High-thermal-conductivity thermal management structure of multilayer circuit board

Abstract

The utility model relates to the technical field of multi-layer circuit boards, in particular to a high-heat-conduction heat management structure of a multi-layer circuit board. The multi-layer circuit board comprises a concentric-square-shaped frame, the inner wall of the concentric-square-shaped frame is connected with a multi-layer circuit board body in a sliding mode, adjusting devices are arranged on the two sides of the concentric-square-shaped frame, each adjusting device comprises a plurality of round holes, the round holes are formed in the two sides of the concentric-square-shaped frame respectively, the surface of the multi-layer circuit board body is fixedly connected with two fixing blocks, and the fixing blocks are fixedly connected with the inner wall of the concentric-square-shaped frame. Insertion rods are slidably inserted into the two fixing blocks and slidably connected with the inner walls of the round holes, one ends of the insertion rods are fixedly connected with the round blocks, the sizes of the insertion rods are matched with the sizes of the round holes, the arc surfaces of the insertion rods are sleeved with first springs, and the two ends of the first springs are fixedly connected with the round blocks and the fixing blocks respectively. The problem that the heat dissipation space is seriously limited due to the fact that the distances between part of the multi-layer circuit board and the equipment shell and between part of the multi-layer circuit board and other parts are extremely close is solved.

Description

Technical Field

[0001] This utility model relates to the field of multilayer circuit board technology, and in particular to a high thermal conductivity thermal management structure for multilayer circuit boards. Background Technology

[0002] As electronic devices continue to evolve towards higher performance and miniaturization, multilayer circuit boards are widely used as core components. However, with the increasing integration of electronic components and the rising power consumption, multilayer circuit boards generate a significant amount of heat during operation. Furthermore, as electronic devices strive for simplification, the spacing between some multilayer circuit boards and the device casing or other components is extremely close.

[0003] Regarding the above-mentioned and existing related technologies, the inventors believe that the following defects often exist: electronic devices on the market are gradually pursuing simplification, and the spacing between some of their multi-layer circuit boards and the device casing and other components is extremely close. The narrow spacing severely restricts the heat dissipation space, making it difficult for natural air convection to form an effective heat dissipation channel due to insufficient space. Therefore, a high thermal conductivity thermal management structure for multi-layer circuit boards is proposed to address the above problems. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies where the spacing between some multilayer circuit boards and the equipment casing and other components is extremely close, resulting in severely limited heat dissipation space. Therefore, this invention proposes a high thermal conductivity thermal management structure for multilayer circuit boards.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a high thermal conductivity thermal management structure for a multilayer circuit board, comprising a U-shaped frame, wherein a multilayer circuit board body is slidably connected to the inner wall of the U-shaped frame, and adjustment devices are provided on both sides of the U-shaped frame. The adjustment devices include a plurality of circular holes, which are respectively opened on both sides of the U-shaped frame. Two fixing blocks are fixedly connected to the surface of the multilayer circuit board body, and a rod is slidably inserted into each of the two fixing blocks. The rod is slidably connected to the inner wall of the circular hole, and a circular block is fixedly connected to one end of the rod. The size of the rod is adapted to the size of the circular hole.

[0006] The effect achieved by the above components is as follows: by setting the adjustment device, the height of the multi-layer circuit board body placed in the U-shaped frame can be adjusted. The adjustable height can optimize the contact area and distance between the multi-layer circuit board body and the equipment, thereby allowing the surrounding air to flow more smoothly in the equipment, accelerating heat exchange, improving its heat dissipation efficiency, and avoiding the obstruction of heat dissipation due to the distance being too close.

[0007] Preferably, the arc surface of the insertion rod is fitted with a first spring, and the two ends of the first spring are fixedly connected to the circular block and the fixed block, respectively.

[0008] The effect achieved by the above components is that when the insertion rod is aligned with the round hole, the elastic force of the first spring will drive the insertion rod to automatically insert into the inner wall of the round hole, and the insertion rod will remain stable after insertion, thus improving the convenience of the device.

[0009] Preferably, the spiral frame has liquid inlets on both sides and liquid outlets on both sides, and the inner walls of the liquid inlets and liquid outlets are connected by arc-shaped pipes.

[0010] The effect achieved by the above components is as follows: an inlet and an outlet are opened on the side wall of the U-shaped frame and connected to an arc-shaped pipe, allowing coolant to flow through it. When the coolant flows in the arc-shaped pipe, it exchanges heat with the multi-layer circuit board body inside the U-shaped frame, quickly transferring the heat of the multi-layer circuit board body to the coolant, thereby effectively reducing its temperature.

[0011] Preferably, the inner walls of both the inlet and outlet are slidably connected with protective plugs, which are made of sponge material.

[0012] The effect achieved by the above components is as follows: the protective plug made of sponge material has a certain degree of elasticity and flexibility, which can tightly fill the inlet and outlet of the liquid, effectively blocking dust and preventing dust from accumulating inside, thus affecting the heat dissipation effect when the coolant is used later.

[0013] Preferably, four soft pads made of rubber are fixedly connected to the surface of the multilayer circuit board body.

[0014] The effect achieved by the above components is that the rubber pads have good elasticity, which can buffer the impact during collision, absorb and disperse the impact force, and reduce the risk of damage caused by the collision between the polygonal circuit board body and the U-shaped frame.

[0015] Preferably, the upper surface of the spiral frame is provided with a protective device, which includes two mounting blocks. Both mounting blocks are fixedly connected to the upper surface of the spiral frame. A filter screen is slidably connected to the inner wall of the spiral frame. Two arc-shaped blocks are fixedly connected to the upper surface of the filter screen. The surface of the arc-shaped blocks is provided with locking holes. The surface of the mounting blocks is provided with circular grooves. A second spring is fixedly connected to the inner wall of the circular groove of the mounting block. One end of the second spring is fixedly connected to a round rod, which is slidably connected to the inner wall of the circular groove of the mounting block.

[0016] The effects achieved by the above-mentioned components are as follows: by setting up protective devices, dust or impurities are prevented from covering the surface of electronic components on the multilayer circuit board body, reducing the risk of short circuits and ensuring the normal operation of electronic components. At the same time, the filter screen can also prevent corrosive dust or impurities from contacting the electronic components on the multilayer circuit board body, extending the effective service life of the electronic components.

[0017] Preferably, a U-shaped block is fixedly connected to the surface of the mounting block, and the U-shaped block is made of an elastic material.

[0018] The effect achieved by the above components is that by setting up the U-shaped block, the operator can quickly release the limit. When the filter screen is damaged due to long-term use and needs to be replaced, the operator can quickly release the limit by pressing the U-shaped block, which improves the flexibility of the device.

[0019] In summary, the beneficial effects of this utility model are as follows:

[0020] 1. In this utility model, by setting an adjustment device, the height of the multi-layer circuit board body placed in the U-shaped frame is adjusted. The adjustable height can optimize the contact area and distance between the multi-layer circuit board body and the equipment, thereby allowing the surrounding air to flow more smoothly in the equipment, accelerating heat exchange, improving its heat dissipation efficiency, and avoiding the obstruction of heat dissipation due to the distance being too close.

[0021] 2. In this utility model, by setting a protective device, dust or impurities are prevented from covering the surface of electronic components on the multilayer circuit board body, reducing the risk of short circuits and ensuring the normal operation of electronic components. At the same time, the filter screen can also prevent corrosive dust or impurities from contacting the electronic components on the multilayer circuit board body, extending the effective service life of the electronic components. Attached Figure Description

[0022] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0023] Figure 2 This is a schematic diagram of the adjusting device in this utility model;

[0024] Figure 3 In this utility model Figure 2 Enlarged view of point A;

[0025] Figure 4 In this utility model Figure 2 Enlarged view of point B;

[0026] Figure 5 This is a schematic diagram of the protective device in this utility model;

[0027] Figure 6 In this utility model Figure 5 Enlarged view of point C;

[0028] Figure 7 This is a schematic diagram of the mounting block in this utility model.

[0029] Legend: 1. U-shaped frame; 2. Multi-layer circuit board body; 3. Adjustment device; 301. Round hole; 302. Fixing block; 303. Insert rod; 304. Round block; 305. First spring; 306. Liquid inlet; 307. Liquid outlet; 308. Arc-shaped tube; 309. Protective plug; 310. Soft pad; 4. Protective device; 41. Mounting block; 42. Filter screen; 43. Arc-shaped block; 44. Second spring; 45. Round rod; 46. U-shaped block. Detailed Implementation

[0030] Reference Figure 1 and Figure 2 As shown, this utility model provides a technical solution: a high thermal conductivity thermal management structure for a multilayer circuit board, including a U-shaped frame 1, with a multilayer circuit board body 2 slidably connected to the inner wall of the U-shaped frame 1. Adjustment devices 3 are provided on both sides of the U-shaped frame 1. By setting the adjustment devices 3, the height of the multilayer circuit board body 2 placed in the U-shaped frame 1 can be adjusted. The adjustable height can optimize the contact area and distance between the multilayer circuit board body 2 and the equipment, thereby allowing the surrounding air to flow more smoothly in the equipment, accelerating heat exchange, improving its heat dissipation efficiency, and avoiding the obstruction of heat dissipation due to excessive distance. A protective device 4 is provided on the upper surface of the U-shaped frame 1. By setting the protective device 4, dust or impurities are prevented from covering the surface of electronic components on the multilayer circuit board body 2, reducing the risk of short circuits and ensuring the normal operation of electronic components. At the same time, the filter screen 42 can also prevent corrosive dust or impurities from contacting the electronic components on the multilayer circuit board body 2, extending the effective service life of the electronic components.

[0031] The specific settings and functions of its adjustment device 3 and protection device 4 will be described in detail below.

[0032] Reference Figure 2 , Figure 3 and Figure 4As shown in this embodiment: the adjusting device 3 includes several circular holes 301, which are respectively opened on both sides of the U-shaped frame 1. Two fixing blocks 302 are fixedly connected to the surface of the multilayer circuit board body 2. Insert rods 303 are slidably inserted into the two fixing blocks 302. The insert rods 303 are slidably connected to the inner wall of the circular holes 301. A circular block 304 is fixedly connected to one end of the insert rod 303. The size of the insert rod 303 is adapted to the size of the circular holes 301. A first spring 30 is sleeved on the arc surface of the insert rod 303. 5. The two ends of the first spring 305 are fixedly connected to the circular block 304 and the fixing block 302 respectively. When the insertion rod 303 is aligned with the circular hole 301, the elastic force of the first spring 305 will drive the insertion rod 303 to automatically insert into the inner wall of the circular hole 301, and the insertion rod 303 remains stable after insertion, which improves the convenience of the device. Both sides of the loop frame 1 are provided with liquid inlets 306 and liquid outlets 307. The inner walls of the liquid inlets 306 and liquid outlets 307 are connected by arc-shaped tubes. 308. An inlet 306 and an outlet 307 are opened on the side wall of the U-shaped frame 1 and connected to an arc-shaped pipe 308 to allow coolant to circulate within them. When the coolant flows in the arc-shaped pipe 308, it exchanges heat with the multi-layer circuit board body 2 inside the U-shaped frame 1, quickly transferring the heat of the multi-layer circuit board body 2 to the coolant, thereby effectively reducing its temperature. Protective plugs 309 are slidably connected to the inner walls of the inlet 306 and the outlet 307. The protective plugs 309 are made of sponge material, which has a certain degree of elasticity and flexibility, and can tightly fill the inlet 306 and the outlet 307, effectively blocking dust and preventing dust from accumulating inside, which would affect the heat dissipation effect when the coolant is used later. Four soft pads 310 are fixedly connected to the surface of the multi-layer circuit board body 2. The soft pads 310 are made of rubber material, which has good elasticity and can play a buffering role in the event of a collision, absorbing and dispersing the impact force, and reducing the risk of damage caused by the collision between the polygonal circuit board body and the U-shaped frame 1.

[0033] Reference Figure 5 , Figure 6 and Figure 7As shown, specifically, the protective device 4 includes two mounting blocks 41, both of which are fixedly connected to the upper surface of the U-shaped frame 1. A filter screen 42 is slidably connected to the inner wall of the U-shaped frame 1. Two arc-shaped blocks 43 are fixedly connected to the upper surface of the filter screen 42. The surface of the arc-shaped blocks 43 has a locking hole. The surface of the mounting blocks 41 has a circular groove. A second spring 44 is fixedly connected to the inner wall of the circular groove of the mounting block 41. One end of the second spring 44 is fixedly connected to a circular rod 45. The circular rod 45 is slidably connected to the inner wall of the circular groove of the mounting block 41. A U-shaped block 46 is fixedly connected to the surface of the mounting block 41. The U-shaped block 46 is made of elastic material. By setting the U-shaped block 46, the operator can quickly release the limit. When the filter screen 42 is damaged due to long-term use and needs to be replaced, the operator can quickly release the limit by pressing the U-shaped block 46, which improves the flexibility of the device.

[0034] Working principle: To install the polygonal circuit board body inside the device, a U-shaped frame 1 is usually installed first. When it is necessary to adjust the distance between the polygonal circuit board body and the device, pulling the circular block 304 causes the insertion rod 303 to slide backward on the inner wall of the circular hole 301 until the insertion rod 303 moves away from the inner wall of the circular hole 301. At this time, the polygonal circuit board body is pushed to slide upward on the inner wall of the U-shaped frame 1. The polygonal circuit board body drives the soft pad 310 to move, which in turn drives the fixing block 302 to move. The fixing block 302 drives the insertion rod 303 to move, which in turn drives the circular block 304 to move. The circular block 304 drives the first spring 305 to move. When a suitable position is found, the insertion rod 303 is aligned with the circular hole 301. The elastic force of the first spring 305 drives the circular block 304 to move forward, and the circular block 304 drives the insertion rod 303 to automatically insert into the circular hole 301. When coolant needs to be output into the inlet 306, the polygonal circuit board body is adjusted so that the insertion rod 303 can be inserted into the highest circular hole 301. At this time, the arc-shaped tube 308 will contact the polygonal circuit board body, and then coolant can be output into the inlet 306. When the coolant flows in the arc-shaped tube 308, it exchanges heat with the multi-layer circuit board body 2, quickly transferring the heat of the multi-layer circuit board body 2 to the coolant, thereby effectively reducing its temperature. By setting the adjustment device 3, the height of the multi-layer circuit board body 2 placed in the U-shaped frame 1 can be adjusted. The adjustable height can optimize the contact area and distance between the multi-layer circuit board body 2 and the equipment, thereby allowing the surrounding air to flow more smoothly in the equipment, accelerating heat exchange, improving its heat dissipation efficiency, and avoiding the obstruction of heat dissipation due to the close distance.

[0035] When it is necessary to prevent a large amount of dust or impurities from covering the surface of electronic components on the multilayer circuit board body 2, the filter screen 42 is pushed to cause the arc block 43 to slide downward on the inner wall of the retaining frame 1. The arc block 43 presses against the round rod 45, and the inner wall of the round groove of the mounting block 41 of the round rod 45 slides backward. The round rod 45 presses against the second spring 44. When the round rod 45 is aligned with the locking hole of the arc block 43, the elastic force of the second spring 44 will drive the round rod 45 to automatically insert into the inner wall of the locking hole of the arc block 43. Then the filter screen 42 can be fixed on the inner wall of the retaining frame 1. By setting the protective device 4, it is possible to prevent dust or impurities from covering the surface of electronic components on the multilayer circuit board body 2, reduce the risk of short circuit, and ensure the normal operation of electronic components. At the same time, the filter screen 42 can also prevent corrosive dust or impurities from contacting the electronic components on the multilayer circuit board body 2, extending the effective service life of the electronic components.

[0036] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

Claims

1. A high thermal conductivity thermal management structure for a multilayer circuit board, comprising a U-shaped frame (1), characterized in that: The inner wall of the spiral frame (1) is slidably connected to a multi-layer circuit board body (2). Adjustment devices (3) are provided on both sides of the spiral frame (1). The adjustment devices (3) include several round holes (301). The several round holes (301) are respectively opened on both sides of the spiral frame (1). Two fixing blocks (302) are fixedly connected to the surface of the multi-layer circuit board body (2). Insert rods (303) are slidably inserted into the two fixing blocks (302). The insert rods (303) are slidably connected to the inner wall of the round holes (301). One end of the insert rods (303) is fixedly connected to a round block (304). The size of the insert rods (303) is adapted to the size of the round holes (301).

2. The high thermal conductivity thermal management structure for a multilayer circuit board according to claim 1, characterized in that: The first spring (305) is sleeved on the arc surface of the insertion rod (303), and the two ends of the first spring (305) are fixedly connected to the round block (304) and the fixing block (302) respectively.

3. The high thermal conductivity thermal management structure for a multilayer circuit board according to claim 1, characterized in that: The spiral frame (1) has liquid inlets (306) on both sides and liquid outlets (307) on both sides. The inner walls of the liquid inlets (306) and liquid outlets (307) are connected by arc-shaped pipes (308).

4. The high thermal conductivity thermal management structure for a multilayer circuit board according to claim 3, characterized in that: The inner walls of the liquid inlet (306) and the liquid outlet (307) are slidably connected with protective plugs (309), which are made of sponge material.

5. The high thermal conductivity thermal management structure for a multilayer circuit board according to claim 1, characterized in that: Four soft pads (310) are fixedly connected to the surface of the multilayer circuit board body (2), and the soft pads (310) are made of rubber.

6. The high thermal conductivity thermal management structure for a multilayer circuit board according to claim 1, characterized in that: The upper surface of the spiral frame (1) is provided with a protective device (4). The protective device (4) includes two mounting blocks (41). Both mounting blocks (41) are fixedly connected to the upper surface of the spiral frame (1). The inner wall of the spiral frame (1) is slidably connected to a filter screen (42). The upper surface of the filter screen (42) is fixedly connected to two arc-shaped blocks (43). The surface of the arc-shaped blocks (43) is provided with a card hole. The surface of the mounting block (41) is provided with a circular groove. The inner wall of the circular groove of the mounting block (41) is fixedly connected to a second spring (44). One end of the second spring (44) is fixedly connected to a round rod (45). The round rod (45) is slidably connected to the inner wall of the circular groove of the mounting block (41).

7. The high thermal conductivity thermal management structure for a multilayer circuit board according to claim 6, characterized in that: The surface of the mounting block (41) is fixedly connected to a U-shaped block (46), which is made of an elastic material.

Images