Wafer box detection device

Abstract

The utility model discloses a wafer box detection device. The wafer box detection device comprises a base and a test frame, the base is used for placing a wafer box; the testing frame comprises a vertical piece and a horizontal piece; the horizontal piece is provided with one or more test surfaces, and the test surfaces are used for detecting the thickness of a support bulge of the wafer box; the horizontal piece is installed on the vertical piece, the vertical piece is installed on the base and used for setting the height range of the testing face, and the height range is related to the qualified range of the thickness of the supporting protrusion. The device judges whether the thickness is qualified or not by detecting whether the supporting protrusions are in the height range of the testing faces or not, detection can be conducted only by moving the to-be-detected supporting protrusions of the wafer box to the corresponding testing faces, the structure is simple, cost is low, and efficiency is high.

Description

TECHNICAL FIELD

[0001] The utility model relates to container detection technical field especially relates to a wafer box detection device. BACKGROUND

[0002] Wafer box is used for the container of accomodating and transporting wafer. In order to avoid the mutual friction of wafer in the process of handling, transportation etc. cause pollution, therefore sets up corresponding multiple parallel support plate on two opposite inner side walls of wafer box respectively. Wafer is placed between two support plates, for isolating adjacent wafer, reduces the pollution damage risk caused by wafer mutual friction. At the same time, in the process of handling and transportation, the support plate and wafer contact friction can also bring pollution, in order to improve the cleanliness of wafer, sets up multiple horizontal support protrusions on the support plate, wafer contacts with support protrusion, reduces the support contact area, thereby reduces the pollution risk, improves the yield.

[0003] Support protrusion needs to keep the same or similar thickness, especially the support protrusion on the same support piece, otherwise wafer can not be put into wafer box completely, or put into wafer and shake and rub with other wafers and the problem of wafer not flat causes self sliding, thereby brings damage. Since the support piece is balanced with each other, therefore the height of the support protrusion of the support piece needs to be detected to judge whether the thickness of the support protrusion is qualified. Detecting support protrusion needs high-precision detection equipment, at present, high-precision automatic detection equipment is used for detection, and the structure is complex, and the manufacturing and maintenance cost is high. SUMMARY

[0004] In order to reduce wafer box detection cost and reduce the complexity of structure, the utility model provides a wafer box detection device.

[0005] Based on the above purpose, the utility model provides a wafer box detection device, including: including: base and test frame;The base is used for placing wafer box;The test frame includes: vertical piece and horizontal piece;The horizontal piece is provided with one or more test surfaces, and the test surface is used for detecting the thickness of the support protrusion of wafer box;The horizontal piece is installed on the vertical piece, and the vertical piece is installed on the base and is used for setting the height range of the test surface, and the height range is related to the qualified range of support protrusion thickness.

[0006] Optionally, the base includes: carrier plate and bottom plate;The carrier plate is arranged on the bottom plate and is used for placing and fixing wafer box;The test frame is arranged on the bottom plate.

[0007] Optionally, the carrier plate includes: positioning column;The positioning column is matched with the positioning structure of the wafer box and is used for positioning and fixing the wafer box.

[0008] Optionally, the bottom plate comprises a first step body and a second step body; the second step body is higher than the first step body; the carrier plate is movably placed on the first step body; the test frame is arranged on the second step body; the height of the carrier plate after being placed on the first step body is the same as the height of the second step body.

[0009] Optionally, the second step body comprises a first T-shaped groove and a first sliding rail; the vertical member is installed on the first T-shaped groove and can slide along the first sliding rail.

[0010] Optionally, the horizontal member comprises a pushing member and a horizontal rod; the test surface is arranged on the pushing member, and the pushing member is installed on the horizontal rod; the horizontal rod is installed on the vertical member and the height of the test surface is set by setting the height of the horizontal rod on the vertical member.

[0011] Optionally, the pushing member comprises a mounting block and a test block; the mounting block is connected with the test block, and the mounting block is installed on the horizontal rod; the test block is used for detecting the thickness of the supporting protrusion of the wafer box.

[0012] Optionally, the test block comprises a third step body and a fourth step body; the third step body and the fourth step body are connected with the mounting block, and the fourth step body is used for detecting the thickness of the supporting protrusion.

[0013] Optionally, the surface of the fourth step body facing the surface of the supporting member on which the supporting protrusion is located is the test surface; the test block realizes the detection of whether the thickness of the supporting protrusion is within the qualified range by adjusting the height range of the test surface.

[0014] Optionally, the maximum height value and the minimum height value of the test surface are set according to the qualified range of the thickness of the supporting protrusion of the wafer box; the test surface with the maximum height value and the test surface with the minimum height value are formed by one detection device or two detection devices.

[0015] The utility model has the following beneficial effects:

[0016] 1、The wafer box detection device detects the thickness of the supporting protrusion through the test surface of the horizontal member of the test frame, adjusts the height range of the test surface through the vertical member, and determines whether the thickness is qualified by detecting whether the supporting protrusion is within the height range of the test surface, so that the wafer box to be detected is only needed to be moved to the corresponding test surface for detection, and the structure is simple, the cost is low, and the efficiency is high.

[0017] The pushing member is installed on the horizontal rod through the mounting block, and the step structure of the third step body and the fourth step body is adopted to avoid the supporting member in the wafer box and complete the thickness detection of the supporting protrusion, so that the structure is simple and the detection is convenient. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 is a structure schematic view of a wafer box detection device provided by an embodiment of the present application;

[0019] Figure 2 is another view structure schematic view of a carrier plate of a wafer box detection device provided by an embodiment of the present application;

[0020] Figure 3 is an explosion structure schematic view of a test frame provided by an embodiment of the present application;

[0021] Figure 4 is a structure schematic view of a push member provided by an embodiment of the present application;

[0022] Figure 5 is a cross-sectional structure schematic view of a wafer box detection device and a wafer box provided by an embodiment of the present application.

[0023] Explanation of reference numerals:

[0024] 1, base; 11, carrier plate; 111, positioning column; 112, foot pad; 113, weight-reducing groove; 12, bottom plate; 121, first step body; 122, second step body; 1221, first T-shaped groove; 1222, second slide rail;

[0025] 2, test frame; 21, vertical member; 211, first slide block; 212, vertical rod; 2121, second T-shaped groove; 2122, second slide rail; 2123, through hole; 22, horizontal member; 221, push member; 2211, mounting block; 2212, test block; 22121, third step body; 22122, fourth step body; 22123, surface; 222, horizontal rod; 2221, mounting groove; 223, mounting seat; 2231, second slide block; 2232, mounting body;

[0026] 3, wafer box; 31, supporting protrusion; 32, supporting member. DETAILED DESCRIPTION

[0027] In order to make the above objectives, features and advantages of the present application more apparent, specific embodiments of the present application will be described in detail below with reference to the accompanying drawings. In the following description, a large number of specific details are set forth in order to provide a thorough understanding of the present application. However, the present application can be implemented in many different ways other than those described herein, and those skilled in the art can make similar improvements without departing from the spirit of the present application, so the present application is not limited to the specific embodiments disclosed below.

[0028] Reference Figures 1-5The utility model provides a wafer box detection device, including: base 1 and test frame 2, the base 1 is used to place wafer box 3, the test frame 2 is installed on base 1, is used to detect the thickness of the support protrusion 31 of wafer box 3.

[0029] The base 1 includes: a carrier plate 11 and a base plate 12, the carrier plate 11 is arranged on the base plate 12 for placing and fixing the wafer box 3, and the test frame 2 is arranged on the base plate 12, the carrier plate 11 and the base plate 12 are arranged separately to place, remove and detect the wafer box 3.

[0030] The carrier plate 11 includes: a positioning column 111, the positioning column 111 is matched with the positioning structure of the wafer box 3 for positioning and fixing the wafer box 3, and the positioning column 111 is arranged on the upper surface of the carrier plate 11.

[0031] Further, the carrier plate 11 further includes: a foot pad 112 and a weight-reducing groove 113, the foot pad 112 and the weight-reducing groove 113 are arranged on the bottom surface of the carrier plate 11, the foot pad 112 is used to increase the height and friction of the carrier plate 11, and the weight-reducing groove 113 is used to reduce the weight of the carrier plate 11.

[0032] The base plate 12 includes: a first step body 121 and a second step body 122, the second step body 122 is higher than the first step body 121, the carrier plate 11 can be movably placed on the first step body 121, and the test frame 2 is arranged on the second step body 122, further, after the carrier plate 11 is placed on the first step body 121, the height of the carrier plate 11 is the same as the height of the second step body 122 to provide detection accuracy.

[0033] Further, the second step body 122 includes: a first T-shaped groove 1221 and a first sliding rail 1222, the test frame 2 is installed on the first T-shaped groove 1221 and can slide along the first sliding rail 1222.

[0034] The test frame 2 includes: a vertical piece 21 and a horizontal piece 22, the horizontal piece 22 is provided with one or more test surfaces, the test surfaces are used to detect the thickness of the support protrusion 31 of the wafer box 3, the horizontal piece 22 is installed on the vertical piece 21, the vertical piece 21 is installed on the base 1 and is used to set the height range of the test surfaces, and the height range is related to the qualified range of the thickness of the support protrusion (31), specifically, the vertical piece 21 is installed on the first T-shaped groove 1221 and can slide along the first sliding rail 1222, and the number of the vertical piece 21 and the horizontal piece 22 is one or more, and in the embodiment, the number of the vertical piece 21 and the horizontal piece 22 is two.

[0035] The horizontal piece 22 comprises a pushing piece 221 and a horizontal rod 222; the pushing piece 221 is installed on the horizontal rod 222; the horizontal rod 222 is installed on the vertical piece 21. The pushing pieces 221 on the same horizontal rod 222 are at least one and are arranged at intervals; the number and interval distance of the pushing pieces 221 are the same as the number and interval distance of the supporting protrusions 31 of the wafer box 3 on the same supporting piece 32. The number of the horizontal rods 221 of the same horizontal piece 22 is determined by the detection accuracy required by those skilled in the art, and the more the number of the horizontal rods 221, the more the number of the supporting protrusions 31 that can be detected at the same time.

[0036] The horizontal piece 22 further comprises a mounting seat 223; the horizontal rod 222 is installed on the vertical piece 21 through the mounting seat 223, and the height of the horizontal rod 222 on the vertical piece 21, i.e. the height of the test surface, is set by setting the position of the mounting seat 223 on the vertical piece 21.

[0037] The vertical piece 21 comprises a first sliding block 211 and a vertical rod 212; the first sliding block 211 is installed between the first T-shaped groove 1221 and the first sliding rail 1222 and can slide along the first sliding rail 1222. The vertical rod 212 is connected with the first sliding block 211 and is used for installing the mounting seat 223.

[0038] The vertical rod 212 further comprises a second T-shaped groove 2121 and a second sliding rail 2122; the mounting seat 223 is installed in the second T-shaped groove 2121 and can slide along the second sliding rail 2122 to set the height of the mounting seat 223.

[0039] The mounting seat 223 comprises a second sliding block 2231 and a mounting body 2232; the second sliding block 2231 is installed in the second T-shaped groove 2121 and the second sliding rail 2122 and can slide along the second sliding rail 2122; the mounting body 2232 is connected with the second sliding block 2231 and is used for installing the horizontal rod 222. Further, the mounting body 2232 is a concave structure, and the horizontal rod 222 is fixed in the concave part of the mounting body 2232. Further, the horizontal rod 222 is fixed in the concave part of the mounting body 2232 by screws or bolts. In order to further stabilize the horizontal rod 222, the horizontal rod 222 is provided with a stepped structure so that the two stepped surfaces are respectively pressed against the concave part and the side surface of the mounting body 2232.

[0040] The vertical rod 212 further comprises a through hole 2123; the mounting body 2232 can be fixed on the through hole 2123 by screws or bolts within the range of the through hole; further, the mounting body 2232 slides within the range of the through hole 2123 and is fixed on the through hole 2123 by screws or bolts.

[0041] The horizontal rod 222 is provided with a mounting groove 2221, and the pusher 221 is mounted on the horizontal rod 222 through the mounting groove 2221. Further, the pusher 221 is fixed on the mounting groove 2221 through screws or bolts.

[0042] The pusher 221 comprises a mounting block 2211 and a testing block 2212; the mounting block 2211 is connected with the testing block 2212 and is mounted on the mounting groove 2221; and the testing block 2212 is used for detecting the thickness of the support protrusion 31 of the wafer box 3.

[0043] The testing block 2212 comprises a third step body 22121 and a fourth step body 22122; the third step body 22121 is connected with the fourth step body 22122 and the mounting block 2211, and the fourth step body 22122 is used for detecting the thickness of the support protrusion 31.

[0044] The surface 22123 of the fourth step body 22122 facing the surface of the support 32 where the support protrusion 31 is located is the testing surface; and the detection of whether the thickness of the support protrusion 31 is within the qualified range is realized by setting the height range of the surface 22123 of the fourth step body 22122.

[0045] The mounting block 2211 is in an L-shaped structure, and the mounting groove 2221 is in a matching L-shaped structure, so as to avoid displacement of the testing block 2212 during detection, resulting in detection failure and improving detection accuracy.

[0046] During use, the horizontal rod 222 is mounted on the vertical rod 212 through the mounting body 2232, the position of the support protrusion 31 to be detected of the selected wafer box and the position of the testing surface are selected, the maximum height value and the minimum height value of the testing surface are set according to the qualified range of the thickness of the support protrusion 31; the testing surface with the maximum height value and the testing surface with the minimum height value are formed by one detection device or two detection devices. During detection, the wafer box is placed on the carrier plate 11 and is positioned and fixed by the positioning column 111 on the carrier plate 11; the wafer box is moved to the position where the support protrusion 31 to be detected corresponds to the testing surface, the testing frame 2 is pushed, and the testing surface of the testing block 2211 moves relatively along the surface of the support 32 where the support protrusion 31 is located. When the testing surface with the maximum height value can pass through the support protrusion 31 and the testing surface with the minimum height value cannot pass through the support protrusion 31, the support protrusion 31 is detected as qualified; otherwise, the support protrusion 31 is detected as unqualified.

[0047] The technical features of the above embodiments can be combined arbitrarily, and in order to make the description concise, all possible combinations of the technical features in the above embodiments are not described, however, as long as the combinations of the technical features do not exist contradictory, they should be considered as the scope of the present disclosure.

[0048] The above embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed, but it should not be understood as a limitation on the patent scope of the present application. It should be pointed out that, for ordinary skilled persons in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which all belong to the protection scope of the present application. Therefore, the protection scope of the present application patent should be subject to the appended claims.

Claims

1. A wafer cassette inspection apparatus characterized by comprising: The utility model relates to a kind of test device for wafer box, including: Base (1) and test frame (2); The base (1) is used to place wafer box (3); The test frame (2) includes: vertical piece (21) and horizontal piece (22);The horizontal piece (22) is provided with one or more test surfaces, and the test surface is used to detect the thickness of the supporting protrusion (31) of wafer box (3);The horizontal piece (22) is installed on the vertical piece (21), and vertical piece (21) is installed on the base (1) and is used to set the height range of the test surface, and the height range is related to the qualified range of the thickness of supporting protrusion (31).

2. The wafer boat inspection apparatus of claim 1, wherein The base (1) includes: carrier plate (11) and bottom plate (12);The carrier plate (11) is arranged on the bottom plate (12), for placing and fixing wafer box (3);The test frame (2) is arranged on the bottom plate (12).

3. The wafer boat inspection apparatus of claim 2, wherein, The carrier plate (11) includes: positioning column (111);The positioning column (111) is matched with the positioning structure of the wafer box (3), for positioning and fixing the wafer box (3).

4. The wafer boat inspection apparatus of claim 2, wherein The bottom plate (12) includes: first step body (121) and second step body (122);The second step body (122) is higher than the first step body (121);The carrier plate (11) can be movably placed in the first step body (121);The test frame (2) is arranged on the second step body (122);After the carrier plate (11) is placed in the first step body (121), the height is the same as the height of the second step body (122).

5. The wafer boat inspection apparatus of claim 4, wherein, The second step body (122) includes: first T-shaped groove (1221) and first slide rail (1222);The vertical piece (21) is installed on the first T-shaped groove (1221) and can slide along the first slide rail (1222).

6. The wafer boat inspection apparatus of claim 1, wherein, The horizontal piece (22) includes: pusher (221) and horizontal rod (222);The test surface is arranged on the pusher (221), and the pusher (221) is installed on the horizontal rod (222);The horizontal rod (222) is installed on the vertical piece (21), and the height of the test surface is set by setting the height of the horizontal rod (222) on the vertical piece (21).

7. The wafer boat inspection apparatus of claim 6, wherein, The pusher (221) includes: mounting block (2211) and test block (2212);The mounting block (2211) is connected with the test block (2212), and the mounting block (2211) is installed on the horizontal rod (222);The test block (2212) is used to detect the thickness of the supporting protrusion (31) of wafer box (3).

8. The wafer boat inspection apparatus of claim 7, wherein, The test block (2212) includes: third step body (22121) and fourth step body (22122);The third step body (22121) is connected with the fourth step body (22122) and the mounting block (2211), and the fourth step body (22122) is used to detect the thickness of the supporting protrusion (31).

9. The wafer boat inspection apparatus of claim 8, wherein, The surface (22123) of the fourth step body (22122) facing the supporting piece (32) where the supporting protrusion (31) is located is the test surface.

10. The FOUP inspection apparatus according to any one of claims 1 to 9, wherein The maximum height value and the minimum height value of the test surface are set according to the qualified range of the thickness of the supporting protrusion (31) of the wafer box (3); the test surface of the maximum height value and the test surface of the minimum height value are formed by one detection device or two detection devices.

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