Light receiving end capable of improving heat dissipation performance and 1.6 T FR4 optical module
By employing independent TIA chips and a row of distributed PD chips at the optical receiver, increasing the chip spacing and introducing capacitor filtering, the problem of poor heat dissipation in traditional optical receivers is solved, and the high-temperature performance of high-speed optical modules is improved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 武汉钧恒科技有限公司
- Filing Date
- 2025-06-04
- Publication Date
- 2026-04-10
AI Technical Summary
Traditional four-channel array TIA chips in optical receivers have poor heat dissipation, resulting in poor high-temperature performance of high-speed optical modules.
Multiple independent TIA chips are used to replace the array TIA chips, and the PD chips are distributed in rows. The odd-numbered and even-numbered PD chips are respectively placed on opposite sides of the TIA chips to increase the chip spacing to increase the heat dissipation space. Wire bonding capacitors are introduced on the PCB board for power filtering.
It improves the heat dissipation performance of the optical receiver and enhances the high-temperature performance of the high-speed optical module.
Smart Images
Figure CN224109691U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to optical module technical field, concretely relates to a light receiving end and 1.6T FR4 optical module of improving heat dissipation performance. BACKGROUND
[0002] The traditional light receiving end structure is as follows, it includes: Z-block assembly, four channel array converging lens, 45 DEG reflecting prism, four PD chips, four channel array TIA chip, collimator, glass capillary tube and optical fiber, collimator is coupled with the light inlet of Z-block assembly, Z-block assembly includes: Z-block and multiple optical filters fixed in the light emitting surface of Z-block in turn, collimator is fixed at the end of glass capillary tube, the optical fiber coupled with collimator is fixed in glass capillary tube, external light is coupled into Z-block assembly in turn through optical fiber, collimator, the light emitting side of Z-block assembly is arranged with a 45 DEG reflecting prism, a four channel array converging lens is coupled between Z-block assembly and 45 DEG reflecting prism, which is fixed with 45 DEG reflecting prism in the form of bonding, collimator, Z-block assembly, 45 DEG reflecting prism and glass capillary tube are fixed on the substrate respectively, the substrate is fixed on the PCB, four PD chips are arranged in a row below the reflecting surface of 45 DEG reflecting prism, a four channel array TIA chip is arranged on the outside of four PD chips, as shown in the specific Figure 1 Four PD chips and four channel array TIA chip are gold wire bonded, four PD chips and four channel array TIA chip are fixed on the PCB respectively, or, four PD chips and four channel array TIA chip are fixed on the PCB respectively by flip-chip technology, four PD chips are electrically connected with four channel array TIA chip through the PCB;Four channel array TIA chip is electrically connected with the PCB.In high-speed optical module, such as 1.6T FR4 optical module, if this kind of light receiving end is used, due to the large heat of four channel array TIA chip and its poor heat dissipation, the high-temperature performance of high-speed optical module is poor. UTILITY MODEL CONTENTS
[0003] The utility model solves the technical problem to provide a light receiving end and 1.6T FR4 optical module of improving heat dissipation performance to overcome the above prior art deficiencies.
[0004] The technical scheme that the utility model solves the above technical problem is as follows:
[0005] The application discloses an optical receiving end with improved heat dissipation performance, which comprises at least four TIA chips and at least four PD chips, and all the PD chips are arranged in a row with a predetermined channel spacing.
[0006] The application has the advantages that: the multiple independent TIA chips are used to replace the array TIA chip, and one TIA chip is arranged on the first outer side of each PD chip located at an odd position in all the PD chips arranged in a row, and one TIA chip is arranged on the second outer side opposite to the first outer side of each PD chip located at an even position in all the PD chips arranged in a row, so that the distance between the two adjacent TIA chips on the same side is enlarged, and enough space is provided for heat dissipation, and the TIA chips can be applied to high-speed optical modules.
[0007] Based on the above technical scheme, the application can be further improved as follows.
[0008] Further, each PD chip is gold wire bonded with one TIA chip, the TIA chips and the PD chips are fixed on a PCB, and the TIA chips are electrically connected with the PCB.
[0009] Further, the TIA chips and the PD chips are fixed on the PCB by using a flip-chip process, each PD chip is electrically connected with one TIA chip through the PCB, and the TIA chips are electrically connected with the PCB.
[0010] Further, one wire bonding capacitor for filtering is fixed on the PCB at the inner side of each TIA chip, and the wire bonding capacitor is electrically connected with the TIA chip through the PCB.
[0011] The above further advantages are that: since enough space is provided between the two adjacent TIA chips on the same side, the wire bonding capacitor can be introduced, the wire bonding capacitor is used for TIA chip power filtering, and the performance can be improved.
[0012] Further, one TIA chip is arranged on the right side of each PD chip located at an odd position in all the PD chips arranged in a row, and one TIA chip is arranged on the left side of each PD chip located at an even position in all the PD chips arranged in a row.
[0013] Further, the light receiving end further comprises, in sequence along the direction of light propagation, a collimator, a Z-block assembly, a multi-channel array converging lens, and a 45° reflecting prism, the collimator is fixed at the end of a glass capillary, an optical fiber coupled with the collimator is fixed in the glass capillary, the PD chip is below the reflecting surface of the 45° reflecting prism, each channel of the Z-block assembly is coupled with a PD chip in sequence through the multi-channel array converging lens and the 45° reflecting prism.
[0014] Further, the collimator, the Z-block assembly, the 45° reflecting prism, and the glass capillary are fixed on a substrate, and the substrate is fixed on a PCB.
[0015] Further, the multi-channel array converging lens is fixed to the 45° reflecting prism by adhesion.
[0016] Further, the number of TIA chips is four, and the number of PD chips is four.
[0017] Based on the above technical scheme, the utility model further provides a 1.6T FR4 optical module, which comprises two above-mentioned light receiving ends.
[0018] The above further beneficial effects are as follows: since the light receiving end has good heat dissipation, when it is applied to the 1.6T FR4 optical module, the 1.6T FR4 optical module has good high-temperature performance. BRIEF DESCRIPTION OF DRAWINGS
[0019] Figure 1 It is a layout diagram of four PD chips and four-channel array TIA chips in the prior art;
[0020] Figure 2 It is a layout diagram of four PD chips and four-channel array TIA chips in the utility model;
[0021] Figure 3 It is a front view of the light receiving end in the utility model;
[0022] Figure 4 It is a top view of the light receiving end in the utility model.
[0023] In the drawings, the components represented by each reference numeral are listed as follows:
[0024] 1, TIA chip, 2, PD chip, 3, PCB, 4, wire bonding capacitor, 5, collimator, 6, Z-block assembly, 7, multi-channel array converging lens, 8, 45° reflecting prism, 9, glass capillary, 10, optical fiber, 11, substrate. DETAILED DESCRIPTION
[0025] The principles and characteristics of the utility model are described below in combination with the drawings, and the examples are only used to explain the utility model and not to limit the scope of the utility model.
[0026] Embodiment 1
[0027] As Figure 2 shown, a light receiving end for improving heat dissipation performance comprises a TIA chip 1 and a PD chip 2, the number of the TIA chip 1 is at least four, the number of the PD chip 2 is at least four, in this embodiment, each TIA chip 1 and PD chip 2 is a single independent type, not an array type chip in the prior art, all PD chips 2 are distributed in a row with a predetermined channel spacing, the specific spacing is determined according to the actual application, and each PD chip 2 located at an odd position in all PD chips 2 distributed in a row is provided with a TIA chip 1 on the first outer side, and each PD chip 2 located at an even position in all PD chips 2 distributed in a row is provided with a TIA chip 1 on the second outer side opposite to the first outer side, that is, the first outer side and the second outer side are opposite sides.
[0028] A plurality of independent TIA chips 1 are used to replace the array TIA chip, and each PD chip 2 located at an odd position in all PD chips 2 distributed in a row is provided with a TIA chip 1 on the first outer side, and each PD chip 2 located at an even position in all PD chips 2 distributed in a row is provided with a TIA chip 1 on the second outer side opposite to the first outer side, so that the distance between the two adjacent TIA chips 1 on the same side is pulled apart, thereby having enough space, which is beneficial to heat dissipation, so that it can be applied to high-speed optical modules.
[0029] Embodiment 2
[0030] As Figure 2 , Figure 3 , Figure 4 shown, this embodiment is a further improvement on the basis of embodiment 1, and the specific improvements are as follows:
[0031] Each PD chip 2 corresponds to a TIA chip 1 and is gold wire bonded, the PD chip 2 is fixed on the PCB board 3, the TIA chip 1 is fixed on the PCB board 3, and the TIA chip 1 is electrically connected with the PCB board 3.
[0032] Embodiment 3
[0033] As Figure 2 , Figure 3 , Figure 4 shown, this embodiment is a further improvement on the basis of embodiment 1, and the specific improvements are as follows:
[0034] The TIA chip 1 is fixed on the PCB board 3 by flip-chip technology, and the PD chip 2 is fixed on the PCB board 3 by flip-chip technology. Each PD chip 2 is electrically connected to a corresponding TIA chip 1 through the PCB board 3, and the TIA chip 1 is electrically connected to the PCB board 3.
[0035] Embodiment 4
[0036] As shown in Figure 2 , Figure 3 , Figure 4 This embodiment is a further improvement based on any one of embodiments 2 or 3, and the specific improvements are as follows:
[0037] A wire-bonding capacitor 4 is fixed on the PCB board 3 at the inner side of each TIA chip 1. The wire-bonding capacitor 4 is electrically connected to the TIA chip 1 through the PCB board 3. Since there is enough space between the two adjacent TIA chips 1 on the same side, the wire-bonding capacitor 4 can be introduced. The wire-bonding capacitor 4 is used for TIA chip 1 power supply filtering, which can improve the performance.
[0038] Embodiment 5
[0039] As shown in Figure 2 , Figure 3 , Figure 4 This embodiment is a further improvement based on any one of embodiments 1-4, and the specific improvements are as follows:
[0040] Each PD chip 2 in the odd position of all PD chips 2 distributed in a row is arranged with a TIA chip 1 on the right side, and each PD chip 2 in the even position of all PD chips 2 distributed in a row is arranged with a TIA chip 1 on the left side. In this embodiment, the left and right sides are defined based on the view angle of the provided view. If the view angle changes, the left and right sides will also change.
[0041] Embodiment 6
[0042] As shown in Figure 2 , Figure 3 , Figure 4 This embodiment is a further improvement based on any one of embodiments 1-5, and the specific improvements are as follows:
[0043] The light receiving end further comprises a collimator 5, a Z-block assembly 6, a multi-channel array converging lens 7 and a 45° reflecting prism 8, which are coupled in sequence along the light propagation direction, the collimator 5 is fixed at the end of a glass capillary 9, an optical fiber 10 coupled with the collimator 5 is fixed in the glass capillary 9, the PD chip 2 is below the reflecting surface of the 45° reflecting prism 8, each channel of the Z-block assembly 6 is coupled with a PD chip 2 in sequence through the multi-channel array converging lens 7 and the 45° reflecting prism 8, external light is coupled into the collimator 5 through the optical fiber 10, and then coupled into the Z-block assembly 6 through the collimator 5, and the light output of each channel of the Z-block assembly 6 is coupled into a PD chip 2 in sequence through the multi-channel array converging lens 7 and the 45° reflecting prism 8.
[0044] Further, the collimator 5, the Z-block assembly 6, the 45° reflecting prism 8 and the glass capillary 9 are fixed on a substrate 11, and the substrate 11 is fixed on the PCB board 3, and the collimator 5 is preferably a collimating lens.
[0045] The multi-channel array converging lens 7 is preferably fixed to the 45° reflecting prism 8 by bonding, of course, other fixing methods are not excluded in actual application, and the above is only an exemplary description.
[0046] Embodiment 7
[0047] A 1.6T FR4 optical module comprises two light receiving ends according to any one of the embodiments 1-6, the number of TIA chips 1 is four, the number of PD chips 2 is four, the single wave of each channel of the light receiving end is 200G, 200G*4 channels*2, which is 1.6T, and since the light receiving end has good heat dissipation, when it is applied to the 1.6T FR4 optical module, the 1.6T FR4 optical module has good high-temperature performance.
[0048] Although the embodiments of the utility model have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limiting the utility model, and those skilled in the art can change, modify, replace and modify the above embodiments within the scope of the utility model.
Claims
1. An optical receiving end with improved heat dissipation performance, characterized in that, The application comprises: at least four TIA chips (1) and at least four PD chips (2), all the PD chips (2) are arranged in a row with a predetermined channel spacing; each of the PD chips (2) in odd positions is provided with a TIA chip (1) on the first outer side, and each of the PD chips (2) in even positions is provided with a TIA chip (1) on the second outer side opposite to the first outer side.
2. The light receiving end with improved heat dissipation performance according to claim 1, wherein, Each PD chip (2) is gold wire bonded with a TIA chip (1), and the TIA chip (1) and the PD chip (2) are fixed on a PCB board (3), and the TIA chip (1) is electrically connected with the PCB board (3).
3. The light receiving end with improved heat dissipation performance according to claim 1, wherein, The TIA chip (1) and the PD chip (2) are fixed on the PCB board (3) by flip-chip technology, each PD chip (2) is electrically connected with a TIA chip (1) through the PCB board (3), and the TIA chip (1) is electrically connected with the PCB board (3).
4. The light receiving end with improved heat dissipation performance according to claim 2 or 3, characterized in that, A wire-bonded capacitor (4) for filtering is fixed on the PCB board (3) at the inner side of each TIA chip (1), and the wire-bonded capacitor (4) is electrically connected with the TIA chip (1) through the PCB board (3).
5. The optical receiving end with improved heat dissipation performance according to claim 1, characterized in that, Each of the PD chips (2) in odd positions is provided with a TIA chip (1) on the right side, and each of the PD chips (2) in even positions is provided with a TIA chip (1) on the left side.
6. The optical receiving end with improved heat dissipation performance according to claim 1, wherein, Further comprising, in sequence along the light propagation direction: a collimator (5), a Z-block assembly (6), a multi-channel array converging lens (7), and a 45° reflecting prism (8), the collimator (5) is fixed on the end of a glass capillary tube (9), an optical fiber (10) coupled with the collimator (5) is fixed in the glass capillary tube (9), the PD chip (2) is below the reflecting surface of the 45° reflecting prism (8), each channel of the Z-block assembly (6) is coupled with a PD chip (2) in sequence through the multi-channel array converging lens (7) and the 45° reflecting prism (8).
7. The light receiving end of claim 6, wherein, The collimator (5), the Z-block assembly (6), the 45° reflecting prism (8), and the glass capillary tube (9) are fixed on a substrate (11), and the substrate (11) is fixed on the PCB board (3).
8. The light receiving end of claim 6, wherein, The multi-channel array converging lens (7) is fixed to the 45° reflecting prism (8) by adhesion.
9. The light receiving end with improved heat dissipation performance according to claim 1, wherein The number of the TIA chips (1) is four, and the number of the PD chips (2) is four.
10. A 1.6T FR4 optical module characterized by, The application comprises: two optical receiving ends according to any one of claims 1-9.