Optical module

Abstract

The optical module provided by the utility model comprises a circuit board, a first side of which is provided with a light emitting chip and a second side of which is provided with a groove; wherein the groove does not penetrate through the circuit board, the groove is provided with a groove bottom in the circuit board, and the projection of the groove in the first side direction of the circuit board covers the light emitting chip; the lens assembly is arranged above the light emitting chip in a covering manner; the bottom of the TEC is located in the groove and connected with the groove bottom, and the TEC is electrically connected with the circuit board; and the thermistor is arranged at the top of the TEC or the first side of the circuit board and is electrically connected with the circuit board. The optical module provided by the embodiment of the utility model is convenient for ensuring the stability of the performance of the optical chip.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the field of optical fiber communication technology, and in particular to an optical module. BACKGROUND

[0002] With the development of new business and application modes such as cloud computing, mobile Internet, video, artificial intelligence, the progress of optical communication technology becomes increasingly important. In optical communication technology, an optical module is a tool for converting optical signals and electrical signals, and is one of the key devices in optical communication equipment, which is in the core position of optical communication. The optical module is provided with optical chips such as optical transmitting chips, and the optical transmitting chips are used to generate optical signals. The performance of some optical transmitting chips is easily affected by the working temperature. In order to ensure the stability of the performance of the optical transmitting chips, the working temperature of the optical transmitting chips needs to be stabilized within a certain range. SUMMARY

[0003] Some embodiments provide an optical module, which facilitates to ensure the stability of the performance of optical chips.

[0004] Some embodiments provide an optical module, which comprises:

[0005] A circuit board, a first side of which is provided with an optical transmitting chip, and a second side of which is provided with a groove; wherein the groove does not penetrate the circuit board, and the groove forms a groove bottom in the circuit board, and a projection of the groove in the direction of the first side of the circuit board covers the optical transmitting chip;

[0006] A lens assembly, which is arranged above the optical transmitting chip;

[0007] A Thermo Electric Cooler (TEC), a bottom of which is located in the groove and connected with the groove bottom, and which is electrically connected with the circuit board;

[0008] A thermistor, which is arranged on the top of the TEC or the first side of the circuit board, and is electrically connected with the circuit board.

[0009] One of the above technical solutions has the following advantages or beneficial effects: the first side of the circuit board is provided with a light emitting chip, and a groove is formed on the second side of the circuit board. The groove bottom is located inside the circuit board and below the light emitting chip. The bottom of the TEC is located in the groove, and the bottom of the TEC is connected to the groove bottom, so that the light emitting chip and the TEC are located on both sides of the circuit board and are separated by the circuit board. Moreover, the groove can shorten the heat conduction path between the TEC and the light emitting chip, and facilitate the assembly of the TEC to the circuit board. The thermistor is arranged on the top of the TEC or the first side of the circuit board to monitor the temperature of the light emitting chip. When the temperature monitored by the thermistor is lower than the preset working temperature of the light emitting chip, the TEC can generate heat to heat the light emitting chip; when the temperature monitored by the thermistor is higher than the preset working temperature of the light emitting chip, the TEC absorbs heat to cool the light emitting chip.

[0010] When the light emitting chip is heated by the TEC, the heat generated by the TEC is transmitted to the circuit board through the groove bottom, and then transmitted to the light emitting chip through the circuit board; when the light emitting chip is cooled by the TEC, the heat generated by the light emitting chip is transmitted to the circuit board, then transmitted to the groove bottom through the circuit board, and then transmitted to the TEC through the groove bottom, and the TEC absorbs the heat. In this way, the stability of the light chip performance can be ensured by the TEC.

[0011] In this embodiment, the TEC and the light emitting chip are arranged on different sides of the circuit board, and the TEC is directly fixed to the circuit board, which can reduce the process steps of the optical module assembly process, improve the optical module assembly efficiency, reduce the patching tolerance of the light emitting chip, and reduce the cost of using substrates and pads.

[0012] Some embodiments provide an optical module, wherein the bottom of the light emitting chip is connected to the first side of the circuit board.

[0013] A via hole is arranged on the circuit board, and the via hole is located between the light emitting chip and the groove bottom, and the top of the via hole does not extend to the first side of the circuit board.

[0014] One of the above technical solutions has the following advantages or beneficial effects: when the light emitting chip is arranged on the first side of the circuit board, a via hole is arranged on the circuit board between the light emitting chip and the groove. The via hole is a metalized hole with high thermal conductivity, which can accelerate the heat conduction efficiency between the light emitting chip and the TEC, and thus maintain the working temperature of the light emitting chip in a relatively stable range to ensure the stability of the light emitting chip performance.

[0015] Some embodiments provide an optical module, wherein the first side of the circuit board is provided with a light receiving chip, the light receiving chip is located on the side of the light emitting chip, and the light receiving chip is located below the lens assembly.

[0016] The first metal layer is arranged at the bottom of the groove, and the bottom of the TEC is connected to the first metal layer;

[0017] A second metal layer is arranged inside the circuit board between the light emitting chip and the bottom of the groove; the projection edges of the first metal layer and the second metal layer in the direction of the first surface of the circuit board exceed the light emitting chip, and the projections of the first metal layer and the second metal layer in the direction of the first surface of the circuit board extend to the light receiving chip.

[0018] One of the above technical solutions has the following advantages or beneficial effects: the first metal layer is arranged at the bottom of the groove, the bottom of the TEC is connected to the first metal layer, and the second metal layer is arranged inside the circuit board between the light emitting chip and the bottom of the groove. The second metal layer has good heat conduction efficiency and can accelerate the heat conduction speed of the circuit board. The heat generated by the light emitting chip is transmitted to the circuit board, then to the first metal layer, and finally to the temperature adjusting component through the first metal layer; or the heat generated by the temperature adjusting component is transmitted to the first metal layer, then to the circuit board, and then to the light emitting chip through the circuit board. The first metal layer has good heat conduction efficiency and can accelerate the heat conduction speed between the circuit board and the TEC. Moreover, it has good flatness, which facilitates the contact area with the temperature adjusting component and further ensures the heat exchange efficiency between the circuit board and the temperature adjusting component.

[0019] Some embodiments provide a light module, wherein the bottom of the groove is provided with a first metal layer, and the bottom of the TEC is connected to the first metal layer.

[0020] One of the above technical solutions has the following advantages or beneficial effects: by connecting the bottom of the TEC to the first metal layer, heat transfer can be more efficient. During the operation of the light module, the light emitting chip will continuously generate heat, which will be transferred to the circuit board. The first metal layer, as a key bridge for heat transfer, can quickly conduct the heat generated by the light emitting chip to the TEC, and the TEC can then dissipate the heat, thereby effectively reducing the temperature of the light emitting chip and ensuring its stable operation. At the same time, when the light emitting chip needs to be heated, the heat generated by the TEC can also be quickly transferred to the light emitting chip through the first metal layer to meet its operating temperature requirements. Moreover, the connection of the bottom of the TEC to the first metal layer facilitates the reduction of thermal resistance and the improvement of heat conduction efficiency, so that the light emitting chip can maintain good performance in different working environments.

[0021] Some embodiments provide a light module, wherein a via hole is arranged on the circuit board, the via hole is located between the light emitting chip and the bottom of the groove, and the bottom of the via hole is connected to the first metal layer.

[0022] One of the above technical solutions has the following advantages or beneficial effects: the via can optimize the heat conduction path between the TEC and the light reflection chip. The heat generated by the light emitting chip can be transmitted to the first metal layer more quickly through the via, and then processed by the TEC. Moreover, the connection mode of the via and the first metal layer is relatively stable, which can ensure the stability and reliability of heat conduction during the long-term work of the optical module. When the optical module faces complex working environment and different temperature changes, the synergistic effect of the via and the first metal layer can keep the light emitting chip in an appropriate working temperature range at all times, so that the light emitting chip can maintain good performance in different working environments.

[0023] Some embodiments provide an optical module, wherein a second metal layer is arranged inside the circuit board between the light emitting chip and the groove bottom, and the second metal layer is connected to the via.

[0024] One of the above technical solutions has the following advantages or beneficial effects: after the second metal layer is connected to the via, the heat generated by the light emitting chip can be more efficiently conducted from the via to the second metal layer. Compared with relying only on the via to conduct heat, the second metal layer provides more conduction paths for heat, thereby accelerating the heat conduction efficiency between the light emitting chip and the TEC.

[0025] Some embodiments provide an optical module, comprising:

[0026] A circuit board, a first side of which is provided with a light chip, and a second side of which is provided with a groove; the groove does not penetrate the circuit board, and the groove forms a groove bottom inside the circuit board; a projection of the groove in the direction of the first side of the circuit board covers the light chip; the light chip is used to generate or receive optical signals;

[0027] A lens assembly is arranged above the light chip;

[0028] A temperature adjusting component, a bottom of which is located in the groove and connected to the groove bottom;

[0029] A via is arranged inside the circuit board between the groove bottom and the light chip, a top of the via does not extend to the first side of the circuit board, and a bottom of the via extends to the groove bottom.

[0030] One of the above technical solutions has the following advantages or beneficial effects: the first side of the circuit board is provided with the light chip, and the second side of the circuit board is provided with the groove. The groove bottom is located inside the circuit board and below the light chip. The bottom of the temperature adjusting component is located in the groove, and the bottom of the temperature adjusting component is connected to the groove bottom, so that the light emitting chip and the temperature adjusting component are located on both sides of the circuit board and separated by the circuit board.

[0031] When the temperature adjusting component heats the light emitting chip, the temperature adjusting component generates heat which is transmitted to the circuit board through the groove bottom and then transmitted to the light emitting chip through the circuit board; when the temperature adjusting component cools the light emitting chip, the heat generated by the light emitting chip is transmitted to the circuit board, then transmitted to the groove bottom through the circuit board, and then transmitted to the temperature adjusting component through the groove bottom, and the temperature adjusting component absorbs the heat. In this way, the stability of the performance of the light chip can be ensured through the temperature adjusting component.

[0032] In the embodiment, the temperature adjusting component and the light emitting chip are located on different sides of the circuit board, and the temperature adjusting component is directly fixedly connected to the circuit board, which can not only reduce the process steps of the assembly process of the optical module and improve the assembly efficiency of the optical module, but also reduce the mounting tolerance of the light emitting chip and the cost of using substrates and pads.

[0033] Some embodiments provide an optical module, wherein the groove bottom is provided with a first metal layer; a second metal layer is arranged in the circuit board between the groove bottom and the light chip;

[0034] The top of the via is connected to the second metal layer, and the bottom of the via is connected to the first metal layer.

[0035] One of the above technical solutions has the following advantages or beneficial effects: the first metal layer, the second metal layer and the via can jointly constitute an efficient heat conduction path. When the temperature adjusting component works, whether it is heating or cooling, the heat can be quickly conducted to the via through the first metal layer and then quickly transmitted to or from the light chip through the second metal layer. The first metal layer and the second metal layer have good heat conduction performance, which can greatly improve the efficiency of heat transmission and further enhance the precise regulation of the temperature of the light chip, thereby better ensuring the stability of the performance of the light chip.

[0036] Some embodiments provide an optical module, comprising:

[0037] A circuit board is provided with a groove, a light emitting chip is arranged on the top surface, and a solder pad is arranged on the bottom surface; the opening of the groove penetrates the bottom surface of the circuit board, and the groove is located below the light emitting chip;

[0038] A lens assembly is connected to the top surface of the circuit board at the bottom, and the lens assembly is arranged above the light emitting chip;

[0039] A TEC is arranged in the groove at the bottom, and an electrode is arranged at the top; the electrode is wire-bonded to the solder pad;

[0040] A temperature monitoring device is arranged at the top of the TEC and electrically connected to the circuit board.

[0041] One of the above technical solutions has the following advantages or beneficial effects: a groove is opened on the circuit board, the light emitting chip is located on the circuit board above the groove, the bottom of the TEC is located in the groove and is connected to the groove. The groove provides a specific mounting space for the TEC, facilitating the assembly of the TEC and enabling the TEC to be closer to the light emitting chip, which is conducive to achieving more precise temperature control of the light emitting chip. The TEC is connected to the pad by wire bonding through the electrode, realizing electrical connection with the circuit board, and enabling timely heating or refrigeration operation of the light emitting chip according to the temperature information fed back by the temperature monitoring device. The temperature monitoring device monitors the temperature at the top of the TEC, that is, the temperature around the light emitting chip, and feeds back the temperature signal to the circuit board, so that the circuit board controls the TEC to work, maintains the light emitting chip to work in a stable temperature environment, and further ensures the stability and reliability of the optical signal output of the optical module. The TEC and the light emitting chip are arranged on different sides of the circuit board, which can not only reduce the process steps of the optical module assembly process and improve the optical module assembly efficiency, but also reduce the mounting tolerance of the light emitting chip and the cost of using substrates and pads.

[0042] Some embodiments provide an optical module, wherein the bottom of the groove is provided with a via, the via extends in the direction of the light emitting chip, and the via does not penetrate the top surface of the circuit board.

[0043] One of the above technical solutions has the following advantages or beneficial effects: a via is arranged in the circuit board between the light emitting chip and the bottom of the groove. The via is a metalized hole with high thermal conductivity, which facilitates the acceleration of the heat conduction efficiency between the light emitting chip and the TEC, and further facilitates the maintenance of the working temperature of the light emitting chip within a relatively stable range to ensure the stability of the performance of the light emitting chip. BRIEF DESCRIPTION OF DRAWINGS

[0044] In order to more clearly illustrate the technical solutions in the present disclosure, the following will briefly introduce the drawings needed to be used in some embodiments of the present disclosure. Obviously, the drawings in the following description are only the drawings of some embodiments of the present disclosure, and other drawings can also be obtained by those skilled in the art according to these drawings. In addition, the drawings in the following description can be regarded as schematic diagrams, and are not limited to the actual size, actual process, actual timing of signals, etc. of the products involved in the embodiments of the present disclosure.

[0045] Figure 1 FIG. 1 is a partial structure diagram of an optical communication system according to some embodiments;

[0046] Figure 2 FIG. 2 is a partial structure diagram of a host computer according to some embodiments;

[0047] Figure 3 FIG. 3 is a structure diagram of an optical module according to some embodiments;

[0048] Figure 4 exploded view of an optical module according to some embodiments;

[0049] Figure 5 exploded view of an internal structure of an optical module according to some embodiments;

[0050] Figure 6 is Figure 5 a close-up view of area A in the middle;

[0051] Figure 7 is an internal structure view of an optical module according to some embodiments;

[0052] Figure 8 is Figure 7 a close-up view of area B in the middle;

[0053] Figure 9 is a close-up view of an internal structure of an optical module according to some embodiments;

[0054] Figure 10 is a close-up view of another internal structure of an optical module according to some embodiments;

[0055] Figure 11 is a close-up view of an internal structure of an optical module according to some embodiments;

[0056] Figure 12 is a close-up view of an internal structure of an optical module according to some embodiments;

[0057] Figure 13 is an internal structure cross-sectional view of an optical module according to some embodiments;

[0058] Figure 14 is Figure 13 a close-up view of area C in the middle;

[0059] Figure 15 is a cross-sectional view of an internal structure of an optical module according to some embodiments Figure 1 ;

[0060] Figure 16 is a cross-sectional view of an internal structure of an optical module according to some embodiments Figure 2 ;

[0061] Figure 17 is a cross-sectional view of an internal structure of an optical module according to some embodiments Figure 3 ;

[0062] Figure 18 is a cross-sectional view of an internal structure of an optical module according to some embodiments Figure 4 ;

[0063] Figure 19 An internal structure diagram of yet another optical module according to some embodiments;

[0064] Figure 20 An internal structure diagram of another optical module according to some embodiments. DETAILED DESCRIPTION

[0065] Some embodiments of the present disclosure will be described in detail below with reference to the drawings. However, the described embodiments are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments provided in the present disclosure, all other embodiments obtained by those skilled in the art belong to the scope of protection of the present disclosure.

[0066] Unless otherwise required by the context, throughout the specification and claims, the term "comprising" is interpreted to mean "including, but not limited to"; the terms "first", "second", etc. are not used to denote or imply relative importance or an upper limit on the number; the term "multiple" means two or more; the term "connected" should be interpreted broadly, for example, "connected" can be fixedly connected, or detachably connected, or integrated, can be directly connected, or indirectly connected through an intermediate medium; the use of the terms "adapted to" or "configured to" means open and inclusive language, which does not exclude devices adapted or configured to perform additional tasks or steps; the terms "parallel", "vertical", "same", "consistent", "flush", etc. are not limited to absolute mathematical relationships, but also include acceptable error ranges generated in practice, and differences formed based on the same design concept but due to manufacturing reasons.

[0067] In optical communication technology, in order to establish information transmission between information processing devices, information is loaded onto light, and the transmission of information is carried out by using the propagation speed of light. Such information-loaded light is an optical signal. The optical signal can reduce the loss of optical power when transmitted in an optical information transmission device, and realize long-distance transmission of the optical signal. At the same time, the cost of optical information transmission devices such as optical fibers is lower than that of electrical information transmission devices such as copper wires. Therefore, optical communication technology can realize high-speed, long-distance, and low-cost information transmission.

[0068] Information processing devices usually include optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., and optical information transmission devices usually include optical fibers and optical waveguides, etc. The signals that information processing devices can recognize and process are electrical signals, while optical communication technology uses optical signals for transmission, which requires optical modules to convert between optical signals and electrical signals.

[0069] The optical module can realize mutual conversion between optical signals and electrical signals between the information processing device and the optical information transmission device. In some embodiments, at least one of the optical signal input end or the optical signal output end of the optical module is connected with an optical fiber, and at least one of the electrical signal input end or the electrical signal output end of the optical module is connected with an optical network terminal; a first optical signal from the optical fiber is transmitted to the optical module, the optical module converts the first optical signal into a first electrical signal, and transmits the first electrical signal to the optical network terminal; a second electrical signal from the optical network terminal is transmitted to the optical module, the optical module converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber.

[0070] Since the information transmission between multiple information processing devices can be realized through electrical signals, at least one of the multiple information processing devices needs to be directly connected with the optical module, without the need for all the information processing devices to be directly connected with the optical module. Here, the information processing device directly connected with the optical module is also referred to as the host computer of the optical module. In addition, the optical signal input end or the optical signal output end of the optical module is referred to as an optical port, and the electrical signal input end or the electrical signal output end of the optical module is referred to as an electrical port.

[0071] Figure 1 FIG. 1 is a partial structure diagram of an optical communication system according to some embodiments. As shown in FIG. 1, the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100 of an optical module, the optical module 200, an optical fiber 101, and a network cable 103, wherein the optical fiber 101 belongs to an optical information transmission device, and the network cable 103 belongs to an electrical information transmission device. Figure 1

[0072] In some embodiments, one end of the optical fiber 101 extends to the direction of the remote information processing device 1000, and the other end of the optical fiber 101 is connected with the optical module 200 through the optical port of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, and the propagation of the optical signal in the totally reflected direction can almost maintain the original optical power. The optical signal is totally reflected multiple times in the optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or to transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby realizing long-distance information transmission based on low power loss.

[0073] The optical communication system includes one or more optical fibers 101. In some embodiments, the optical fiber 101 is detachably connected with the optical module 200; in some embodiments, the optical fiber 101 is non-detachably connected with the optical module 200.

[0074] The host computer 100 is configured to provide a data signal to the optical module 200, or receive a data signal from the optical module 200, or monitor or control the working state of the optical module 200.​

[0075] The host computer 100 includes a housing accommodating the optical module 200, and an optical module interface 102 disposed on the housing. The optical module 200 is inserted into the housing through the optical module interface 102, so that the host computer 100 establishes a unidirectional or bidirectional electrical signal connection with the optical module 200.

[0076] The host computer 100 further includes an external electrical interface that can access an electrical signal network. In some embodiments, the external electrical interface includes a Universal Serial Bus (USB) or a network cable interface 104. The network cable interface 104 is configured to access a network cable 103, so that the host computer 100 establishes a unidirectional or bidirectional electrical signal connection with the network cable 103.

[0077] One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so that an electrical signal connection is established between the local information processing device 2000 and the host computer 100 through the network cable 103. In some embodiments, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103, the host computer 100 generates a second electrical signal according to the third electrical signal, the second electrical signal from the host computer 100 is transmitted to the optical module 200, the optical module 200 converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber 101, and the second optical signal is transmitted to the remote information processing device 1000 in the optical fiber 101.

[0078] In some embodiments, the first optical signal from the remote information processing device 1000 propagates through the optical fiber 101, the first optical signal from the optical fiber 101 is transmitted to the optical module 200, the optical module 200 converts the first optical signal into a first electrical signal, the optical module 200 transmits the first electrical signal to the host computer 100, the host computer 100 generates a fourth electrical signal according to the first electrical signal, and transmits the fourth electrical signal to the local information processing device 2000.

[0079] In some embodiments, the optical module is a tool for converting optical signals and electrical signals, and in the conversion process of the optical signals and the electrical signals, the information does not change, and the encoding or decoding method of the information changes.

[0080] The host computer 100 includes an Optical Line Terminal (OLT), an Optical Network Terminal (ONT), or a data center server, in addition to the optical network terminal.

[0081] Figure 2is a partial structural diagram of a host computer according to some embodiments. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structure of the host computer 100 related to the optical module 200 is shown. As Figure 2 shown, in some embodiments, the host computer 100 further includes a PCB circuit board 105 arranged in the accommodation cavity, and a cage 106 arranged on the surface of the PCB circuit board 105; the optical module 200 is inserted into the cage 106 and fixed by the cage 106;

[0082] In some embodiments, the cage 106 is provided with a heat sink 107, which can dissipate heat for the optical module; in some embodiments, the heat sink 107 has a protruding structure such as fins to increase the heat dissipation area.

[0083] In some embodiments, the cage 106 is internally provided with an electrical connector configured to access the electrical port of the optical module 200.

[0084] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100, and the optical module 200 is fixed by the cage 106. The heat generated by the optical module 200 is conducted to the cage 106, and then diffused through the heat sink 107.

[0085] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100, and the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, so that the optical module 200 and the host computer 100 establish electrical signal connection.

[0086] In some embodiments, the optical port of the optical module 200 is connected to the optical fiber 101, so that the optical module 200 and the optical fiber 101 establish optical signal connection.

[0087] Figure 3 is a structural diagram of an optical module according to some embodiments, Figure 4 is an exploded view of an optical module according to some embodiments. As Figure 3 and Figure 4 shown, in some embodiments, the optical module 200 includes a shell including an upper shell 201 and a lower shell 202. The upper shell 201 covers the lower shell 202 to form two openings 203 and 204, one of which is an electrical port and the other of which is an optical port. In some embodiments, the shell forms an opening that is both an electrical port and an optical port.

[0088] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal material, which is beneficial to realize electromagnetic shielding and heat dissipation.

[0089] The upper shell 201 and the lower shell 202 are combined to facilitate the installation of the circuit board 300, the lens assembly 400 and the like into the shells, and the shells can protect the devices.

[0090] The direction of the line connecting the two openings 203 and 204 can be consistent with the length direction of the optical module 200, or can be inconsistent with the length direction of the optical module 200. For example, the opening 203 is located at the end of the optical module 200 (the right end of the optical module 200), and the opening 204 is also located at the end of the optical module 200 (the left end of the optical module 200). Alternatively, the opening 203 is located at the end of the optical module 200, and the opening 204 is located at the side of the optical module 200. Figure 3 Figure 3

[0091] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and arranged perpendicularly to the bottom plate 2021; and the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the shell.

[0092] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and arranged perpendicularly to the bottom plate 2021; and the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and arranged perpendicularly to the cover plate 2011, and the two upper side plates and the two lower side plates 2022 are combined to cover the lower shell 202 by the upper shell 201.

[0093] As Figure 3 and Figure 4 ​​As shown, in some embodiments, the light module includes a circuit board 300 disposed in the housing, the circuit board 300 including circuit traces, electronic components, and chips, etc. The electronic components and chips are connected according to the circuit design through the circuit traces to realize power supply, electrical signal transmission, and grounding functions, etc. The electronic components may, for example, include capacitors, resistors, transistors, metal oxide semiconductor field effect transistors (MOSFETs). The chips may include microcontroller units (MCUs), laser drive chips, transimpedance amplifiers (TIAs), limiting amplifiers (LAs), clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0094] In some embodiments, the circuit board includes a rigid circuit board, which, due to its relatively hard material, can also realize a bearing function, such as the rigid circuit board can stably bear the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0095] In some embodiments, the circuit board also includes a flexible circuit board, which can be used independently; or can be used in cooperation with the rigid circuit board.

[0096] In some embodiments, the circuit board also includes a gold finger formed on the surface of the end thereof, the gold finger being composed of a plurality of pins independent of each other.

[0097] In some embodiments, the gold finger is disposed on the surface of one side of the circuit board 300. In some embodiments, the gold finger is disposed on the surfaces of the upper and lower sides of the circuit board 300 to provide a larger number of pins, thereby adapting to occasions where a large number of pins are required.

[0098] In some embodiments, the gold finger of the circuit board extends from the electrical port and is inserted into the electrical connector of the host computer 100; the circuit board is inserted into the cage 106, and the gold finger is in conduction with the electrical connector in the cage 106. The gold finger is configured to establish electrical connection with the host computer, and can realize electrical connection functions such as power supply, grounding, inter-integrated circuit (I2C) signal transmission, data signal transmission, etc.

[0099] In some embodiments, the light module 200 further comprises an unlocking component 600 outside the shell thereof. The unlocking component 600 is configured to achieve the fixed connection between the light module 200 and the host computer, or to release the fixed connection between the light module 200 and the host computer.

[0100] For example, the unlocking component 600 is located outside the two lower side plates 2022 of the lower shell 202, and comprises a clamping component matched with the cage 106 of the host computer 100. When the light module 200 is inserted into the cage 106, the light module 200 is fixed in the cage 106 by the clamping component of the unlocking component 600; when the unlocking component 600 is pulled, the clamping component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the clamping component and the host computer, to release the fixation between the light module 200 and the host computer, so that the light module 200 can be pulled out of the cage 106.

[0101] In some embodiments, the bottom of the lens assembly 400 is connected to the circuit board 300 and covers the light chips including light emitting chips and / or light receiving chips, etc., and the light emitting chips, the light receiving chips, etc. are electrically connected to the circuit board 300. The lens assembly 400 has optical surfaces such as transmission surfaces and reflection surfaces, to adjust the transmission direction of the emitted light signals and / or received light signals through the combination of the transmission surfaces and the reflection surfaces, so that the emitted light signals generated by the light emitting chips can be output from the light module, and the light signals input into the light module can be transmitted to the light receiving chips. The light emitting chips can include lasers, and the light receiving chips can include photodetectors. In some embodiments, a matching chip can also be arranged below the lens assembly 400, and the matching chip can include a laser driving chip and / or a TIA, etc.

[0102] In some embodiments, the lens assembly 400 is connected to the optical fiber ribbon 410, and the light signals generated by the light emitting chips are transmitted to the optical fiber ribbon 410 through the lens assembly 400; or the light signals input through the optical fiber ribbon 410 are transmitted to the lens assembly 400, and then transmitted to the light receiving chips through the lens assembly 400. Of course, in some embodiments, the lens assembly 400 is arranged at the side of the optical port of the light module 200, and the lens assembly 400 is directly connected to the external optical fiber.

[0103] In some embodiments, one end of the optical fiber ribbon 410 can be provided with an optical fiber adapter for optical connection of the optical fiber ribbon 410 to the external optical fiber. In some embodiments, the optical fiber adapter is arranged horizontally in the optical port, i.e. the main plane of the optical fiber adapter is parallel or approximately parallel to the bearing plane of the optical port. Of course, in some embodiments, the optical fiber adapter is arranged vertically in the optical port, i.e. the main plane of the optical fiber adapter is perpendicular or approximately perpendicular to the bearing plane of the optical port. Figure 4 Fig. 6 shows a state in which the optical fiber joint is arranged horizontally.

[0104] In some embodiments, the other end of the fiber ribbon 410 can be provided with a fiber connector through which the fiber ribbon is connected to the lens assembly 400. Of course, in some embodiments, the fiber ribbon 410 can be directly connected to the lens assembly 400 by glue or the like.

[0105] Figure 5 Fig. 6 is an exploded view of an internal structure of an optical module according to some embodiments, Figure 6 Fig. 7 is a schematic view of the internal structure of the optical module according to some embodiments, Figure 5 Fig. 8 is a partial enlarged view of Fig. 7 at A. As shown in Figure 5 Fig. 9 is a schematic view of the internal structure of the optical module according to some embodiments, Figure 6 In some embodiments, a light emitting chip 310 can be disposed below the lens assembly 400. Exemplarily, the bottom of the light emitting chip 310 can be connected to the surface of the circuit board 300, and the light emitting chip 310 is electrically connected to the circuit board 300. The light signal generated by the light emitting chip 310 is transmitted to the lens assembly 400, transmitted to the first fiber ribbon 410 through the lens assembly 400, and transmitted to the outside of the optical module through the fiber ribbon 410. In some embodiments, the light emitting chip 310 can generate multiple beams of light signals.

[0106] In some embodiments, a laser driving chip 330 can be disposed below the lens assembly 400, and the laser driving chip 330 is disposed at the side of the light emitting chip 310. The laser driving chip 330 is electrically connected to the circuit board 300 and the laser driving chip 330 is electrically connected to the light emitting chip 310. The light emitting chip 310 can be wire-connected to the laser driving chip 330.

[0107] In some embodiments, a light receiving chip 320 can be disposed below the lens assembly 400. The light signal transmitted to the lens assembly 400 through the fiber ribbon 410 is transmitted to the light receiving chip 320 through the lens assembly 400. The light receiving chip 320 can receive multiple beams of light signals. The light receiving chip 320 can be disposed at the side of the light emitting chip 310.

[0108] In some embodiments, a TIA 340 can be disposed below the lens assembly 400, and the TIA 340 is disposed at the side of the light receiving chip 320. The TIA 340 is electrically connected to the circuit board 300 and the TIA 340 is electrically connected to the light receiving chip 320. The TIA 340 can be disposed on the circuit board 300, and the top surface of the TIA 340 is higher than the top surface of the circuit board 300. The light receiving chip 320 can be wire-connected to the TIA 340.

[0109] In some embodiments, the light receiving chip 320 can be located at the side of the light emitting chip 310 in the width direction of the circuit board 300. Exemplarily, the light receiving chip 320 and the light emitting chip 310 are disposed side by side along the width direction of the circuit board 300.

[0110] In some embodiments, the optical emitting chip 310 encapsulates multiple lasers. Exemplarily, the optical emitting chip 310 may encapsulate four VCSEL lasers; however, in this embodiment, the optical emitting chip 310 is not limited to encapsulating four VCSEL lasers. In some embodiments, the transmission rate of the VCSEL lasers is 50Gb / s, 100Gb / s, 200Gb / s, etc. The higher the transmission rate of the VCSEL lasers in the optical emitting chip 310, the more sensitive the high-frequency performance of the VCSEL lasers becomes to the laser's operating temperature; for example, it can only maintain its high-frequency performance within a very small temperature range. Therefore, in order to allow the optical module 200 to operate within an ambient temperature range of 0℃-70℃, it is necessary to maintain the operating temperature of the optical emitting chip 310 within a certain temperature range to reduce the impact of ambient temperature on its operating temperature.

[0111] In some embodiments, the optical receiver chip 320 is packaged with multiple photodetectors. The optical receiver chip 320 may package with four photodetectors, but in this embodiment, the optical receiver chip 320 is not limited to packaging with four photodetectors.

[0112] In some embodiments, a DSP chip 350 may be disposed on the circuit board 300. The DSP chip 350 may be located on the side of the end of the lens assembly 400.

[0113] Figure 7 This is an internal structural diagram of an optical module according to some embodiments. Figure 8 for Figure 7 A magnified view of a section at point B. (See image below.) Figure 7 and Figure 8 As shown, in some embodiments, the optical module 200 may include a temperature regulation component 500. The temperature regulation component 500 is used to regulate the temperature of the optical emitting chip 310, etc., so as to stabilize the operating temperature of the optical emitting chip 310, etc., within a relatively constant range, thereby facilitating the maintenance of the high-frequency performance of the optical emitting chip 310.

[0114] In some embodiments, the light-emitting chip 310 may be disposed on or on the side of the temperature regulating component 500. The temperature regulating component 500 may include a heating device, a thermoelectric cooler (TEC) 500a, etc. When the optical module 200 is in a low-temperature environment, the heating device can generate heat and transfer the generated heat to the light-emitting chip 310 to provide heat to the light-emitting chip 310, thereby maintaining the operating temperature of the light-emitting chip 310 and reducing the impact of the low-temperature environment on the operating temperature of the light-emitting chip 310. The TEC 500a can be used to absorb the heat generated by the light-emitting chip 310 to reduce the temperature of the light-emitting chip 310, and can also generate heat to heat the light-emitting chip 310, making it more convenient to maintain the operating temperature of the light-emitting chip 310.

[0115] In some embodiments, the light-emitting chip 310 is located on a first side of the circuit board 300, and the temperature regulating component 500 is located on a second side of the circuit board 300, such that the light-emitting chip 310 and the temperature regulating component 500 are located on different sides of the circuit board 300. The first side of the circuit board 300 may be the side where the top surface of the circuit board 300 is located, and the second side of the circuit board 300 may be the side where the bottom surface of the circuit board 300 is located. Exemplarily, the light-emitting chip 310 is connected to the top surface of the circuit board 300, and the bottom of the temperature regulating component 500 is in contact with the circuit board 300 projected in the direction where the light-emitting chip 310 is located, so that the heat generated by the light-emitting chip 310 is transferred to the temperature regulating component 500 through the circuit board 300, or the heat generated by the temperature regulating component 500 is transferred to the light-emitting chip through the circuit board 300.

[0116] In some embodiments, a light emitting chip 310 is connected to a first side of the circuit board 300, and a temperature regulating component 500 is connected to a second side of the circuit board 300.

[0117] In some embodiments, a light-emitting chip 310 is connected to a first side of the circuit board 300, and a TEC 500a is connected to a second side of the circuit board 300, such that the light-emitting chip 310 and the TEC 500a are located on different sides of the circuit board 300. Exemplarily, the bottom of the TEC 500a may be connected to the second side of the circuit board 300, such that the bottom of the TEC 500a can contact the second side of the circuit board 300. The first side of the circuit board 300 may be the front side of the circuit board 300, and the second side of the circuit board 300 may be the back side of the circuit board 300. Exemplarily, the projection of the lens assembly 400 in the direction of the circuit board 300 covers the TEC 500a, and the projection of the TEC 500a in the direction of the circuit board 300 covers the light-emitting chip 310. This facilitates control over the size of the TEC 500a and also ensures the ability of the TEC 500a to adjust the temperature of the light-emitting chip 310.

[0118] Figure 9 This is a partially enlarged view of the internal structure of an optical module according to some embodiments. For example... Figure 9 As shown, in some embodiments, a through-hole 301 is formed on the circuit board 300, and the temperature regulating component 500 is embedded in the through-hole 301, so that part or all of the temperature regulating component 500 is located within the through-hole 301. The light emitting chip 310 may be disposed on the top of the temperature regulating component 500. Exemplarily, a substrate 501 is disposed on the top of the temperature regulating component 500, and the light emitting chip 310 is disposed on the substrate 501.

[0119] Figure 10 This is a partially enlarged view of the internal structure of another optical module according to some embodiments. Figure 10As shown, in some embodiments, in order to facilitate the assembly of the temperature adjustment component 500 and the circuit board 300, a spacer 502 is further arranged below the temperature adjustment component 500 to support the connection of the temperature adjustment component 500 through the spacer 502. Exemplarily, the spacer 502 can be fixedly connected with the circuit board 300, and thus the relative fixation of the temperature adjustment component 500 and the circuit board 300 is achieved through the spacer 502.

[0120] When the light emitting chip 310 is arranged on the temperature adjustment component 500, the machining tolerance of the spacer 502 and the assembly tolerance of the spacer 502 and the circuit board 300 and the like are accumulated, and finally accumulated on the light emitting chip 310, so that the patch height tolerance of the light emitting chip 310 reaches ±50μm, which affects the assembly precision of the light emitting chip 310 and the lens assembly 400, the light driving chip 330 and the like, such as the coupling efficiency of the light signal generated by the light emitting chip 310 to the light driving chip 330. When the top of the temperature adjustment component 500 is arranged on the substrate 501, the patch height tolerance of the light emitting chip 310 will also exceed ±50μm. Of course, in some embodiments, in order to reduce the influence of the light emitting chip 310 arranged on the temperature adjustment component 500, the light emitting chip 310 is arranged outside the temperature adjustment component 500, so that the temperature adjustment component 500 is located at the light emitting chip 310. In this way, the heat of the light emitting chip 310 and the temperature adjustment component 500 will be transmitted through the air, which will cause the low working efficiency of the temperature adjustment component 500, and it is difficult to meet the working temperature requirement of the light emitting chip 310.

[0121] When the circuit board 300 and the temperature adjustment component 500 are fixedly connected through the spacer 502 and the like, the temperature adjustment component 500 is usually first attached to the spacer 502, and then the spacer 502 and the circuit board 300 are assembled, which will increase the assembly process of the optical module. Moreover, during the assembly process, the tolerance needs to be strictly controlled, which increases the assembly difficulty. In addition, after the spacer 502 and the circuit board 300 are fixedly connected, in order to ensure the firmness of the connection of the spacer 502 and the circuit board 300, the edges of the connection of the spacer 502 and the circuit board 300 usually need to be coated with black glue, and the black glue solidification will prolong the assembly period, and the improper control of the amount of black glue may also cause the light emitting chip 310 and the like to be contaminated.

[0122] In this way, the temperature adjustment component 500 and the light emitting chip 310 are located on different sides of the circuit board 300, and the temperature adjustment component 500 is directly fixedly connected with the circuit board 300, which can not only reduce the process steps of the optical module assembly process and improve the optical module assembly efficiency, but also reduce the patch tolerance of the light emitting chip 310 and the like, and reduce the cost of using the substrate 501 and the spacer 502 and the like.

[0123] Figure 11 A partial enlarged view of an internal structure of an optical module according to some embodiments, Figure 12Fig. 1 is a schematic diagram of an optical module according to some embodiments. As shown in Fig. 1, the optical module includes a circuit board 300, a light emitting chip 310, a light receiving chip 320, and a temperature adjusting component 500. Figure 11 and Figure 12 In some embodiments, a recess 302 is formed on the second surface of the circuit board 300, and the recess 302 forms a groove bottom 3021 in the circuit board 300, so that the recess 302 does not penetrate through the circuit board 300. The projection of the recess 302 in the direction of the first surface of the circuit board 300 can cover the light emitting chip 310. The bottom of the temperature adjusting component 500 is located in the recess 302, and the temperature adjusting component 500 can be connected to the groove bottom 3021, so as to facilitate the heat exchange efficiency between the temperature adjusting component 500 and the light emitting chip 310, and facilitate the positioning and assembly of the temperature adjusting component 500.

[0124] In some embodiments, the edge of the projection of the groove bottom 3021 in the direction of the first surface of the circuit board 300 exceeds the edge of the light emitting chip 310, and the projection of the groove bottom 3021 in the direction of the first surface of the circuit board 300 does not extend to the light receiving chip 320.

[0125] In some embodiments, the recess 302 can be a square groove, but the embodiments of the present disclosure are not limited to the square groove.

[0126] In some embodiments, the bottom of the TEC 500a is located in the recess 302, and the bottom of the TEC 500a is connected to the groove bottom 3021.

[0127] In some embodiments, the top of the TEC 500a is provided with an electrode 510, and a bonding pad 303 can be provided on the second surface of the circuit board 300. The electrode 510 can be wire-bonded to the bonding pad 303 to realize the electrical connection between the TEC 500a and the circuit board 300.

[0128] In some embodiments, the temperature adjusting component 500 can include a temperature monitoring device for monitoring the temperature of the light emitting chip 310 and the like. The temperature monitoring device can be arranged at the side edge of the light emitting chip 310 and the like. For example, the temperature monitoring device is arranged on the first surface of the circuit board 300 and located at the side edge of the light emitting chip 310. The temperature monitoring device can be a temperature sensing device such as a thermistor 500b.

[0129] In some embodiments, the thermistor 500b can be arranged on the top of the TEC 500a, and the thermistor 500b is wire-bonded to the second surface of the circuit board 300. Of course, in some embodiments, the thermistor 500b can be arranged on the first surface of the circuit board 300, and the thermistor 500b is electrically connected to the first surface of the circuit board 300; or the thermistor 500b can be arranged in the recess 302.

[0130] Figure 13 Fig. 2 is a cross-sectional view of the internal structure of an optical module according to some embodiments, Figure 14 Fig. 3 is a cross-sectional view of the internal structure of an optical module according to some embodiments, Figure 13A local enlarged view at C. As shown in Figure 13 and Figure 14 In some embodiments, a first metal layer 3022 is arranged on the groove bottom 3021, and the first metal layer 3022 is connected to the bottom of the temperature adjusting component 500. The heat generated by the light emitting chip 310 and the like is transmitted to the circuit board 300, and then transmitted to the first metal layer 3022 through the circuit board 300, and finally transmitted to the temperature adjusting component 500 through the first metal layer 3022; or the heat generated by the temperature adjusting component 500 is transmitted to the first metal layer 3022, and then transmitted to the circuit board 300 through the first metal layer 3022, and then transmitted to the light emitting chip 310 and the like through the circuit board 300. The heat conduction efficiency of the first metal layer 3022 is greater than that of the circuit board 300, so that the first metal layer 3022 arranged on the groove bottom 3021 can accelerate the heat exchange efficiency between the circuit board 300 and the temperature adjusting component 500, thereby facilitating the temperature adjusting component 500 to maintain the performance of maintaining the working temperature of the light emitting chip 310 and the like. Moreover, the first metal layer 3022 has good flatness, which facilitates the contact area with the temperature adjusting component 500, and can further ensure the heat exchange efficiency between the circuit board 300 and the temperature adjusting component 500.

[0131] In some embodiments, the projection edge of the first metal layer 3022 in the direction of the bottom surface of the circuit board 300 exceeds the edge of the light emitting chip 310, but the projection of the first metal layer 3022 in the direction of the bottom surface of the circuit board 300 does not extend to the light receiving chip 320, thereby facilitating the reduction of the influence of the heat generated by the light emitting chip 310 on the light receiving chip 320, or facilitating the reduction of the influence of the heat generated by the temperature adjusting component 500 on the light receiving chip 320.

[0132] In some embodiments, a metal layer can be arranged on the side wall of the groove 302, which facilitates to improve the heat conduction efficiency of the circuit board 300 to a certain extent.

[0133] In some embodiments, the first metal layer 3022 can be a metal material layer such as gold or copper, which has good heat conduction efficiency. The bottom of the temperature adjusting component 500 can be bonded to the first metal layer 3022 through a heat-conducting silver adhesive.

[0134] In some embodiments, the bottom of the TEC 500a is bonded to the first metal layer 3022 through a heat-conducting silver adhesive.

[0135] In some embodiments, the projection of the first metal layer 3022 in the direction of the first surface of the circuit board 300 covers the light emitting chip 310, and the area of the first metal layer 3022 is greater than the projection area of the light emitting chip 310 on the circuit board 300, so that the heat generated by the light emitting chip 310 can be efficiently transmitted to the TEC 500a, thereby improving the heat dissipation efficiency of the light emitting chip 310.

[0136] In some embodiments, no metal layer is disposed on the sidewall of the groove 302. When the TEC 500a absorbs heat transmitted to it through the first metal layer 3022, the first metal layer 3022 is closer to the light emitting chip 310, which facilitates ensuring the heat absorption efficiency of the TEC 500a. Moreover, no metal layer is disposed on the sidewall of the groove 302, which facilitates reducing the influence of heat transmitted in other directions of the circuit board 300 on the heat absorption efficiency of the TEC 500a for the light emitting chip 310. In this way, the efficiency of the TEC 500a for dissipating heat for the light emitting chip 310 is facilitated to be ensured.

[0137] Figure 15 A cross section of an internal structure of a light module according to some embodiments Figure 1 , Figure 16 A cross section of an internal structure of a light module according to some embodiments Figure 2 . As shown in Figure 15 and Figure 16 , in some embodiments, a via hole 3023 can be disposed in the circuit board 300 between the groove bottom 3021 and the light emitting chip 310. The via hole 3023 is a metalized hole and can penetrate the inner layer of the circuit board 300. The via hole 3023 can improve the heat conduction efficiency between the light emitting chip 310 and the temperature adjusting component 500. Exemplarily, a plurality of via holes 3023 can be disposed in the circuit board 300 between the groove bottom 3021 and the light emitting chip 310.

[0138] In some embodiments, the top of the via hole 3023 does not extend to the top surface of the circuit board 300. If the top of the via hole 3023 extends to the bottom of the light emitting chip 310, the height tolerance of the patch of the light emitting chip 310 can be increased. Therefore, the top of the via hole 3023 does not extend to the top surface of the circuit board 300, which can ensure the heat conduction efficiency between the light emitting chip 310 and the temperature adjusting component 500 and reduce the influence of the via hole 3023 on the height tolerance of the patch of the light emitting chip 310.

[0139] In some embodiments, the bottom of the via hole 3023 can be connected to the first metal layer 3022, which can accelerate the heat conduction efficiency between the circuit board 300 and the first metal layer 3022, thereby facilitating improving the heat conduction efficiency between the light emitting chip 310 and the temperature adjusting component 500.

[0140] Figure 17 A cross section of an internal structure of a light module according to some embodiments Figure 3 . As shown in Figure 16 and Figure 17As shown, in some embodiments, a second metal layer 3024 may be provided in the circuit board 300 between the bottom of the slot 3021 and the light emitting chip 310. The second metal layer 3024 is located in the inner layer of the circuit board 300, which facilitates the improvement of the heat conduction efficiency between the light emitting chip 310 and the temperature regulating component 500. Exemplarily, multiple layers of the second metal layer 3024 may be provided in the circuit board 300 between the bottom of the slot 3021 and the light emitting chip 310.

[0141] In some embodiments, the second metal layer 3024 may be a metal material layer with good thermal conductivity, such as gold or copper.

[0142] In some embodiments, the projection edge of the second metal layer 3024 in the direction of the first surface of the circuit board 300 may extend beyond the light emitting chip 310, and the projection of the second metal layer 3024 in the direction of the first surface of the circuit board 300 does not extend to the light receiving chip 320. In this way, the heat conduction efficiency between the light emitting chip 310 and the temperature regulation component 500 can be improved, and the impact of heat generated by the light receiving chip 320 or the temperature regulation component 500 on the light receiving chip 320 can be reduced.

[0143] In some embodiments, vias 3023 can connect the second metal layer 3024 and the first metal layer 3022, thereby improving the heat conduction efficiency between the light emitting chip 310 and the temperature regulating component 500. Exemplarily, multiple vias 3023 and multiple layers of the second metal layer 3024 can be staggered.

[0144] Figure 18 A cross-sectional view of the internal structure of an optical module according to some embodiments. Figure 4 .like Figure 18 As shown, in some embodiments, the thermistor 500b is disposed on the first surface of the circuit board 300, and the thermistor 500b is located on the side of the light emitting chip 310.

[0145] In some embodiments, the projection of the first metal layer 3022 onto the first surface of the circuit board 300 covers the thermistor 500b, so that the thermistor 500b can monitor the operating temperature of the light emitting chip 310.

[0146] In some embodiments, the projection of the second metal layer 3024 onto the first surface of the circuit board 300 covers the thermistor 500b, facilitating the thermistor 500b's ability to monitor the operating temperature of the light emitting chip 310. Exemplarily, the projection of the second metal layer 3024 onto the first surface of the circuit board 300 extends below the laser driver chip 330, reducing the impact of the heat generated by the TEC 500a for heating the light emitting chip 310 on the laser driver chip 330.

[0147] Figure 19This is an internal structural diagram of another optical module according to some embodiments. Figure 20 This is an internal structural diagram of another optical module according to some embodiments. Figure 19 and Figure 20 As shown, in some embodiments, the optical module 200 may include a first lens assembly 400a and a second lens assembly 400b. The bottom of the first lens assembly 400a and the second lens assembly 400b is connected to a circuit board 300. An optical chip is disposed below the first lens assembly 400a and the second lens assembly 400b, the optical chip including a light emitting chip and / or a light receiving chip, etc. Transmitting surfaces and reflecting surfaces are formed on the first lens assembly 400a and the second lens assembly 400b, so that the transmission direction of the emitted light signal and / or received light signal can be adjusted by the combination of the transmitting and reflecting surfaces, enabling the emitted light signal generated by the light emitting chip to be output from the optical module and the light signal input to the optical module to be transmitted to the light receiving chip. The light emitting chip includes a laser, and the light receiving chip includes a photodetector. The placement below the first lens assembly 400a and the second lens assembly 400b is not limited to an optical chip; a matching chip may also be disposed, the matching chip including a laser driver chip and / or a TIA, etc.

[0148] In some embodiments, the second lens assembly 400b is connected to the second optical fiber strip 420, and the optical signal generated by the second optical emitting chip is transmitted to the second optical fiber strip 420 through the second lens assembly 400b; or, the optical signal input through the second optical fiber strip 420 is transmitted to the second lens assembly 400b, and then transmitted to the second optical receiving chip through the second lens assembly 400b.

[0149] In some embodiments, the second fiber optic strip 420 and the first fiber optic strip 410 share a single fiber optic connector. However, in some embodiments, the ends of the second fiber optic strip 420 and the first fiber optic strip 410 may not share a single fiber optic connector; that is, the second fiber optic strip 420 and the first fiber optic strip 410 are each connected to a corresponding fiber optic connector, and the two fiber optic connectors are arranged side-by-side at the optical port of the optical module 200; for example, the two fiber optic connectors are arranged side-by-side vertically at the optical port of the optical module 200.

[0150] In some embodiments, a temperature regulating component 500 is provided below both the first lens assembly 400a and the second lens assembly 400b. The arrangement of the temperature regulating component 500 below the first lens assembly 400a and the second lens assembly 400b can refer to the structure and use of the temperature regulating component in the above embodiments.

[0151] Finally, it should be noted that: the above examples are only used to illustrate the technical solutions of the present disclosure, but not to limit them; although the present disclosure has been described in detail with reference to the foregoing examples, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing examples, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present disclosure.

Claims

1. An optical module characterized by comprising: The circuit board is provided with a light emitting chip on the first side and a recess on the second side; the recess does not penetrate the circuit board, and a groove bottom is formed in the circuit board; the projection of the recess in the first side direction of the circuit board covers the light emitting chip; The lens assembly is arranged above the light emitting chip; The TEC is arranged in the recess and connected to the groove bottom; The thermistor is arranged on the top of the TEC or the first side of the circuit board and electrically connected to the circuit board. The bottom of the light emitting chip is connected to the first side of the circuit board; 2. The optical module according to claim 1, characterized by The via is arranged between the light emitting chip and the groove bottom, and the top of the via does not extend to the first side of the circuit board. The first side of the circuit board is provided with a light receiving chip, which is located on the side of the light emitting chip and below the lens assembly; 3. The optical module according to claim 1, characterized by The groove bottom is provided with a first metal layer, and the bottom of the TEC is in contact with the first metal layer; The second metal layer is arranged inside the circuit board between the light emitting chip and the groove bottom; the projection edges of the first metal layer and the second metal layer in the direction of the first side of the circuit board exceed the light emitting chip, and the projections of the first metal layer and the second metal layer in the direction of the first side of the circuit board extend to the light receiving chip. The groove bottom is provided with a first metal layer, and the bottom of the TEC is in contact with the first metal layer.

4. The optical module according to claim 1, characterized by The via is arranged on the circuit board, between the light emitting chip and the light emitting chip and the groove bottom, and the bottom of the via is connected to the first metal layer.

5. The optical module according to claim 3 or 4, characterized by The second metal layer is arranged inside the circuit board between the light emitting chip and the groove bottom, and the second metal layer is connected to the via.

6. The optical module of claim 2, wherein, The circuit board is provided with a light chip on the first side and a recess on the second side; the recess does not penetrate the circuit board, and a groove bottom is formed in the circuit board; the projection of the recess in the first side direction of the circuit board covers the light chip; the light chip is used for generating or receiving optical signals; 7. An optical module characterized by comprising: The lens assembly is arranged above the light chip; The temperature adjusting component is arranged in the recess and connected to the groove bottom; The via is arranged inside the circuit board between the groove bottom and the light chip, the top of the via does not extend to the first side of the circuit board, and the bottom of the via extends to the groove bottom. The groove bottom is provided with a first metal layer; the second metal layer is arranged inside the circuit board between the groove bottom and the light chip; The top of the via is connected to the second metal layer, and the bottom of the via is connected to the first metal layer.

8. The optical module according to claim 7, characterized by The circuit board is provided with a light chip on the first side and a recess on the second side; the recess does not penetrate the circuit board, and a groove bottom is formed in the circuit board; the projection of the recess in the first side direction of the circuit board covers the light chip; the light chip is used for generating or receiving optical signals ​ 9. An optical module characterized by comprising: ​ ​ ​ A TEC is arranged in the recess, and an electrode is arranged on the top of the TEC; the electrode is wire-bonded to the pad; A temperature monitoring device is arranged on the top of the TEC and electrically connected to the circuit board.

10. The optical module according to claim 9, characterized by A via hole is arranged at the bottom of the recess, and the via hole extends to the direction of the light emitting chip; the via hole does not penetrate the top surface of the circuit board.

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