Wafer stage damping mechanism and test system

Abstract

The utility model provides a wafer carrying table damping mechanism and a test system, the wafer carrying table damping mechanism comprises a main carrying table and a substrate, the main carrying table is provided with a placing area for accommodating a wafer, and an elastic rod is arranged between the main carrying table and the substrate; the elastic rod comprises a sliding rod and a sliding seat, and the sliding rod is elastically connected with the sliding seat; an adsorption cavity is formed in the sliding rod, an adsorption guide pipe is further arranged on the base plate, the adsorption guide pipe penetrates through the base plate and then extends into the adsorption cavity, and the adsorption guide pipe is connected with the adsorption cavity in a vacuum adsorption mode after impact is generated when the wafer is placed in the placing area and the damping spring deforms and shrinks. According to the utility model, after shock absorption of impact force is completed, the main bearing platform and the substrate form a rigid connection structure again under the vacuum adsorption connection effect, and the shock absorption mechanism of the wafer bearing platform can provide enough stability when the probe card detects the wafer.

Description

TECHNICAL FIELD

[0001] The utility model belongs to wafer test technical field especially relates to a wafer platform damping mechanism and test system. BACKGROUND

[0002] The test system of wafer will adopt probe station and probe card assembled on probe station to carry out one by one performance test to the wafer to be tested, and the wafer is usually moved to the lower side of probe card by multi-axis traction equipment and is connected by probe card to detect wafer performance.

[0003] In the current technology, in order to realize automatic production detection, the mechanical arm with adsorption effect is usually used to realize transfer when the wafer is placed on the platform on the multi-axis traction equipment, and a collision force is generated between the mechanical arm structure and the platform during the placement process, which can easily cause the wafer to be damaged, so a damping mechanism is arranged on the platform to absorb the kinetic energy in the impact process, but the contact effect of the damping structure is not good during the subsequent detection process, which leads to inaccurate final test data. UTILITY MODEL CONTENTS

[0004] The utility model provides a wafer platform damping mechanism, which aims to solve the problem of poor contact effect between the probe card and the wafer in the subsequent detection process of the current damping mechanism that absorbs the kinetic energy in the impact process, which leads to inaccurate final test data.

[0005] The utility model is realized in this way, a wafer platform damping mechanism, comprising:

[0006] The main bearing table and the base plate, the main bearing table is equipped with the placement area of containing wafer, the main bearing table and the base plate are equipped with the elastic rod between;

[0007] The elastic rod includes a sliding rod and a sliding seat, the sliding rod and the sliding seat are nested, the sliding seat is connected with the base plate, the sliding rod extends out of the sliding seat away from the base plate and is connected with the main bearing table, the outer wall of the sliding rod is provided with a damping spring, and the sliding rod is elastically connected between the damping spring and the sliding seat;

[0008] The sliding rod is provided with a suction cavity, and the base plate is also provided with a suction conduit, the suction conduit extends into the suction cavity after penetrating through the base plate, and when the wafer is placed in the placement area, the impact causes the damping spring to deform and shrink, and the suction conduit and the suction cavity are connected by vacuum adsorption.

[0009] Preferably, the sliding seat is provided with a sliding cavity, the end face of the sliding seat away from the base plate is provided with a sliding port, the sliding cavity is communicated with the outside through the sliding port, and part of the structure of the sliding rod extends to the outside of the sliding seat from the sliding port.

[0010] Preferably, the diameter of the sliding port is the same as the diameter of the sliding rod, and a sliding ring is further arranged on the sliding rod, the diameter of the sliding ring is the same as the diameter of the sliding cavity, and the shock-absorbing spring is nested on the part of the sliding rod between the sliding ring and the base plate.

[0011] Preferably, the adsorption guide pipe is provided with a flexible joint at one end and an outer connecting port at the other end, the flexible joint end of the adsorption guide pipe is inserted into the adsorption cavity, and the outer connecting port end of the adsorption guide pipe extends out of the base plate.

[0012] Preferably, the adsorption cavity is provided with a sealing ring matched with the flexible joint away from the base plate.

[0013] Preferably, the part of the sliding rod extending out of the sliding seat is in an arc structure in cross section, and the sliding port is in a structure matched with the part of the sliding rod extending out of the sliding seat.

[0014] Preferably, the end of the sliding rod close to the base plate is further provided with a shock-absorbing rubber pad.

[0015] A test system using the wafer carrier damping mechanism.

[0016] Compared with the prior art, the embodiments of the present application have the following beneficial effects:

[0017] The wafer carrier damping mechanism provided by the utility model can provide sufficient stability when a probe card detects a wafer, avoids vibration of the main bearing table and the base plate affecting the contact effect of the test process in the contact process, and avoids affecting the test precision of the damping structure. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 is a structural schematic view of a wafer carrier damping mechanism provided by the utility model.

[0019] Figure 2 is a schematic view of an elastic rod structure of a wafer carrier damping mechanism provided by the utility model.

[0020] Figure 3 is a schematic view of the internal structure of an elastic rod of a wafer carrier damping mechanism provided by the utility model.

[0021] Figure 4 is a structural schematic view of an adsorption guide pipe in a wafer carrier damping mechanism provided by the utility model.

[0022] Figure 5 is a structural schematic view of a sliding rod and a sliding seat of a wafer carrier damping mechanism provided by the utility model.

[0023] BRIEF DESCRIPTION OF DRAWINGS

[0024] 100, main bearing table; 101, placement area; 200, elastic rod; 210, sliding rod; 211, sliding ring; 212, adsorption cavity; 213, shock absorbing rubber pad; 220, sliding seat; 221, sliding port; 222, sliding cavity; 230, adsorption guide pipe; 231, flexible joint; 232, outer connection port; 240, shock absorbing spring; 250, sealing ring; 300, base plate. DETAILED DESCRIPTION

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used in the description herein is for describing particular embodiments only and is not intended to be limiting of the application; the use herein of terms such as "comprise", "have" and "include" or variations such as "comprises", "comprising", "containing", "having" and "includes" or variations such as "comprises", "comprising", "containing", "having" and "includes" are intended to be inclusive or open-ended and do not exclude additional, unrecited elements or method steps; the use herein of terms such as "first", "second" and "third" or the like does not imply an order or sequence unless specifically stated, but such terms are used for differentiation only.

[0026] Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase "in an embodiment" in various places in the specification are not necessarily all referring to the same embodiment, nor are they necessarily mutually exclusive or alternative embodiments. It is expressly understood that any of the embodiments described herein can be incorporated into other embodiments.

[0027] The utility model embodiment provides a kind of wafer bearing table damping mechanism, it is applied to the test system of probe table composition, as shown in Figures 1-5 The wafer bearing table damping mechanism includes:

[0028] Main bearing table 100 and base plate 300, the placement area 101 for accommodating wafer is equipped on the main bearing table 100, at least three groups of elastic rods 200 are equipped between the main bearing table 100 and base plate 300;Base plate 300 is arranged in the multi-axis motion mechanism of probe table, here the principle of multi-axis motion structure is traction wafer and moves in X, Y, Z axis, and the different parts on wafer are contacted and connected with probe card by the movement of multi-axis motion mechanism, and testing is completed;

[0029] The elastic rod 200 comprises a sliding rod 210 and a sliding seat 220, the sliding rod 210 and the sliding seat 220 are nested, the sliding seat 220 is connected with the base plate 300, the sliding rod 210 extends out of the sliding seat 220 away from the base plate 300 and is connected with the main bearing table 100, the outer wall of the sliding rod 210 is provided with a damping spring 240, the sliding rod 210 is elastically connected between the damping spring 240 and the sliding seat 220;

[0030] The sliding rod 210 is internally provided with an adsorption cavity 212, the base plate 300 is further provided with an adsorption conduit 230, the adsorption conduit 230 extends into the adsorption cavity 212 after penetrating through the base plate 300, the adsorption conduit 230 is connected with an external negative pressure equipment, the negative pressure equipment mainly forms a vacuum effect by vacuumizing the adsorption conduit 230, when the adsorption conduit 230 is internally vacuumized, an adsorption fixing effect is generated to the structure of the adsorption conduit 230;

[0031] When the wafer is placed in the placement area 101, the mechanical arm releases the wafer to generate an impact so that the damping spring 240 is deformed and shrinks, the sliding rod 210 approaches the sliding seat 220, the impact force generated in the process is absorbed by the spring 240, until the adsorption conduit 230 hits the adsorption cavity 212, at this time, a negative pressure is generated at the port of the adsorption conduit 230 and contacts the sealing ring 250 in the adsorption cavity 212 to generate a vacuum adsorption connection effect; at this time, the wafer table damping mechanism loses the vibration ability, avoiding the influence of the back-and-forth movement of the spring on the wafer, and under the vacuum adsorption connection effect, the main bearing table 100 and the base plate 300 form a rigid connection structure, providing sufficient stability when the probe card detects the wafer, avoiding the vibration of the main bearing table 100 and the base plate 300 affecting the contact effect of the test process and affecting the test precision;

[0032] As a preferred embodiment in the embodiment, the sliding seat 220 is internally provided with a sliding cavity 222, the end face of the sliding seat 220 away from the base plate 300 is provided with a sliding port 221, the sliding cavity 222 is communicated with the outside through the sliding port 221, and part of the structure of the sliding rod 210 extends to the outside of the sliding seat 220 from the sliding port 221;

[0033] The diameter of the sliding port 221 is the same as the diameter of the sliding rod 210, the sliding rod 210 is further provided with a sliding ring 211, the diameter of the sliding ring 211 is the same as the diameter of the sliding cavity 222 but is larger than the diameter of the sliding port 221, and the damping spring 240 is nested on the part of the sliding rod 210 between the sliding ring 211 and the base plate 300; the sliding ring 211 exerts pressure on the spring 240 and prevents the sliding rod 210 from slipping off from the sliding port 221;

[0034] In the embodiment, in order to enhance the stability of the axial movement of the sliding rod 210, the part of the sliding rod 210 extending out of the sliding seat 220 has an arc-shaped cross section, and the sliding port 221 has a structure matching the part of the sliding rod 210 extending out of the sliding seat 220;

[0035] As a preferred embodiment in the embodiment, the adsorption conduit 230 is provided with a flexible joint 231 at one end and an outer connecting port 232 at the other end, the flexible joint 231 of the adsorption conduit 230 is inserted into the adsorption cavity 212, and the outer connecting port 232 of the adsorption conduit 230 extends out of the base plate 300; the side of the adsorption cavity 212 away from the base plate is provided with a sealing ring 250 matching the flexible joint 231

[0036] In the embodiment, the adsorption conduit 230 and the base plate 300 are fixedly and sealingly connected, the adsorption conduit 230 is mainly vacuumized by an external device, the damping spring 240 absorbs the impact force in the placing process when the wafer is placed by a mechanical arm or other equipment, and after the placing action is completed, the main supporting table 100 and the base plate 300 are restored to the rigid connection; the influence of the elastic structure on the subsequent detection is avoided.

[0037] The utility model further provides a test system of wafer supporting table damping mechanism, the test system is based on probe station test principle, and the wafer supporting table damping mechanism mainly serves as the supporting structure of wafer in the test process.

[0038] It should be noted that, for the foregoing embodiments, in order to simply describe, they are all expressed as a series of action combinations, but those skilled in the art should know that the utility model is not limited by the action sequence described, because according to the utility model, certain steps can adopt other sequences or simultaneously perform.Secondly, those skilled in the art should know that the embodiments described in the specification all belong to preferred embodiments, and the actions and modules involved are not necessarily necessary for the utility model.

[0039] The above examples are only used to illustrate the technical solutions of the present application, and are not intended to limit the protection scope of the present application. Obviously, the described examples are only some of the embodiments of the present application, not all the embodiments. Based on these examples, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of the present application. Although the present application has been described in detail with reference to the above examples, those of ordinary skill in the art can still combine, add or delete the features in the embodiments of the present application according to the circumstances without creative labor, so as to obtain different other technical solutions which do not deviate from the concept of the present application in essence, and these technical solutions also fall within the scope of the present application.

Claims

1. A wafer stage vibration damping mechanism, characterized in that, include: A main support stage (100) and a substrate (300) are provided. The main support stage (100) is provided with a placement area (101) for accommodating wafers. An elastic rod (200) is provided between the main support stage (100) and the substrate (300). The elastic rod (200) includes a sliding rod (210) and a sliding seat (220), which are nested together. The sliding seat (220) is connected to the base plate (300). The sliding rod (210) extends from the sliding seat (220) away from the base plate (300) and is connected to the main support platform (100). The outer wall of the sliding rod (210) is provided with a shock-absorbing spring (240). The sliding rod (210) is elastically connected to the sliding seat (220) through the shock-absorbing spring (240). The sliding rod (210) has an adsorption cavity (212) inside, and the substrate (300) is also provided with an adsorption conduit (230). The adsorption conduit (230) extends through the substrate (300) and into the adsorption cavity (212). When the wafer is placed in the placement area (101), the impact damping spring (240) deforms and contracts, and the adsorption conduit (230) and the adsorption cavity (212) are vacuum adsorbed and connected.

2. A wafer table damping mechanism as set forth in claim 1, wherein The sliding seat (220) has a sliding cavity (222) inside. The end face of the sliding seat (220) away from the substrate (300) has a sliding port (221). The sliding cavity (222) is connected to the outside through the sliding port (221). The sliding rod (210) extends from the sliding port (221) to the outside of the sliding seat (220).

3. A wafer table damping mechanism as set forth in claim 2, wherein The diameter of the sliding port (221) is the same as the diameter of the sliding rod (210). The sliding rod (210) is also provided with a sliding ring (211). The diameter of the sliding ring (211) is the same as the diameter of the sliding cavity (222). The shock-absorbing spring (240) nests the sliding rod (210) on the part between the sliding ring (211) and the base plate (300).

4. A wafer table damping mechanism as set forth in claim 3, wherein The adsorption conduit (230) has a flexible connector (231) at one end and an external connection port (232) at the other end. The flexible connector (231) of the adsorption conduit (230) is inserted into the adsorption chamber (212), and the external connection port (232) of the adsorption conduit (230) extends out of the substrate (300).

5. A wafer table damping mechanism as set forth in claim 4, wherein The adsorption cavity (212) is provided with a sealing ring (250) on the side away from the substrate, which is adapted to the flexible connector (231).

6. A wafer table damping mechanism as set forth in claim 5, wherein The cross-section of the portion of the sliding rod (210) extending out of the sliding seat (220) is an arc-shaped structure, and the sliding port (221) adopts a structure that is adapted to the portion of the sliding rod (210) extending out of the sliding seat (220).

7. A wafer table damping mechanism as set forth in claim 6, wherein The sliding rod (210) is also provided with a shock-absorbing pad (213) at the end near the base plate (300).

8. A test system, characterized by The testing system employs the wafer stage vibration damping mechanism as described in claim 7.

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