Headphone with built-in double-frequency loudspeaker

Abstract

The utility model discloses a headphone with built-in double-frequency loudspeakers, which comprises a headband and earmuff assemblies arranged at two ends of the headband, each earmuff assembly comprises an earphone main body and a sounding unit, the earphone main body is connected with the sounding unit through a connecting arm, and the sounding unit comprises a loudspeaker front cavity support, a loudspeaker rear cavity support, a bass loudspeaker and a mid-high pitch loudspeaker. A loudspeaker mounting seat is arranged on the inner side of the loudspeaker front cavity support, the alto-tweeter is arranged on the loudspeaker mounting seat, and the woofer is arranged on the loudspeaker front cavity support. According to the headphone with the built-in double-frequency horns provided by the utility model, the bass horns and the mid-high-frequency horns are integrated in the sounding units of the headphone, so that the bass is ensured to sink, the frequency bands of the mid-high-frequency horns are also considered, the audio frequency of the mid-high-frequency horns can be smoother, the requirements of users on the bass and the mid-high-frequency horns are met, and the user experience is improved.

Description

Technical Field

[0001] This utility model relates to the field of headphone technology, and in particular to a headphone with a built-in dual-frequency speaker. Background Technology

[0002] Over-ear headphones are audio devices worn directly on a user's head and ears. They mainly consist of a headband and earcups. The earcups cover the user's ears and integrate the sound drivers. The headband connects the two earcups and sits on the user's head. Over-ear headphones are commonly used in internet cafes, music venues, e-sports venues, or professional audio production environments. Most over-ear headphones on the market have only one speaker on each earcup. Because there's only one speaker, it's difficult to achieve a balanced sound performance that effectively addresses both low and mid-high frequencies, thus reducing the user experience. Utility Model Content

[0003] The purpose of this invention is to provide a pair of headphones with built-in dual-frequency speakers. The headphone's sound unit integrates a bass speaker and a mid-high frequency speaker, ensuring that the bass is deep while also taking into account the mid-high frequency range. The mid-high frequency audio is also smoother, thus meeting the user's needs for both bass and mid-high frequencies and improving the user experience.

[0004] To solve the above-mentioned technical problems, the technical solution provided by this utility model is: a headphone with built-in dual-frequency speakers, including a headband and ear cup assemblies disposed at both ends of the headband. The ear cup assemblies include a headphone body and a sound unit. The headphone body is connected to the sound unit through a connecting arm. The sound unit includes a front cavity support for the speaker, a mid-high frequency speaker, a low frequency speaker, and a rear cavity support for the speaker. The front cavity support for the speaker has a frustum structure and a speaker mounting seat at the front end. The rear cavity support for the speaker is detachably connected to the front cavity support for the speaker. The mid-high frequency speaker is disposed on the speaker mounting seat, and the low frequency speaker is disposed at the rear end of the front cavity support for the speaker. The mid-high frequency speaker and the low frequency speaker are coaxially arranged opposite each other. The headphone body is fitted onto the front and rear ends of the front cavity support for the speaker and the rear cavity support for the speaker, and the headphone body matches the front cavity support for the speaker to form a frustum shape. Sound holes are distributed on the circumferential surface of the frustum of the headphone body.

[0005] This invention adopts the above-mentioned technical solution. The woofer is mounted on the front cavity support of the woofer to generate bass audio, allowing users to experience a deep bass sound. Simultaneously, a mid-high frequency woofer is mounted on the woofer mounting base to generate mid-high frequency audio. This allows users to experience both deep bass and high-pitched mid-high frequencies through the headphones, while maintaining a smooth mid-high frequency response. This enables the headphones to simultaneously deliver bass and mid-high frequency sounds, enhancing the user experience and satisfying the need for both bass and treble. The mid-high frequency woofer and the woofer are coaxially aligned and each is responsible for its corresponding frequency band during sound production. When sounding simultaneously, the sound waves from the mid-high frequency woofer and the woofer can also be internally coupled and output through the sound hole.

[0006] The aforementioned headphones with built-in dual-frequency speakers have a speaker front cavity support comprising a ring-shaped base, a connecting plate, and a speaker mounting base. One end of the connecting plate is connected to the ring-shaped base, and the other end is connected to the speaker mounting base. The speaker mounting base is provided with a speaker opening. The speaker mounting base is used to install a mid-high frequency speaker, and the speaker opening is used to output the frequency range emitted by the mid-high frequency speaker.

[0007] The aforementioned headphones with built-in dual-frequency speakers also include a PCBA motherboard in the sound unit. This PCBA motherboard is located on the rear side of the speaker rear cavity bracket and is connected to the wiring of the woofer and mid-high frequency speakers. The PCBA motherboard is used to connect the woofer and mid-high frequency speakers and drive them to vibrate and produce sound.

[0008] The aforementioned headphones with built-in dual-frequency speakers include a detachable outer shell and an inner shell. The inner shell has a housing frame, in which the mid-high frequency speaker and the speaker front cavity support are assembled. The housing frame is used to install the mid-high frequency speaker and the speaker front cavity support. The outer shell and the inner shell are detachable for easy assembly and inspection.

[0009] The aforementioned headphones with built-in dual-frequency speakers have sound-passing holes distributed on the surface of the housing. These sound-passing holes are used to conduct sound through the housing, allowing the audio emitted by the woofer and mid-high frequency speakers to be guided out through the sound-passing holes and thus transmitted to the listener's ear.

[0010] The aforementioned headphones with built-in dual-frequency speakers have a speaker back cover on the main body shell that fits into the housing frame. The main body shell is connected to the inner shell of the main body, and the speaker unit is installed and positioned in the space enclosed by the housing frame and the speaker back cover. The connection between the main body shell and the inner shell, and the enclosure formed by the speaker back cover and the housing frame, creates a space for installing and fixing the speaker unit.

[0011] The aforementioned headphones with built-in dual-frequency speakers have a connecting arm comprising a first connecting arm and a second connecting arm. The first connecting arm is connected to the headphone body shell and the speaker rear cover, while the second connecting arm is connected to the headphone body inner shell and the housing frame. The connecting arms connect the headphone body and the speaker unit respectively via the first and second connecting arms.

[0012] The aforementioned headphones with built-in dual-frequency speakers have connecting arms made of elastic material. This elastic material allows the connecting arms to fit snugly against the ears when the headphones are worn.

[0013] The beneficial effects achieved by this utility model are: the headphones integrate a bass speaker and a mid-high frequency speaker, enabling the headphones to have deep bass and mid-high frequency sound quality, while taking into account different frequency bands, improving user experience, achieving full frequency coverage of sound, and enhancing product competitiveness. Attached Figure Description

[0014] Figure 1 This is a three-dimensional structural diagram of a headset with a built-in dual-frequency speaker according to an embodiment of the present invention;

[0015] Figure 2 This is a schematic diagram of the earcup assembly of a headset with a built-in dual-frequency speaker according to an embodiment of the present invention;

[0016] Figure 3 This is a cross-sectional view of the internal structure of the earcup assembly of a headset with a built-in dual-frequency speaker according to an embodiment of the present invention.

[0017] Figure 4 This is an exploded structural diagram of the earcup assembly of a headset with a built-in dual-frequency speaker according to an embodiment of the present invention.

[0018] Figure 5 This is an exploded structural diagram of a headset with a built-in dual-frequency speaker according to the second embodiment of this utility model;

[0019] Figure 6 This is an exploded structural diagram of the ear cup assembly according to the second embodiment of the present invention;

[0020] Figure 7 This is a structural schematic diagram of the earmuff assembly and earmuff connector according to the second embodiment of this utility model;

[0021] Figure 8 yes Figure 7 A magnified structural diagram of position A in the middle;

[0022] Figure 9 This is a side view of the ear cup assembly according to the second embodiment of the present invention;

[0023] Figure 10 This is a structural schematic diagram of the ear cup connector according to the second embodiment of this utility model;

[0024] Figure 11 This is a schematic diagram of the structure of the earmuff connector connecting the headband according to the second embodiment of the present invention;

[0025] Figure 12 This is an exploded structural diagram of the earmuff connector according to the second embodiment of the present invention;

[0026] Figure 13 This is a schematic diagram of the structure of the sound-producing unit according to the third embodiment of this utility model;

[0027] Figure 14 This is a cross-sectional structural diagram of the ear cup assembly according to the third embodiment of the present utility model;

[0028] Figure 15This is a cross-sectional structural diagram of the sound-producing unit according to the third embodiment of this utility model;

[0029] Figure 16 This is a schematic diagram of the structure of the speaker front cavity bracket according to the third embodiment of this utility model;

[0030] Figure 17 This is a cross-sectional view of the internal structure of the earmuff assembly according to the fourth embodiment of this utility model;

[0031] Figure 18 yes Figure 17 A magnified structural diagram of position B in the middle;

[0032] Figure 19 This is a schematic diagram of the structure of the ball-head plunger in the first connecting arm according to the fourth embodiment of this utility model;

[0033] Figure 20 This is a cross-sectional structural diagram of the ball-head plunger according to the fourth embodiment of this utility model;

[0034] Figure 21 This is a schematic diagram of the cooperation structure between the ball-head plunger and the gear spring in the fourth embodiment of this utility model;

[0035] Figure 22 This is a schematic diagram of the gear shift spring according to the fourth embodiment of the present invention;

[0036] Figure 23 This is a schematic diagram of the structure of the sound-producing unit according to the fourth embodiment of this utility model.

[0037] Explanation of reference numerals in the attached drawings: Headband 1, Earcup connector 11, Arc-shaped opening 111, Rotating support shaft 112, Snap-fit ​​block 113, Limiting block 114, Connector bottom shell 115, Connector face cover 116, Connecting part 117, Mounting block 118, Hinge part 12, Hinge rod 121, Rotating part 122, Earcup assembly 2, Headphone body 21a, Connecting arm 21b, Release hole 201, Earcup back cover 202, Back cover outer shell 203, Back cover inner shell 204, First magnetic magnet 205, Second magnetic magnet 206, Magnet slot 207, Headphone body outer shell 211, Headphone body inner shell 212, Receiving frame 213, Speaker back cover 214, First connecting arm 215, Second connecting arm 216, Assembly hole 217, Ball plunger 218, Rotating hole 2111, Positioning block 2112 2121, 2122, 2123, 2131, 2151, 2181, 2182, 2183, 2184, 2185, 2186, 2187, 2188, 3, 3, 3, 3, 301, 302, 303, 304, 305, 306, 307, 308, 309, 311, 312, 313, 314, 315, 341, 342, 371, 372, 373, 374. Detailed Implementation

[0038] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. Example

[0039] Reference Figure 1 and Figure 4As shown, a pair of headphones with built-in dual-frequency speakers includes a headband 1 and earcup assemblies 2 disposed at both ends of the headband 1. The earcup assemblies 2 include a headphone body 21a and a speaker unit 3. The headphone body 21a is connected to the speaker unit 3 via a connecting arm 21b. The speaker unit 3 includes a front speaker support 301, a mid-high frequency speaker 306, a low frequency speaker 302, and a rear speaker support 304. The front speaker support 301 has a frustum structure and a speaker mounting base 314 at the front end. The rear speaker support 304 is connected to the front speaker support 306. The cavity support 301 is detachably connected. The mid-high frequency speaker 306 is mounted on the speaker mounting base 314, and the woofer 302 is located at the rear end of the speaker front cavity support 301. The mid-high frequency speaker 306 and the woofer 302 are coaxially opposite each other. The headphone body 21a is fitted onto the front and rear ends of the speaker front cavity support 301 and the speaker rear cavity support 304, and the headphone body 21a matches the speaker front cavity support 301 to form a frustum shape. Sound holes 2131 are distributed on the side circumferential surface of the frustum of the headphone body 21a. Among them, the woofer 302 and the mid-high frequency speaker 306 are coaxially opposite each other.

[0040] The upper bottom surface of the headphone body 21a facing outward is a closed structure. The sound waves emitted by the mid-high frequency speaker 306 and the low frequency speaker 302 are output through the sound hole 2131 on the side of the headphone body 21a, so that the sound waves can radiate outward from the center. The energy of the center part of the sound wave is low, which reduces the direct impact on the eardrum when it enters the ear canal, and reduces the fatigue caused by the direct impact of sound waves on the eardrum when the user wears it.

[0041] The woofer 302 and the mid-high frequency speaker 306 are coaxial, and the sound-emitting surfaces of the mid-high frequency speaker 306 and the woofer 302 face each other. This means that when the mid-high frequency speaker 306 emits sound, some of the sound waves are absorbed by the diaphragm of the woofer 302, while the rest are reflected and ultimately exited through the sound hole 2131. The sound waves emitted by the mid-high frequency speaker 306 are coupled with the woofer 302 and then transmitted through the sound hole 2131. When the mid-high frequency speaker 306 and the woofer 302 emit sound simultaneously, the mid-high frequency sound waves are absorbed and reflected by the woofer 302 and then exited through the sound hole 2131 along with the bass sound waves emitted by the woofer 302. Through the coupling of the mid-high frequency speaker 306 and the woofer 302, the ear can obtain different listening effects.

[0042] The speaker front cavity bracket 301 includes an annular base 311, a connecting plate 312, and a speaker mounting base 314. One end of the connecting plate 312 is connected to the annular base 311, and the other end is connected to the speaker mounting base 314. The speaker mounting base 314 has a speaker opening 315. A mid-high frequency speaker 306 is located at the speaker opening 315 of the speaker mounting base 314, and the sound waves emitted by the mid-high frequency speaker 306 are directed outward through the speaker opening 314. A woofer 32 is mounted on the annular base 311, and the woofer 32 is coaxially opposite to the mid-high frequency speaker 306. The lead wire of the mid-high frequency speaker 306 is electrically connected to the PCBA main board 303 after passing through the connecting plate 312. Figure 3 As shown, in this embodiment, the sound waves emitted by the mid-high frequency speaker 306 are directed out from the speaker opening 315, radiate in all directions, and then output from the sound passage 2131 of the housing frame 213. By adding the mid-high frequency speaker 306, the mid-high frequency speaker 306 and the woofer 302 each handle their respective frequency bands. This ensures that the low frequencies are deep while the mid-high frequency range is smoother, thus meeting the user's sound quality requirements for both low and mid-high frequencies and enhancing the product's competitiveness.

[0043] The sound unit 3 includes a PCBA main board 303, which is located on the rear side of the speaker rear cavity bracket 304 and connected to the wiring of the woofer 302 and the mid-high frequency speaker 306. It is used to connect the power supply and control the vibration and sound production of the woofer 302 and the mid-high frequency speaker 306. The woofer 302 and the mid-high frequency speaker 306 each control their corresponding frequency bands, allowing the headphones to hear both deep bass and high-pitched mid-high frequencies, thus improving the user experience.

[0044] The headphone body 21a includes a detachably connected headphone body shell 211 and a headphone body inner shell 212. The headphone body inner shell 212 is provided with a housing frame 213, in which the mid-high frequency speaker 306 and the speaker front cavity support 301 are assembled. The surface of the housing frame 213 is distributed with sound-passing holes 2131. The sound waves emitted by the woofer 302 and the mid-high frequency speaker 306 are both directed outward through the sound-passing holes 2131, thereby transmitting them into the ear canal.

[0045] In this embodiment, as Figure 2-4 As shown, the connecting arm 21b includes a first connecting arm 215 and a second connecting arm 216. The first connecting arm 215 is connected to the earphone main body shell 211 and the speaker rear cover 214, and the second connecting arm 216 is connected to the earphone main body inner shell 212 and the housing frame 213. Further, in other embodiments, the connecting arm 21b may also be made of an elastic material, making the first connecting arm 215 and the second connecting arm 216 elastic, allowing the outer side of the housing frame 213 to fit snugly against the ear canal, improving sound quality.

[0046] When assembling the headphones, first attach the mid-high frequency speaker 306 to the speaker mounting base 314, then glue the woofer 302 to the annular base 311 of the speaker front cavity bracket 301. Screw the speaker rear cavity bracket 304 through the connecting ear 341 and thread it onto the screw post 313, completing the connection between the speaker rear cavity bracket 34 and the speaker front cavity bracket 31. Then glue the speaker front cavity bracket 301 to the headphone body inner shell 212. Finally, install the PCBA main board 303 on the mounting post 342 of the speaker rear cavity bracket 304, solder the leads of the woofer 302 and mid-high frequency speaker 306 to the PCBA main board 303, and finally connect the headphone body outer shell 211 to the headphone body inner shell 212, securing it with screws to complete the headphone assembly.

[0047] In this embodiment, the speaker opening 315 of the speaker mounting base 314 is an axial through hole penetrating the speaker mounting base 315, while the axis of the housing frame 213 is closed and non-conductive. The sound holes 2131 are distributed around the axis, forming an annular shape. Furthermore, the housing frame 213 is conical in shape, and the sound holes 2131 are distributed on the conical surface of the housing frame 213, so that the sound waves transmitted from the sound holes 2131 can diffuse evenly around the axis, reducing the direct impact of the axis on the middle of the eardrum when the sound waves are transmitted to the eardrum, making the sound softer for the user.

[0048] Implementation 2

[0049] Reference Figures 1-12 As shown, in this second embodiment, based on the first embodiment, the headphones include a headband 1 and earcup assemblies 2 connected to both ends of the headband 1. The earcup assembly 2 includes a headphone body 21a and a sound unit 3. The headphone body 21a is connected to the sound unit 3 via a connecting arm 21b. The sound unit 3 is located at the center of the earcup assembly 2. The sound unit 3 and the inner periphery of the earcup assembly 2 form an open release hole 201 that extends axially along the earcup assembly 2. The release hole 201 is U-shaped. Correspondingly, a rear earcup cover 202 is detachably provided on the rear side of the earcup assembly 2 to cover the release hole 201. The shape and size of the rear earcup cover 202 are adapted to the release hole 201.

[0050] Reference Figure 1 , Figure 5As shown, during use, the headset is worn on the user's head, with the earcup assembly 2 covering the user's ears. When the earcup back cover 202 is attached to the earcup assembly 2, covering the release hole 201, a closed listening space is formed between the earcup assembly 2 and the user's ear canal, allowing sound to be transmitted to the eardrum and enhancing the user's immersive listening experience. Furthermore, the earcup back cover 202 provides sound insulation, preventing sound leakage when privacy during calls is required. With the earcup back cover 202 attached, it is suitable for occasions such as internet cafes, e-sports, and professional audio production.

[0051] When using headphones for extended periods, the earcup assembly 2 creates a closed listening space between the earcup and the user's ears. Prolonged use in this enclosed space can cause discomfort. Removing the earcup back cover 202 allows the listening space to connect with the outside environment, releasing sound pressure and alleviating discomfort. With the back cover 202 open, the user can hear not only the sound from the headphones but also the sounds of the surrounding environment, making it suitable for scenarios requiring immediate awareness of ambient sounds, such as outdoor activities. Removing the earcup back cover 202 connects the inside of the earcup assembly 2 to the outside environment through the release hole 201, allowing airflow and faster heat dissipation from the ears, reducing sweating. It also allows more sound waves to escape from the rear of the speaker unit 3, reducing sound reflections and echoes around the ears, resulting in a more natural sound.

[0052] Reference Figures 5 to 6As shown, the earphone body 21a includes an earphone body outer shell 211 and an earphone body inner shell 212. The sound unit 3 is disposed in the space formed by the earphone body outer shell 211 and the earphone body inner shell 212. The earcup back cover 202 includes a back cover outer shell 203 and a back cover inner shell 204, which can be connected by a snap-fit ​​mechanism. In other embodiments, the back cover outer shell 203 and the back cover inner shell 204 can also be connected by other means, such as adhesive bonding or screw connection. A first magnetic magnet 205 is provided on the back cover inner shell 204, and a second magnetic magnet 206 is provided in the magnetic groove 207 of the earphone body outer shell 211. The first magnetic magnet 205 and the second magnetic magnet 206 are positioned opposite each other, with opposite polarities on their opposing end faces. When the first magnetic magnet 205 approaches the second magnetic magnet 206, they are attracted by magnetic force, thus fixing the earcup back cover 202 to the outside of the headphone body shell 211, achieving the assembly of the earcup back cover 202. Using the mutual attraction of the first magnetic magnet 205 and the second magnetic magnet 206 to install the earcup back cover 202 makes it more convenient for users to remove and install the earcup back cover 202 from and onto the headphone body shell 211. The earcup back cover 202 is configured to include a back cover outer shell 203 and a back cover inner shell 204. When the back cover outer shell 203 and the back cover inner shell 204 are assembled to form the earcup back cover 202, the first magnetic magnet 205 is installed inside the earcup back cover 202 and is not exposed.

[0053] In other embodiments, the earcup back cover 202 and the earcup assembly 2 can also be fixedly connected by a snap-fit ​​connection. For example, a snap-fit ​​is provided on the headphone main body shell 211, and a snap-fit ​​hole or snap-fit ​​groove is provided on the earcup back cover 202. The earcup back cover 202 and the headphone main body shell 211 are detachably connected by snap-fit. Alternatively, the earcup back cover 202 and the headphone main body shell 211 can be detachably connected by a screw connection. For example, a screw hole is provided on the outer side of the headphone main body shell 211, and a through hole is provided on the earcup back cover 202 at a corresponding position for the screw to pass through. The locking screw passes through the through hole of the earcup back cover 202 and is threaded onto the screw hole of the headphone main body shell 211, completing the connection between the earcup back cover 202 and the earcup assembly 2. The specific connection method between the earcup back cover 202 and the earcup assembly 2 can be selected according to actual usage requirements.

[0054] Reference Figures 7 to 12 As shown, the earcup assembly 2 is connected to the headband 1 via an earcup connector 11. One end of the earcup connector 11 is inserted into the headband 1, and the other end of the earcup connector 11 is provided with an arc-shaped opening. The earcup connector 11 is Y-shaped in general. The arc-shaped opening of the earcup connector 11 is rotatably connected to the earcup assembly 2, so that the earcup assembly 2 can rotate in the opening to adjust its angle for easy wearing.

[0055] In this embodiment, the end of the earcup connector 11 that connects to the earcup assembly 2 has an arc-shaped opening 111. Rotational support shafts 112 protrude inwards from both ends of the arc-shaped opening 111. A rotating hole 2111, rotatably fitted onto the rotating support shaft 112, is provided on the radially outer side wall of the earcup assembly 2's headphone body shell 211. The rotating support shaft 112 of the earcup connector 11 is inserted into the rotating hole 2111 on the side wall of the headphone body shell 211, allowing the earcup assembly 2 to rotate on the earcup connector 11, thereby adjusting the angle of the earcup assembly 2 for user comfort. Figure 6 and Figure 7 As shown, a snap-fit ​​block 113 extends radially outward from the outer end of the rotating support shaft 112. When the rotating support shaft 112 is inserted into the rotating hole 2111, it is snapped onto the inner bottom wall of the rotating hole 2111 by the snap-fit ​​block 113, preventing the earcup assembly 2 from detaching from the rotating support shaft 112. The rotating support shaft 112 is hollow along the axial direction and connects to the internal cavity of the earcup connector 11 for cable routing.

[0056] Combination Figure 10 and Figure 11 Furthermore, a radially spaced limiting block 114 is provided at one end of the rotating support shaft 112 near the arc-shaped end of the earcup connector 11. A positioning block 2112, cooperating with the limiting block 114, is provided radially inwardly on the wall of the rotating hole 2111. The positioning blocks 2112 are spaced apart on the wall of the rotating hole 2111, with the spacing allowing the rotating support shaft 112 to pass through. The positioning block 2112 is embedded in the gap between the two limiting blocks 114. During rotation, the positioning block 2112 can abut against the limiting block 114, thereby limiting the rotation angle of the earcup assembly 2 relative to the rotating support shaft 112. When the rotating support shaft 112 is inserted into the rotating hole 2111, and the earcup assembly 2 rotates around the rotating support shaft 112, the positioning block 2112 contacts the limiting block 114, limiting the rotation angle of the earcup assembly 2.

[0057] like Figure 11 As shown, the earcup connector 11 is connected to the headband 1 via a hinge 12. A hinge rod 121 is inserted into the top of the hinge 12, as shown... Figure 10 As shown. The hinge 12 is rotatably connected to the end of the headband 1 via the hinge rod 121. The rotatable connection between the earcup connector 11 and the headband 1 allows the two earcup assemblies 2 to be rotated relative to the inside of the headband 1 when the headphones are not in use, thereby folding the two earcup assemblies 2 inside the headband 1 for easy storage. Furthermore, a rotating part 122 extends from the bottom end of the hinge 12 toward the earcup assembly 2, and a connecting part 117 is provided at the top end of the earcup connector 11. The earcup connector 11 is rotatably connected to the rotating part 122 via the connecting part 117. Specifically, as... Figure 11As shown, the rotating part 122 has a rotating groove 1221, and the inner side of the connecting part 117 is provided with a snap-fit ​​groove 1171 that mates with the rotating groove 1221 of the rotating part 122. (Refer to...) Figure 12 As shown, the connecting part 117 is provided with a mounting block 118 that can be detached and installed by screws, so that the earmuff connector 11 is connected to the hinge part 12.

[0058] Reference Figure 11 and Figure 12 As shown, in this embodiment, the rotating slot 1221 and the snap-fit ​​slot 1171 are annular slots. The rotating slot 1221 is an outer annular slot opened around the outer peripheral wall surface of the rotating part 122; the snap-fit ​​slot 1171 is an inner annular slot opened around the inner peripheral wall of the connecting part 117. The mounting block 118 is used to fix the rotating part 122 and the connecting part 117 by screw fixing when the rotating part 122 is embedded in the connecting part 117. The mounting block 118 is also provided with a snap-fit ​​slot 1171 opened along its inner peripheral wall. When the connecting part 117 is installed, a snap-fit ​​slot 1171 is formed that covers the bottom of the rotating slot 1221. Specifically, the groove wall of the rotating slot 1221 is embedded in the snap-fit ​​slot 1171, and the groove wall of the snap-fit ​​slot 1171 is embedded in the rotating slot 1221, so that the rotating part 122 is connected to the connecting part 117, and the earcup connector 11 can rotate relative to the rotating part 122 through the connecting part 117, thereby realizing the earcup assembly 2 to rotate axially with the rotating part 122 in the extension direction relative to the headband 1, thereby adjusting the angle of the earcup assembly 2. When wearing headphones, the earcup assembly 2 can rotate freely after touching the user's ear, making it more convenient to wear on the user's head.

[0059] Reference Figure 6 As shown, the inner side of the headphone body inner shell 212 is provided with a foam ring 2121, a locking washer 2122, and a hook portion 2123. The hook portion 2123 is distributed in a ring-shaped pattern along the edge of the headphone body inner shell 212. The locking washer 2122 is embedded inside the foam ring 2121 and is engaged with the hook portion 2123, thereby assembling the foam ring 2121 onto the inner surface of the headphone body inner shell 212. The foam ring 2121 contacts the user's head skin, which can cushion the pressure of the ear cup assembly on the head when wearing the headphones, improving wearing comfort; and better seals the ear cup assembly 2 with the user's ear, forming a sealed listening space with the ear cup back cover 20. Sound is emitted from the speaker unit 3. With the ear cup back cover 202 covering the release hole 201, there is no sound leakage, improving the user's immersive listening experience. In cold weather, the earcup back cover 202 seals over the release hole 201, and the earcup assembly 2 completely covers the user's ears, providing a sealing and warming effect.

[0060] like Figure 3As shown, the sound unit 3 includes a front speaker support 301, a woofer 302, a PCBA main board 303, and a rear speaker support 304. The woofer 302 is mounted between the front speaker support 301 and the rear speaker support 304, and the PCBA main board 303 is mounted on the outside of the rear speaker support 304. After the woofer 302 and the PCBA main board 303 are mounted on the front speaker support 301 and the rear speaker support 304, they are assembled into the inner shell 211 and the outer shell 212 of the headphone body. The woofer 302 includes a bass diaphragm, a bass voice coil, a magnetic plate, and a neodymium iron boron magnet. When the bass voice coil is energized, it generates a magnetic field. Combined with the magnetic field of the neodymium iron boron magnet, the bass voice coil drives the bass diaphragm to vibrate and produce sound. One of the two earcup assemblies 2 is also equipped with a battery. The battery is connected to the PCBA main board 303 located in each of the two earcup assemblies 2 via wires to provide power.

[0061] Reference Figure 2-4 As shown, the inner shell 212 of the earphone body is provided with a housing 213 for accommodating the sound unit 3, and the outer shell 211 of the earphone body is provided with a speaker back cover 214 adapted to the housing 213. The housing 213 and the speaker back cover 214 are located at the center of the earcup assembly 2, allowing the sound unit 3 to be aligned with the user's ear canal. The connecting arm 21b includes a first connecting arm 215 and a second connecting arm 216. The housing 213 and the speaker back cover 214 are respectively connected to the outer shell 211 of the earphone body and the inner shell 212 of the earphone body via the first connecting arm 215 and the second connecting arm 216. In this embodiment, the first connecting arm 215 and the second connecting arm 216 are made of plastic and are used to support and position the sound unit 3. In other embodiments, the first connecting arm 215 and the second connecting arm 216 may also be made of an elastic material, making the first connecting arm 215 and the second connecting arm 216 elastic, allowing the outer part of the housing 213 to fit snugly against the ear canal, improving sound quality.

[0062] Reference Figure 12 As shown, the earcup connector 11 includes a connector base shell 115 and a connector face cover 116. The connector face cover 116 covers the connector base shell 115, and its internal cavity can be used to pass through the guide cable. Example

[0063] Further reference Figures 13 to 16As shown, this embodiment is based on the above-described embodiment one or embodiment two. The rear speaker cavity support 304 and the front speaker cavity support 301 are assembled into one unit, and the woofer 302 and PCBA main board 303 are assembled therein to form the sound unit 3. The front speaker cavity support 301 is fixed to the inner shell 212 of the earphone body. The outer shell 211 of the earphone body and the inner shell 212 of the earphone body can be connected by screws to form the earphone body of the earcup assembly 2. The sound unit 3 is assembled in the housing 213 of the earcup assembly 2.

[0064] A reflector cone 305 is provided at the center of the inner side of the speaker front cavity support 301. The reflector cone 305 protrudes towards the woofer 302, is conical in shape, and is coaxial with the center line of the woofer 302. When the woofer 302 emits sound, its sound waves propagate forward. When the sound waves at the center pass through the reflector cone 305, they are reflected by the surface of the reflector cone 305 and diffuse outwards. The surface of the housing 213 is distributed with sound holes 2131 for sound waves to pass through. The sound waves reflected by the conical surface of the reflector cone 305 diffuse outwards and exit from the sound holes 2131. The reflector cone 305 allows the sound to diffuse 360 ​​degrees in all directions through reflection, reducing the impact of sound waves on the eardrum when they reach it, making the sound heard softer. The sound waves emitted by the woofer 302 spread outwards around the reflector cone 305. As they travel into the ear, the low-frequency sound waves can travel inwards along the ear canal wall, reducing the direct impact on the center of the eardrum and making the sound softer.

[0065] Specifically, the woofer 302 vibrates when powered, emitting sound waves that propagate towards the front cavity support 301. During propagation, peripheral sound waves pass through the outer periphery of the reflector cone 305 and then exit through the sound holes 2131 of the housing 213, entering the user's ear canal. Another portion of the sound waves at the center, as they propagate forward, radiate outwards through the surface of the reflector cone 305, with some waves exiting directly through the sound holes 2131 of the housing 213. The arrangement of the reflector cone 305 ensures that the bass emitted by the woofer 302 diffuses outwards from the reflector cone 305, entering the ear canal. Furthermore, the sound holes 2131 of the housing 213 are arranged in a ring around the reflector cone 305, with no sound holes in the center of the housing 213. This allows bass sound waves to bypass the center of the ear canal and travel along the surface of the ear canal, reducing direct radiation to the center of the eardrum and making the listening experience softer.

[0066] like Figure 16As shown, the speaker front cavity support 301 in this embodiment includes an annular base 311 and connecting plates 312 connected to the surface of the annular base 311. Four connecting plates 312 are arranged at intervals, with one end connected to the annular base 311 and the other end converging towards the axis and connected as a single unit. A sound reflector 305 is located at the end where the connecting plates 312 converge, protruding towards the woofer 302. Specifically, the end of the sound reflector 305 connected to the connecting plate 312 is integrally formed and extends towards the woofer 302 to form a single structure. The integrally formed sound reflector 305 can be cold-pressed during processing, forming a cylindrical sound reflector 305 by cold pressing from the end connected to the connecting plate 312. In other embodiments, the sound reflector 305 can also be a separate structure, installed and fixed at the convergence point of the connecting plates 312. The reflector cone 305 is cone-shaped, and its surface diffuses the sound waves transmitted from the woofer 302, allowing the sound waves to radiate more evenly in all directions.

[0067] like Figure 13 The front cavity bracket 301 of the speaker extends from its edge toward the rear cavity bracket 304 to form a screw post 313. The edge of the rear cavity bracket 304 of the speaker has a connecting ear 341 corresponding to the position of the screw post 313. The connecting ear 341 has a through hole, through which a screw is passed to connect the rear cavity bracket 304 to the front cavity bracket 301. A mounting post 342 is provided on the rear side of the rear cavity bracket 304, and the PCBA main board 303 can also be fixed to the mounting post 342 by screw connection.

[0068] During assembly, first, the front cavity bracket 301 of the speaker is glued to the housing bracket 213 of the inner shell 212 of the headphone body, and then the woofer 302 is glued to the front cavity bracket 301. Next, the rear cavity bracket 304 of the speaker is attached to the front cavity bracket 301, and screws are passed through the through-hole of the connecting ear 341 and threaded onto the screw post 313 to complete the assembly of the front cavity bracket 301 and the rear cavity bracket 304. After the rear cavity bracket 304 is assembled onto the front cavity bracket 301, the edge of the woofer 302 is clamped between the front cavity bracket 301 and the rear cavity bracket 304. Then, the PCBA main board 303 is screwed onto the mounting post 342, and the leads on the woofer 302 are soldered to the corresponding pads on the PCBA main board 303. Finally, the outer shell 211 of the headphone body is connected to the inner shell 212 of the headphone body with screws and glue, completing the assembly of the earcup assembly 2. Example

[0069] Reference Figures 17 to 23As shown, in this embodiment, based on the above embodiments one, two and / or three, the sound unit 3 can move relative to the earmuff assembly 2, so that the sound units 3 located at both ends of the headband 1 can adjust their relative distance, thereby adjusting the distance between the sound unit 3 and the ear canal when worn.

[0070] like Figure 17 As shown, the sound unit 3 also includes a speaker component upper shell 307 and a speaker component bottom shell 308. The earphone main body outer shell 211 is connected to the speaker component upper shell 307 via a first connecting arm 215, and the earphone main body inner shell 212 is connected to the speaker component bottom shell 308 via a second connecting arm 216. The mid-high frequency speaker 306 is mounted on the speaker mounting base 314, and the woofer 302 is mounted on the annular base 311 of the speaker front cavity bracket 301. Then, the speaker rear cavity bracket 304 is fixedly connected to the speaker front cavity bracket 301. The PCBA main board 303 is mounted on the rear side of the speaker rear cavity bracket 304, and the leads of the mid-high frequency speaker 306 and the woofer 302 are soldered to the PCBA main board 303. After assembling the speaker front cavity bracket 301 and the speaker rear cavity bracket 304, the sound unit 3 is assembled on the front and rear speaker component upper shells 307 and speaker component bottom shells 308.

[0071] Reference Figure 17 and Figure 18 The upper shell 307 of the speaker component is slidably connected to the first connecting arm 215, allowing the upper shell 307 to slide relative to the first connecting arm 215, thereby adjusting the relative position of the two upper shells 307 of the speaker components located at both ends of the headband 1, and thus adjusting the distance between the sound unit 3 and the ear canal. A mounting hole 217 is provided at the contact point between the first connecting arm 215 and the upper shell 307 of the speaker component, and a ball-head plunger 218 is provided in the mounting hole 217. A stop spring 371 is provided on the upper shell 307 of the speaker component. The ball-head plunger 218 contacts and cooperates with the stop spring 371, allowing the upper shell 307 of the speaker component to slide relative to the end of the first connecting arm 215. The ball-head plunger 218 presses against the stop spring 371 to fix the position of the sound unit 3, thereby adjusting the distance of the sound unit 3 relative to the ear. By adjusting the distance of the sound unit 3 relative to the ear, users can experience different listening effects.

[0072] like Figure 19 The diagram shown illustrates the position of the ball plunger 218 mounted on the first connecting arm 215 in this embodiment. Specifically, the end of the first connecting arm 215 that connects to the upper housing 307 of the horn component is provided with an assembly hole 217, in which the ball plunger 218 is assembled.

[0073] Reference Figure 20As shown, specifically, the ball-head plunger 218 includes a plunger body 2181, a spring 2182, and a plunger rod 2183. The plunger body 2181 has a semi-enclosed plunger groove 2184. One end of the plunger rod 2183 extends into the plunger groove 2184, and its outer end forms a hemispherical end 2185. The groove opening of the plunger groove 2184 extends radially inward with a radial inner edge 2186, and the inner side of the hemispherical end 2185 forms a radial outer edge 2187. The spring 2182 is disposed in the plunger groove 2184, and its two ends abut against the bottom wall of the plunger groove 2184 and the inner side of the hemispherical end 2185, respectively. Through the cooperation of the radial outer edge 2187 and the radial inner edge 2186, the hemispherical end 2185 and the plunger rod 2183 will not slip out of the plunger groove 2184. In other embodiments, the end of the plunger rod 213 may be configured as a spherical end with a diameter larger than the inner diameter of the plunger groove opening, so as to prevent the plunger rod 2183 from running out of the plunger groove 2184.

[0074] Reference Figure 21 and Figure 22 As shown, the surface of the shift spring 371 is provided with positioning grooves 372 that are adapted to the surface of the hemispherical end 2185. The spring 2182 pushes the hemispherical end 2185 of the plunger rod 2183 to extend outward. When the hemispherical end 2185 of the plunger rod 2183 abuts against the shift spring 371 between the positioning grooves 372, the plunger rod 2183 and the spring 2182 are compressed into the plunger groove 2184, and the sound unit 3 can continue to move. When the hemispherical end 2185 of the plunger rod 2183 abuts against the positioning groove 372, the spring 2182 pushes the plunger rod 2183 to extend and lock the shift spring 371, thereby fixing the position of the sound unit 3.

[0075] Because the hemispherical end 2185 of the plunger rod 2183 abuts against the positioning groove 372 of the stop spring 371, the sound unit 3 is locked in place. The pressure is mainly provided by the elastic force of the spring 2182. When the force required to move the sound unit 3 is large enough to overcome the elastic force of the spring 2182, the hemispherical end 2185 of the plunger rod 2183 moves into the plunger groove 2184 under the pressure of the stop spring 371, and compresses the spring to accumulate elastic force. This allows the sound unit 3 to continue moving relative to the first connecting arm 215. After the sound unit 3 moves to the desired position, the positioning groove 372 corresponds to the plunger rod 2183, and the spring 2182 pushes the plunger rod 2183 outward to abut against the stop spring 371, thereby adjusting the position of the sound unit 3.

[0076] like Figure 23 As shown, the bottom shell 308 and the upper shell 307 of the horn component are provided with mounting grooves 309 for accommodating and locking the first connecting arm 215. The bottom outer side of the first connecting arm 215 is provided with a locking flange 2151, which, in conjunction with... Figure 19 and Figure 23 As shown, the locking flange 2151 engages with the inner wall of the mounting groove 309, thus preventing the sound unit 3 from detaching from the first connecting arm 215. Specifically, when connecting the first connecting arm 215 to the upper shell 307 and the lower shell 308 of the speaker component, the locking flange 2151 of the first connecting arm 215 first engages with the upper shell 307 of the speaker component, and then the lower shell 308 is assembled onto the upper shell 307. After assembly, the first connecting arm 215 cannot be separated from the mounting groove 309.

[0077] like Figure 21 As shown, the back of the shift spring 371 has inwardly extending metal barbs 373. These barbs 373 penetrate the rubber surface of the speaker component upper housing 307, thereby fixing the shift spring 371 to the speaker component upper housing 307. This prevents the shift spring 371 from detaching from the surface of the speaker component upper housing 307 during the movement of the sound unit 3. By fixing the shift spring 371 by inserting the barbs 373 into the surface of the mounting groove 309 of the speaker component upper housing 307, pressure can be applied using a tool to force the barbs 373 of the shift spring 371 into the surface of the mounting groove 309, resulting in a secure connection and simplified manufacturing process.

[0078] During assembly, the mid-high frequency speaker 306 and the woofer 302 are respectively mounted on the speaker mounting base 314 and the annular chassis 311. Then, the speaker front cavity bracket 301 and the speaker rear cavity bracket 304 are assembled, and the PCBA main board 303 is assembled. The audio leads of the mid-high frequency speaker 306 and the woofer 302 are connected to the PCBA main board 303. Then, the speaker front cavity bracket 301 and the speaker rear cavity bracket 304 are installed together into the speaker component bottom shell 308. When installing the speaker front cavity bracket 301 and the speaker rear cavity bracket 304 into the speaker component bottom shell 308, they can be fixed with glue. Press the stop spring 371 into the speaker component upper shell 307 to make the stop spring 371 and the speaker component upper shell 308 firmly connected. The ball-head plunger 218 is fitted into the mounting hole 217 of the first connecting arm 215, and then the first connecting arm 215 is inserted into the mounting groove 309. The locking flange 2151 of the first connecting arm 215 is engaged in the mounting groove 309, thus completing the connection between the first connecting arm 215 and the sound unit 3. Alternatively, the end of the first connecting arm 215 can be placed in the mounting groove 309 on the upper shell 307 of the speaker component, and then the upper shell 307 of the speaker component is assembled. The upper shell 307 of the speaker component is connected to the bottom shell 307 of the speaker component with glue, thereby positioning the first connecting arm 215 in the mounting groove 309. Finally, the earphone body shell 211 and the earphone body inner shell 212 are assembled into one piece using screws.

[0079] In practical use, this invention allows for adjustment of the earcup connector 11 and headband 1 by rotating the hinge part 12, facilitating user comfort. During wear, the earcup connector 11 can be rotated to adjust the angle of the earcup assembly 2, and further, the earcup assembly 2 can be rotated to adjust its tilt angle, further enhancing comfort and ease of use. When not in use, the hinge part 12 can be rotated to fold relative to the end of the headband 1, causing the earcup assembly 2 to fold inwards towards the headband 1, reducing space requirements and making it easier to carry.

[0080] The earcup back cover 202 covers the earcup assembly 2, creating a relatively enclosed listening space around the user's ears. This effectively isolates sound leakage, providing excellent sound insulation and protecting the user's privacy during calls. It is also suitable for immersive music listening or professional audio production. If discomfort arises after prolonged listening, the earcup back cover 202 can be removed, allowing the listening space covered by the earcup assembly 2 to connect with the outside world, releasing internal sound pressure and alleviating discomfort from extended wear. When used outdoors, it also allows for timely awareness of surrounding sounds, enhancing alertness.

[0081] During listening, sound waves are reflected by the sound cone 305 and output through the sound hole 2131 on the surface of the housing 213. This allows low-frequency sound waves to diffuse outwards around the axis of the sound unit 3 and enter the ear canal, reducing the impact of axial transmission on the eardrum and making the sound smoother. The sound unit 3 also includes a mid-high frequency speaker 306. The mid-high frequency speaker 306 and the woofer 302 are each responsible for their respective frequency bands, ensuring that the low frequencies are deep while the mid-high frequency range is also smoother, thus meeting the user's needs for both low-frequency and mid-high frequency sound quality.

[0082] The first connecting arm 215 is inserted and positioned in the mounting slot 309, allowing the movable sound unit 3 to adjust its position relative to the first connecting arm 215, thereby adjusting the distance between the sound unit 3 and the user's eardrum and enabling the user to experience different listening sensations. Through the cooperation of the ball plunger 218 and the stop spring 371, the ball plunger 218 presses against the stop spring 371 to fix the position of the sound unit 3 relative to the first connecting arm 215. Furthermore, the ball plunger 218 can be adjusted to correspond to the positioning groove 372 on the stop spring 371, thus achieving position adjustment of the sound unit 3.

[0083] In summary, this utility model has been manufactured into actual samples as described in the specification and figures, and has undergone multiple use tests. The results of these tests demonstrate that this utility model can achieve its intended purpose, and its practical value is undeniable. The embodiments described above are merely illustrative examples of this utility model and are not intended to limit it in any way. Any person skilled in the art who makes partial modifications or alterations to the technical content disclosed in this utility model without departing from its technical features shall also fall within the scope of this utility model's technical features.

Claims

1. A headset with built-in dual-frequency speakers, comprising a headband (1) and earcup assemblies (2) disposed at both ends of the headband (1), wherein the earcup assemblies (2) include a headphone body (21a) and a sound unit (3), wherein the headphone body (21a) is connected to the sound unit (3) via a connecting arm (21b), characterized in that: The sound unit (3) includes a front cavity support (301), a mid-high frequency speaker (306), a low frequency speaker (302), and a rear cavity support (304). The front cavity support (301) has a frustum structure and a speaker mounting base (314) at the front end. The rear cavity support (304) is detachably connected to the front cavity support (301). The mid-high frequency speaker (306) is mounted on the speaker mounting base (314). The low frequency speaker (302) is mounted at the rear end of the front cavity support (301). The mid-high frequency speaker (306) and the low frequency speaker (302) are coaxially opposite each other. The headphone body (21a) is fitted onto the front and rear ends of the front cavity support (301) and the rear cavity support (304). The headphone body (21a) matches the front cavity support (301) to form a frustum shape. Sound holes (2131) are distributed on the side circumferential surface of the frustum of the headphone body (21a).

2. The headphones with built-in dual-frequency speakers according to claim 1, characterized in that: The front cavity bracket (301) of the horn includes an annular base (311), a connecting plate (312) and a horn mounting base (314). One end of the connecting plate (312) is connected to the annular base (311) and the other end is connected to the horn mounting base (314). The horn mounting base (314) is provided with a horn opening (315).

3. The headphones with built-in dual-frequency speakers according to claim 1, characterized in that: The sound unit (3) also includes a PCBA main board (303), which is located on the rear side of the speaker rear cavity bracket (304) and connected to the circuits of the bass speaker (302) and the mid-high frequency speaker (306).

4. The headphones with built-in dual-frequency speakers according to claim 1, characterized in that: The headphone body (21a) includes a detachably connected headphone body shell (211) and a headphone body inner shell (212). The headphone body inner shell (212) is provided with a housing frame (213), and the mid-high frequency speaker (306) and the speaker front cavity support (301) are assembled in the housing frame (213).

5. The headphones with built-in dual-frequency speakers according to claim 4, characterized in that: The surface of the housing (213) is provided with sound-passing holes (2131) for sound transmission.

6. The headphones with built-in dual-frequency speakers according to claim 4, characterized in that: The earphone body shell (211) is provided with a speaker back cover (214) that is compatible with the housing frame (213). The earphone body shell (211) is connected to the earphone body inner shell (212). The sound unit (3) is installed and positioned in the space enclosed by the housing frame (213) and the speaker back cover (214).

7. The headphones with built-in dual-frequency speakers according to claim 4, characterized in that: The connecting arm (21b) includes a first connecting arm (215) and a second connecting arm (216). The first connecting arm (215) is connected to the earphone body shell (211) and the speaker back cover (214), and the second connecting arm (216) is connected to the earphone body inner shell (212) and the housing frame (213).

8. The headphones with built-in dual-frequency speakers according to claim 1, characterized in that: The connecting arm (21b) is made of an elastic material.

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