Glass wafer precision machining device

Abstract

The utility model discloses a glass wafer precision machining device, and particularly relates to the technical field of glass wafer machining, which comprises a base, a support frame fixedly connected to the top end of the base, a first electric push rod fixedly connected to the top end of the support frame, a connecting box fixedly connected to the output end of the first electric push rod, and a first variable frequency motor mounted in the connecting box. The output end of the first variable frequency motor is fixedly connected with a grinding disc, a feeding assembly and a limiting mechanism are installed on the inner side of the base, and the limiting mechanism is installed on one side of the feeding assembly. By arranging the feeding assembly and the limiting mechanism, feeding and taking work can be completed at the same time when the quartz glass wafer is machined, so that continuous feeding is achieved, the shutdown waiting time caused by single feeding is shortened, meanwhile, displacement of the quartz glass wafer caused by cutting force of a grinding disc in the grinding process can be reduced, and the grinding quality of the quartz glass wafer is improved. And the machining and grinding precision can be improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to glass wafer processing technical field more specifically, the utility model relates to a glass wafer precision machining device. BACKGROUND

[0002] Quartz glass is widely used in semiconductor integrated circuit industry due to its good performance, and wafer is the core of semiconductor integrated circuit. Photolithography technology has become the main method of producing wafer due to its good technical characteristics. Quartz glass wafer refers to the semiconductor integrated circuit product processed by photolithography technology.

[0003] The existing quartz glass wafer precision machining device is inconvenient to observe the thickness of the quartz glass wafer polished by the grinding disc, and cannot stop the polishing and polishing of the quartz glass wafer in time, affecting the polishing precision of the quartz glass wafer.

[0004] According to the search, the quartz glass wafer precision machining device disclosed in the Chinese patent with the publication number CN212145960U can obtain the thickness of the polished quartz glass wafer by observing the displacement of the limiting rod on the scale, which is convenient to observe the thickness of the quartz glass wafer polished by the grinding disc, can stop the polishing and polishing of the quartz glass wafer in time, and avoids affecting the polishing precision of the quartz glass wafer.

[0005] The quartz glass wafer precision machining device described above is inconvenient to use in practice. During the processing of the quartz glass wafer, manual single feeding is required, which leads to the need to wait for the polishing to be completed before taking it out and continuing to feed. The process of stopping and re-feeding consumes a lot of time, resulting in a decrease in overall production efficiency. UTILITY MODEL CONTENTS

[0006] In order to overcome the above-mentioned defects of the prior art, the utility model provides a glass wafer precision machining device to solve the problems raised in the background art.

[0007] In order to achieve the above-mentioned purpose, the utility model provides the following technical scheme:

[0008] A glass wafer precision machining device, comprising a base, the top end of the base is fixedly connected with a support frame, the top end of the support frame is fixedly connected with a first electric push rod, the output end of the first electric push rod is fixedly connected with a connecting box, the inside of the connecting box is installed with a first frequency conversion motor, the output end of the first frequency conversion motor is fixedly connected with a grinding disc, the inside of the base is installed with a feeding assembly and a limiting mechanism, the limiting mechanism is installed on one side of the feeding assembly;

[0009] The feeding assembly comprises a second variable frequency motor, the second variable frequency motor is installed in the base, a first gear is fixedly connected to the output end of the second variable frequency motor, a second gear is engaged on one side of the first gear, the second gear is rotatably connected to the inside of the base, a rotating disc is engaged on the outside of the second gear, a plurality of suction cups are fixedly connected to the upper surface of the rotating disc, a conveying box is fixedly connected to one side of the supporting frame, a feeding cylinder is communicated with the top end of the conveying box, a second electric push rod is fixedly connected to one side of the suction cup, a pushing ring is fixedly connected to the output end of the second electric push rod, the pushing ring is slidably connected to the inside of the pushing ring, a gas cylinder is fixedly connected to the top end of the conveying box, a pressing disc is fixedly connected to the output end of the gas cylinder, and the pressing disc is slidably connected to the inside of the conveying box.

[0010] By adopting the above technical scheme, continuous feeding of the wafer can be realized, and downtime waiting time caused by single feeding can be reduced.

[0011] As a further description of the above technical scheme, the limiting mechanism comprises a third electric push rod, the third electric push rod is fixedly connected to one side of the base, a connecting frame is fixedly connected to the output end of the third electric push rod, a sliding block is fixedly connected to one side of the connecting frame, a guide column is slidably connected to the inside of the sliding block, the guide column is fixedly connected to the inside of the supporting frame, a stepping motor is fixedly connected to the other side of the connecting frame, a bidirectional screw rod is fixedly connected to the output end of the stepping motor, the screw rod is rotatably connected to the inside of the connecting frame, a clamping rod is threadedly connected to the outside of the bidirectional screw rod, and a clamping block is fixedly connected to one side of the clamping rod.

[0012] By adopting the above technical scheme, the quartz glass wafer can be stably positioned during polishing, so as to reduce the displacement of the quartz glass wafer during processing.

[0013] The technical effects and advantages of the utility model are as follows:

[0014] 1. By setting the feeding assembly, compared with the prior art, the quartz glass wafer is indirectly pushed by the pushing ring, and the rotating disc can stably rotate, so that the feeding and taking work can be completed at the same time during the processing of the quartz glass wafer, thereby realizing continuous feeding, reducing downtime waiting time caused by single feeding, and being beneficial to improve the processing efficiency.

[0015] 2. By setting the limiting mechanism, compared with the prior art, the arc on one side of the clamping block can adapt to wafers of different sizes, and the relative movement of the two clamping rods can stably clamp and position the quartz glass wafer, so as to reduce the displacement of the quartz glass wafer caused by the cutting force of the grinding disc during polishing, and be beneficial to improve the processing and polishing precision. DRAWINGS

[0016] Figure 1It is the whole structure schematic view of the utility model.

[0017] Figure 2 It is the base rear side structure schematic view of the utility model.

[0018] Figure 3 It is the first gear and second gear structure schematic view of the utility model.

[0019] Figure 4 It is the base section view structure schematic view of the utility model.

[0020] Figure 5 It is the turntable structure schematic view of the utility model.

[0021] Figure 6 It is the conveying box internal structure schematic view of the utility model.

[0022] Figure 7 It is the connecting frame structure schematic view of the utility model.

[0023] The figure mark is: 1, base;2, support frame;3, first electric push rod;4, connecting box;5, first variable frequency motor;6, grinding disc;7, second variable frequency motor;8, first gear;9, second gear;10, toothed disc;11, turntable;12, sucking disc;13, conveying box;14, feeding cylinder;15, second electric push rod;16, push ring;17, air cylinder;18, pressing disc;19, third electric push rod;20, connecting frame;21, sliding block;22, guide column;23, stepping motor;24, bidirectional screw;25, clamping rod;26, clamping block. DETAILED DESCRIPTION

[0024] The technical scheme in the embodiments of the utility model will be described clearly and completely below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0025] The embodiment of the application discloses a kind of glass wafer precision machining devices as shown in Figures 1-6 It includes base 1, base 1 top end fixedly connected with support frame 2, support frame 2 top end fixedly connected with first electric push rod 3, first electric push rod 3 output end fixedly connected with connecting box 4, connecting box 4 inside installation has first variable frequency motor 5, first variable frequency motor 5 output end fixedly connected with grinding disc 6, base 1 inner side installation has feeding assembly and limiting mechanism, limiting mechanism is installed in feeding assembly side;

[0026] The feeding assembly comprises a second variable frequency motor 7 installed inside the base 1, a first gear 8 fixedly connected to the output end of the second variable frequency motor 7, a second gear 9 meshing one side of the first gear 8, the second gear 9 being rotatably connected inside the base 1, a turntable 11 meshing the outer side of the second gear 9, a plurality of suction cups 12 fixedly connected to the upper surface of the turntable 11, a conveying box 13 fixedly connected to one side of the support frame 2, a feeding cylinder 14 communicated with the top end of the conveying box 13, a second electric push rod 15 fixedly connected to one side of the suction cup 12, a push ring 16 fixedly connected to the output end of the second electric push rod 15, the push ring 16 being slidably connected to the inner side of the push ring 16, a pneumatic cylinder 17 fixedly connected to the top end of the conveying box 13, a pressing disc 18 fixedly connected to the output end of the pneumatic cylinder 17, the pressing disc 18 being slidably connected to the inner side of the conveying box 13, the push ring 16 can push the quartz glass crystal inside the conveying box 13, so that the quartz glass crystal falls through the opening below the conveying box 13 to the upper surface of the turntable 11, and the pneumatic cylinder 17 pushes the pressing disc 18 to move downward, so that the pressing disc 18 presses the quartz glass crystal, so that the suction cup 12 can adsorb the lower surface of the quartz glass crystal, the second variable frequency motor 7 meshes to drive the first gear 8 to rotate, so that the first gear 8 meshes the second gear 9 to rotate, so that the second gear 9 can mesh to drive the gear disc 10 to rotate, so that the turntable 11 can stably rotate, the turntable 11 can drive a plurality of quartz glass crystals to rotate, the rotation of the turntable 11 can synchronize the feeding and taking work during the processing of the quartz glass wafer, which can reduce the downtime waiting time caused by single feeding, and is helpful to improve the processing efficiency.

[0027] Referring to Figure 1 and 7 , the limiting mechanism comprises a third electric push rod 19 fixedly connected to one side of the base 1, a connecting frame 20 fixedly connected to the output end of the third electric push rod 19, a sliding block 21 fixedly connected to one side of the connecting frame 20, a guide column 22 slidably connected to the inner side of the sliding block 21, the guide column 22 being fixedly connected to the inner side of the support frame 2, a stepping motor 23 fixedly connected to the other side of the connecting frame 20, a bidirectional screw rod 24 fixedly connected to the output end of the stepping motor 23, the bidirectional screw rod 24 being rotatably connected inside the connecting frame 20, a clamping rod 25 threadedly connected to the outer side of the bidirectional screw rod 24, a clamping block 26 fixedly connected to one side of the clamping rod 25, the guide column 22 can provide a guiding action for the movement of the connecting frame 20, the opposite thread directions of the outer side of the bidirectional screw rod 24 can drive the two clamping rods 25 to move relatively through the threads, so that the two clamping rods 25 drive the clamping block 26 to clamp the quartz glass wafer, which can reduce the displacement of the quartz glass wafer caused by the cutting force of the grinding disc 6 during the grinding process, and is helpful to improve the processing and grinding precision.

[0028] Working principle of this utility model: This utility model designs a precision processing device for glass wafers, the specific structure of which is shown in the attached instruction manual. Figures 1-6 As shown, in this technical solution, through the cooperation between various structures, when grinding quartz glass wafers is required, the quartz glass wafers are first stacked in the feed cylinder 14. When feeding the quartz glass wafers, the second electric push rod 15 is activated, which pushes the push ring 16 to move inside the conveyor box 13. This allows the push ring 16 to push the quartz glass wafers inside the conveyor box 13, thereby pushing the quartz glass wafers from the bottom opening of the conveyor box 13 to above the turntable 11. Then, the cylinder 17 is activated, using air... Cylinder 17 pushes the pressing plate 18 down, allowing it to press the quartz glass wafer so that the suction cup 12 can adhere to the lower surface of the quartz glass wafer. Then, the second variable frequency motor 7 is activated, driving the first gear 8 to rotate. The first gear 8 meshes with and drives the second gear 9 to rotate, which in turn drives the gear disc 10 to rotate, ensuring the turntable 11 rotates stably. The turntable 11 rotates the quartz glass wafer to below the grinding disc 6. Then, the third electric push rod 19 is activated, utilizing... The third electric push rod 19 pulls the connecting frame 20 downwards. The slider 21 slides against the outer side of the guide post 22, allowing the connecting frame 20 to move stably downwards. This brings the two guide posts 22 into contact with the upper surface of the turntable 11. Then, the stepper motor 23 is activated, driving the bidirectional screw 24 to rotate. The opposite thread direction on the outer side of the bidirectional screw 24 drives the two clamping rods 25 to move relative to each other. This allows the clamping rods 25 to move the clamping block 26 to clamp and limit the movement of the quartz glass wafer. Then, the first electric push rod 3 is activated, which pushes the connecting box 4 downward so that the grinding disc 6 can contact the upper surface of the quartz glass wafer. The first variable frequency motor 5 is then activated, which drives the grinding disc 6 to rotate so that the grinding disc 6 can complete the grinding work. After the grinding is completed, the second variable frequency motor 7 is activated so that the turntable 11 can rotate and rotate the un-grinded quartz glass wafer to below the grinding disc 6. At this time, the push ring 16 can be activated to continue feeding, and the ground quartz glass wafer can be removed.

[0029] In the accompanying drawings of the embodiments disclosed in this utility model, only the structures involved in the embodiments of this utility model are shown. Other structures can be referred to with ordinary design. In the absence of conflict, the same embodiment and different embodiments of this utility model can be combined with each other.

[0030] The contents not described in the specification are all the prior art known by the person skilled in the art, and the model parameters of the electric appliances are not specifically limited, and the conventional equipment can be used, in the technical scheme, the electric appliance control elements not mentioned belong to the prior art, so the figure is not shown, and here is not described again;

[0031] Finally: the above is only the preferred embodiment of the utility model, and is not used for limiting the utility model, any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model should be included in the protection scope of the utility model.

Claims

1. A glass wafer precision processing device comprising a base (1), characterized in that: The base (1) top fixedly connected with support frame (2), the support frame (2) top fixedly connected with the first electric push rod (3), the first electric push rod (3) output end fixedly connected with the connection box (4), the connection box (4) is installed with first variable frequency motor (5) inside, the first variable frequency motor (5) output end fixedly connected with grinding disc (6), the base (1) inside installation and limit mechanism, the limit mechanism installation on one side of feeding assembly, The feeding assembly comprises a second variable frequency motor (7), the second variable frequency motor (7) is installed in the base (1), the second variable frequency motor (7) output end fixedly connected with first gear (8), the first gear (8) one side is engaged with second gear (9), the second gear (9) is rotatably connected with the base (1) inside, the second gear (9) outside is engaged with rotary table (11), the rotary table (11) upper surface fixedly connected with a plurality of suction cups (12).

2. The glass wafer precision processing apparatus according to claim 1, characterized by: The support frame (2) one side fixedly connected with conveying box (13), the conveying box (13) top intercommunication has feeding cylinder (14).

3. The glass wafer precision processing apparatus according to claim 2, characterized by: The suction cup (12) one side fixedly connected with the second electric push rod (15), the second electric push rod (15) output end fixedly connected with push ring (16), the push ring (16) and push ring (16) inside slide connection.

4. The glass wafer precision processing apparatus according to claim 2, characterized by: The conveying box (13) top fixedly connected with pneumatic cylinder (17), the pneumatic cylinder (17) output end fixedly connected with pressing disc (18), the pressing disc (18) and conveying box (13) inside slide connection.

5. The glass wafer precision processing apparatus according to claim 1, characterized by: The limit mechanism comprises a third electric push rod (19), the third electric push rod (19) and base (1) one side fixedly connected, the third electric push rod (19) output end fixedly connected with connecting frame (20).

6. The glass wafer precision processing apparatus according to claim 5, characterized by: The connecting frame (20) one side fixedly connected with sliding block (21), the sliding block (21) inside slide connection has guide column (22), the guide column (22) and support frame (2) inside fixedly connected, the other side of connecting frame (20) fixedly connected with stepper motor (23).

7. The glass wafer precision processing apparatus according to claim 6, characterized by: The stepper motor (23) output end fixedly connected with bidirectional screw rod (24), the bidirectional screw rod (24) and connecting frame (20) inside rotatably connected, the bidirectional screw rod (24) outside thread connection has clamping rod (25), the clamping rod (25) one side fixedly connected with clamping block (26).

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