Quick-release liquid cooling circulation module for server and locking structure thereof
By introducing layered elastic compensation technology such as a high thermal conductivity flexible graphene composite material layer and a floating module into the server liquid cooling circulation module, combined with a quick-release locking mechanism, the thermal runaway problem of the liquid cooling circulation module under flow interruption conditions is solved, achieving efficient thermal management and emergency response, and improving the reliability and safety of the system.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- DONGGUAN HUAHAO COMMUNICATION EQUIPMENT CO LTD
- Filing Date
- 2026-02-26
- Publication Date
- 2026-06-05
Smart Images

Figure CN122152090A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of server technology, specifically to a quick-release server liquid cooling circulation module and its locking structure. Background Technology
[0002] The quick-release server liquid cooling circulation module and its locking structure are an integrated supporting structure designed for high-density liquid cooling heat dissipation scenarios of servers. The liquid cooling circulation module is an independent pluggable unit that integrates core functions such as cold plate, quick-connect liquid circuit connector, and heat exchange auxiliary components. It can be directly connected to the heat-generating components of the server to complete the coolant circulation heat exchange and can be quickly disassembled and maintained without the server as a whole. Existing technologies struggle to provide layered elastic compensation for thermal stress in server liquid cooling circulation modules, reducing the dynamic bonding stability and thermal uniformity between the cold plate and the chip. They also struggle to effectively suppress the risk of interface loosening or leakage caused by temperature fluctuations and mechanical vibrations, making it difficult to enhance long-term system reliability and thermal management efficiency while ensuring convenient quick-release. Furthermore, existing technologies struggle to maintain a minimum coolant flow through the server cold plate after the main circuit is cut off, making it difficult to provide continuous emergency cooling to the chip for 3-5 minutes. This makes it difficult to effectively prevent thermal runaway when the system faces the risk of sudden flow interruption, reducing the reliability and safety of quick-release liquid cooling systems. Existing quick-release server liquid cooling circulation modules and their locking structures use a rigid connection design between the cold plate and the mounting frame, which suffers from uncompensated thermal deformation, easy loosening of the fit, reduced thermal conductivity, and lack of stress monitoring. This makes it difficult to ensure a tight fit between the cold plate and the CPU, reducing the module's heat dissipation reliability and operational safety. Finally, existing technologies struggle to ensure convenient and quick disassembly for routine maintenance while automatically triggering mechanical decoupling devices in emergencies to rapidly and safely separate the cooling circuit. They also struggle to incorporate anti-detachment mechanisms to prevent pipes or connectors from coming loose under accidental conditions such as vibration or misoperation, thus reducing the reliability and emergency response capability of liquid cooling modules under complex operating conditions. Summary of the Invention
[0003] Therefore, in order to overcome the above-mentioned shortcomings, the present invention provides a quick-release server liquid cooling circulation module and its locking structure.
[0004] The present invention is implemented by constructing a quick-release server liquid cooling circulation module and its locking structure. The device includes a server body, in which a liquid cooling circulation module is fixedly connected to the top of the server body and a motherboard is fixedly connected to the left end of the server body. The liquid cooling circulation module includes a heat sink, which is fixedly connected to the top of the server body. A cooling fan is provided at the bottom of the heat sink. One end of the liquid inlet pipe is fixedly connected to the bottom of the heat sink. A side support mechanism is fixedly connected to the bottom of the heat sink. The outer wall of the liquid inlet pipe is connected to the water cooling head, and a circulation pump is provided inside the water cooling head. A high thermal conductivity flexible graphene composite material layer is provided at the left end of the water cooling head. A gradient variable stiffness viscoelastic damping layer is bonded to the left end of the high thermal conductivity flexible graphene composite material layer. A shape memory alloy spring composite bearing layer is bonded to the left end of the gradient variable stiffness viscoelastic damping layer. A floating module is fixedly connected to the left end of the water cooling head. The outer wall of the water cooling head is fixedly connected to a quick-release locking mechanism.
[0005] Preferably, the side branch mechanism includes a liquid outlet pipe, a liquid outlet pipe is fixedly connected to the bottom of the heat sink, a pressure sensor is fixedly connected to the outside of the liquid outlet pipe, a temperature sensor is fixedly connected to the outside of the liquid outlet pipe, a first valve is fixedly connected to the delivery port at one end of the liquid outlet pipe, a multi-way valve is connected to the delivery port at the other end of the liquid outlet pipe, the other end of the multi-way valve is connected to the side branch pipe, and a second valve is fixedly connected to the delivery port of the side branch pipe.
[0006] Preferably, the floating module includes a mounting shell, the left end of the water-cooling head is fixedly connected to the mounting shell, an array of electric springs are arranged inside the mounting shell, a high-elasticity polyurethane pressure equalization buffer layer is adhesively connected to the left end of the electric spring, a cold plate is fixedly connected to the left end of the high-elasticity polyurethane pressure equalization buffer layer, a high-performance phase change thermal conductive pad is fixedly connected to the left end of the cold plate, and resistance strain gauges are adhesively connected to each of the ±45° directions of the spring wire axis of the electric spring.
[0007] Preferably, the quick-release locking mechanism includes a mounting plate, the outer wall of the water cooling head is fixedly connected to the mounting plate, two sets of pull ropes are fixedly connected to the center of the left end of the mounting plate, connecting rods are fixedly connected to all four sides of the left end of the mounting plate, a turntable is rotatably connected to the left end of the connecting rod, five sets of electromagnetic slots are provided on the side of the turntable, a protruding rod is provided in the electromagnetic slot, an arc-shaped block is fixedly connected to the left end of the protruding rod, the arc-shaped block is slidably connected to the right end of the insert block, four sets of mating shells are fixedly connected to the right end of the main board, damping rods are fixedly connected to the upper and lower ends of the right side of the mating shell, the damping rods are fixedly connected to the triangular block, an electromagnetic block is fixedly connected to the left end of the triangular block, and the electromagnetic block is electrically connected to an external current output device.
[0008] Preferably, the outlet pipe is located on the left side of the inlet pipe, and the pressure sensor and temperature sensor are both electrically connected to an external display screen.
[0009] Preferably, the electric spring is electrically connected to an external power source, and the outer wall of the cold plate is wrapped with a high thermal conductivity flexible graphene composite material layer, a gradient variable stiffness viscoelastic damping layer, and a shape memory alloy spring composite load-bearing layer.
[0010] Preferably, the internal circulation pump of the water cooling head is connected to the inlet pipe, the outlet pipe, and the side branch pipe, and the inlet pipe, the outlet pipe, and the side branch pipe are all connected to the cold plate.
[0011] Preferably, the other end of the side branch pipe is connected to the heat dissipation vent, and the side branch pipe is located on the left side of the liquid outlet pipe.
[0012] Preferably, the left end of the pull rope is fixedly connected to the main board, the electromagnetic block and the arc-shaped block are magnetically attracted, and the right end of the mating shell is provided with a slot to facilitate the insertion of the arc-shaped block, the insert block, and the connecting rod.
[0013] Preferably, the electromagnetic groove consists of an arc-shaped sliding groove on the side of the turntable and eight sets of electromagnetic blocks fixedly connected in the arc-shaped sliding groove. The electromagnetic blocks are electrically connected to an external current output device. The electromagnetic blocks in the electromagnetic groove are magnetically attracted to the protruding rods, and the arc-shaped sliding groove in the electromagnetic groove is slidably connected to the protruding rods.
[0014] The present invention has the following advantages: The present invention provides an improved quick-release server liquid cooling circulation module and its locking structure, which, compared with similar devices, has the following improvements: This invention discloses a quick-release server liquid cooling circulation module and its locking structure. The liquid cooling circulation module employs layered elastic compensation for thermal stress within the module, improving the dynamic bonding stability and heat conduction uniformity between the cold plate inside the floating module and the CPU / GPU. Simultaneously, it effectively suppresses the risk of interface loosening or leakage caused by temperature fluctuations and mechanical vibrations. This ensures convenient quick-release while enhancing the system's long-term reliability and thermal management efficiency. A bypass mechanism is incorporated, using a multi-way valve and bypass pipe to circulate the liquid, ensuring that even if the outlet pipe delivery channel is cut off, a minimum amount of coolant still flows through the cold plate inside the floating module, providing the CPU / GPU with a valuable few minutes for safe shutdown or switching. A backup path fundamentally avoids thermal runaway; a floating module, through the cooperation of an electric spring and a high-elasticity polyurethane pressure-equalizing buffer layer, ensures a stable and tight fit between the high-performance phase change thermal pad and the CPU / GPU surface, providing a continuous, reliable, and efficient heat conduction path. Simultaneously, resistance strain gauges monitor the pressure at each point in real time, verifying the pressure equalization effect and providing data for health prediction; a quick-release locking mechanism ensures convenient disassembly for routine maintenance while automatically triggering a mechanical decoupling device in emergencies, allowing the cooling circuit to quickly and safely separate. A pull rope further prevents pipes or joints from loosening under vibration, misoperation, or other unexpected conditions, improving the reliability and emergency response capability of the liquid cooling circulation module under complex operating conditions. Attached Figure Description
[0015] Figure 1 This is a schematic diagram of the structure of the present invention; Figure 2This is a three-dimensional structural diagram of the liquid cooling circulation module of the present invention; Figure 3 This is a three-dimensional structural diagram of the side support mechanism of the present invention; Figure 4 This is a left-view stereoscopic structural diagram of the floating module of the present invention; Figure 5 This is the present invention. Figure 4 Enlarged structural diagram at point A; Figure 6 This is a three-dimensional structural diagram of the quick-release locking mechanism of the present invention; Figure 7 This is the present invention. Figure 6 Enlarged structural diagram at point B; Figure 8 This is a schematic diagram of the structure of the present invention in conjunction with the shell.
[0016] The components include: Server body-1, Liquid cooling circulation module-2, Heat sink-21, Cooling fan-22, Inlet pipe-23, Side branch mechanism-24, Outlet pipe-241, Pressure sensor-242, Temperature sensor-243, First valve-244, Multi-way valve-245, Side branch pipe-246, Second valve-247, Water cooling head-25, High thermal conductivity flexible graphene composite material layer-26, Gradient variable stiffness viscoelastic damping layer-27, Shape memory alloy spring composite load-bearing layer-28, Floating module-29, Mounting shell-2 91. Electric Spring - 292. High-Elasticity Polyurethane Pressure Equalizing Buffer Layer - 293. Cold Plate - 294. High-Performance Phase Change Thermal Conductive Pad - 295. Resistance Strain Gauge - 296. Quick-Release Locking Mechanism - 210. Mounting Plate - 2101. Pull Rope - 2102. Connecting Rod - 2103. Turntable - 2104. Electromagnetic Slot - 2105. Protruding Rod - 2106. Arc Block - 2107. Insert Block - 2108. Mating Shell - 2109. Damping Rod - 21010. Triangular Block - 21011. Electromagnetic Block - 21012. Main Board - 3. Detailed Implementation
[0017] The following is in conjunction with the appendix Figures 1-8 The principles and features of the present invention are described below. The examples given are for illustrative purposes only and are not intended to limit the scope of the invention. The invention is described more specifically in the following paragraphs by way of example with reference to the accompanying drawings. It should be noted that the drawings are in a very simplified form and use non-precise proportions, and are only used to facilitate and clarify the illustration of the embodiments of the invention.
[0018] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0019] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "setting" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances. The embodiments of this invention will now be described according to its overall structure.
[0020] Example 1:
[0021] Please see Figures 1-2 The present invention discloses a quick-release server liquid cooling circulation module and its locking structure, including a server body 1, a liquid cooling circulation module 2 fixedly connected to the top of the server body 1, a motherboard 3 fixedly connected to the left end of the server body 1, and a CPU / GPU mounted on the motherboard 3.
[0022] The liquid cooling circulation module 2 includes a heat sink 21. The heat sink 21 is fixedly connected to the top of the server body 1. A cooling fan 22 is provided at the bottom of the heat sink 21. The bottom of the heat sink 21 is fixedly connected to one end of the liquid inlet pipe 23. A side support mechanism 24 is fixedly connected to the bottom of the heat sink 21. The cooling fan 22 facilitates the blowing of air over the fins, and finally dissipates the heat to the outside of the server body 1.
[0023] The outer wall of the liquid inlet pipe 23 is connected to the water cooling head 25, and a circulation pump is installed inside the water cooling head 25. A high thermal conductivity flexible graphene composite material layer 26 is provided at the left end of the water cooling head 25. A gradient variable stiffness viscoelastic damping layer 27 is bonded to the left end of the high thermal conductivity flexible graphene composite material layer 26. The gradient variable stiffness viscoelastic damping layer 27 facilitates the smooth absorption of thermal expansion displacement of the internal cooling plate 294 of the floating module 29.
[0024] The left end of the gradient variable stiffness viscoelastic damping layer 27 is bonded to a shape memory alloy spring composite load-bearing layer 28, the left end of the water cooling head 25 is fixedly connected to a floating module 29, and the outer wall of the water cooling head 25 is fixedly connected to a quick-release locking mechanism 210.
[0025] The working principle of a quick-release server liquid cooling circulation module and its locking structure based on Embodiment 1 is as follows: First, when using this device, place it in the work area, and then connect it to an external power source to provide the power required for its operation. Secondly, during use, the server body 1 first locks the liquid cooling circulation module 2 using the quick-release locking mechanism 210, ensuring that the inner cooling plate 294 of the floating module 29 is in contact with the CPU / GPU on the motherboard 3. Then, the internal circulation pump of the water cooling head 25 drives the coolant to flow through the inner cooling plate 294 of the floating module 29, which is in close contact with the CPU / GPU, via the inlet pipe 23, absorbing heat from the CPU / GPU. The warm liquid after absorbing heat is then transported by the internal circulation pump of the water cooling head 25 to the heat sink 21 through the outlet pipe 241. The large-area fins of the heat sink 21 conduct heat to the metal, and then the cooling fan 22 installed on the heat sink 21 blows air over the fins, ultimately dissipating the heat to the outside of the server body 1. The cooled liquid then flows back to the inner cooling plate 294 of the floating module 29 through the inlet pipe 23, forming a continuous and efficient "absorption-transfer-dissipation" cycle. In the operation of the floating module 29, the internal cooling plate 294 utilizes a highly thermally conductive flexible graphene composite material layer 26 to ensure efficient heat dissipation from the sidewall of the internal cooling plate 294. A gradient variable stiffness viscoelastic damping layer 27 smoothly absorbs the thermal expansion displacement of the internal cooling plate 294 and dissipates vibration energy into heat through viscoelastic shear. A shape memory alloy spring composite load-bearing layer 28 actively contracts and stiffens when the operating temperature is reached, providing adaptive locking force. This layered elastic compensation of thermal stress in the liquid cooling circulation module 2 improves the dynamic bonding stability and thermal uniformity between the internal cooling plate 294 and the CPU / GPU, while effectively suppressing the risk of interface loosening or leakage caused by temperature fluctuations and mechanical vibration. This ensures convenient quick disassembly while enhancing the long-term reliability and thermal management efficiency of the system.
[0026] Example 2:
[0027] Please see Figure 3 The present invention provides a quick-release server liquid cooling circulation module and its locking structure. Compared with Embodiment 1, this embodiment further includes: a side support mechanism 24. The side support mechanism 24 includes a liquid outlet pipe 241. The liquid outlet pipe 241 is fixedly connected to the bottom of the heat sink 21. A pressure sensor 242 is fixedly connected to the outside of the liquid outlet pipe 241. A temperature sensor 243 is fixedly connected to the outside of the liquid outlet pipe 241. The temperature sensor 243 facilitates the detection of liquid temperature.
[0028] A first valve 244 is fixedly connected to one end of the liquid outlet pipe 241 at the delivery port, and the other end of the liquid outlet pipe 241 is connected to one end of a multi-way valve 245 at the delivery port. The other end of the multi-way valve 245 is connected to a side branch pipe 246, and a second valve 247 is fixedly connected to the delivery port of the side branch pipe 246. The first valve 244 and the second valve 247 facilitate the control of liquid delivery.
[0029] The outlet pipe 241 is located to the left of the inlet pipe 23. The pressure sensor 242 and the temperature sensor 243 are both electrically connected to the external display screen. The other end of the side branch pipe 246 is connected to the heat sink 21, and the side branch pipe 246 is located to the left of the outlet pipe 241. The internal circulation pump of the water cooling head 25 is connected to the inlet pipe 23, the outlet pipe 241, and the side branch pipe 246 respectively.
[0030] In this embodiment: When the liquid outlet pipe 241 is transporting liquid, the pressure sensor 242 and the temperature sensor 243 detect the pressure and temperature of the liquid in the outlet pipe 241, respectively, and transmit the detection data to an external display screen. When the operator observes on the external display screen that the pressure and temperature detection data of the liquid exceed the preset values, the first valve 244 stops working and the second valve 247 is started. The liquid is circulated through the multi-way valve 245 and the bypass pipe 246, ensuring that even if the delivery channel of the outlet pipe 241 is cut off, a minimum amount of coolant can still flow through the internal cooling plate of the floating module 29, giving the CPU / GPU 3-5 minutes of valuable time for safe shutdown or switching to the backup path, fundamentally avoiding thermal runaway.
[0031] Example 3:
[0032] Please see Figures 4-5 The present invention discloses a quick-release server liquid cooling circulation module and its locking structure. Compared with Embodiment 1, this embodiment further includes a floating module 29. The floating module 29 includes a mounting shell 291. The left end of the water cooling head 25 is fixedly connected to the mounting shell 291. An array of electric springs 292 is provided inside the mounting shell 291. A high-elasticity polyurethane pressure equalization buffer layer 293 is glued to the left end of the electric springs 292. The high-elasticity polyurethane pressure equalization buffer layer 293 can easily absorb and equalize the pressure differences caused by the stiffness tolerance of the electric springs 292 themselves, the installation height deviation, or the microscopic unevenness of the cold plate 294.
[0033] A cold plate 294 is fixedly connected to the left end of a high-elasticity polyurethane pressure equalization buffer layer 293. A high-performance phase change thermal conductive pad 295 is fixedly connected to the left end of the cold plate 294. Resistance strain gauges 296 are attached to each of the ±45° directions along the spring wire axis of the electric spring 292. Resistance strain gauges 296 have resistance strain elements inside.
[0034] The electric spring 292 is electrically connected to an external power supply. The outer wall of the cold plate 294 is wrapped with a high thermal conductivity flexible graphene composite material layer 26, a gradient variable stiffness viscoelastic damping layer 27, and a shape memory alloy spring composite bearing layer 28. The liquid inlet pipe 23, the liquid outlet pipe 241, and the side branch pipe 246 are all connected to the cold plate 294.
[0035] In this embodiment: During use, the cold plate 294 receives uniform support preload from the array of electric springs 292 within the mounting housing 291. Simultaneously, the high compressive deformation capacity of the highly elastic polyurethane pressure-equalizing buffer layer 293 absorbs and balances pressure differences caused by variations in the stiffness tolerance of the electric springs 292, installation height deviations, or microscopic unevenness of the cold plate 294. This dynamically compensates for uneven stress distribution at each support point, ensuring a uniform distribution of the total support force on the cold plate 294. This effectively suppresses unintended tilting or warping of the cold plate 294 during compression, maintaining a consistently high level of precision. This ensures that the high-performance phase change thermal pad 295 achieves full-area, stable, and tight adhesion to the CPU / GPU surface, providing a continuous, reliable, and efficient heat conduction path. At the same time, when the electric spring 496 is working, it generates a stress field around it. This stress field affects the resistance value of the resistance strain gauge 296. Then, the resistance strain element inside the resistance strain gauge 296 deforms under the stress, allowing the operator to calculate the length change of the electric spring 496 through the resistance value of the resistance strain gauge 296. This enables real-time monitoring of pressure at various points, verification of pressure equalization effect, and provision of data for health prediction.
[0036] Example 4:
[0037] Please see Figures 6-8 The present invention discloses a quick-release server liquid cooling circulation module and its locking structure. Compared with Embodiment 1, this embodiment further includes a quick-release locking mechanism 210. The quick-release locking mechanism 210 includes a mounting plate 2101. The outer wall of the water cooling head 25 is fixedly connected to the mounting plate 2101. Two sets of pull ropes 2102 are fixedly connected to the center of the left end of the mounting plate 2101. Connecting rods 2103 are fixedly connected to all four sides of the left end of the mounting plate 2101. A turntable 2104 is rotatably connected to the left end of the connecting rods 2103. The pull ropes 2102 are used to prevent the liquid cooling circulation module 2 from falling and being damaged.
[0038] The turntable 2104 has five sets of electromagnetic slots 2105 on its side. The electromagnetic slots 2105 have protruding rods 2106 inside. The left end of the protruding rod 2106 is fixedly connected to an arc-shaped block 2107. The arc-shaped block 2107 is slidably connected to the right end of the insert block 2108. The right end of the main board 3 is fixedly connected to four sets of mating shells 2109. The upper and lower ends of the right side of the mating shell 2109 are fixedly connected to damping rods 21010. The damping rods 21010 are fixedly connected to the triangular block 21011. The damping rods 21010 facilitate the triangular block 21011 to perform a restoring motion.
[0039] An electromagnetic block 21012 is fixedly connected to the left end of the triangular block 21011, and the electromagnetic block 21012 is electrically connected to an external current output device. The left end of the pull rope 2102 is fixedly connected to the main board 3. The electromagnetic block 21012 and the arc-shaped block 2107 are magnetically attracted. The right end of the housing 2109 is provided with a slot to facilitate the insertion of the arc-shaped block 2107, the insert block 2108, and the connecting rod 2103. The electromagnetic block 21012 is convenient for the arc-shaped block 2107 to be magnetically attracted.
[0040] The electromagnetic groove 2105 consists of an arc-shaped slide groove on the side of the turntable 2104 and eight sets of electromagnetic blocks fixedly connected in the arc-shaped slide groove. The electromagnetic blocks are electrically connected to an external current output device. The electromagnetic blocks and the protruding rods 2106 in the electromagnetic groove 2105 are magnetically attracted to each other, and the arc-shaped slide groove and the protruding rods 2106 in the electromagnetic groove 2105 are slidably connected.
[0041] In this embodiment: First, when installing the liquid cooling circulation module 2, an external current output device drives the eight sets of electromagnetic blocks in the electromagnetic groove 2105 to work step by step. This causes the five sets of protruding rods 2106 to be magnetically attracted by the electromagnetic blocks, gradually increasing the distance between the five sets of arc-shaped blocks 2107. Then, the operator moves the connecting rod 2103 to the left via the mounting plate 2101. The connecting rod 2103 drives the turntable 2104, electromagnetic groove 2105, protruding rods 2106, arc-shaped blocks 2107, and insert blocks 2108 to be inserted into the mating shell 2109. The arc-shaped block 2107, in cooperation with the triangular block 21011, compresses the damping rod 21010. When the arc-shaped block 2107 switches from a contact state with the triangular block 21011 to a non-contact state as the insertion depth increases, the damping rod 21010 recovers and stretches, causing the electromagnetic block 21012 to come into contact with the arc-shaped block 2107. The electromagnetic block 21012 is driven to work by the external current output device, so that the electromagnetic block 21012 and the arc-shaped block 2107 are in a magnetic adsorption state, thus completing the installation of the liquid cooling circulation module 2. Secondly, when emergency decoupling is required, the operation of the electromagnetic block 21012 is stopped by the external current output device. At the same time, the external current output device drives the eight sets of electromagnetic blocks in the electromagnetic slot 2105 to work in stages. This causes the five sets of protruding rods 2106 to be magnetically attracted by the electromagnetic blocks, and the distance between the five sets of arc blocks 2107 gradually shortens. This puts the arc blocks 2107 and the electromagnetic block 21012 in a non-contact state and causes them to fall off due to gravity. At the same time as they fall off, the pull rope 2102 prevents the liquid cooling circulation module 2 from falling and being damaged. While ensuring the convenience of quick disassembly for daily maintenance, the mechanical decoupling device is automatically triggered in an emergency to quickly and safely separate the cooling circuit. The pull rope 2102 also prevents the pipes or joints from loosening under accidental conditions such as vibration or misoperation, thereby improving the reliability and emergency response capability of the liquid cooling circulation module 2 under complex working conditions.
[0042] This invention provides an improved quick-release server liquid cooling circulation module and its locking structure. The liquid cooling circulation module 2 improves the dynamic bonding stability and heat conduction uniformity between the internal cold plate 294 of the floating module 29 and the CPU / GPU by performing layered elastic compensation for thermal stress within the module 2. This effectively suppresses the risk of interface loosening or leakage caused by temperature fluctuations and mechanical vibration, enhancing the long-term reliability and thermal management efficiency of the system while ensuring convenient quick-release. A bypass mechanism 24, through a multi-way valve 245 and a bypass pipe 246, circulates the liquid, ensuring that even if the outlet pipe 241 is cut off, a minimum amount of coolant still flows through the internal cold plate of the floating module 29, providing the CPU / GPU with 3-5 minutes of valuable time for safe shutdown or... Switching to a backup path fundamentally avoids thermal runaway; a floating module 29, through the cooperation of an electric spring 292 and a high-elasticity polyurethane pressure equalization buffer layer 293, ensures that the high-performance phase change thermal pad 295 achieves full-area, stable, and tight adhesion to the CPU / GPU surface, providing a continuous, reliable, and efficient heat conduction path; at the same time, resistance strain gauges 296 monitor the pressure at each point in real time, verifying the pressure equalization effect and providing data for health prediction; a quick-release locking mechanism 210 is set up, which ensures convenient disassembly for daily maintenance while automatically triggering a mechanical decoupling device in emergencies, allowing the cooling circuit to be quickly and safely separated, and working with a pull rope 2102 to prevent the pipes or joints from loosening under accidental conditions such as vibration or misoperation, improving the reliability and emergency response capability of the liquid cooling circulation module 2 under complex operating conditions.
[0043] The above description shows and illustrates the basic principles, main features, and advantages of the present invention. Standard parts used in the present invention can be purchased from the market, and irregular parts can be customized according to the description and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts, and equipment adopt conventional models in the prior art, and the circuit connection adopts conventional connection methods in the prior art, which will not be described in detail here.
[0044] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A quick-release server liquid cooling circulation module and its locking structure, comprising a server body (1), wherein a liquid cooling circulation module (2) is fixedly connected to the top of the server body (1), and a motherboard (3) is fixedly connected to the left end of the server body (1). Its features are: The liquid cooling circulation module (2) includes a heat sink (21). The heat sink (21) is fixedly connected to the top of the server body (1). A cooling fan (22) is provided at the bottom of the heat sink (21). The bottom of the heat sink (21) is fixedly connected to one end of the liquid inlet pipe (23). A side support mechanism (24) is fixedly connected to the bottom of the heat sink (21). The outer wall of the liquid inlet pipe (23) is connected to the water cooling head (25). A circulation pump is provided inside the water cooling head (25). (25) A high thermal conductivity flexible graphene composite material layer (26) is provided on the left end. A gradient variable stiffness viscoelastic damping layer (27) is bonded to the left end of the high thermal conductivity flexible graphene composite material layer (26). A shape memory alloy spring composite bearing layer (28) is bonded to the left end of the gradient variable stiffness viscoelastic damping layer (27). A floating module (29) is fixedly connected to the left end of the water cooling head (25). The outer wall of the water cooling head (25) is fixedly connected to the quick-release locking mechanism (210).
2. The quick-release server liquid cooling circulation module and its locking structure according to claim 1, characterized in that: The side branch mechanism (24) includes a liquid outlet pipe (241), the bottom of the heat sink (21) is fixedly connected to the liquid outlet pipe (241), a pressure sensor (242) is fixedly connected to the outside of the liquid outlet pipe (241), a temperature sensor (243) is fixedly connected to the outside of the liquid outlet pipe (241), a first valve (244) is fixedly connected to the delivery port at one end of the liquid outlet pipe (241), the other end of the liquid outlet pipe (241) is connected to one end of a multi-way valve (245), the other end of the multi-way valve (245) is connected to a side branch pipe (246), and a second valve (247) is fixedly connected to the delivery port of the side branch pipe (246).
3. The quick-release server liquid cooling circulation module and its locking structure according to claim 2, characterized in that: The floating module (29) includes a mounting shell (291). The water cooling head (25) is fixedly connected to the mounting shell (291) at its left end. An array of electric springs (292) is provided inside the mounting shell (291). A high-elasticity polyurethane pressure equalization buffer layer (293) is glued to the left end of the electric spring (292). A cold plate (294) is fixedly connected to the left end of the high-elasticity polyurethane pressure equalization buffer layer (293). A high-performance phase change thermal conductive pad (295) is fixedly connected to the left end of the cold plate (294). Resistance strain gauges (296) are glued to each of the ±45° directions of the spring wire axis of the electric spring (292).
4. The quick-release server liquid cooling circulation module and its locking structure according to claim 3, characterized in that: The quick-release locking mechanism (210) includes a mounting plate (2101). The outer wall of the water cooling head (25) is fixedly connected to the mounting plate (2101). Two sets of pull ropes (2102) are fixedly connected to the center of the left end of the mounting plate (2101). Connecting rods (2103) are fixedly connected to all four sides of the left end of the mounting plate (2101). A turntable (2104) is rotatably connected to the left end of the connecting rods (2103). Five electromagnetic slots (2105) are provided on the side of the turntable (2104). A protruding rod (2106) is provided in the electromagnetic slot (2105). An arc-shaped block (2107) is fixedly connected to the left end of the rod (2106). The arc-shaped block (2107) is slidably connected to the right end of the plug block (2108). Four sets of mating shells (2109) are fixedly connected to the right end of the main board (3). Damping rods (21010) are fixedly connected to the upper and lower ends of the right side of the mating shell (2109). The damping rods (21010) are fixedly connected to the triangular block (21011). An electromagnetic block (21012) is fixedly connected to the left end of the triangular block (21011). The electromagnetic block (21012) is electrically connected to the external current output device.
5. The quick-release server liquid cooling circulation module and its locking structure according to claim 4, characterized in that: The outlet pipe (241) is located on the left side of the inlet pipe (23), and the pressure sensor (242) and temperature sensor (243) are both electrically connected to the external display screen.
6. The quick-release server liquid cooling circulation module and its locking structure according to claim 5, characterized in that: The electric spring (292) is electrically connected to an external power supply device. The outer wall of the cold plate (294) is wrapped with a high thermal conductivity flexible graphene composite material layer (26), a gradient variable stiffness viscoelastic damping layer (27), and a shape memory alloy spring composite bearing layer (28).
7. The quick-release server liquid cooling circulation module and its locking structure according to claim 6, characterized in that: The internal circulation pump of the water cooling head (25) is connected to the inlet pipe (23), the outlet pipe (241), and the side branch pipe (246), respectively. The inlet pipe (23), the outlet pipe (241), and the side branch pipe (246) are all connected to the cold plate (294).
8. The quick-release server liquid cooling circulation module and its locking structure according to claim 7, characterized in that: The other end of the side branch pipe (246) is connected to the heat sink (21), and the side branch pipe (246) is located on the left side of the liquid outlet pipe (241).
9. The quick-release server liquid cooling circulation module and its locking structure according to claim 8, characterized in that: The left end of the pull rope (2102) is fixedly connected to the main board (3), the electromagnetic block (21012) and the arc block (2107) are magnetically attracted, and the right end of the mating shell (2109) is provided with a slot for easy insertion of the arc block (2107), the insert block (2108) and the connecting rod (2103).
10. The quick-release server liquid cooling circulation module and its locking structure according to claim 9, characterized in that: The electromagnetic groove (2105) consists of an arc-shaped sliding groove on the side of the turntable (2104) and eight sets of electromagnetic blocks fixedly connected in the arc-shaped sliding groove. The electromagnetic blocks are electrically connected to an external current output device. The electromagnetic blocks in the electromagnetic groove (2105) are magnetically attracted to the protruding rod (2106). The arc-shaped sliding groove in the electromagnetic groove (2105) is slidably connected to the protruding rod (2106).