Light path structure suitable for universal chip module and TOF photoelectric sensor
By employing a semi-transparent mirror, collimating lens, and converging reflection device in the optical path structure of the TOF sensor, the emitted light and received light are made coaxial, solving the problems of near-end blind zone and short detection distance of traditional TOF sensors, and realizing effective detection at a longer distance and blind zone-free light reception.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-05
- Publication Date
- 2026-04-10
AI Technical Summary
Traditional TOF sensors use diffuse reflection optical paths, which have problems such as near-end blind zones and short detection distances.
The optical path structure is suitable for general-purpose chip modules, including a semi-transparent mirror, a collimating lens, and a converging reflection device, so that the emitted light and the received light are coaxial, increasing the intensity of the returned light and reducing the blind zone.
It enhances light reception capabilities, increases detection distance, reduces blind spots, avoids lens cut-off, and improves the detection performance of the TOF sensor.
Smart Images
Figure CN224109692U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to photoelectric sensor more specifically, it relates to a kind of optical path structure and TOF photoelectric sensor suitable for general chip module. BACKGROUND
[0002] As shown in Figure 1 Traditional TOF sensor adopts diffuse reflection optical path, under the same detection distance, the light intensity of reflection back decreases with the increase of reflection angle, if the light reflected back is too weak, receiving chip cannot detect signal, therefore, the detection distance of TOF photoelectric sensor of this kind of optical path structure is shorter.And since the distance between the receiving end and the transmitting end of TOF photoelectric sensor chip module is short, so the lens under traditional optical path will be cut, which will also weaken the reception of light and affect the detection distance.In addition, since there is a relative distance between the receiving end and the reflecting end, the traditional optical path has a blind area in the case of close-range detection, that is, the light cannot hit the receiving chip on the receiving end through the receiving lens.
[0003] Therefore, the present application provides an optical path structure suitable for general chip module and TOF photoelectric sensor, which solves the above problems. SUMMARY
[0004] The technical problem to be solved by the present application is that the traditional TOF sensor adopts diffuse reflection optical path, which has a near-end blind area and a short detection distance.The purpose is to provide an optical path structure suitable for general chip module and TOF photoelectric sensor, which makes the transmitting light and receiving light coaxial through a reasonable optical path structure, increases the intensity of returned light and reduces the blind area.
[0005] The present application first provides an optical path structure suitable for general chip module, comprising: a half-transmission half-reflection mirror and a collimating lens arranged in sequence along the transmitting end of the chip module; a converging reflection device arranged along the receiving end of the chip module, the converging reflection device is used for reflecting and converging the reflected light received by the half-transmission half-reflection mirror to the receiving end of the chip module; wherein the light from the transmitting end of the chip module is emitted through the half-transmission half-reflection mirror and the collimating lens, and the coaxially returned reflected light is returned to the receiving end of the chip module through the collimating lens, the half-transmission half-reflection mirror and the converging reflection device.
[0006] As a possible implementation, the collimating lens is a plano-convex mirror, the side close to the half-transmission half-reflection mirror is a plane, and the side away from the half-transmission half-reflection mirror is a convex surface.
[0007] As a possible implementation, the half-transmission half-reflection mirror and the collimating lens are coaxially arranged with the transmitting end of the chip module.
[0008] As a possible implementation, the converging reflection device is coaxially arranged with the receiving end of the chip module.
[0009] As a possible implementation, the converging reflection device employs a spherical mirror.
[0010] As a possible implementation, the spherical mirror is placed at the intersection of the light path of the semi-transparent half-mirror and the emitting end of the chip module.
[0011] As a possible implementation, the converging reflection device comprises a plane mirror and a plano-convex lens, the side of the plano-convex lens close to the plane mirror is flat, and the side away from the plane mirror is convex.
[0012] As a possible implementation, the plane mirror is placed at the intersection of the light path of the semi-transparent half-mirror and the emitting end of the chip module.
[0013] As a possible implementation, the plane mirror and the plano-convex lens are coaxially arranged with the emitting end of the chip module.
[0014] The application also provides a TOF photoelectric sensor, comprising a chip module and a light path structure suitable for a general chip module as described above.
[0015] Compared with the prior art, the application has the following beneficial effects: 1. The light path structure is used to receive the reflected light coaxial with the emitted light, compared with the traditional diffuse reflected light, the returned light intensity is increased, and the lens does not need to be cut, the reception of light is enhanced, and the detection distance is increased; 2. The reflected light is coaxial with the emitted light, so the blind area is almost zero, and the blind area is reduced. BRIEF DESCRIPTION OF DRAWINGS
[0016] The accompanying drawings described herein are used to provide a further understanding of the embodiments of the application, form a part of the application, and do not constitute a limitation to the embodiments of the application. In the drawings:
[0017] Figure 1 A schematic diagram of a conventional TOF sensor light path structure provided for the embodiments of the application;
[0018] Figure 2 A schematic diagram of a TOF sensor general chip module provided for the embodiments of the application;
[0019] Figure 3 A schematic diagram of a light path structure suitable for a general chip module provided for the embodiments of the application;
[0020] Figure 4 A light path schematic diagram of a light path structure suitable for a general chip module provided for the embodiments of the application;
[0021] Figure 5A schematic diagram of lens cutting provided for the embodiment of the present application is shown in the figure;
[0022] Figure 6 A schematic diagram of receiving light rays after lens cutting provided for the embodiment of the present application is shown in the figure;
[0023] Figure 7 A schematic diagram of a receiving blind area provided for the embodiment of the present application is shown in the figure;
[0024] Figure 8 A schematic diagram of another converging reflection device provided for the embodiment of the present application is shown in the figure.
[0025] Markings in the figures and corresponding names of parts:
[0026] 1, chip module; 2, transmitting end; 3, receiving end; 4, transmitting lens; 5, receiving lens; 6, transmitting light rays; 7, diffusely reflected light rays; 8, laser; 9, receiving chip; 10, semi-transmissive and semi-reflective mirror; 11, collimating lens; 12, converging reflection device; 13, plane mirror; 14, plano-convex lens. DETAILED DESCRIPTION
[0027] In order to make the purpose, technical scheme and advantages of the present application clearer, more specific embodiments and the accompanying drawings are used to make a further detailed description of the present application. The schematic embodiments and the description thereof are used to explain the present application, but not to limit the present application.
[0028] Please refer to Figure 1 shown, Figure 1 A schematic diagram of a conventional TOF sensor optical path structure provided for the embodiment of the present application is shown in the figure. The conventional optical path structure includes a transmitting lens 4 and a receiving lens 5. The propagation path of light rays is as follows: the transmitting end 2 in the chip module 1 emits transmitting light rays 6, which are converged into parallel light by the transmitting lens 4 for detection, diffusely reflected, and then diffusely reflected light rays 7 return to the receiving lens 5, and then converge to the receiving end 3 of the chip module 1.
[0029] Please refer to Figure 2 shown, Figure 2 A schematic diagram of a general chip module of a TOF sensor provided for the embodiment of the present application is shown in the figure. The general chip module of the TOF sensor includes a laser 8, a transmitting end 2, a receiving chip 9 and a receiving end 3. The laser emitted by the laser 8 is output through the transmitting end 2, and the receiving chip 9 receives the returned light rays through the receiving end 3. When the chip module 1 works: the laser 8 in the chip module emits light rays, which are emitted through the transmitting end 2, converged into parallel light by the transmitting lens 4, then diffusely reflected to the receiving lens 5, then converged to the receiving end 3 of the chip module 1, and then returned to the receiving chip 9.
[0030] from Figure 1 and Figure 2It can be seen that the traditional TOF sensor adopts a diffuse reflection light path, and the light path structure has a near-end blind area problem; and the reflected light is weakened, and the far-end detection distance is reduced. Therefore, the application provides a light path structure suitable for a general chip module and a TOF sensor, which solves the above problems.
[0031] Please refer to Figure 3 as shown, Figure 3 The application provides a schematic diagram of the light path structure suitable for the general chip module. The light path structure comprises: a half-transmission half-reflection mirror 10 and a collimating lens 11 arranged in sequence along a transmitting end 2 of a chip module 1; a converging reflection device 12 arranged along a receiving end 3 of the chip module 1, and the converging reflection device 12 is used for reflecting and converging the reflected light received by the half-transmission half-reflection mirror 10 to the receiving end 3 of the chip module 1; wherein the light of the transmitting end 2 of the chip module 1 is emitted through the half-transmission half-reflection mirror 10 and the collimating lens 11, and the returned reflected light is returned to the receiving end 3 of the chip module 1 through the collimating lens 11, the half-transmission half-reflection mirror 10 and the converging reflection device 12.
[0032] Specifically, the half-transmission half-reflection mirror is used for transmitting all the light of the transmitting end of the chip module to the collimating lens and reflecting all the reflected light to the converging reflection device; the collimating lens is used for collimating the light of the transmitting end of the chip module into parallel light and converging the reflected light; the converging reflection device is used for reflecting the reflected light to the receiving end of the chip module and converging the light, so that the light can reach the receiving end of the chip module as much as possible. Please refer to Figure 4 as shown, Figure 4 The application provides a light path schematic diagram of the light path structure suitable for the general chip module. The propagation path of the light is: the chip module transmitting end emits light, the light passes through the half-transmission half-reflection mirror to reach the collimating lens, then the parallel light is formed through the collimating lens for detection, the reflected light reaches the collimating lens again, the parallel light passes through the collimating lens to form converging light, the light is reflected to the converging reflection device through the half-transmission half-reflection mirror, and then the light is converged to the receiving end of the chip module.
[0033] The application improves in that: 1, the light path structure is used to receive the reflected light coaxial with the emitted light, compared with the traditional diffuse reflected light, the returned light intensity is increased, and the lens does not need to be cut, the reception of the light is enhanced, and the detection distance is increased; 2, the reflected light is coaxial with the emitted light, so that the blind area is almost zero, and the blind area is reduced.
[0034] Regarding the increase of the detection distance: the reflected light of the traditional light path structure is diffuse reflection, and the intensity of the reflected light I will be reduced decreases with the increase of the distance, if the reflected light is too weak, the receiving chip cannot detect the signal, thus the detection distance of the TOF sensor is limited; in addition, in the case of only considering reflection, the light intensity and the diffuse reflection angle satisfy the Lambert cosine law: Since the distance between the receiving end and the transmitting end is short, the lens under the traditional light path will be cut, after the lens is cut, part of the light in the diffuse reflection light can normally pass through the receiving lens, part of the light is blocked, so the light receiving range is also weakened, which also affects the detection distance of the TOF sensor; the lens cutting is shown as Figure 5 , and the received light after the lens cutting is shown as Figure 6 Compared with the traditional light path structure, the light path structure provided by the application receives the reflected light coaxial with the transmitted light, the reflected light is perpendicular to the return, and most of the energy emitted can be received, and there is no problem of diffuse reflection lens cutting, and the range of received light is large; therefore, the light path structure of the application can improve the reception of the returned light and increase the detection distance.
[0035] Regarding the reduction of the blind area: the reflected light of the traditional light path structure is diffuse reflection, since there is a relative distance between the receiving end and the reflecting end on the chip module, there is a blind area in the case of near distance detection of the diffuse reflection light, that is, the light passing through the receiving lens cannot hit the receiving chip of the receiving end, as shown in Figure 7 Compared with the traditional light path structure, the received light and the transmitted light are coaxial in the light path structure provided by the application, and the blind area is almost zero.
[0036] As a possible implementation manner, the collimating lens is a plano-convex mirror, the side close to the half-transmission half-reflection mirror is a plane, and the side away from the half-transmission half-reflection mirror is a convex surface. The collimating lens collimates the light transmitted by the half-transmission half-reflection mirror into parallel light, receives the reflected light and converges it to the half-transmission half-reflection mirror, so as to realize the coaxiality of the transmitted light and the reflected light.
[0037] As a possible implementation manner, the half-transmission half-reflection mirror, the collimating lens and the transmitting end of the chip module are coaxially arranged. The transmitting end of the chip module transmits light, which is transmitted to the collimating lens through the half-transmission half-reflection mirror and forms parallel light through the collimating lens.
[0038] As a possible implementation manner, the converging reflection device is coaxially arranged with the receiving end of the chip module. The reflected light is converged to the half-transmission half-reflection mirror through the collimating lens, reflected to the converging reflection device through the coating on the half-transmission half-reflection mirror, and converged to the receiving end of the chip module through the converging reflection device.
[0039] As a possible implementation manner, the converging reflection device adopts a spherical mirror.
[0040] Further, the spherical mirror is arranged at the light path intersection of the semi-transparent half mirror and the chip module emitting end.
[0041] Specifically, the reflected light of the semi-transparent half mirror is reflected and converged to the receiving end of the chip module by the spherical mirror. Figure 3
[0042] As a possible implementation, the converging reflection device comprises a plane mirror and a plano-convex lens, wherein the side of the plano-convex lens close to the plane mirror is flat, and the side away from the plane mirror is convex.
[0043] Further, the plane mirror is arranged at the light path intersection of the semi-transparent half mirror and the chip module emitting end.
[0044] Further, the plane mirror and the plano-convex lens are coaxially arranged with the chip module emitting end.
[0045] Specifically, if the spherical mirror cannot effectively converge the reflected light, the spherical mirror can be replaced by a plane mirror 13 (which can reduce the cost), and then a plano-convex lens 14 is added between the plane mirror and the receiving end of the chip module, so that the light is focused to the receiving end of the chip module. Figure 8
[0046] A TOF photoelectric sensor comprises a chip module and a light path structure suitable for a general chip module as shown in Figure 3
[0047] It should be noted that the TOF photoelectric sensor provided by the present application adopts the light path structure as shown in Figure 3 , which has corresponding technical effects, and here is not described in more detail.
[0048] The above detailed description is further detailed for the purpose, technical scheme and beneficial effects of the present application, and it should be understood that the above description is only a specific implementation of the present application, and is not used to limit the protection scope of the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.
Claims
1. An optical path structure suitable for a general chip module, characterized by, The application relates to a light path structure suitable for a general chip module. The light path structure comprises a semi-transmissive and semi-reflective mirror and a collimating lens arranged in sequence along a transmitting end of the chip module; a converging reflection device arranged along a receiving end of the chip module, the converging reflection device being used for reflecting and converging the reflected light rays received by the semi-transmissive and semi-reflective mirror to the receiving end of the chip module; wherein the light rays of the transmitting end of the chip module are emitted through the semi-transmissive and semi-reflective mirror and the collimating lens, the coaxially returned reflected light rays are returned to the receiving end of the chip module through the collimating lens, the semi-transmissive and semi-reflective mirror and the converging reflection device.
2. The optical path structure according to claim 1, wherein The collimating lens is a plano-convex lens, the side close to the semi-transmissive and semi-reflective mirror is a plane, and the side far from the semi-transmissive and semi-reflective mirror is a convex surface.
3. The optical path structure according to claim 1, wherein The semi-transmissive and semi-reflective mirror and the collimating lens are coaxially arranged with the transmitting end of the chip module.
4. The optical path structure according to claim 1, wherein The converging reflection device is coaxially arranged with the receiving end of the chip module.
5. The optical path structure according to any one of claims 1 to 4, wherein The converging reflection device adopts a spherical mirror.
6. The optical path structure according to claim 5, wherein The spherical mirror is arranged at the light path intersection of the semi-transmissive and semi-reflective mirror and the transmitting end of the chip module.
7. The optical path structure according to any one of claims 1 to 4, wherein The converging reflection device comprises a plane mirror and a plano-convex lens, the side close to the plane mirror of the plano-convex lens is a plane, and the side far from the plane mirror of the plano-convex lens is a convex surface.
8. The optical path structure according to claim 7, wherein The plane mirror is arranged at the light path intersection of the semi-transmissive and semi-reflective mirror and the transmitting end of the chip module.
9. The optical path structure according to claim 7, wherein The plane mirror and the plano-convex lens are coaxially arranged with the transmitting end of the chip module.
10. A TOF photosensor, characterized by, The application relates to a light path structure suitable for a general chip module. The light path structure comprises a chip module and a light path structure suitable for a general chip module according to any one of claims 1-9.