Camera module and electronic equipment

Abstract

The utility model relates to the technical field of camera shooting, and specifically provides a camera shooting module comprising a circuit board; the photosensitive part is arranged on the circuit board; the bracket is arranged on the circuit board and is provided with a light hole; the lens base is arranged on one side, deviating from the circuit board, of the bracket; the lens is arranged in the lens base; and the first bonding piece is connected between the lens base and the lens. Wherein the lens, the light hole and the photosensitive member are sequentially and correspondingly arranged along the optical axis direction of the lens, the thermal expansion coefficient of the lens seat along the optical axis direction of the lens is at least, and the thermal expansion coefficient of the lens seat along the direction perpendicular to the optical axis direction of the lens is at least. According to the camera module, the thermal expansion coefficient of the lens base is reasonably configured, so that the back focal length variation of the lens caused by temperature change can be effectively and positively compensated, the adverse effect of the variation on the overall performance of the camera module is reduced, and the imaging quality of the camera module is favorably improved. The utility model further provides electronic equipment comprising a shell and the camera module.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of camera technology, in particular to a camera module and an electronic device. BACKGROUND

[0002] The camera module usually adopts glue to bond the lens and the lens seat. In the process of assembling the camera module, the glue needs to be baked at high temperature to solidify, so as to realize the fixed connection of the lens and the lens seat. However, the temperature drift sensitivity between different lenses is different. When the temperature changes in different camera modules, the lens will appear back focus variation, thereby affecting the imaging quality of the camera module. CONTENT OF THE UTILITY MODEL

[0003] In view of the above, it is necessary to provide a camera module and an electronic device to improve the imaging quality.

[0004] The embodiment of the present application provides a camera module, which comprises:

[0005] a circuit board;

[0006] a photosensitive member arranged on the circuit board;

[0007] a support arranged on the circuit board and provided with a light transmission hole;

[0008] a lens seat arranged on the side of the support away from the circuit board;

[0009] a lens arranged in the lens seat; and

[0010] a first bonding member connected between the lens seat and the lens;

[0011] wherein the lens, the light transmission hole and the photosensitive member are sequentially arranged along the optical axis direction of the lens, the thermal expansion coefficient of the lens seat along the optical axis direction of the lens is at least , and the thermal expansion coefficient of the lens seat along the direction perpendicular to the optical axis direction of the lens is at least .

[0012] In the above camera module, by reasonably configuring the thermal expansion coefficient of the lens seat, the back focus variation of the lens caused by the temperature change can be effectively compensated in a positive direction, thereby reducing the adverse effect of the variation on the overall performance of the camera module, and the imaging quality of the camera module is improved.

[0013] In some embodiments, the thermal expansion coefficient of the lens seat along the optical axis direction of the lens is the same as the thermal expansion coefficient of the lens seat along the direction perpendicular to the optical axis direction of the lens.

[0014] Therefore, through the above setting, the processing technology of the lens seat can be simplified, and the production cost of the lens seat is reduced.

[0015] In some embodiments, the lens seat is in a barrel structure, the lens is in abutment with the inner wall of the lens seat at one end close to the support, a gap is formed between the lens and the inner wall of the lens seat at an end away from the support, the gap is arranged around the lens, and the first adhesive is filled in the gap.

[0016] Therefore, the first adhesive is arranged around the lens, the stability of the connection between the lens and the lens seat can be improved, and in addition, the first adhesive is accommodated in the gap, overflow of the first adhesive to the lens seat can be avoided, and the aesthetic appearance of the camera module can be ensured.

[0017] In some embodiments, the camera module further comprises:

[0018] The second adhesive is connected between the circuit board and the photosensitive element to fix the circuit board and the photosensitive element.

[0019] Therefore, the connection difficulty of the circuit board and the photosensitive element can be reduced by the second adhesive, and the production cost of the camera module can be reduced.

[0020] In some embodiments, the camera module further comprises:

[0021] The third adhesive is connected between the support and the circuit board to fix the support and the circuit board.

[0022] Therefore, the connection difficulty of the support and the circuit board can be reduced by the third adhesive, and the production cost of the camera module can be reduced.

[0023] In some embodiments, a receiving groove is formed on one side of the support facing the circuit board, the receiving groove is arranged around the support, and the third adhesive is filled in the receiving groove and flush with the side surface of the support.

[0024] Therefore, the third adhesive is filled in the receiving groove and flush with the side surface of the support, the uniformity of the connection of the support and the circuit board can be ensured, and overflow of the third adhesive to the side surface of the circuit board can be avoided, thereby ensuring the aesthetic appearance of the camera module.

[0025] In some embodiments, the camera module further comprises:

[0026] The fourth adhesive is connected between the lens seat and the support to fix the lens seat and the support.

[0027] Therefore, the connection difficulty of the lens seat and the support can be reduced by the fourth adhesive, and the production cost of the camera module can be reduced.

[0028] In some embodiments, the camera module further comprises:

[0029] The filter is arranged on the support and covers the light transmission hole.

[0030] Therefore, the stray light entering the lens can be filtered by the filter, so as to improve the imaging quality of the camera module.

[0031] In some embodiments, the camera module further comprises:

[0032] The fifth adhesive is connected between the filter and the support, so as to fix the filter and the support.

[0033] Therefore, the fifth adhesive can reduce the connection difficulty of the filter and the support, which is conducive to reducing the production cost of the camera module.

[0034] The embodiment of the present application also provides an electronic device, comprising:

[0035] The housing; and

[0036] The camera module described above is installed on the housing.

[0037] In the electronic device described above, by reasonably configuring the thermal expansion coefficient of the lens seat in the camera module, the back focal variation of the lens caused by temperature change can be effectively compensated, so as to reduce the adverse effect of the variation on the overall performance of the camera module, which is conducive to improving the imaging quality of the electronic device. BRIEF DESCRIPTION OF DRAWINGS

[0038] Figure 1 It is a cross-sectional view of the camera module of the embodiment of the present application.

[0039] Figure 2 It is a structural schematic view of the electronic device of the embodiment of the present application.

[0040] Main element symbol explanation: camera module 100, gap 100a, circuit board 110, photosensitive member 120, support 130, light transmission hole 130a, accommodating groove 130b, lens seat 140, lens 150, first adhesive 160, second adhesive 170, third adhesive 180, fourth adhesive 190, filter 191, fifth adhesive 192, electronic device 1000, housing 200. DETAILED DESCRIPTION

[0041] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the drawings, wherein the same or similar reference signs represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present application, and cannot be understood as a limitation of the present application.

[0042] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the term "connection" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integrally connected; it can be mechanical connection, or electrical connection or can communicate with each other; it can be directly connected, or indirectly connected through an intermediate medium, or the internal communication of two elements or the interaction relationship between two elements. In the description of the present application, it should be noted that the meaning of "multiple" is two or more, unless otherwise explicitly specified and limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0043] The embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0044] Please refer to Figure 1 The embodiment of the present application provides a camera module 100, which comprises a circuit board 110, a photosensitive element 120, a bracket 130, a lens seat 140, a lens 150 and a first adhesive 160. The photosensitive element 120 is arranged on the circuit board 110, the bracket 130 is arranged on the circuit board 110 and is provided with a light transmission hole 130a, the lens seat 140 is arranged on the side of the bracket 130 away from the circuit board 110, the lens 150 is arranged in the lens seat 140, and the first adhesive 160 is connected between the lens seat 140 and the lens 150. Among them, the lens 150, the light transmission hole 130a and the photosensitive element 120 are sequentially arranged corresponding to the optical axis direction of the lens 150, the thermal expansion coefficient of the lens seat 140 along the optical axis direction of the lens 150 is at least The thermal expansion coefficient of the lens seat 140 along the direction perpendicular to the optical axis direction of the lens 150 is at least .

[0045] Exemplarily, the thermal expansion coefficient of the lens seat 140 along the optical axis direction of the lens 150 can be 、 The thermal expansion coefficient of the lens seat 140 along the direction perpendicular to the optical axis direction of the lens 150 can be .

[0046] In the above-mentioned camera module 100, by reasonably configuring the thermal expansion coefficient of the lens seat 140, the rear focal variation of the lens 150 caused by temperature change can be effectively compensated in a positive direction, thereby reducing the adverse effects of such variation on the overall performance of the camera module 100, and improving the imaging quality of the camera module 100.

[0047] In the embodiment, the first adhesive 160 can be a ring-shaped structure formed by curing glue.

[0048] In some embodiments, the coefficient of thermal expansion of the lens holder 140 along the optical axis direction of the lens 150 is the same as the coefficient of thermal expansion of the lens holder 140 along a direction perpendicular to the optical axis direction of the lens 150.

[0049] Therefore, by the above arrangement, the machining process of the lens holder 140 can be simplified, and the production cost of the lens holder 140 can be reduced.

[0050] Please refer to Figure 1 In some embodiments, the lens holder 140 has a barrel structure, one end of the lens 150 close to the bracket 130 abuts against the inner wall of the lens holder 140, and a gap 100a is formed between the other end of the lens 150 away from the bracket 130 and the inner wall of the lens holder 140. The gap 100a is arranged around the lens 150, and the first adhesive 160 is filled in the gap 100a.

[0051] Therefore, the first adhesive 160 is arranged around the lens 150, which can improve the stability of the connection between the lens 150 and the lens holder 140. In addition, the first adhesive 160 is accommodated in the gap 100a, which can prevent the first adhesive 160 from overflowing to the lens holder 140, thereby ensuring the aesthetic appearance of the camera module 100.

[0052] In some embodiments, the camera module 100 further comprises a second adhesive 170. The second adhesive 170 is connected between the circuit board 110 and the photosensitive element 120 to fix the circuit board 110 and the photosensitive element 120. In this embodiment, the second adhesive 170 can be a sheet structure formed by curing of glue.

[0053] Therefore, the second adhesive 170 can reduce the connection difficulty of the circuit board 110 and the photosensitive element 120, which is conducive to reducing the production cost of the camera module 100.

[0054] In some embodiments, the camera module 100 further comprises a third adhesive 180. The third adhesive 180 is connected between the bracket 130 and the circuit board 110 to fix the bracket 130 and the circuit board 110. In this embodiment, the third adhesive 180 can be an annular structure formed by curing of glue.

[0055] Therefore, the third adhesive 180 can reduce the connection difficulty of the bracket 130 and the circuit board 110, which is conducive to reducing the production cost of the camera module 100.

[0056] Please refer to Figure 1 In some embodiments, the side of the bracket 130 facing the circuit board 110 is provided with a receiving groove 130b, the receiving groove 130b is arranged around the bracket 130, and the third adhesive 180 is filled in the receiving groove 130b and flush with the side surface of the bracket 130.

[0057] Therefore, the third adhesive 180 is filled in the accommodation groove 130b and flushes with the side surface of the support 130, which can ensure the uniformity of the connection between the support 130 and the circuit board 110, and avoid overflow of the third adhesive 180 to the side surface of the circuit board 110, thereby ensuring the aesthetic appearance of the camera module 100.

[0058] In some embodiments, the camera module 100 further includes a fourth adhesive 190. The fourth adhesive 190 is connected between the lens holder 140 and the support 130 to fix the lens holder 140 and the support 130. In this embodiment, the fourth adhesive 190 can be an annular structure formed by curing of glue.

[0059] Therefore, the fourth adhesive 190 can reduce the connection difficulty of the lens holder 140 and the support 130, which is conducive to reducing the production cost of the camera module 100.

[0060] Referring to Figure 1 In some embodiments, the camera module 100 further includes a light filtering member 191. The light filtering member 191 is arranged on the support 130 and covers the light transmission hole 130a.

[0061] Therefore, the light filtering member 191 can filter the stray light entering the lens 150, thereby improving the imaging quality of the camera module 100.

[0062] In some embodiments, the camera module 100 further includes a fifth adhesive 192. The fifth adhesive 192 is connected between the light filtering member 191 and the support 130 to fix the light filtering member 191 and the support 130. In this embodiment, the fifth adhesive 192 can be a sheet structure formed by curing of glue.

[0063] Therefore, the fifth adhesive 192 can reduce the connection difficulty of the light filtering member 191 and the support 130, which is conducive to reducing the production cost of the camera module 100.

[0064] Referring to Figure 2 The embodiments of the present application also provide an electronic device 1000, which includes a housing 200 and the above-mentioned camera module 100, and the camera module 100 is mounted on the housing 200. The electronic device 1000 can be a mobile phone, a tablet computer, etc.

[0065] In the above-mentioned electronic device 1000, by reasonably configuring the thermal expansion coefficient of the lens holder 140 in the camera module 100, the back focal variation of the lens 150 caused by temperature change can be effectively compensated, thereby reducing the adverse effects of this variation on the overall performance of the camera module 100, which is conducive to improving the imaging quality of the electronic device 1000.

[0066] It is apparent that the present application is not limited to the details of the foregoing exemplary embodiments, and that the present application can be implemented in other specific forms without departing from the spirit or essential characteristics of the application. Therefore, the embodiments should be considered in all respects as illustrative and not restrictive, the scope of the application being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

[0067] Finally, it should be noted that the above embodiments are merely used to illustrate the technical solutions of the present application, rather than limit the present application. Although the present application is described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present application can be modified or equivalently replaced, without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. An image capturing module, comprising: The camera module comprises: a circuit board; a photosensitive element disposed on the circuit board; a support disposed on the circuit board and having a light-transmitting hole; a lens holder disposed on a side of the support away from the circuit board; a lens disposed in the lens holder; and a first adhesive connecting the lens holder and the lens. The lens holder has a thermal expansion coefficient along an optical axis of the lens that is the same as a thermal expansion coefficient of the lens holder along a direction perpendicular to the optical axis of the lens. The lens, the light transmission hole and the photosensitive piece are sequentially arranged along the optical axis direction of the lens. The thermal expansion coefficient of the lens holder along the direction perpendicular to the optical axis direction of the lens is at least .

2. The camera module of claim 1, wherein, The lens holder has a barrel structure, an end of the lens close to the support abuts against an inner wall of the lens holder, and a gap is formed between an end of the lens away from the support and the inner wall of the lens holder, the gap being arranged around the lens, and the first adhesive is filled in the gap.

3. The camera module of claim 1, wherein, The camera module further comprises:

4. The camera module of claim 1, wherein, a second adhesive connecting the circuit board and the photosensitive element to fix the circuit board and the photosensitive element. The camera module further comprises:

5. The camera module of claim 1, wherein the lens is disposed on the substrate. a third adhesive connecting the support and the circuit board to fix the support and the circuit board. The support has a receiving groove on a side of the support facing the circuit board, the receiving groove being arranged around the support, and the third adhesive is filled in the receiving groove and flush with a side surface of the support.

6. The camera module of claim 5, wherein, The camera module further comprises:

7. The camera module of claim 1, wherein the lens is a lens having a focal length of 2.5 mm or less. a fourth adhesive connecting the lens holder and the support to fix the lens holder and the support. The camera module further comprises: 8.The camera module of claim 1, wherein, a light filter disposed on the support and covering the light-transmitting hole. The camera module further comprises:

9. The camera module of claim 8, wherein, a fifth adhesive connecting the light filter and the support to fix the light filter and the support. The camera module comprises:

10. An electronic device, comprising: a housing; and the camera module as claimed in any one of claims 1 to 9, the camera module being mounted in the housing. ​ ​

Images