Heat dissipation structure and electronic equipment

Abstract

The utility model provides a heat dissipation structure and electronic equipment, the heat dissipation structure can comprise a cover body and a heat conductor, the cover body is provided with a first space and at least one first opening communicated with the first space, the first space is at least used for assembling a functional part, the functional part can generate heat, and the heat conductor is arranged in the first space. The functional area of the functional part corresponds to the first opening; the heat conductor is at least connected with a target surface of the functional part and a target inner wall of the first space formed by the cover body, and the target surface and the target inner wall are close to the first opening; wherein the first opening is used for forming a mounting channel of the heat conductor; and / or the first opening can form an input and / or output channel of the functional part.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the field of heat dissipation technology, and in particular to a heat dissipation structure and an electronic device. BACKGROUND

[0002] The electronic device is provided with a functional part such as a light-emitting lamp and a lens, so as to enrich the functions of the electronic device.

[0003] The functional part is arranged in the shell of the electronic device, so as to protect the functional part by the shell.

[0004] However, the functional part generates heat during operation, which causes the local temperature of the electronic device corresponding to the position of the functional part to be too high. INVENTION CONTENTS

[0005] The present disclosure provides a heat dissipation structure and an electronic device, and the technical solutions are as follows:

[0006] In a first aspect, the present disclosure provides a heat dissipation structure, which can include: a cover body and a heat conduction body, the cover body has a first space and at least one first opening communicating with the first space, the first space is at least used for assembling a functional part, the functional part can generate heat, and a functional area of the functional part corresponds to the first opening; the heat conduction body is connected with at least a target surface of the functional part and a target inner wall of the cover body forming the first space, the target surface and the target inner wall are adjacent to the first opening; wherein the first opening is used to form a mounting channel of the heat conduction body; and / or the first opening can form an input and / or output channel of the functional part.

[0007] In some embodiments, the arrangement direction of the target inner wall and the target surface is parallel to the depth direction of the first opening; the target inner wall surrounds the first opening once; and the orthogonal projection of the target surface to the target inner wall coincides with the target inner wall.

[0008] In some embodiments, the first side of the cover body is recessed with a first recess to form a first space with a second opening, the second side of the cover body opposite to the first side is recessed with a second recess, the at least one first opening corresponds to the inner bottom wall of the first recess and the inner bottom wall of the second recess, and respectively communicates with the first recess and the second recess; the heat conduction body is further arranged at the inner side wall and the inner bottom wall of the second recess and the first opening, and the heat conduction body of the inner side wall and the inner bottom wall of the second recess is connected with the heat conduction body between the target surface and the target inner wall through the heat conduction body of the first opening.

[0009] In some embodiments, the first part of the functional component extends out of the first opening to the second groove, so that the functional area is located in the second groove and corresponds to the first opening; and the heat-conducting body of the first opening corresponds between the first part and a circumferential wall of the first opening.

[0010] In some embodiments, the heat-conducting body is a heat-conducting glue, and the cover has heat-conducting performance.

[0011] In a second aspect, the present disclosure provides an electronic device, which can include: an electronic device body and at least one heat dissipation structure, the electronic device body can include: a first shell, a second shell, and a functional component arranged between the first shell and the second shell, the functional component can generate heat, and a functional area of the functional component is opposite to the first shell; the at least one heat dissipation structure is arranged between the first shell and the second shell, and includes: a cover and a heat-conducting body, the cover has a first space and at least one first opening communicating with the first space, the first space is at least used for assembling the functional component, and the functional area of the functional component corresponds to the first opening; the heat-conducting body is connected with at least a target surface of the functional component and a target inner wall of the cover forming the first space, and the target surface and the target inner wall are adjacent to the first opening; wherein the first opening is used to form a mounting channel of the heat-conducting body; and / or the first opening can form an input and / or output channel of the functional component.

[0012] In some embodiments, the heat dissipation structure includes a first heat dissipation structure, the functional component is an image processing chip signal connected with a camera module of the electronic device, the image processing chip is arranged in the first space of the first heat dissipation structure, and an exposed surface of the image processing chip corresponds to the first opening of the first heat dissipation structure; and / or the heat dissipation structure further includes a second heat dissipation structure, the functional component is a light emitting component signal connected with the camera module of the electronic device, the light emitting component is arranged in the first space of the second heat dissipation structure, and a light emitting area of the light emitting component corresponds to the first opening of the second heat dissipation structure.

[0013] In some embodiments, the electronic device can further include: a circuit board arranged between the first shell and the second shell, connected with the first heat dissipation structure and / or the second heat dissipation structure close to one side of the second shell, and the functional component is arranged on the circuit board and electrically connected with the circuit board.

[0014] In some embodiments, the electronic device can further include a camera module, a lens of which is disposed on a side of the circuit board facing the first housing and is in signal connection with an image processing chip, and the first housing is provided with a light-transmitting area corresponding to the lens, the light-transmitting area being an opening formed on the first housing or a transparent material layer provided corresponding to the lens.

[0015] In some embodiments, the cover body and the first housing both have heat conduction performance.

[0016] The above description is only a summary of the technical solutions of the present disclosure. In order to more clearly understand the technical means of the present disclosure, and can be implemented according to the content of the specification, the following will be described in detail with the preferred embodiments of the present disclosure and with the drawings as follows. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the present disclosure or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only some embodiments of the present disclosure, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of these drawings.

[0018] Figure 1 Structure diagram of the heat dissipation structure provided by the present disclosure Figure 1 ;

[0019] Figure 2 Structure diagram of the heat dissipation structure provided by the present disclosure Figure 2 ;

[0020] Figure 3 Cross-sectional structure diagram of the heat dissipation structure provided by the present disclosure

[0021] Figure 4 Partial cross-sectional structure diagram of the electronic device provided by the present disclosure

[0022] Figure 5 Partial cross-sectional enlarged structure diagram of the electronic device provided by the present disclosure

[0023] Explanation of reference signs:

[0024] 10, heat dissipation structure; 11, cover body; 111, first space; 112, first opening; 113, target inner wall; 114, second opening; 115, first groove; 116, second groove; 1161, guide inclined surface; 117, third opening; 12, heat conduction body; 10A, first heat dissipation structure; 10B, second heat dissipation structure; 20, functional part; 201, functional area; 202, target surface; 203, first part; 21, image processing chip; 22, light emitting part; 30, electronic device; 31, electronic device body; 311, first shell; 312, second shell; 313, camera device; 3131, lens; 314, circuit board. DETAILED DESCRIPTION

[0025] The embodiments of the present disclosure will be described in further detail below with reference to the drawings and examples. The detailed description and drawings of the following examples are used to exemplarily illustrate the principles of the present disclosure, but cannot be used to limit the scope of the present disclosure, and the present disclosure can be implemented in many different forms, and is not limited to the specific examples disclosed herein, but includes all technical solutions falling within the scope of the claims.

[0026] The present disclosure provides these examples in order to make the present disclosure thorough and complete, and fully convey the scope of the present disclosure to those skilled in the art. It should be noted that: unless otherwise specified, the relative arrangement of components and steps, the composition of materials, numerical expressions and values set forth in these examples should be interpreted as merely exemplary, and not as a limitation.

[0027] It should be noted that, in the description of the present disclosure, unless otherwise specified, the meaning of "a plurality of" is greater than or equal to two; the orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", "inner", "outer" and the like is only for the purpose of facilitating the description of the present disclosure and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present disclosure. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0028] In addition, "first", "second", and similar words used in the present disclosure do not indicate any order, number, or importance, but are only used to distinguish different parts. "Vertical" is not strictly vertical, but within the allowable range of error. "Parallel" is not strictly parallel, but within the allowable range of error. "Include" or "contain" and similar words mean that the elements before the word cover the elements listed after the word, and do not exclude the possibility of also covering other elements.

[0029] It should be noted that, in the description of the present disclosure, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connecting" should be understood in a broad sense, for example, can be fixed connection, can also be detachable connection, or integrally connected; can be directly connected, or indirectly connected through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in the present disclosure can be understood according to the specific circumstances. When it is described that a specific device is located between the first device and the second device, there can be or can not be an intermediate device between the specific device and the first device or the second device.

[0030] All the terms used in the present disclosure have the same meaning as understood by those skilled in the art to which the present disclosure belongs, unless otherwise specifically defined. It should also be understood that the terms defined in general dictionaries should be interpreted to have meanings consistent with their meanings in the context of the relevant art, and should not be interpreted in an idealized or excessively formalized sense, unless otherwise defined explicitly herein.

[0031] The techniques, methods, and devices known to those skilled in the relevant art can not be discussed in detail, but in appropriate cases, the techniques, methods, and devices should be considered as part of the specification.

[0032] The electronic device is provided with a functional piece such as a light-emitting lamp and a lens to enrich the functions of the electronic device.

[0033] The functional piece is arranged in the shell of the electronic device to protect the functional piece by the shell.

[0034] However, the functional piece generates heat during operation, causing the local temperature of the electronic device corresponding to the position of the functional piece to be too high.

[0035] The present inventors have found that a heat dissipation structure can be provided, which can include a cover body and a heat conduction body. The cover body has a first space and a first opening communicating with the first space. The functional piece can be assembled in the first space, and the functional area of the assembled functional piece corresponds to the first opening (for example, the functional area is in the first space and opposite to the first opening, or the functional area extends from the first opening and is opposite to the first opening). The heat conduction body can be arranged between the target surface of the functional piece and the target inner wall of the cover body forming the first space. Since the target surface and the target inner wall are adjacent to the first opening, the heat generated by the functional piece can be conducted to the heat conduction body and discharged from the first opening near the heat conduction body, so as to timely dissipate the heat generated by the functional piece, thereby reducing the probability of the temperature of the electronic device corresponding to the position of the functional piece being too high. In addition, the first opening can be a mounting channel of the heat conduction body or a channel for the functional piece to realize its function, so that the first opening at least has the above two functions, so as to reduce the number of first openings.

[0036] First aspect

[0037] The present disclosure provides a heat dissipation structure 10, as shown in Figures 1 to 5 The heat dissipation structure 10 can include a cover 11 and a heat conduction body 12. The cover 11 has a first space 111 and at least one first opening 112 communicating with the first space 111, and the first space 111 is used at least for assembling a functional component 20 capable of generating heat. The functional area 201 of the functional component 20 corresponds to the first opening 112. The heat conduction body 12 is connected to at least the target surface 202 of the functional component 20 and the target inner wall 113 of the cover 11 forming the first space 111. The target surface 202 and the target inner wall 113 are adjacent to the first opening 112. The first opening 112 is used to form a mounting channel of the heat conduction body 12. The first opening 112 can form an input and / or output channel of the functional component 20.

[0038] The cover 11 can be made of metal materials such as iron, copper, aluminum, etc. The metal material can improve the structural strength of the cover 11 and prolong the service life of the cover 11. The cover 11 can also be made of non-metal materials such as plastic. The non-metal material can reduce the manufacturing cost of the cover 11 and reduce the risk of short circuit between the cover 11 and other electronic devices (such as the functional component 20, etc.) in the electronic equipment 30 assembled with the heat dissipation structure 10. The first space 111 of the cover 11 can be a cavity inside the cover 11, or a first recess 115 with a second opening 114 formed by a first side recess of the cover 11 as shown in Figure 2 and Figure 3 In the case of the first space 111 being a cavity inside the cover 11, the functional component 20 can be placed in the cavity during the manufacturing process of the cover 11. In the case of the first space 111 being the first recess 115, the functional component 20 can be assembled in the first recess 115 through the second opening 114 of the first recess 115 after the manufacturing is completed. The first opening 112 can be a hole with a rectangular, circular, etc. shape. The shape of the hole can be consistent with the shape of the functional area 201, so that the shape is adapted and the visual effect is good when the functional area 201 corresponds to the first opening 112. As shown in Figure 4 and Figure 5 In the case of the first space 111 being the first recess 115, the first opening 112 can be arranged on the bottom wall of the first recess 115 and opposite to the second opening 114. The size of the first opening 112 can be smaller than the size of the second opening 114 and consistent with the size of the corresponding functional area 201. The functional area 201 corresponding to the first opening 112 can be the functional area 201 of the functional component 20 in the first space 111 and opposite to the first opening 112. It can also be as shown in Figure 4 and Figure 5The functional area 201 shown in the middle extends from and is opposite to the first opening 112.

[0039] The heat conductor 12 has at least a heat conduction function, and the heat conductor 12 is connected to the target surface 202 of the functional component 20 and the target inner wall 113 of the cover 11 forming the first space 111, and since the target surface 202 and the target inner wall 113 are close to the first opening 112, the heat conductor 12 is close to the first opening 112, so that the heat generated by the functional component 20 can be at least transmitted to the first opening 112 through the area where the target surface 202 is located and the heat conductor 12, and then sent out through the first opening 112.

[0040] In the case where the number of first openings 112 is multiple, each of the multiple first openings 112 can be used as a mounting channel of the heat conductor 12 and also correspond to multiple functional areas 201 on one functional component 20 or multiple functional components 20 in the first space 111. In the case where the number of first openings 112 is multiple, some of the first openings 112 can be used as a mounting channel of the heat conductor 12, and the others can be used to correspond to multiple functional areas 201 on one functional component 20 or multiple functional components 20 in the first space 111. The input channel can be an input channel of signals, light, heat, etc., and the output channel can be an output channel of signals, light, heat, etc.

[0041] In an example, referring to Figures 1 to 5 As shown, the heat dissipation structure 10 can include a cover 11 and a heat conductor 12. The first side of the cover 11 is recessed with a first recess 115 having a second opening 114 to form a first space 111. The bottom wall of the first recess 115 is provided with two first openings 112. The first space 111 is used to assemble an image processing chip 21. The processing area of the image processing chip 21 corresponds to one of the first openings 112. The heat conductor 12 is connected to at least the target surface 202 of the functional component 20 and the target inner wall 113 of the cover 11 forming the first space 111. The target surface 202 and the target inner wall 113 are close to the first opening 112. The first opening 112 that is dislocated from the processing area is used to form a mounting channel of the heat conductor 12. The first opening 112 corresponding to the processing area can form an output channel for heat dissipation of the processing area.

[0042] It can be understood that the distance between the target inner wall 113 and the target surface 202 (such as 0.06 mm) can make the heat conductor 12 meet the heat dissipation thickness, and can reduce the probability of collision between the target inner wall 113 and the target surface 202.

[0043] In the embodiment, the heat dissipation structure 10 can include a cover 11 and a heat conducting body 12. The cover 11 has a first space 111 and a first opening 112 communicating with the first space 111. The functional component 20 can be assembled in the first space 111, and a functional area 201 of the assembled functional component 20 can correspond to the first opening 112. The heat conducting body 12 can be arranged between a target surface 202 of the functional component 20 and a target inner wall 113 of the cover 11 forming the first space 111, and the target surface 202 and the target inner wall 113 are adjacent to the first opening 112. Thus, the heat generated by the functional component 20 can be conducted to the heat conducting body 12 and discharged at least through the first opening 112, so that the heat generated by the functional component 20 can be dissipated in time, thereby reducing the probability of excessively high temperature of the electronic device 30 at the position of the functional component 20. In addition, the first opening 112 can be a mounting channel of the heat conducting body 12 or a channel for realizing the function of the functional component 20, so that the first opening 112 can have multiple functions, thereby reducing the number of the first openings 112.

[0044] In some embodiments, referring to Figure 5 As shown, the arrangement direction Z of the target inner wall 113 and the target surface 202 is parallel to the depth direction of the first opening 112. The target inner wall 113 surrounds the first opening 112 once. The orthogonal projection of the target surface 202 on the target inner wall 113 coincides with the target inner wall 113.

[0045] When the number of the first openings 112 is one, the target inner wall 113 can be annular, the target surface 202 can also be annular, and the target inner wall 113 and the target surface 202 are opposite to each other and both surround the first opening 112. In this way, the target inner wall 113 and the target surface 202 are close to the first opening 112, so that the heat conducting body 12 can be conveniently mounted between the target surface 202 and the target inner wall 113 through the first opening 112, and the mounted heat conducting body 12 is close to the first opening 112, so that the heat of the functional component 20 can be quickly sent out through the first opening 112.

[0046] When the number of the first openings 112 is multiple, the target inner wall 113 can be multiple annular and the multiple annular can be connected to each other, the target surface 202 can also be multiple annular and the multiple annular can be connected to each other, and the target inner wall 113 and the target surface 202 are opposite to each other and both surround the first opening 112. In this way, the target inner wall 113 and the target surface 202 are close to the first opening 112, so that the heat conducting body 12 can be conveniently mounted between the target surface 202 and the target inner wall 113 through the first opening 112, and the mounted heat conducting body 12 is close to the first opening 112, so that the heat of the functional component 20 can be quickly sent out through the first opening 112.

[0047] In some embodiments, referring to Figures 1 to 5 As shown, the first side of the cover 11 is recessed with a first recess 115 to form a first space 111 with a second opening 114, and the second side of the cover 11 opposite to the first side is recessed with a second recess 116, and at least one first opening 112 corresponds to the inner bottom wall of the first recess 115 and the inner bottom wall of the second recess 116 and respectively communicates the first recess 115 and the second recess 116; the heat-conducting body 12 is further arranged on the inner side wall, the inner bottom wall of the second recess 116 and the first opening 112, and the heat-conducting body 12 on the inner side wall and the inner bottom wall of the second recess 116 is connected with the heat-conducting body 12 between the target surface 202 and the target inner wall 113 through the heat-conducting body 12 of the first opening 112.

[0048] That is, the first side and the second side of the cover 11 opposite to each other are respectively provided with the first recess 115 and the second recess 116, the second opening 114 of the first recess 115 and the third opening 117 of the second recess 116 are opposite to each other, the first opening 112 is arranged on the inner bottom wall of the first recess 115 and the inner bottom wall of the second recess 116 and communicates the first recess 115 and the second recess 116, the heat-conducting body 12 is arranged not only between the target surface 202 of the functional part 20 and the target inner wall 113 of the first recess 115 in the first recess 115, but also on the inner side wall and the inner bottom wall of the second recess 116 and the first opening 112, and the heat-conducting body 12 in the first recess 115, the first opening 112 and the second recess 116 is connected with each other, so that the heat generated by the functional part 20 can be discharged through the third opening 117 of the cover 11 via the path of the heat-conducting body 12 in the first recess 115, the heat-conducting body 12 in the first opening 112 and the heat-conducting body 12 in the second recess 116, and the heat-conducting body 12 on the inner side wall and the inner bottom wall of the second recess 116 can increase the heat-conducting area to further improve the heat dissipation efficiency around the functional part 20.

[0049] In some embodiments, referring to Figure 4 and Figure 5 As shown, the first part 203 of the functional part 20 extends to the second recess 116 through the first opening 112, so that the functional area 201 is located in the second recess 116 and corresponds to the first opening 112; the heat-conducting body 12 of the first opening 112 corresponds to between the first part 203 and the inner wall of the first opening 112.

[0050] In other words, the functional part 20 is partially located in the first opening 112 and partially located in the second recess 116, and has an annular space between the peripheral side and the first opening 112, and the heat-conducting body 12 is further arranged in the annular space and can be connected with the peripheral side of the functional part 20 and the inner wall of the first opening 112.

[0051] In the embodiment, the heat-conducting body 12 located at the first opening 112 surrounds the functional component 20 located in the first opening 112 by one circle, so that the heat generated by the functional component 20 can be diffusively radiated to the one circle of the heat-conducting body 12 in the first opening 112 through the circumferential side of the first part 203, so as to be able to conduct more heat, thereby improving the heat dissipation efficiency of the functional component 20; and the one circle of the heat-conducting body 12 located in the first opening 112 is connected with the one circle of the side surface of the first part 203 and the one circle of the inner wall of the first opening 112 respectively, so as to be able to reduce the probability of shaking of the first part 203 relative to the first opening 112.

[0052] In some embodiments, referring to Figures 1 to 5 As shown, the heat-conducting body 12 is heat-conducting glue, and the cover body 11 has heat-conducting performance. The heat-conducting glue can be injected between the target surface 202 and the target inner wall 113 through the mounting channel formed by the first opening 112. In this way, the heat-conducting glue can not only conduct and dissipate heat, but also can bond the target surface 202 and the target inner wall 113 respectively, and bond the first part 203 and the one circle of the inner wall of the first opening 112 respectively, so as to be able to improve the structural strength between the cover body 11, the functional component 20 and the heat-conducting body 12; then, the heat generated by the functional component 20 can be dissipated not only through the heat-conducting body 12, but also through the cover body 11, so as to be able to further reduce the temperature of the position where the functional component 20 is located.

[0053] Here, the inner side wall and the inner bottom wall of the second groove 116 can be connected through the guide slope 1161, so that in the process of setting the second groove 116 and installing the heat-conducting glue, the heat-conducting glue can flow from the opening of the second groove 116 to the target surface 202 and the target inner wall 113 between the inner side wall of the second groove 116, the guide slope 1161, the inner bottom wall and the first opening 112, and the guide slope 1161 can accelerate the flow speed of the heat-conducting glue, thereby improving the installation efficiency of the heat-conducting body 12.

[0054] The second aspect

[0055] The present disclosure provides an electronic device 30, referring to Figure 4 and Figure 5As shown, the electronic device 30 can include an electronic device body 31 and at least one heat dissipation structure 10. The electronic device body 31 can include a first shell 311, a second shell 312, and a functional component 20 disposed between the first shell 311 and the second shell 312. The functional component 20 can generate heat. A functional area 201 of the functional component 20 is opposite to the first shell 311. The at least one heat dissipation structure 10 is disposed between the first shell 311 and the second shell 312. The heat dissipation structure 10 can include a cover 11 and a heat conduction body 12. The cover 11 has a first space 111 and at least one first opening 112 communicating with the first space 111. The first space 111 is at least used for assembling the functional component 20. The functional area 201 of the functional component 20 corresponds to the first opening 112. The heat conduction body 12 is connected with at least a target surface 202 of the functional component 20 and a target inner wall 113 of the first space 111 formed by the cover 11. The target surface 202 and the target inner wall 113 are adjacent to the first opening 112. The first opening 112 is used for forming a mounting channel of the heat conduction body 12. The first opening 112 can form an input and / or output channel of the functional component 20. A side of the first opening 112 opposite to the first space 111 is opposite to the first shell 311.

[0056] The electronic device 30 can be a notebook computer, a tablet computer, or the like. When the electronic device 30 is a notebook computer, the electronic device body 31 includes a display part having a display screen and a system part having a key area, or the electronic device body 31 includes a display part having a display screen.

[0057] In an example, the electronic device body 31 of the electronic device 30 is a notebook computer. The electronic device body 31 includes a display part having a display screen and a system part having a key area. The display part can rotate relative to the system part to realize opening and folding of the notebook computer. Figure 4 and Figure 5 As shown, the display part has the first shell 311 and the second shell 312. The first shell 311 and the second shell 312 are oppositely disposed and form an external shell of the display part. The second shell 312 is flush with the display screen. The heat dissipation structure 10 is disposed between the first shell 311 and the second shell 312. The first opening 112 of the cover 11 is opposite to the first shell 311. The functional component 20 is an image processing chip 21. A processing area of the image processing chip 21 is opposite to the first opening 112 and the first shell 311. A camera module 313 electrically connected with the image processing chip 21 is further disposed between the first shell 311 and the second shell 312. A light receiving surface of a lens 3131 of the camera module 313 is opposite to the first shell 311. An image collected by the lens 3131 can be processed by the image processing chip 21.

[0058] In this embodiment, by arranging the heat dissipation structure 10 in the electronic device 30, and assembling the functional component 20 in the heat dissipation structure 10, the heat of the functional component 20 can be transmitted to the first opening 112 adjacent to the heat conduction body 12, and then transmitted out through the first opening 112, so as to reduce the temperature of the position where the functional area 201 is located.

[0059] In some embodiments, as shown in Figure 4 The heat dissipation structure 10 can include a first heat dissipation structure 10A, and the functional component 20 is an image processing chip 21 connected with the camera module 313 of the electronic device 30, the image processing chip 21 is arranged in the first space 111 of the first heat dissipation structure 10A, and the exposed surface of the image processing chip 21 corresponds to the first opening 112 of the first heat dissipation structure 10A; and / or, the heat dissipation structure 10 can also include a second heat dissipation structure 10B, and the functional component 20 is a light emitting component 22 connected with the camera module 313 of the electronic device 30, the light emitting component 22 is arranged in the first space 111 of the second heat dissipation structure 10B, and the light emitting area of the light emitting component 22 corresponds to the first opening 112 of the second heat dissipation structure 10B.

[0060] The image processing chip 21 can process an image, which can be an image stored in the memory of the electronic device body 31, an image collected by the lens 3131 of the camera module 313 arranged in the electronic device body 31, an image transmitted to the electronic device body 31 from other devices through a transmission device, or an image obtained in other ways.

[0061] The light emitting component 22 can have a light supplementing function to provide light supplement for the collection area during the image collection of the camera module 313.

[0062] In the case that the functional component 20 includes the first heat dissipation structure 10A, the image processing chip 21 is arranged in the first space 111 of the first heat dissipation structure 10A, and the exposed surface (such as the processing area) of the image processing chip 21 corresponds to the first opening 112 of the first heat dissipation structure 10A; in the case that the functional component 20 includes the second heat dissipation structure 10B, the light emitting component 22 is arranged in the first space 111 of the second heat dissipation structure 10B, and the light emitting area of the light emitting component 22 corresponds to the first opening 112 of the second heat dissipation structure 10B; and the heat dissipation structure 10 can simultaneously arrange the first heat dissipation structure 10A and the second heat dissipation structure 10B, so that the first heat dissipation structure 10A and the second heat dissipation structure 10B can simultaneously dissipate heat for multiple functional components 20, so as to reduce the probability of local temperature overheat of multiple functional components 20 in the electronic device 30.

[0063] In some embodiments, as shown in Figure 4As shown, the electronic device 30 can further include a circuit board 314 disposed between the first housing 311 and the second housing 312, connected to the side of the first heat dissipation structure 10A and / or the second heat dissipation structure 10B close to the second housing 312, and the functional component 20 is disposed on the circuit board 314 and electrically connected to the circuit board 314.

[0064] The circuit board 314 can be a structure for data processing, power management, etc. in the electronic device 30, which can be connected to the image processing chip 21, the light emitting component 22, etc. For example, the start, stop, processing progress, processing parameters, etc. of the image processing chip 21 can be controlled, and the start light emitting time, stop light emitting time, light emitting brightness, etc. of the light emitting component 22 can be controlled, so as to enrich the function settings of the functional component 20 through the circuit board 314, and the heat generated by the circuit board 314 can be dissipated through the functional component 20 and the heat conductor 12, so as to reduce the probability of the temperature of the circuit board 314 being too high.

[0065] In some embodiments, referring to Figure 4 As shown, the electronic device 30 can further include a camera module 313, the lens 3131 of which is disposed on the side of the circuit board 314 facing the first housing 311 and is signal connected to the image processing chip 21, and the first housing 311 is provided with a light transmission area corresponding to the lens 3131, which is an opening or a transparent material layer provided corresponding to the lens 3131.

[0066] The lens 3131 of the camera module 313 enables the electronic device 30 to have a camera function, and the camera module 313 can be located between the image processing chip 21 and the light emitting component 22, so that the distance between the camera module 313 and the image processing chip 21 and the light emitting component 22 is short, the image processing chip 21 can quickly receive and process the image collected by the camera module 313, and the light emitting component 22 can quickly supplement the light in the light collection area of the camera module 313.

[0067] When the light transmission area is a transparent material layer, it can be a glass material, a plastic material, or other materials.

[0068] In some embodiments, the cover body 11 and the first housing 311 both have heat conduction performance. In this way, the heat conductor 12 can conduct the heat generated by the functional component 20 to the cover body 11, the cover body 11 can conduct the heat to the first housing 311, and then dissipate the heat through the large surface of the first housing 311, which can further improve the heat dissipation efficiency and reduce the temperature at the position of the functional component 20.

[0069] It should be noted that the heat dissipation structure in the electronic device provided by the present disclosure is similar to the description of the heat dissipation structure embodiments described above, and has similar beneficial effects as the heat dissipation structure embodiments described above. For technical details not disclosed in the electronic device embodiments of the present disclosure, please refer to the description of the heat dissipation structure embodiments in the present disclosure for understanding, which will not be described here.

[0070] So far, the embodiments of the present disclosure have been described in detail. In order to avoid obscuring the concept of the present disclosure, some details known in the art are not described. Those skilled in the art can fully understand how to implement the technical solutions disclosed herein according to the above description.

[0071] Although some specific embodiments of the present disclosure have been described in detail through examples, those skilled in the art should understand that the above examples are only for illustration, not for limiting the scope of the present disclosure. Those skilled in the art should understand that the above embodiments can be modified or some technical features can be replaced equivalently without departing from the scope and spirit of the present disclosure. In particular, as long as there is no structural conflict, each technical feature mentioned in each embodiment can be combined in any way.

Claims

1. A heat dissipating structure, characterized by comprising: The heat dissipation structure comprises: a cover body having a first space and at least one first opening communicating with the first space, the first space being used for at least assembling a functional component capable of generating heat, a functional area of the functional component corresponding to the first opening; a heat conduction body connected to at least a target surface of the functional component and a target inner wall of the cover body forming the first space, the target surface and the target inner wall being adjacent to the first opening; wherein the first opening is used for forming a mounting channel of the heat conduction body; and / or the first opening is capable of forming an input and / or output channel of the functional component.

2. The heat dissipation structure according to claim 1, wherein: an arrangement direction of the target inner wall and the target surface is parallel to a depth direction of the first opening; the target inner wall surrounds the first opening; a normal projection of the target surface to the target inner wall coincides with the target inner wall.

3. The heat dissipation structure according to claim 2, wherein: a first side of the cover body is recessed with a first groove to form a first space having a second opening, a second side of the cover body opposite to the first side is recessed with a second groove, the at least one first opening corresponds to inner bottom walls of the first groove and the second groove and respectively communicates with the first groove and the second groove; the heat conduction body is further arranged on inner side walls and inner bottom walls of the second groove and the first opening, and the heat conduction body on the inner side walls and the inner bottom walls of the second groove is connected to the heat conduction body between the target surface and the target inner wall through the heat conduction body of the first opening.

4. The heat dissipation structure according to claim 3, wherein: a first part of the functional component extends to the second groove through the first opening, so that the functional area is located in the second groove and corresponds to the first opening; the heat conduction body of the first opening corresponds to between the first part and inner walls of the first opening.

5. The heat dissipation structure according to any one of claims 1 to 4, wherein: the heat conduction body is a heat conduction adhesive, and the cover body has a heat conduction performance. The electronic device comprises:

6. An electronic device, comprising: an electronic device body comprising a first shell, a second shell and a functional component arranged between the first shell and the second shell, the functional component being capable of generating heat, a functional area of the functional component corresponding to the first shell; at least one heat dissipation structure arranged between the first shell and the second shell, comprising: a cover body having a first space and at least one first opening communicating with the first space, the first space being used for at least assembling the functional component, a functional area of the functional component corresponding to the first opening; a heat conduction body connected to at least a target surface of the functional component and a target inner wall of the cover body forming the first space, the target surface and the target inner wall being adjacent to the first opening; wherein the first opening is used for forming a mounting channel of the heat conduction body; and / or the first opening is capable of forming an input and / or output channel of the functional component.

7. The electronic device according to claim 6, wherein: ​ The heat dissipation structure comprises a first heat dissipation structure, the functional component is an image processing chip connected with a camera module of the electronic device, the image processing chip is arranged in a first space of the first heat dissipation structure, and a surface of the image processing chip exposed corresponds to a first opening of the first heat dissipation structure; And / or, The heat dissipation structure further comprises a second heat dissipation structure, the functional component is a light emitting component connected with the camera module of the electronic device, the light emitting component is arranged in a first space of the second heat dissipation structure, and a light emitting area of the light emitting component corresponds to a first opening of the second heat dissipation structure.

8. The electronic device of claim 7, wherein, Further comprising: A circuit board arranged between the first shell and the second shell, connected with a side of the first heat dissipation structure and / or the second heat dissipation structure close to the second shell, and the functional component is arranged on the circuit board and electrically connected with the circuit board.

9. The electronic device of claim 8, wherein, Further comprising: A camera module, a lens of which is arranged on a side of the circuit board facing the first shell and connected with the image processing chip, and the first shell is provided with a light transmission area corresponding to the lens, the light transmission area being an opening arranged on the first shell or a transparent material layer arranged corresponding to the lens.

10. The electronic device of claim 6, wherein The cover body and the first shell both have heat conduction performance.

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