Integrated uniform-temperature liquid cooling head and heat dissipation equipment
By designing an integrated homogeneous liquid cooling head, and utilizing the circulation of phase change working fluid and coolant, the problems of low heat dissipation performance and complex structure of existing liquid cooling heads are solved, achieving efficient heat transfer and simple heat dissipation effect.
Patent Information
- Application Number
- CN202520740492.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-17
- Publication Date
- 2026-04-10
- Estimated Expiration
- 2035-04-17
AI Technical Summary
Existing liquid cooling heads have low heat dissipation performance, complex structure, and cannot meet the heat dissipation requirements of high-performance computing devices, and have low space utilization.
An integrated homogenous liquid cooling head was designed, which uses an inlet nozzle, an outlet nozzle, a top cover, and a homogenous heat dissipation component, including a heat dissipation cover plate and a heat dissipation base plate, to form a liquid flow cavity and a phase change cavity. Heat dissipation is achieved by circulating the phase change working fluid and the coolant, reducing the complexity of structures such as impellers.
It improves heat dissipation performance, simplifies the structure, increases space utilization, and ensures efficient heat transfer and circulating heat dissipation.