Automatic clamping wafer magazine

Abstract

The utility model discloses an automatic clamping wafer magazine, which is characterized in that the automatic clamping wafer magazine comprises a synchronous plate rotatably arranged at the bottom of a feeding table, the synchronous plate is connected with a plurality of clamping jaws at the upper part of the feeding table and drives the plurality of clamping jaws to synchronously and linearly move towards a first direction, and the rotating direction of the synchronous plate is a second direction. A butterfly-type synchronous plate is adopted, a sliding groove connecting rod structure is used for synchronously driving a plurality of clamping jaws to move and be fixed through an automatic mechanism, and the working efficiency is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of semiconductor packaging equipment, especially relates to an automatic clamping wafer magazine. BACKGROUND

[0002] In the semiconductor packaging process, the wafer film needs to be fixed accurately in the loading process. In the existing embodiment, the clamping of the film usually relies on manual operation of the clamping jaw for adjustment, such as Figure 1 and Figure 2 Different sizes of film frames 1, 2 are shown, in which case the operator needs to adjust the clamping jaw position one by one according to the wafer size to ensure that the film is accurately fixed, which is not only inefficient, but also prone to uneven clamping force or positioning deviation due to human error, affecting the packaging quality. In addition, frequent manual adjustment may also introduce contamination risk, adversely affecting the clean semiconductor production environment. SUMMARY

[0003] In order to overcome the above-mentioned defects of the prior art, the purpose of the utility model is to provide an automatic clamping wafer magazine to achieve the purpose of automatically clamping the wafer film.

[0004] In order to achieve the above-mentioned purpose, the technical scheme adopted by the utility model is:

[0005] An automatic clamping wafer magazine, comprising a rotating synchronous plate arranged at the bottom of a loading table, the synchronous plate being connected to a plurality of clamping jaws on the upper part of the loading table and driving the plurality of clamping jaws to move synchronously in a straight line towards a first direction, the rotation direction of the synchronous plate being a second direction.

[0006] Further, a plurality of third guide grooves are formed on the loading table, the clamping jaws and the synchronous plate are connected through a pin shaft, the pin shaft passes through the third guide grooves and the second guide grooves on the synchronous plate, the second guide grooves are arc-shaped grooves, and the third guide grooves are straight grooves.

[0007] Further, a plurality of first guide grooves are formed on the loading table, the third guide grooves are located in the first guide grooves and the first guide grooves are in the same direction as the first direction.

[0008] Further, the first direction points to the rotation axis of the synchronous plate.

[0009] Further, a second mounting hole is formed on the synchronous plate, the second mounting hole is used to drive the synchronous plate to rotate and is located at the rotation axis of the synchronous plate.

[0010] Further, a locking block is arranged in the second mounting hole.

[0011] Further, the pin shaft has a first portion and a second portion with different outer diameters.

[0012] The utility model discloses beneficial effect lies in:

[0013] The automatic wafer clamping cartridge provided by the utility model adopts butterfly type synchronous plates, utilizes the sliding slot connecting rod structure to drive multiple clamping claws to move and fix through automatic mechanism synchronous driving, and operation efficiency is improved. BRIEF DESCRIPTION OF DRAWINGS

[0014] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or prior art, below, the drawings needed to be used in the embodiment or prior art description will be simply introduced.

[0015] Figure 1 It is schematic of wafer diaphragm on loading table Figure 1 .

[0016] Figure 2 It is schematic of wafer diaphragm on loading table Figure 1 .

[0017] Figure 3 It is the whole structure schematic diagram of the utility model.

[0018] Figure 4 It is Figure 3 Remove the structure schematic diagram of loading table.

[0019] Figure 5 It is the structure schematic of synchronous plate.

[0020] Figure 6 It is the structure schematic diagram of second mounting hole. DETAILED DESCRIPTION

[0021] In the description of the utility model, need explanation is, the orientation or position relation that the term "upper", "lower", "left", "right", "internal", "external" etc. indicate is based on the orientation or position relation shown in the drawing, and the above description is simplified for the convenience of describing the utility model, and is not indicate or imply that the device or element indicated must have the specific orientation, with specific orientation configuration and operation, therefore can not be understood as the limitation of the utility model.

[0022] In the specification, when one element is located on another element, "fixed" to another element, "connected" to another element, "joined" to another element, etc., the element can be directly located on another element, fixed to another element, connected to another element, joined to another element or contact another element, or there can be intermediate elements.

[0023] It will be understood that, although the terms "first", "second", etc. can be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. Thus, a first element could be termed a second element without departing from the teachings of the present application.

[0024] Exemplary embodiments of the present application will be described herein below with reference to the accompanying drawings. It is to be understood, however, that the application can be presented in many different forms and should not be limited to the embodiments described below. It is also to be understood that the embodiments disclosed herein can be combined in various ways, thereby providing more additional embodiments. In all the drawings, the same reference numerals designate the same or functionally similar elements.

[0025] Reference Figure 3 and Figure 4 An automatic clamping wafer magazine is shown, which comprises a plurality of clamping jaws 20 arranged on a feeding table 10, the clamping jaws 20 being connected to a synchronous plate 40 at the bottom of the feeding table 10 through the feeding table 10, and the synchronous plate 40 is driven to rotate to drive the plurality of clamping jaws 20 to move synchronously, thereby achieving clamping and fixing of wafer membranes of different sizes.

[0026] A first guide groove 11 corresponding to the clamping jaws 20 and pointing to the rotating axis of the synchronous plate 40 is formed on the upper surface of the feeding table 10, and the lower end of the clamping jaw 20 is embedded in the first guide groove 11 so that the clamping jaw 20 can only extend along the length direction of the first guide groove 11. Since the transverse width of the first guide groove 11 is similar to that of the clamping jaw 20, the clamping jaw 20 will not be twisted during movement. A third guide groove 12 is also formed in the first guide groove 11, and the third guide groove 12 passes through the feeding table 10 to make the upper and lower sides of the feeding table 10 communicate with each other. A second guide groove 41 is formed on the synchronous plate 40, and a pin shaft 30 passes through the second guide groove 41 and the third guide groove 12 in sequence and is inserted into the bottom of the clamping jaw 20, thereby forming a connecting rod structure with the synchronous plate 40 and the clamping jaw 20. A first mounting hole 13 is also formed on the feeding table 10, and the synchronous plate 40 is arranged to rotate around the first mounting hole 13 as the axis. The plurality of first guide grooves 11 and the third guide grooves 12 arranged in the first guide grooves 11 are straight guide grooves and are arranged around the first mounting hole 13, so that the clamping jaws 20 are synchronously close to / distant from the axis along the first direction 3 with the guide groove structure, and the axis is the center of the wafer membrane, thereby achieving clamping of the wafer membrane by synchronously changing the position of the clamping jaw 20 in the first guide groove 11. The pin shaft 30 has a first part 31 and a second part 32 with different outer diameters, so that it can only pass through the second guide groove 41 in a specified order, preventing misassembly.

[0027] Reference Figure 5When the magazine works, the synchronization plate 40 rotates along the second direction 4 under the drive of the electric mechanism, the second guide groove 41 is an arc-shaped groove, the extension direction of the second guide groove 41 is the product of the vector direction of the first direction 3 and the second direction 4. Thus, the rotary motion of the synchronization plate 40 is converted into linear motion through the arc-shaped groove and the pin shaft structure, while controlling the synchronous movement of the plurality of clamping jaws 20.

[0028] With reference to Figure 6 In an embodiment, a second mounting hole 42 connected with the driving mechanism is further provided on the synchronization plate 40, and the second mounting hole 42 is coaxial with the first mounting hole 13. A locking block 43 is further fixed in the second mounting hole 42, and the driving shaft of the driving mechanism is inserted into the second mounting hole 42 and fixed in the locking block 43 in interference, so as to assist the positioning of the driving shaft during installation.

Claims

1. An automatic wafer clamping magazine, characterized in that, It includes a rotatable synchronous plate disposed at the bottom of the loading platform. The synchronous plate is connected to several grippers on the upper part of the loading platform and drives the several grippers to move synchronously in a first direction. The rotation direction of the synchronous plate is a second direction.

2. The automatic wafer clamping magazine as described in claim 1, characterized in that, A plurality of third guide grooves are provided on the loading platform. The gripper is connected to the synchronization plate by a pin. The pin passes through the third guide groove and the second guide groove on the synchronization plate. The second guide groove is an arc-shaped groove, and the third guide groove is a straight groove.

3. The automatic wafer clamping magazine as described in claim 2, characterized in that, It also includes a plurality of first guide grooves formed on the loading platform, wherein the third guide groove is located inside the first guide groove and is in the same direction as the first guide groove and the first direction.

4. The automatic wafer clamping magazine as described in claim 2, characterized in that, The first direction points towards the rotation axis of the synchronization plate.

5. An automatic wafer clamping cartridge as described in claim 2, characterized in that, A second mounting hole is also provided on the synchronization plate. The second mounting hole is used to drive the synchronization plate to rotate and is located at the rotation axis of the synchronization plate.

6. The automatic wafer clamping cartridge as described in claim 5, characterized in that, A locking block is also provided in the second mounting hole.

7. An automatic wafer clamping cartridge as described in claim 2, characterized in that, The pin has a first part and a second part with different outer diameters.

Images