Laser cutting equipment for OLED screen processing

Abstract

The utility model discloses laser cutting equipment for OLED (organic light emitting diode) screen processing, which comprises a workbench, a rack and a laser cutting device, the rack is connected with the top of the workbench through an electric slide rail, the laser cutting device is connected with the top of the rack through an electric slide rail, and the laser cutting equipment further comprises a driving assembly and a placing assembly, the placing assembly is arranged on the upper portion of the driving assembly and located below the laser cutting device. According to the scheme, through the arrangement of the collecting disc, waste glass substrates generated by cutting can conveniently fall on a sponge pad in the collecting disc, the waste glass substrates are prevented from being broken, the waste glass substrates are separated and fall off, and subsequent collection is facilitated. The utility model relates to the technical field of laser cutting equipment, and particularly provides laser cutting equipment for processing an OLED (Organic Light Emitting Diode) screen.

Description

TECHNICAL FIELD

[0001] The utility model relates to laser cutting equipment technical field, specifically point to a kind of laser cutting equipment for OLED screen processing. BACKGROUND

[0002] OLED display technology is different from traditional LCD display mode, without backlight, using very thin organic material coating and glass substrate, when there is current, these organic materials will emit light.OLED screen processing, glass substrate needs to be cut.

[0003] Because liquid crystal glass substrate is thin, ordinary cutting mode cannot cut it, easy to damage glass substrate, currently when cutting liquid crystal glass substrate, laser cutting mode is generally used to cut, glass substrate is placed on the placement plate of laser cutting and is positioned, and then controller controls the cutting head of laser cutting to cut glass substrate.

[0004] But in the above method, waste glass after cutting and the glass substrate needed are located on the placement plate, cannot realize the function of glass substrate quick separation, it is inconvenient to take out the glass substrate needed, and waste glass needs to be placed elsewhere, which is not convenient for the centralized collection of waste glass.

[0005] Therefore, we propose a kind of laser cutting equipment for OLED screen processing. INVENTION CONTENTS

[0006] In view of the above situation, in order to overcome the defects of prior art, the utility model provides a kind of laser cutting equipment for OLED screen processing.

[0007] The technical scheme adopted by the utility model is as follows: the utility model discloses a kind of laser cutting equipment for OLED screen processing, including workbench, rack and laser cutting device, the rack is connected with the top of workbench by electric slide rail, the laser cutting device is connected with the top of rack by electric slide rail, further include driving assembly and placement assembly, the placement assembly is located in the upper portion of driving assembly, the placement assembly is below laser cutting device.

[0008] Further, the driving assembly includes motor, support plate, screw rod, guide rod and horizontal plate, the support plate is symmetrically arranged on the top of workbench, the motor is fixedly arranged on one of the support plates, the screw rod is rotatably arranged between the two support plates by bearing, the output end of the motor is fixedly connected with one end of the screw rod, the guide rod is fixedly arranged between the two support plates and located on one side of the screw rod, the horizontal plate is threadedly connected with the screw rod and slidably connected with the guide rod, and the placement assembly is arranged on the top of the horizontal plate.

[0009] Further, the placing assembly comprises a fixed column, a mounting plate and electric suction cups, the fixed column is fixedly arranged on the top of the horizontal plate, the mounting plate is fixedly arranged on the top of the fixed column, and the electric suction cups are arranged on the mounting plate.

[0010] Further, the placing assembly further comprises a collecting disc, the collecting disc is rotatably sleeved on the fixed column through a bearing, the collecting disc is located above the horizontal plate and below the mounting plate.

[0011] Further, the driving assembly further comprises a long strip rod, the long strip rod is fixedly arranged between the two groups of supporting plates, a gear rack is fixedly arranged on the side wall of the long strip rod, a gear is fixedly arranged on the bottom of the collecting disc, the gear is coaxial with the fixed column and located outside the fixed column, and the gear rack and the gear are intermittently engaged.

[0012] Further, sponge pads are arranged on the inner bottom wall and the circumferential inner wall of the collecting disc.

[0013] The laser cutting equipment for OLED screen processing has the following beneficial effects: the waste glass substrate generated by cutting can fall on the sponge pads in the collecting disc, the waste glass substrate is separated and falls off, and the subsequent collection is facilitated; the horizontal plate moves to drive the gear to move synchronously, when the gear is engaged with the gear rack on the long strip rod, the gear is driven to rotate, and then the collecting disc is driven to rotate, the centrifugal force generated by the rotation of the collecting disc moves the waste glass substrate in the collecting disc to the periphery, the waste glass substrate is away from the glass substrate on the electric suction cup, the glass substrate on the electric suction cup is avoided from being shielded, and the worker is facilitated to take out the waste glass substrate from the collecting disc. BRIEF DESCRIPTION OF DRAWINGS

[0014] The accompanying drawings are used to provide a further understanding of the present application, and constitute a part of the specification, and are used to explain the present application together with embodiments of the present application, and do not constitute a limitation to the present application. In the drawings:

[0015] Figure 1 It is a schematic diagram of the overall structure of the present application;

[0016] Figure 2 It is a schematic diagram of the overall structure of the present application;

[0017] Figure 3 It is a schematic diagram of the overall structure of the present application;

[0018] Figure 4 It is a schematic diagram of the overall structure of the present application;

[0019] Figure 5A perspective view of the placement assembly from another angle;

[0020] Figure 6 A perspective view of the driving assembly.

[0021] Wherein, 1, workbench, 2, rack, 3, driving assembly, 4, placement assembly, 5, laser cutting device, 6, glass substrate, 31, motor, 32, support plate, 33, screw rod, 34, guide rod, 35, horizontal plate, 41, fixed column, 42, mounting plate, 43, electric suction cup, 44, collection disc, 45, long rod, 46, rack, 47, gear, 48, sponge pad. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0023] As shown in Figures 1-6 The utility model discloses a laser cutting equipment for OLED screen processing, including workbench 1, rack 2 and laser cutting device 5, rack 2 is connected through motorized slide rail with the top of workbench 1, and laser cutting device 5 is connected through motorized slide rail with the top of rack 2, still including driving assembly 3 and placement assembly 4, placement assembly 4 is located in the upper portion of driving assembly 3, and placement assembly 4 is below laser cutting device 5.

[0024] As shown in Figures 1-6 Driving assembly 3 includes motor 31, support plate 32, screw rod 33, guide rod 34 and horizontal plate 35, support plate 32 is symmetrically arranged on the top of workbench 1, motor 31 is fixedly arranged on one group of support plate 32, screw rod 33 is rotatably arranged between two groups of support plate 32 through bearing, the output end of motor 31 is fixedly connected with one end of screw rod 33, guide rod 34 is fixedly arranged between two groups of support plate 32 and is located on the side of screw rod 33, horizontal plate 35 is threadedly connected with screw rod 33 and is slidably connected with guide rod 34, and placement assembly 4 is arranged on the top of horizontal plate 35.

[0025] As shown in Figures 1-6 Placement assembly 4 includes fixed column 41, mounting plate 42 and electric suction cup 43, fixed column 41 is fixedly arranged on the top of horizontal plate 35, mounting plate 42 is fixedly arranged on the top of fixed column 41, and electric suction cup 43 is distributed on mounting plate 42.

[0026] As shown in Figures 1-6As shown, the placing assembly 4 further comprises a collecting disc 44 which is rotatably sleeved on the fixed column 41 through a bearing, the collecting disc 44 is located above the horizontal plate 35 and below the mounting plate 42, and sponge pads 48 are arranged on the inner bottom wall and the circumferential inner wall of the collecting disc 44.

[0027] As shown, the driving assembly 3 further comprises a long rod 45 which is fixed between the two groups of support plates 32, a rack 46 is fixed on the side wall of the long rod 45, a gear 47 is fixed at the bottom of the collecting disc 44, the gear 47 is coaxial with the fixed column 41 and located outside the fixed column 41, and the rack 46 is intermittently engaged with the gear 47. Figures 1-6

[0028] In specific use, the glass substrate 6 to be processed is fixed through the electric suction disc 43, the position of the laser cutting device 5 in the left-right direction and the front-back direction can be controlled through the electric sliding rail on the workbench 1 and the electric sliding rail on the rack 2, so that the four edges of the glass substrate 6 to be processed can be cut; the waste glass substrate 6 generated by cutting will fall on the sponge pads 48 inside the collecting disc 44, preventing the waste glass substrate 6 from breaking, separating and falling, which facilitates subsequent collection; the electric sliding rail and the electric suction disc 43 are prior art.

[0029] When the motor 31 is started, the screw rod 33 is driven to rotate, and the horizontal plate 35 is driven to move, when the horizontal plate 35 moves, the gear 47 is synchronously driven to move, when the gear 47 is engaged with the rack 46 on the long rod 45, the gear 47 is driven to rotate, and the collecting disc 44 is driven to rotate, the centrifugal force generated by the rotation of the collecting disc 44 causes the waste glass substrate 6 inside the collecting disc 44 to move to the periphery, so that the waste glass substrate 6 moves away from the glass substrate 6 on the electric suction disc 43, avoiding the glass substrate 6 on the electric suction disc 43 from blocking and affecting the worker from taking out the waste glass substrate 6 from the collecting disc 44; the gear 47 is arranged at the middle position of the long rod 45.

[0030] In addition, it should be noted that when the collecting disc 44 rotates, the mounting plate 42 does not rotate, and the glass substrate 6 on the electric suction disc 43 also does not rotate, so that the falling position of the waste glass substrate 6 cut off can be switched, preventing the waste glass substrate 6 from being stacked at the same position inside the collecting disc 44, which is easy to cause the waste glass substrate 6 to collide and break.

[0031] In addition, it should be understood that although the present specification is described in terms of embodiments, not every embodiment contains only one independent technical solution, and the specification is described in this way only for the sake of clarity, and those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can be appropriately combined to form other embodiments that those skilled in the art can understand.​

Claims

1. A laser cutting apparatus for processing an OLED screen, characterized by: The utility model provides a laser cutting device, including workbench, frame and laser cutting device, the frame is connected through electric slide rail with workbench top, laser cutting device is connected through electric slide rail with frame top, still include drive assembly and placing assembly, placing assembly locates drive assembly upper portion, placing assembly is below laser cutting device; The drive assembly includes motor, support plate, screw rod, guide rod and horizontal plate, the support plate is symmetrically equipped on the top of the workbench, the motor is fixedly arranged on one of the support plates, the screw rod is rotatably arranged between the two support plates through a bearing, the output end of the motor is fixedly connected with one end of the screw rod, the guide rod is fixedly arranged between the two support plates and located on one side of the screw rod, the horizontal plate is threadedly connected with the screw rod and slidably connected with the guide rod, and the placing assembly is arranged on the top of the horizontal plate; The placing assembly includes a fixed column, a mounting plate and an electric suction cup, the fixed column is fixedly arranged on the top of the horizontal plate, the mounting plate is fixedly arranged on the top of the fixed column, and the electric suction cup is distributed on the mounting plate. The placing assembly further includes a collecting disc, the collecting disc is rotatably sleeved on the fixed column through a bearing, the collecting disc is located above the horizontal plate and below the mounting plate.

2. The laser cutting apparatus for processing an OLED screen according to claim 1, wherein: The drive assembly further includes a long rod, the long rod is fixedly arranged between the two support plates, a gear rack is fixedly arranged on the side wall of the long rod, a gear is fixedly arranged on the bottom of the collecting disc, the gear is coaxial with the fixed column and located outside the fixed column, and the gear rack is intermittently engaged with the gear.

3. The laser cutting apparatus for processing OLED screen according to claim 1, characterized in that: The inside bottom wall and the circumferential inner wall of the collecting disc are both provided with sponge pads.

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