High-frequency probe card

Abstract

The utility model discloses a high-frequency probe card, which comprises a probe card main body, the probe card main body comprises a PCB substrate, a chip packaging substrate, a probe arm and a resin layer, the PCB substrate is located at the upper end of the chip packaging substrate, the probe arm is located at the bottom of the PCB substrate, the end part of the probe arm is connected with a probe head, and the resin layer is laid at the outer side of the probe arm; and the reinforcing plate is arranged at the upper end of the PCB substrate and is used for bearing and testing the pressing stress of the PCB substrate, so that the PCB substrate and the reinforcing plate can be quickly mounted, and the problems that screws are easily slipped due to excessive mounting and the screws are loosened due to improper mounting when the screws are manually mounted are solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to probe card technical field especially relates to a high frequency probe card. BACKGROUND

[0002] High frequency probe card is the core tool in semiconductor test, and is designed for high frequency signal (such as 5G, millimeter wave, radio frequency device) test;Its core is composed of precisely arranged microprobe, adopts coplanar waveguide or microstrip line structure, ensures 50Ω impedance matching, supports high frequency transmission above 40GHz;Probe tip usually uses tungsten-rhenium alloy or gold-plated material, diameter can be as small as 10μm, realizes accurate contact wafer pad.

[0003] The existing probe card needs to be installed with a reinforcing plate to bear multiple stresses on the upper end (interface area with the testing machine) in high-frequency testing or high-density testing scenarios, as known from a disclosed patent, cantilever probe card for testing CPU high-frequency chip (publication number: CN207457308U), the reinforcing plate is installed on the upper end of the PCB substrate, and the two are installed and fixed through fixing screws, which need to be operated by hand tools during installation, and overinstallation may cause screw slipping and loose screws due to improper installation, which is complicated and time-consuming and laborious. UTILITY MODEL CONTENTS

[0004] The utility model provides a kind of high frequency probe card, can be installed between PCB substrate and reinforcing plate quickly, solve the problem that manual installation screw is prone to overinstallation and loose screws due to improper installation.

[0005] The utility model provides a kind of high frequency probe card, comprising:

[0006] Probe card main part, including PCB substrate, chip package substrate, needle arm and resin layer, the PCB substrate is located in the upper end of chip package substrate, the needle arm is located in the bottom of PCB substrate, and the end of needle arm is connected with probe head, the resin layer is laid in the outside of needle arm;

[0007] Reinforcing plate is arranged in the upper end of the PCB substrate, for bearing the pressing stress of testing the PCB substrate;

[0008] Mounting assembly is arranged between reinforcing plate and PCB substrate, including mounting column located in the upper end of PCB substrate, the middle part of mounting column is equipped with positioning hole, the middle part of reinforcing plate is equipped with installation groove, buffer groove, moving hole, guide groove and moving groove, the inside of moving hole is adaptively connected with trigger column, and the bottom of trigger column is connected with extrusion block, the inside of guide groove is provided with positioning block and limit plate that are adapted between moving groove, and the upper end of positioning block is provided with linkage arm.

[0009] In the high frequency probe card of the utility model one embodiment, the buffer groove, the moving hole and the guide groove are all connected, the trigger column is T type structure, and the trigger column and the extrusion block are fixedly connected, the bottom of the extrusion block is arc structure.

[0010] In the high frequency probe card of the utility model one embodiment, reset spring one is arranged in the buffer groove and close to the bottom of the extrusion block, and the inner diameter of the reset spring one is greater than the outer diameter of the installation groove.

[0011] In the high frequency probe card of the utility model one embodiment, reset spring two is fixedly connected to one side of the positioning block, and the end of the reset spring two is wrapped with a sleeve.

[0012] In the high frequency probe card of the utility model one embodiment, the upper end edge of the linkage arm is provided with a fillet, and the bottom of the extrusion block is extruded and rubbed.

[0013] In the high frequency probe card of the utility model one embodiment, the reinforcing plate comprises a metal reinforcing layer, a high-frequency dielectric layer and a stress buffer layer.

[0014] In the high frequency probe card of the utility model one embodiment, the metal reinforcing layer is made of molybdenum copper alloy material, and the thickness is 0.3mm.

[0015] In the high frequency probe card of the utility model one embodiment, the high-frequency dielectric layer is made of aluminum nitride ceramic material, and the thickness is 0.2mm.

[0016] In the high frequency probe card of the utility model one embodiment, the stress buffer layer is made of silica gel material, and the thickness is 0.1mm.

[0017] The technical scheme provided by the embodiment of the application can include the following beneficial effects: the high frequency probe card is designed, the reinforcing plate can be quickly installed on the upper end of the PCB substrate, manual installation by screw is not needed, and then screw installation is not loose and screw sliding phenomenon is not appeared, and the overall pressure resistance is improved.

[0018] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the application. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical scheme of the embodiment of the utility model, the drawings needed in the embodiment description will be briefly introduced below, and obviously, the drawings in the following description are some embodiments of the utility model, and those skilled in the art can also obtain other drawings according to these drawings without creating labor.

[0020] Figure 1 is a structural schematic diagram of a high-frequency probe card provided by an embodiment of the present application;

[0021] Figure 2 is Figure 1 is another perspective structural diagram of the high-frequency probe card;

[0022] Figure 3 is Figure 1 is a front view of the high-frequency probe card;

[0023] Figure 4 is Figure 1 is a partially exploded structural diagram of the high-frequency probe card;

[0024] Figure 5 is Figure 1 is a partially exploded structural diagram of the high-frequency probe card;

[0025] Figure 6 is Figure 5 is an enlarged view of A in FIG. 6;

[0026] Figure 7 is Figure 1 is a partially exploded structural diagram of the high-frequency probe card. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0028] In the description of the present application, it should be understood that the orientations or positional relationships indicated by the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. are the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first" and "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0029] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0030] like Figures 1 to 7 As shown, this application provides a high-frequency probe card, including: a probe card body 100, a reinforcing plate 60, and a mounting assembly 70. The probe card body 100 includes a PCB substrate 10, a chip packaging substrate 20, a probe arm 30, and a resin layer 50. The PCB substrate 10 is located at the upper end of the chip packaging substrate 20, the probe arm 30 is located at the bottom of the PCB substrate 10, and a probe head 40 is connected to the end of the probe arm 30. The resin layer 50 is laid on the outer side of the probe arm 30. The reinforcing plate 60 is disposed at the upper end of the PCB substrate 10 to withstand the downward pressure stress of testing the PCB substrate 10.

[0031] After adopting the above technical solution, since the probe card body 100 includes a PCB substrate 10, a chip packaging substrate 20, a probe arm 30 and a resin layer 50, before the PCB substrate 10 is used, the reinforcing plate 60 can be quickly installed on the upper end of the PCB substrate 10 through the mounting assembly 70, thereby bearing multiple downward pressure stresses, improving the overall strength of the PCB substrate 10, and thus increasing the service life of the PCB substrate 10.

[0032] In an optional embodiment, the mounting assembly 70 is disposed between the reinforcing plate 60 and the PCB substrate 10, including a mounting post 71 located at the upper end of the PCB substrate 10. The mounting post 71 has a positioning hole 72 in its center. The reinforcing plate 60 has a mounting groove 73, a buffer groove 74, a moving hole 75, a guide groove 79, and a moving groove 710 in its center. A trigger post 76 is adapted to the inside of the moving hole 75, and a pressing block 77 is connected to the bottom of the trigger post 76. The guide groove 79 has a positioning block 711 and a limiting plate 713 adapted to the moving groove 710, and a linkage arm 712 is provided at the upper end of the positioning block 711. This allows the reinforcing plate 60 to be mounted on the upper end of the PCB substrate 10. During installation, the operation is simple. Just put the mounting slot 73 on the upper end of the mounting post 71. The arc-shaped surface at the top of the mounting post 71 contacts the arc-shaped surface at the bottom of the positioning block 711, pressing the positioning block 711. This causes the positioning block 711 to drive the limiting plate 713 to move along the inside of the moving slot 710. At the same time, with the assistance of the sleeve 715, the second reset spring 714 is compressed until the bottom of the reinforcing plate 60 contacts the upper end of the PCB substrate 10. At this time, the positioning hole 72 and the positioning block 711 are aligned. Under the elastic potential energy of the second reset spring 714, the positioning block 711 is inserted into the inside of the positioning hole 72, thus completing the installation of the reinforcing plate 60. No manual screw installation is required. The reinforcing plate 60 can be installed by simply plugging it in.

[0033] Wherein when the reinforcing plate 60 is detached from the PCB substrate 10, only four sets of trigger columns 76 need to be pressed, so that the trigger columns 76 are pressed downward along the inside of the moving hole 75, the extrusion block 77 is pressed downward along the inside of the guide groove 79, the reset spring 78 is further compressed, and finally the bottom of the extrusion block 77 contacts the rounded corner on one side of the linkage arm 712, extruding the linkage arm 712, then the linkage arm 712 drives the positioning block 711 to move away from the positioning hole 72, and finally the positioning block 711 is extruded out of the inside of the positioning hole 72, thereby contacting the mounting column 71, so that the reinforcing plate 60 can be pulled out from the upper end of the PCB substrate 10.

[0034] In the embodiment, the buffer groove 74, the moving hole 75 and the guide groove 79 are all connected, the trigger column 76 is a "T" type structure, the trigger column 76 is fixedly connected with the extrusion block 77, the bottom of the extrusion block 77 is an arc structure, the inside of the buffer groove 74 is provided with the reset spring 78 near the bottom of the extrusion block 77, and the inner diameter of the reset spring 78 is greater than the outer diameter of the mounting groove 73, so that the reset spring 78 can be adapted to be compressed and elongated in the inside of the buffer groove 74, avoiding the reset spring 78 from falling into the inside of the mounting groove 73.

[0035] In an optional embodiment, one side of the positioning block 711 is fixedly connected with the reset spring 714, and the end of the reset spring 714 is wrapped with the sleeve 715, so that the reset spring 714 has a stabilizing effect during compression, avoiding dislocation and shaking of the reset spring 714.

[0036] In an optional embodiment, the reinforcing plate 60 includes a metal reinforcing layer 61, a high-frequency dielectric layer 62 and a stress buffer layer 63, which can strengthen the overall strength of the PCB substrate 10 during use, and better reduce the multiple stresses borne by the upper end of the probe card and the interface area of the test machine in high-frequency test or high-density test scenarios.

[0037] In an optional embodiment, the metal reinforcing layer 61 is made of molybdenum-copper alloy material, and the thickness is 0.3 mm.

[0038] It should be noted that, since the metal reinforcing layer 61 is made of molybdenum-copper alloy material, it has a thermal conductivity of 160 W / mK and a CTE of 7.1 ppm / ℃.

[0039] In an optional embodiment, the high-frequency dielectric layer 62 is made of aluminum nitride ceramic material, and the thickness is 0.2 mm.

[0040] It should be noted that, since the high-frequency dielectric layer 62 is made of aluminum nitride ceramic material (dielectric loss <0.0005 GHz), the high-frequency loss can be effectively reduced to -0.4 dB / cm.

[0041] In an alternative embodiment, the stress buffer layer 63 is made of silica gel material, and the thickness is 0.1 mm.

[0042] It should be noted that, since the stress buffer layer 63 is made of silica gel material, the elastic modulus can reach 3 MPa under the compression resistance thereof.

[0043] In the description of the present application, it should be noted that, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connecting" should be understood in a broad sense, for example, it can be fixed connection, or detachable connection, or integrally connected. It can be mechanical connection, or electrical connection. It can be direct connection, or indirect connection through intermediate medium. It can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0044] In the present application, unless otherwise explicitly specified and limited, the first feature "on" or "under" the second feature can include that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the first feature "on", "above" and "over" the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "under", "below" and "under" the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0045] The above disclosure provides many different embodiments or examples for implementing the different structures of the present application. In order to simplify the disclosure of the present application, the components and arrangements of the specific examples are described in the above. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeatedly refer to the same reference numerals and / or reference letters in different examples. Such repetition is for the purpose of simplification and clarity, and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, the present application provides examples of various specific processes and materials, but those skilled in the art can realize the application of other processes and / or the use of other materials.

[0046] In the description of the specification, reference to "one embodiment", "some embodiments", "an exemplary embodiment", "an example", "a specific example", or "some examples" means that a particular feature, structure, material, or characteristic being described is included in at least one embodiment or example of the application. The appearances of the phrases "in one embodiment", "in some embodiments", "in an exemplary embodiment", "an example", "a specific example", or "some examples" in various places in the specification are not necessarily referring to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics can be combined in any suitable manner in one or more embodiments or examples.

[0047] Although embodiments of the application have been shown and described, it will be appreciated that those skilled in the art can make various changes, modifications, substitutions and alterations thereto without departing from the principles and scope of the application, which are defined by the claims and their equivalents.

Claims

1. A high frequency probe card, characterized by, The utility model relates to probe card technical field, and particularly the probe card of chip testing. Probe card body, including PCB substrate, chip package substrate, needle arm and resin layer, the PCB substrate is located chip package substrate's upper end, the needle arm is located the bottom of PCB substrate, and the end of needle arm is connected with probe head, the resin layer is laid in the outside of needle arm, Reinforcing plate is arranged in the upper end of the PCB substrate, and is used for bearing the pressing stress of testing the PCB substrate, Mounting assembly is arranged between reinforcing plate and PCB substrate, including mounting column in the upper end of PCB substrate, the middle part of mounting column is equipped with positioning hole, the middle part of reinforcing plate is equipped with mounting groove, buffer groove, moving hole, guide groove and moving groove, the inside of moving hole is connected with trigger column and trigger column's bottom is connected with extrusion block, the inside of guide groove is equipped with positioning block and limit plate between moving groove and moving groove, and the upper end of positioning block is equipped with linkage arm.

2. The high frequency probe card of claim 1, wherein The buffer groove, moving hole and guide groove are all connected, the trigger column is "T" type structure, and the trigger column and extrusion block are fixedly connected, the bottom of extrusion block is arc structure.

3. The high frequency probe card of claim 1, wherein The inside of buffer groove is equipped with reset spring no.

4. The high frequency probe card of claim 1, wherein One side of positioning block is fixedly connected with reset spring no.

5. The high frequency probe card of claim 1, wherein The upper end edge of linkage arm is equipped with round angle, and extrusion friction is carried out with the bottom of extrusion block.

6. The high frequency probe card of claim 1, wherein The reinforcing plate includes metal reinforcing layer, high-frequency dielectric layer and stress buffer layer.

7. The high frequency probe card of claim 6, wherein The metal reinforcing layer is molybdenum copper alloy material, and the thickness is 0.3mm.

8. The high frequency probe card of claim 6, wherein, The high-frequency dielectric layer is aluminum nitride ceramic material, and the thickness is 0.2mm.

9. The high frequency probe card of claim 8, wherein, The stress buffer layer is silica gel material, and the thickness is 0.1mm.

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