Wireless charger with refrigeration function

Abstract

The utility model belongs to the technical field of wireless chargers, and particularly relates to a wireless charger with a refrigeration function, which comprises a shell internally provided with a cavity. A refrigeration module is arranged in the cavity, a cold guide plate is arranged on the refrigeration module, a charging module is arranged on the cold guide plate, the cold guide plate can abut against the shell, and the cold guide plate can conduct cold energy to the charging module and the shell. By arranging the refrigeration module, on one hand, heat generated by the charging module in the charging process can be refrigerated and dissipated, and on the other hand, the charging terminal can be refrigerated and dissipated through the shell, so that the problems of damage and charging speed reduction caused by too high heat in the charging process of the wireless charger are solved; and the problems that the shell is too hot and the equipment performance is reduced when the terminal equipment is charged are also solved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to wireless charger technical field especially relates to a wireless charger with refrigeration function. BACKGROUND

[0002] The wireless charger comprises a charging coil for generating a varying magnetic field, and the power-receiving coil of the device to be charged obtains the varying magnetic field to generate an induced current, so as to realize the wireless charging of the device to be charged.

[0003] Through retrieval, the wireless charger is disclosed in Chinese patent publication No. CN222508898U, which comprises a shell, a charging coil and a magnetic piece. The shell comprises a bearing part for bearing the device to be charged, and the charging coil is used for wireless power supply to the device to be charged borne on the bearing part. The magnetic piece is configured to be driven by the device to be charged to move relative to the charging coil, and the charging coil can generate an induced signal in response to the movement of the magnetic piece. Specifically, when the magnetic piece moves relative to the charging coil, the magnetic flux of the charging coil changes to generate an induced current, and the processor connected with the charging coil can generate an induced signal after obtaining the induced current, so that it is sensed that the bearing part has borne the device to be charged, thereby facilitating the subsequent charging action. In the present scheme, only the magnetic piece is added, without adding any other electrical elements, so that the induction of the device to be charged is realized. On the one hand, the induction is more accurate, and on the other hand, the material cost is lower.

[0004] The existing wireless charger generates a large amount of heat due to the large charging power. When the heat is not dissipated, the high temperature will cause damage and performance degradation of the wireless charger. At the same time, the terminal product also generates a large amount of heat during wireless charging, which will cause the charging speed to decrease and the experience to be poor. UTILITY MODEL CONTENTS

[0005] The utility model aims at providing a wireless charger with refrigeration function, which aims at solving the technical problems of poor refrigeration of the wireless charger in the prior art and inability to refrigerate the wireless charging terminal product.

[0006] To achieve the above-mentioned purpose, the utility model embodiment provides a wireless charger with refrigeration function, which comprises a shell, a cavity is arranged in the shell, a refrigeration module is arranged in the cavity, a metal cold guide plate is arranged on the refrigeration module, a charging module is arranged on the cold guide plate, the cold guide plate can abut against the shell, and the cold guide plate can conduct cold to the charging module and the shell.

[0007] Optionally, the cold plate is provided with a ring-shaped outer edge, the outer edge is provided with a containing cavity, the containing cavity is provided with a charging module, the charging module is provided with a cold plate, one side of the cold plate is in contact with the outer edge, and the other side of the cold plate is in contact with the shell.

[0008] Optionally, the charging module comprises a magnetic shield plate, the magnetic shield plate is provided with a charging coil, the containing cavity is further provided with a ring-shaped magnet, the magnet is hollow, the magnet is sleeved on the magnetic shield plate, the coil is provided with a cold plate, the cold plate is in contact with the outer edge, and the magnet, the magnetic shield plate, the coil and the outer edge are located on the same plane.

[0009] Optionally, the refrigeration module comprises a TEC semiconductor wafer in the middle, one side of the TEC semiconductor wafer is provided with a cooling fin, and the other side of the TEC semiconductor wafer is provided with the cold plate, and the cooling fin and the cold plate are both provided with an insulating film between the TEC semiconductor wafer.

[0010] Optionally, the TEC semiconductor wafer comprises at least two sub-cooling wafer grains, and each sub-cooling wafer grain is provided with a control circuit, so that the sub-cooling wafer grains can be independently switched on and off.

[0011] Optionally, the cooling fin is provided with a plurality of cooling fins, and the plurality of cooling fins are arranged around the periphery of the cooling fin.

[0012] Optionally, the cooling fin is provided with a plurality of cooling fins, and the plurality of cooling fins are arranged around the periphery of the cooling fin.

[0013] Optionally, the TEC semiconductor wafer comprises four sub-cooling wafer grains, and the four sub-cooling wafer grains are uniformly distributed, each sub-cooling wafer grain is provided with a control circuit, so that the sub-cooling wafer grains can be independently switched on and off.

[0014] Optionally, the magnetic shield plate comprises a ring-shaped outer edge extending out of the magnetic shield plate, the outer edge forms a placing cavity, and the charging coil is arranged in the placing cavity.

[0015] Optionally, the shell is further provided with a plurality of air inlet holes and heat dissipation holes, the micro fan takes in air from the air inlet holes and discharges air from the heat dissipation holes, so that the heat on the cooling fin is taken away in circulation.

[0016] Optionally, the outer edge and the cold plate are integrally formed.

[0017] Compared with the prior art, the one or more technical solutions of the wireless charger with the refrigeration function provided in the embodiments of the present application at least have one of the following technical effects:

[0018] By setting the refrigeration module, on one hand, heat generated in the charging process of the charging module can be refrigerated and dissipated, and on the other hand, the shell can refrigerate and dissipate heat of the charging terminal, so as to solve the problems of damage and charging speed reduction caused by excessive heat in the charging process of the wireless charger, and solve the problems of overheat of the shell and performance reduction of the terminal device in the charging process. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or prior art description will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0020] Figure 1 It is a structural schematic diagram of the present application.

[0021] Figure 2 It is an exploded sectional structural schematic diagram of the present application.

[0022] Figure 3 It is an exploded structural schematic diagram of the present application.

[0023] Figure 4 It is another angle exploded structural schematic diagram of the present application.

[0024] In the drawings, various reference signs represent:

[0025] 100, shell; 110, cavity; 120, air inlet hole; 130, heat dissipation hole;

[0026] 200, refrigeration module; 210, cold guide plate; 211, outer edge; 212, containing cavity; 220, TEC semiconductor crystal grain; 221, partition refrigeration crystal grain; 230, heat dissipation fin; 231, heat dissipation fin; 232, micro fan;

[0027] 300, charging module; 310, cold guide plate; 320, magnetic separation plate; 321, outer edge; 322, placing cavity; 330, charging coil; 340, magnet. DETAILED DESCRIPTION

[0028] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the drawings, wherein the same or similar reference signs represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are intended to explain the embodiments of the present application, and cannot be understood as a limitation of the present application.

[0029] In the description of the embodiments of the utility model, it is understood that the directions or position relations of the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like are based on the directions or position relations shown in the drawings, and are only for the convenience of describing the embodiments of the utility model and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements indicated must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the utility model.

[0030] In addition, the terms "first" and "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features.

[0031] In the embodiments of the utility model, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connecting", "fixing" and the like should be understood in a broad sense, for example, can be fixed connection, or detachable connection, or integrated; can be mechanical connection, or electrical connection; can be directly connected, or indirectly connected through an intermediate medium; can be the communication inside two elements or the interaction relationship between two elements.

[0032] In one embodiment of the utility model, according to Figures 1-4 As shown in the figure, a wireless charger with refrigeration function includes a shell 100, and a cavity 110 is arranged in the shell 100; a refrigeration module 200 is arranged in the cavity 110, a metal cold guide plate 210 is arranged on the refrigeration module 200, a charging module 300 is arranged on the cold guide plate 210, the cold guide plate 210 can abut against the shell 100, and the cold guide plate 210 can conduct cold to the charging module 300 and the shell 100.

[0033] Specifically, by arranging the refrigeration module 200, on one hand, the heat generated by the charging module 300 during the charging process can be cooled and dissipated, and on the other hand, the shell 100 can cool and dissipate heat for the charging terminal, thereby solving the problems of damage and charging speed reduction caused by excessive heat during the charging process of the wireless charger, and solving the problems of overheat of the shell 100 and performance reduction of the terminal device during charging.

[0034] In another embodiment of the utility model, according to Figures 1-3As shown, the cold-lead plate 210 is provided with an outer edge 211, the outer edge 211 is provided with a containing cavity 212, the containing cavity 212 is provided with a charging module 300, the charging module 300 is provided with a cold-lead sheet 310, one side of the cold-lead sheet 310 can be in contact with the outer edge 211, and the other side of the cold-lead sheet 310 can be in contact with the shell 100.

[0035] Specifically, the cold-lead plate 210 is integrally formed with the outer edge 211, the cold-lead plate 210 is a metal plate and can be integrally stamped, the outer edge 211 abuts against the cold-lead sheet 310, the cold-lead sheet 310 abuts against the shell 100, and the cold energy on the cold-lead plate 210 can be transmitted to the shell 100 through the cold-lead sheet 310 to cool the shell 100, so as to cool the terminal charging device, and the charging module 300 is directly arranged on the cold-lead plate 210, so the charging module 300 can be directly cooled.

[0036] In another embodiment of the present application, according to Figures 2-4 As shown, the charging module 300 comprises a magnetic shielding plate 320, the magnetic shielding plate 320 is provided with a charging coil 330, the containing cavity 212 is further provided with a ring-shaped magnet 340, the magnet 340 is hollow inside, the magnet 340 is sleeved on the magnetic shielding plate 320, the coil is provided with the cold-lead sheet 310, the cold-lead sheet 310 can be in contact with the outer edge 211, and the magnet 340, the magnetic shielding plate 320, the coil and the outer edge 211 are located on the same plane. The magnetic shielding plate 320 comprises an outer edge 321 extending out; the outer edge 321 forms a placing cavity 322, and the charging coil 330 is arranged in the placing cavity 322.

[0037] Specifically, the metal cold-lead plate 210 can be realized on the same plane with the charging coil 330 and the magnetic shielding plate after stamping, such a structure does not affect the performance of the magnetic shielding plate and does not affect the charging efficiency of the charging coil 330, and meanwhile the outer edge 211 of the cold-lead plate 210 can be directly connected with the cold-lead sheet 310, so that the cold-lead plate 210 can bypass the coil and the magnetic shielding plate to realize more efficient cold-lead.

[0038] In another embodiment of the present application, according to Figure 3 and 4 As shown, the refrigeration module 200 comprises a TEC semiconductor crystal grain 220 in the middle; one side of the TEC semiconductor crystal grain 220 is provided with a heat sink 230, and the other side is provided with a cold-lead plate 210, and the heat sink 230 and the cold-lead plate 210 are both provided with an insulating film (not shown) between the TEC semiconductor crystal grain 220.

[0039] It can be understood that the existing semiconductor heat sink 230 is provided with ceramic at both ends, the ceramic cover plate has large thermal resistance, large thickness and low heat conduction efficiency, the metal cold-lead plate 210 can increase the heat conduction effect and reduce the overall thickness, and meanwhile, without the ceramic substrate, the ceramic is fragile and has higher assembly yield.

[0040] It can be understood that the high-thermal-conductivity insulating adhesive film is prior art, and the metal cover plate can be used only because the heat-conducting insulating layer is arranged between the cover plate and the circuit layer. The high-thermal-conductivity insulating adhesive film solves the problem of insulation because the metal plate is conductive.

[0041] It can be understood that the hot end of the TEC semiconductor die 220 is in contact with the heat sink 230, and the cold end of the TEC semiconductor die 220 is in contact with the cold plate 210.

[0042] It can be understood that after the high-molecular insulating film is pressed on the bottom surface of the heat sink 230, the wireless charging peripheral charging control circuit and the TEC die are integrated on the heat sink 230, which has the following advantages: 1. The metal material of the heat sink has better heat conduction than the ceramic, and the heat dissipation efficiency is higher. 2. The ceramic substrate and the surface heat-conducting interface material are saved. 3. The heat sink 230 on the upper side and the metal cold plate 210 on the lower side can be made into a special shape or a step, which is more changeable and has better structural adaptability than the ceramic substrate. 4. The layout of the refrigeration die is more flexible, and the refrigeration die is arranged in a purposeful partition.

[0043] In another embodiment of the present application, according to Figure 3 and 4 It is shown that the TEC semiconductor die 220 includes at least two partitioned refrigeration dies 221, and each partitioned refrigeration die 221 is provided with a control circuit, which can be independently switched. The TEC semiconductor die 220 includes four partitioned refrigeration dies 221, which are uniformly distributed, and each partitioned refrigeration die 221 is provided with a control circuit, which can be independently switched. Specifically, by arranging multiple partitioned refrigeration dies 221, fine control can be achieved, different heating areas can be individually turned on or off to cool down the partitioned refrigeration dies 221, and multiple scenes such as charging, live broadcast and game can be better covered. According to the actual heating small area (point) needs, the refrigeration is performed, and the refrigeration power density of the local area is higher, and the effect is better.

[0044] In another embodiment of the present application, according to Figure 3 and 4 It is shown that the heat sink 230 is provided with multiple heat dissipation fins 231, and the multiple heat dissipation fins 231 are arranged around the periphery of the heat sink 230. The middle part of the heat sink 230 is left as an empty space, and a micro fan 232 is arranged on the empty space. The shell 100 is also provided with multiple air inlet holes 120 and multiple heat dissipation holes 130, and the micro fan 232 takes in air from the air inlet holes 120 and discharges air from the heat dissipation holes 130, so as to circulate and take away the heat on the heat sink 230. Specifically, the hot end of the TEC semiconductor die 220 conducts heat to the heat sink 230, and the heat dissipation fins 231 can increase the heat dissipation area and have better heat dissipation effect. The micro fan 232 can quickly dissipate the heat of the hot end of the TEC semiconductor die 220.

[0045] The above is a further detailed description of the utility model in combination with specific preferred embodiments, and cannot be deemed as limiting the specific implementation of the utility model to these descriptions. For ordinary skilled persons in the technical field to which the utility model belongs, the architecture form can be flexible and changeable without departing from the concept of the utility model, and a series of products can be derived. Only a few simple deductions or replacements should be deemed as belonging to the patent protection range determined by the submitted claims of the utility model.

Claims

1. A wireless charger with a refrigeration function, characterized by, The application relates to a refrigeration device, which comprises a shell, a cavity in the shell, a refrigeration module in the cavity, a metal cold-conducting plate on the refrigeration module, a charging module on the cold-conducting plate, and the cold-conducting plate abutting against the shell. 2.The wireless charging device with refrigeration function according to claim 1, wherein, The cold-conducting plate is provided with an outer edge, the outer edge is provided with a containing cavity, the containing cavity is provided with a charging module, the charging module is provided with a cold-conducting sheet, one side of the cold-conducting sheet is in contact with the outer edge, and the other side of the cold-conducting sheet is in contact with the shell. 3.The wireless charging device with refrigeration function according to claim 2, wherein, The charging module comprises a magnetic shielding plate, the magnetic shielding plate is provided with a charging coil, the containing cavity is further provided with an annular magnet, the magnet is hollow, the magnet is sleeved on the magnetic shielding plate, the coil is provided with the cold-conducting sheet, and the magnet, the magnetic shielding plate, the coil and the outer edge are located on the same plane. 4.The wireless charging device with refrigeration function according to claim 1, wherein, The refrigeration module comprises a middle TEC semiconductor wafer, one side of the TEC semiconductor wafer is provided with a heat dissipation fin, and the other side of the TEC semiconductor wafer is provided with the cold-conducting plate; and insulating films are arranged between the TEC semiconductor wafer and the heat dissipation fin and the cold-conducting plate. 5.The wireless charging device with refrigeration function according to claim 4, wherein, The TEC semiconductor wafer comprises at least two sub-zone refrigeration wafers, and control circuits are arranged on each of the sub-zone refrigeration wafers. 6.The wireless charging device with refrigeration function according to claim 4, wherein, The heat dissipation fin is provided with a plurality of heat dissipation fins, and the heat dissipation fins are arranged around the heat dissipation fin. 7.The wireless charging device with refrigeration function according to claim 6, wherein, The heat dissipation fin is provided with a micro fan. 8.The wireless charging device with refrigeration function of claim 5, wherein, The TEC semiconductor wafer comprises four sub-zone refrigeration wafers, and the four sub-zone refrigeration wafers are uniformly distributed and provided with control circuits. 9.The wireless charging device with refrigeration function of claim 3, wherein, The magnetic shielding plate comprises an extended outer edge, and the outer edge forms a placing cavity, and the charging coil is arranged in the placing cavity. 10.The wireless charging device with refrigeration function of claim 7, wherein, The shell is further provided with a plurality of air inlet holes and heat dissipation holes, the micro fan takes in air from the air inlet holes and discharges air from the heat dissipation holes, and the heat on the heat dissipation fin is taken away in circulation.

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