an optical fiber on a heat sink of a TO laser according to an embodiment of the present invention. Specifically, it may include: a TO laser 1, with an L-shaped optical fiber base 2 attached to the heat sink 103; an optical fiber 3 fixed to the L-shaped optical fiber base 2 and aligned with the chip 104 of the TO laser 1 through the L-shaped optical fiber base 2.

[0028] An L-shaped fiber optic base 2 is attached to the front of the heat sink 103 of the laser. The L-shaped fiber optic base 2 can be fixed to the heat sink using glue or solder. After the fiber optic cable 3 is coupled and aligned with the chip 104, the fiber optic cable 3 is then bonded to the L-shaped fiber optic base 2. The L-shaped fiber optic base 2 not only increases the fixing area with the heat sink 103, but also allows for flexible and convenient adjustment based on the different positions of the light output holes of chips from different manufacturers.

[0029] The optical fiber 3 is connected to the L-shaped optical fiber base 2 via adhesive 4, and the core of the optical fiber 3 is aligned with the chip 104. Specifically, the L-shaped ceramic base 2 is attached to the front side of the heat sink 103 of the TO laser 1, and the optical fiber 3 is fixed to the L-shaped step position of the base with UV adhesive, ensuring that the core 301 is aligned with the chip 104. This prevents the optical fiber from being suspended and eliminates sag caused by gravity. The L-shaped structure provides three-dimensional spatial support, enhancing mechanical stability.

[0030] In one embodiment of this utility model, the thickness of the L-shaped fiber optic base 2 is 10 times the thickness of the outer fiber of the fiber 3. An L-shaped fiber optic base 2 is attached to the front of the heat sink 103 of the TO laser 1. The L-shaped fiber optic base 2 is fixed to the TO laser 1 with glue or solder. After the fiber 3 is coupled and aligned with the chip of the TO laser 1, the fiber 3 is then fixed to the L-shaped fiber optic base with glue.

[0031] Furthermore, the L-shaped fiber optic base 2 is bonded to the heat sink 103 using adhesive 4 or solder. The L-shaped fiber optic base 2 is made of ceramic, glass, or Kovar alloy. The thickness of the L-shaped fiber optic base 2 can be greater than 1.5 mm, which is 10 times the outer diameter of the fiber, effectively ensuring the firmness of the fiber bonding.

[0032] The optical fiber 3 can be fixed to the L-shaped optical fiber base 2, which is tightly connected to the heat sink structure to avoid suspended installation. The L-shaped optical fiber base 2 can be made of a material with a low coefficient of thermal expansion (ceramic / glass) and a highly stable connection (adhesive / solder) to reduce displacement caused by temperature changes. Specifically, the base material can be a high thermal conductivity ceramic (such as AlN), or a thermally conductive adhesive layer can be added between the base and the heat sink to improve heat dissipation efficiency and reduce deformation caused by temperature gradients.

[0033] In one embodiment of this utility model, the TO laser 1 further includes: a base 101 and multiple electrodes 102 penetrating the base 101; wherein, a heat sink 103 is attached to the base 101, and one of the electrodes is electrically connected to the heat sink 103; a chip holder is provided on the heat sink 103, and a chip 104 for exciting the laser is provided on the chip holder; the chip holder and the chip 104 are respectively electrically connected to the electrode 102 via conductor wires 105. The conductor wires 105 are gold wires to ensure the stability of its operation. The base 101 has a groove 106 on its side, which can be used to identify the installation position of the laser and also to limit the installation.

[0034] This novel application effectively solves the problem of precise fiber fixation by adding an L-shaped fiber fixing base to the front end of the heat sink of a TO diode laser. The design is streamlined, highly reliable, easy to manufacture, and effectively solves the problem of fiber coupling failure caused by external vibration or changes in ambient temperature. During fiber head assembly, the position can be adjusted using a three-dimensional frame to match the near-field light of the laser and achieve optimal coupling efficiency. The structure is simple, reliable, and easy and efficient to assemble. This design is applicable to any TO laser with a heat sink, making it widely applicable.

[0035] As an example, the aforementioned optical fiber 3 and L-shaped optical fiber base 2 can be bonded using epoxy resin adhesive 4. Before curing, the fiber core position is calibrated using a microscope. Filling the gaps with adhesive buffers thermal expansion stress, achieving an alignment accuracy of ±0.5μm and reducing power loss to <10%. The outer diameter of the optical fiber is 125μm–150μm, and the base thickness is designed to be 1.25mm–1.5mm (10 times), ensuring sufficient rigidity. To prevent fiber misalignment caused by base deformation, the optimized thickness-to-fiber diameter ratio balances support force and space occupation, effectively ensuring the fiber's secure fixation. The ceramic L-shaped optical fiber base 2 is welded to the heat sink 103 using eutectic solder, increasing the thermal conductivity to 150W / (m・K). This welding method provides higher mechanical strength and thermal conductivity. The Kovar alloy base has a thermal expansion coefficient of 5.1×10⁻⁻⁻⁶. 6 The thermal expansion coefficients of the materials are matched to those of the TO laser heat sink (4J29 alloy) at a temperature of -40℃ to 85℃, reducing interfacial stress caused by temperature cycling.

[0036] Chip 104 is bonded to electrode 102 via gold wire 105, and heat sink 103 is electrically connected to electrode 102 to provide a heat dissipation path. Gold wire has good conductivity, the bonding process is mature, and the contact resistance is <1mΩ. The heat sink 103 is integrated with the electrode, reducing thermal resistance and lowering the chip junction temperature by 15℃. Laser alignment marks can also be etched on the side of the L-shaped fiber optic base 2 to achieve automatic alignment with a CCD camera. This can improve alignment efficiency by 3 times, making it suitable for automated production lines. Silver paste (thermal conductivity 400W / (m・K)) is coated on the bottom of the L-shaped fiber optic base 2, forming a high thermal conductivity interface with the heat sink, resulting in temperature fluctuations of <0.5℃ in the fiber optic fixing area and improved long-term stability. Furthermore, through three innovative directions—structural integration, material matching, and process refinement—the core problem of fixing the TO laser fiber has been solved, exhibiting strong environmental adaptability and a displacement of <1μm under temperature cycling from -40℃ to 85℃. The automated alignment and fixing process reduces the assembly time of a single device to 5 minutes, making it suitable for fields with extremely high requirements for size and stability, such as optical communication modules and lidar.

[0037] It's important to note that a heat sink is an object whose temperature remains constant regardless of the amount of heat transferred to it. Heat sinks are primarily used for heat dissipation, transferring heat from heat sources (such as electronic chips and lasers) to the external environment, ensuring stable operation of the equipment at suitable temperatures. In laser packaging applications, high-power semiconductor lasers generate a significant amount of heat during operation, and heat sinks (such as diamond heat sinks) are used for rapid heat dissipation, ensuring the laser's performance and lifespan.

[0038] Although preferred embodiments of the present invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of the present invention.

[0039] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or terminal device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or terminal device. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or terminal device that includes said element.

[0040] The above provides a detailed description of the structure for fixing an optical fiber on a TO laser heat sink provided by this utility model. Specific examples have been used to illustrate the principle and implementation of this utility model. The description of the above embodiments is only for the purpose of helping to understand the method and core idea of ​​this utility model. At the same time, for those skilled in the art, there will be changes in the specific implementation and application scope based on the idea of ​​this utility model. Therefore, the content of this specification should not be construed as a limitation of this utility model.

Claims

1. A structure for fixing an optical fiber on a TO laser heat sink, characterized in that, include: The TO laser has an L-shaped fiber optic base attached to its heat sink position; An optical fiber is fixed to the L-shaped optical fiber base and aligned with the chip of the TO laser through the L-shaped optical fiber base.

2. The structure according to claim 1, characterized in that, The optical fiber is connected to the L-shaped optical fiber base by adhesive, and the core of the optical fiber is aligned with the chip.

3. The structure according to claim 1 or 2, characterized in that, The thickness of the L-shaped fiber optic base is 10 times the thickness of the outer fiber.

4. The structure according to claim 1, characterized in that, The L-shaped fiber optic base is bonded to the heat sink with adhesive or soldered together.

5. The structure according to claim 1, characterized in that, The L-shaped fiber optic base is made of ceramic, glass, or Kovar alloy.

6. The structure according to claim 1, characterized in that, The TO laser also includes: a base and multiple electrodes penetrating the base; A heat sink is attached to the base, and an electrode is electrically connected to the heat sink. The heat sink is provided with a chip base, and the chip base is provided with a chip for exciting laser; the chip base and the chip are respectively electrically connected to the electrode through conductor lines.

7. The structure according to claim 6, characterized in that, The conductor wire is gold wire.

8. The structure according to claim 6, characterized in that, The base has a groove on its side.

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