Integrated uniform-temperature liquid cooling head and heat dissipation equipment

Abstract

The utility model provides an integrated uniform-temperature liquid cooling head and heat dissipation equipment. The integrated uniform-temperature liquid cooling head comprises a water inlet nozzle, a water outlet nozzle, an upper cover and a uniform-temperature heat dissipation assembly, the water inlet nozzle and the water outlet nozzle are arranged on the upper cover at intervals, the uniform-temperature heat dissipation assembly comprises a heat dissipation cover plate and a heat dissipation bottom plate, one side of the heat dissipation cover plate is connected with the upper cover, the heat dissipation cover plate is provided with heat dissipation shovel teeth, and the heat dissipation cover plate and the upper cover jointly form a liquid flowing cavity. The heat dissipation shovel teeth are located in the liquid flowing cavity. The other side of the heat dissipation cover plate is connected with the heat dissipation bottom plate, the heat dissipation bottom plate and the heat dissipation cover plate jointly form a phase change cavity, a phase change working medium is arranged in the phase change cavity, a capillary layer is arranged on the inner wall of the phase change cavity, the heat dissipation bottom plate is used for abutting against a heat source, and the phase change working medium is used for transferring heat to the heat dissipation shovel teeth during phase change conversion. After the cooling liquid circulates through the water inlet nozzle, the liquid flowing cavity and the water outlet nozzle, the cooling liquid cools the heat dissipation shovel teeth, and the capillary layer is used for enabling the liquid phase change working medium to flow back to the heat dissipation bottom plate.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of liquid cooling head, in particular to an integrated uniform temperature liquid cooling head and heat dissipation equipment. BACKGROUND

[0002] When a computer calculates data, a large amount of heat will be generated, and the computer needs to be cooled to avoid damage. The traditional cooling method is air cooling or water cooling. Air cooling is to use a fan or adopt a heat dissipation fin to cool the computer, and water cooling is to use a liquid cooling head to take away the heat of the computer. However, with the increase of computing demand, the traditional cooling method cannot meet the requirements of heat management in the fields of high-performance computing, data center, cloud computing and artificial intelligence.

[0003] For the water cooling method, most of the conventional liquid cooling heads on the market currently adopt copper cooling heads with notched or forged micro-channels. For example, a liquid cooling head disclosed in a Chinese patent with application number CN202221498033.X uses a water pump to take in and out the heat dissipation liquid into the liquid cooling head. The heat dissipation liquid is in contact with the notched heat dissipation fin after rotating with the impeller, and then takes away the heat. However, due to the low heat flux density of the notched heat dissipation fin and the heat source, it cannot meet the higher heat dissipation requirements. For large computers or servers with higher computing requirements, the heat dissipation performance is still low, and the liquid cooling head also has structures such as impellers and stators inside, making the structure of the liquid cooling head more complex and leading to low space utilization.

[0004] Therefore, there is an urgent need for a new type of liquid cooling head with high heat dissipation performance and simple structure. INVENTION CONTENTS

[0005] The purpose of the present disclosure is to overcome the deficiencies in the prior art and provide an integrated uniform temperature liquid cooling head and heat dissipation equipment with high heat dissipation performance and simple structure.

[0006] The purpose of the present disclosure is achieved by the following technical solutions:

[0007] An integrated uniform temperature liquid cooling head, comprising a water inlet nozzle, a water outlet nozzle, an upper cover and a uniform heat dissipation assembly, the water inlet nozzle and the water outlet nozzle are arranged at intervals on the upper cover, the uniform heat dissipation assembly comprises a heat dissipation cover plate and a heat dissipation bottom plate, one side of the heat dissipation cover plate is connected with the upper cover, the heat dissipation cover plate is provided with heat dissipation notches, the heat dissipation cover plate and the upper cover jointly form a liquid flow cavity, the heat dissipation notches are located in the liquid flow cavity, and the liquid flow cavity is respectively connected with the water inlet nozzle and the water outlet nozzle;

[0008] Another side of the heat dissipation cover plate is connected with the heat dissipation bottom plate, the heat dissipation bottom plate and the heat dissipation cover plate jointly form a phase change cavity, the phase change cavity is used for accommodating a phase change working medium, an inner wall of the phase change cavity is provided with a capillary layer, the heat dissipation bottom plate is used for abutting against a heat source, and the phase change working medium is used for transferring heat to the heat dissipation spade tooth during phase change conversion, so that the cooling liquid circulates through the water inlet nozzle, the liquid flow cavity and the water outlet nozzle, the cooling liquid cools the heat dissipation spade tooth, and the capillary layer is used for returning the liquid phase phase change working medium to the heat dissipation bottom plate.

[0009] In one of the embodiments, the heat dissipation spade tooth comprises a plurality of rectangular tooth bars, and the plurality of rectangular tooth bars are arranged at intervals along the length direction of the heat dissipation cover plate.

[0010] In one of the embodiments, the capillary layer is a copper powder sintering layer or a copper mesh spot welding layer.

[0011] In one of the embodiments, a containing groove is formed in the surface of the heat dissipation cover plate, and part of the structure of the upper cover is located in the containing groove and welded with the heat dissipation cover plate.

[0012] In one of the embodiments, the heat dissipation cover plate is welded with the heat dissipation bottom plate.

[0013] In one of the embodiments, the phase change working medium is pure water or refrigerant.

[0014] In one of the embodiments, a supporting column is protruded on the side of the heat dissipation cover plate away from the heat dissipation spade tooth, the supporting column is located in the phase change cavity, and the supporting column abuts against the heat dissipation bottom plate.

[0015] In one of the embodiments, the number of the supporting columns is a plurality, and the plurality of supporting columns are arranged at intervals on the heat dissipation cover plate.

[0016] In one of the embodiments, the water inlet nozzle and the water outlet nozzle are located on the same side of the upper cover.

[0017] A heat dissipation device comprises the integrated uniform temperature liquid cooling head of any one of the above embodiments. Compared with the prior art, the present disclosure has at least the following advantages:

[0018] 1. The aforementioned integrated vapor chamber liquid cooling head has an inlet and outlet nozzle on the top cover. The top cover, heat dissipation cover plate, and heat dissipation base plate are stacked. The top cover and heat dissipation cover plate together form a liquid flow cavity, and the heat dissipation cover plate and heat dissipation base plate together form a phase change cavity. The phase change cavity contains a phase change working fluid. When the heat dissipation base plate comes into contact with the heat source, heat is transferred to the heat dissipation base plate, causing the phase change working fluid in the phase change cavity to evaporate and carry the heat to the bottom of the heat dissipation cover plate. Then, the heat is transferred to the heat dissipation shovel teeth. At this time, the coolant circulates in the liquid flow cavity through the inlet and outlet nozzles, so that the coolant comes into contact with the heat dissipation shovel teeth to carry away the heat. While the heat dissipation shovel teeth are cooled by the circulating coolant, the gaseous phase change working fluid evaporated in the phase change cavity is cooled and condensed. Finally, it circulates back to the heat source end (i.e., the heat dissipation base plate) through gravity and capillary action. Through this continuous internal circulation, the heat dissipation performance is improved.

[0019] 2. The aforementioned integrated vapor chamber liquid cooling head dissipates heat through the phase change of the phase change working fluid and the circulation of the coolant. While ensuring heat dissipation performance, compared with traditional liquid cooling heads, this application reduces the internal impeller, stator and other structures, making the liquid cooling head structure of this application simpler and more space-efficient. Attached Figure Description

[0020] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the accompanying drawings used in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of this disclosure and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the structure of an integrated homogenizing liquid cooling head in one embodiment;

[0022] Figure 2 for Figure 1 The diagram shows a cross-sectional view of the integrated vapor chamber liquid cooling head.

[0023] Figure 3 for Figure 1 A schematic diagram of the heat dissipation cover plate of the integrated vapor chamber liquid cooling head is shown.

[0024] Figure 4 for Figure 1 Another structural schematic diagram of the heat dissipation cover plate of the integrated vapor chamber liquid cooling head shown;

[0025] Figure 5 for Figure 1 A schematic diagram of the heat dissipation base plate of the integrated vapor chamber liquid cooling head is shown.

[0026] Figure 6 for Figure 1A structural schematic diagram of an upper cover of an integrated liquid cold plate shown in FIG. 1;

[0027] Figure 7 As shown in FIG. 1, the integrated liquid cold plate includes an upper cover 10, a lower cover 20, and a heat transfer plate 30. Figure 1 A structural schematic diagram of another integrated liquid cold plate shown in FIG. 1;

[0028] Figure 8 As shown in FIG. 1, the integrated liquid cold plate includes an upper cover 10, a lower cover 20, and a heat transfer plate 30. Figure 1 A structural schematic diagram of another integrated liquid cold plate shown in FIG. 1; DETAILED DESCRIPTION

[0029] For the purpose of the present disclosure, the following description will be made with reference to the accompanying drawings. In the drawings, the preferred embodiments of the present disclosure are shown. However, the present disclosure can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of the present disclosure can be understood more thoroughly and completely.

[0030] It should be noted that when an element is referred to as being "on" another element, it can be directly on the other element or intervening elements can also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements can also be present. The terms "vertical", "horizontal", "left", "right", and the like as used herein are for the purpose of illustration only and are not intended to limit the present disclosure.

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used in the description of the disclosure herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0032] The one-piece uniform temperature liquid cooling head provided by the present disclosure comprises a water inlet nozzle, a water outlet nozzle, an upper cover and a uniform temperature heat dissipation assembly, the water inlet nozzle and the water outlet nozzle are arranged at intervals on the upper cover, the uniform temperature heat dissipation assembly comprises a heat dissipation cover plate and a heat dissipation bottom plate, one side of the heat dissipation cover plate is connected with the upper cover, the heat dissipation cover plate is provided with heat dissipation spade teeth, the heat dissipation cover plate and the upper cover jointly form a liquid flow cavity, the heat dissipation spade teeth are located in the liquid flow cavity, and the liquid flow cavity is in communication with the water inlet nozzle and the water outlet nozzle respectively; the other side of the heat dissipation cover plate is connected with the heat dissipation bottom plate, the heat dissipation bottom plate and the heat dissipation cover plate jointly form a phase change cavity, the phase change cavity is used for accommodating phase change working medium, the inner wall of the phase change cavity is provided with a capillary layer, the heat dissipation bottom plate is used for abutting against a heat source, and the phase change working medium is used for transferring heat to the heat dissipation spade teeth when phase change conversion occurs, so that the cooling liquid makes the heat dissipation spade teeth cool down after circulating through the water inlet nozzle, the liquid flow cavity and the water outlet nozzle, and the capillary layer is used for returning the liquid phase phase change working medium to the heat dissipation bottom plate.

[0033] The one-piece uniform temperature liquid cooling head, the upper cover is provided with the water inlet nozzle and the water outlet nozzle, the upper cover, the heat dissipation cover plate and the heat dissipation bottom plate are arranged in layers, the upper cover and the heat dissipation cover plate jointly form the liquid flow cavity, the heat dissipation cover plate and the heat dissipation bottom plate jointly form the phase change cavity, the phase change cavity is provided with the phase change working medium, when the heat dissipation bottom plate abuts against the heat source, heat is transferred to the heat dissipation bottom plate, the phase change working medium in the phase change cavity is evaporated by heat, heat is brought to the bottom of the heat dissipation cover plate, and then heat is transferred to the heat dissipation spade teeth, at this time, the cooling liquid is circulated in the liquid flow cavity through the water inlet nozzle and the water outlet nozzle, the cooling liquid contacts the heat dissipation spade teeth to take away heat, and while the heat dissipation spade teeth are cooled by the circulating cooling liquid, the gaseous phase change working medium evaporated in the phase change cavity is condensed by cooling, and finally returns to the heat source end (i.e. the heat dissipation bottom plate) through the action of gravity and the capillary layer. Through the phase change of the phase change working medium and the circulation of the cooling liquid, the heat dissipation performance is better.

[0034] In order to better understand the technical solutions and beneficial effects of the present disclosure, the present disclosure will be further described in detail in combination with specific embodiments:

[0035] As Figures 1 to 3As shown, the integrated liquid cooling head 10 of one embodiment includes a water inlet nozzle 100, a water outlet nozzle 200, an upper cover 300, and a uniform temperature heat dissipation assembly 400. The water inlet nozzle 100 and the water outlet nozzle 200 are arranged at intervals on the upper cover 300. The uniform temperature heat dissipation assembly 400 includes a heat dissipation cover plate 410 and a heat dissipation bottom plate 420. One side of the heat dissipation cover plate 410 is connected to the upper cover 300. The heat dissipation cover plate 410 is provided with heat dissipation spurs 411. The heat dissipation cover plate 410 and the upper cover 300 jointly form a liquid flow cavity 500. The heat dissipation spurs 411 are located in the liquid flow cavity 500. The liquid flow cavity 500 is in communication with the water inlet nozzle 100 and the water outlet nozzle 200, respectively, so that the cooling liquid circulates in the liquid flow cavity 500 through the water inlet nozzle 100 and the water outlet nozzle 200, thereby taking away the heat on the heat dissipation spurs 411.

[0036] Further, the other side of the heat dissipation cover plate 410 is connected to the heat dissipation bottom plate 420. The heat dissipation bottom plate 420 and the heat dissipation cover plate 410 jointly form a phase change cavity 600. The phase change cavity 600 is provided with a phase change working medium (not shown in the figure). The inner wall of the phase change cavity 600 is provided with a capillary layer (not shown in the figure). The heat dissipation bottom plate 420 is used to abut against a heat source. The phase change working medium is used to transfer heat to the heat dissipation spurs 411 when phase change conversion occurs. After the cooling liquid circulates through the water inlet nozzle 100, the liquid flow cavity 500, and the water outlet nozzle 200, the cooling liquid cools down the heat dissipation spurs 411. The capillary layer is used to return the liquid phase phase change working medium to the heat dissipation bottom plate 420.

[0037] In the present embodiment, the heat dissipation cover plate 410 and the heat dissipation bottom plate 420 jointly form the phase change cavity 600. After the phase change cavity 600 is filled with the phase change working medium, the phase change cavity 600 is pumped to a negative pressure state by vacuumizing. The negative pressure state can lower the boiling point of the phase change working medium. When the temperature of the heat dissipation bottom plate 420 reaches 30-40℃, the phase change working medium in the phase change cavity 600 can evaporate to form water vapor to take away heat to the top. Further, the working principle of the liquid cooling head is as follows: the heat dissipation bottom plate 420 is abutted against a heat source. The heat source transfers heat to the heat dissipation bottom plate 420, so that the phase change working medium in the phase change cavity 600 is heated to evaporate. The evaporation takes away heat to the top and abuts against the heat dissipation cover plate 410. Then, the heat is transferred to the heat dissipation spurs 411 on the heat dissipation cover plate 410. At this time, the cooling liquid circulates in the liquid flow cavity 500 through the water inlet nozzle 100 and the water outlet nozzle 200, so that the cooling liquid continuously circulates and contacts the heat dissipation spurs 411 to take away the heat on the heat dissipation spurs 411. While the heat dissipation spurs 411 are cooled by the circulating cooling liquid, the gaseous phase change working medium that evaporates abuts against the heat dissipation cover plate 410 and is cooled to condense. Through the action of gravity and the capillary layer, the liquid phase phase change working medium is circulated and returned to the heat dissipation bottom plate 420. In this way, a heat dissipation cycle is formed inside, thereby improving the heat dissipation performance of the liquid cooling head.

[0038] The integrated liquid cooling head 10 has the water inlet nozzle 100 and the water outlet nozzle 200, the upper cover 300, the heat dissipation cover plate 410 and the heat dissipation bottom plate 420 are stacked, the upper cover 300 and the heat dissipation cover plate 410 jointly form the liquid flow cavity 500, the heat dissipation cover plate 410 and the heat dissipation bottom plate 420 jointly form the phase change cavity 600, the phase change cavity 600 is provided with phase change working medium, when the heat dissipation bottom plate 420 abuts against the heat source, heat is transmitted to the heat dissipation bottom plate 420, so that the phase change working medium in the phase change cavity 600 is heated and evaporated to take heat to the bottom of the heat dissipation cover plate 410, and then the heat is transmitted to the heat dissipation shovels 411, at this time, the cooling liquid is circulated in the liquid flow cavity 500 through the water inlet nozzle 100 and the water outlet nozzle 200, so that the cooling liquid contacts the heat dissipation shovels 411 to take away heat, and at the same time that the heat dissipation shovels 411 are cooled by the circulating cooling liquid, the gaseous phase change working medium evaporated in the phase change cavity 600 is condensed by cooling, and finally flows back to the heat source end (i.e. the heat dissipation bottom plate 420) through gravity and capillary layer effect, so that the heat dissipation performance is better through the internal circulation. The phase change of the phase change working medium and the circulation of the cooling liquid are used for heat dissipation, while the heat dissipation performance is guaranteed, compared with the traditional liquid cooling head, the internal impeller, stator and the like are reduced, so that the liquid cooling head structure of the application is more simple and convenient, and the space utilization is higher.

[0039] As shown in Figure 3 In one embodiment, the heat dissipation shovels 411 include a plurality of rectangular racks 411a, and the plurality of rectangular racks are arranged along the length direction of the heat dissipation cover plate 410. In this embodiment, the plurality of racks are arranged along the length direction of the heat dissipation cover plate 410, so that the number of racks can be set to be larger, and the racks are in a rectangular shape, so that the heat dissipation area of the racks is larger, and the heat dissipation performance of the heat dissipation shovels 411 is better. Further, the heat dissipation shovels 411 and the heat dissipation cover plate 410 are an integral molding structure, the heat dissipation shovels 411 are formed on the heat dissipation cover plate 410 through CNC processing, so that the structure of the heat dissipation cover plate 410 and the heat dissipation shovels 411 is more compact and the structural strength is higher.

[0040] In one of the embodiments, the capillary layer is a copper powder sintering layer or a copper mesh spot welding layer. In this embodiment, the capillary layer is a copper powder sintering layer, and the space surrounded by the heat dissipation cover plate 410 and the heat dissipation bottom plate 420 forms a phase change cavity 600, and the capillary layer is formed on the cavity wall of the phase change cavity 600. It can be understood that, before assembling the heat dissipation cover plate 410 and the heat dissipation bottom plate 420, copper powder sintering needs to be performed on the heat dissipation cover plate 410 and the heat dissipation bottom plate 420, so that the inner surfaces of the heat dissipation cover plate 410 and the heat dissipation bottom plate 420 form a copper powder sintering layer. After the heat dissipation cover plate 410 and the heat dissipation bottom plate 420 are assembled, the cavity wall of the phase change cavity 600 forms a complete capillary layer. Further, the copper powder sintering layer has high porosity and good capillary performance. After the phase change working medium is heated, it evaporates into a gaseous state, and the gaseous phase change working medium flows upward, so that the phase change working medium abuts against the bottom of the heat dissipation cover plate 410. Under the circulation action of the cooling liquid, the gaseous phase change working medium cools and condenses at the heat dissipation bottom plate 420. The liquid phase change working medium is driven by the capillary force of the copper powder sintering layer to flow back from the cold end to the hot end, that is, from the bottom of the heat dissipation cover plate 410 to the heat dissipation bottom plate 420. In this way, the continuous flow of the liquid is ensured, thereby maintaining the continuity of the evaporation-condensation process, forming a closed loop cycle.

[0041] As shown in Figure 3 In one of the embodiments, the surface of the heat dissipation cover plate 410 is provided with a receiving groove 412, and part of the upper cover 300 is located in the receiving groove 412 and welded with the heat dissipation cover plate 410. In this embodiment, the bottom surface of the heat dissipation cover plate 410 is provided with a receiving groove 412, and the bottom of the upper cover 300 is embedded in the receiving groove 412 and welded with the heat dissipation cover plate 410, so that the connection strength of the heat dissipation cover plate 410 and the heat dissipation bottom plate 420 is higher. Further, the heat dissipation cover plate 410 and the heat dissipation bottom plate 420 can be welded by diffusion welding, vacuum brazing or tunnel furnace welding.

[0042] In one of the embodiments, the heat dissipation cover plate 410 is welded with the heat dissipation bottom plate 420. In this embodiment, the side of the heat dissipation cover plate 410 away from the heat dissipation spade tooth 411 is provided with a mounting groove, and the mounting groove is part of the phase change cavity 600. The heat dissipation bottom plate 420 is located in the mounting groove and welded with the heat dissipation bottom plate 420, so that the heat dissipation bottom plate 420 is fixed with the heat dissipation cover plate 410, and the heat dissipation bottom plate 420 and the heat dissipation cover plate 410 jointly form the phase change cavity 600. The heat dissipation bottom plate 420 is used to abut against the heat source, and when the heat source generates heat, the heat dissipation bottom plate 420 is heated, so that the phase change working medium in the phase change cavity 600 is heated and evaporated.

[0043] In one of the embodiments, the phase change working medium is pure water or refrigerant. In this embodiment, the phase change working medium is pure water. Due to the negative pressure state in the phase change cavity 600, the boiling point of the pure water is reduced. When the heat from the heat source is transferred to the heat dissipation bottom plate 420, the pure water is heated to evaporate to form water vapor, which flows upward to the bottom of the heat dissipation cover plate 410. The heat is transferred from the heat dissipation bottom plate 420 to the heat dissipation spade teeth 411. At this time, the cooling liquid circulates in the liquid flow cavity 500 through the water inlet nozzle 100 and the water outlet nozzle 200, so that the cooling liquid is continuously circulated to contact the heat dissipation spade teeth 411 to take away the heat on the heat dissipation spade teeth 411. At the same time, the heat dissipation cover plate 410 is cooled by the circulating cooling liquid, so that the water vapor is condensed at the heat dissipation cover plate 410. Then, the liquid water flows from the heat dissipation cover plate 410 to the heat dissipation bottom plate 420 by gravity and capillary action, so that the internal heat dissipation cycle is formed. Further, in other embodiments, the phase change working medium can be refrigerant, i.e. refrigerant.

[0044] As shown in Figure 4 one of the embodiments, the side of the heat dissipation cover plate 410 away from the heat dissipation spade teeth 411 is provided with a support column 413. The support column 413 is located in the phase change cavity 600 and abuts against the heat dissipation bottom plate 420. It can be understood that the heat dissipation cover plate 410 is connected to the heat dissipation bottom plate 420, and the space between the heat dissipation cover plate 410 and the heat dissipation bottom plate 420 forms the phase change cavity 600. The phase change cavity 600 needs to be filled with the phase change working medium, and the phase change cavity 600 needs to be vacuumized to form a negative pressure state to reduce the boiling point of the phase change working medium. Since the phase change cavity 600 is in a negative pressure state, the external atmospheric pressure may cause the heat dissipation cover plate 410 and the heat dissipation bottom plate 420 to collapse. By providing the support column 413 on the heat dissipation cover plate 410, and locating the support column 413 in the phase change cavity 600 and abutting against the heat dissipation bottom plate 420, the support column 413 can play a supporting role to ensure that the uniform heat dissipation assembly 400 remains flat during long-term use and avoids deformation to cause a decrease in heat dissipation performance. Further, the support column 413 is a copper column, which can be formed on the heat dissipation cover plate 410 by CNC machining or copper powder sintering process.

[0045] As shown in Figure 4 one of the embodiments, the number of the support columns 413 is multiple, and the multiple support columns 413 are arranged at intervals on the heat dissipation cover plate 410. It can be understood that the multiple support columns 413 are arranged at intervals on the heat dissipation cover plate 410, so that the support effect between the heat dissipation cover plate 410 and the heat dissipation bottom plate 420 is better, and the structural stability of the uniform heat dissipation assembly 400 is further ensured. Further, the arrangement of the multiple support columns 413 can guide the steam to flow directionally from the heat source to the condensation area (i.e. the heat dissipation spade teeth 411), avoid heat congestion in the plate, and improve the heat response speed.

[0046] In one embodiment, the inlet 100 and the outlet 200 are located on the same side of the upper cover 300. In this embodiment, both the inlet 100 and the outlet 200 are located on the upper surface of the upper cover 300 to make the structure of the upper cover 300 flat and aesthetically pleasing. Liquid is pumped into the inlet 100 by a water pump, then enters the liquid flow chamber 500, and finally flows out from the outlet 200, allowing the coolant to circulate within the liquid flow chamber 500. It is understood that in other embodiments, the inlet 100 and the outlet 200 may be respectively located on different sides of the upper cover 300.

[0047] Understandably, within the phase change working fluid chamber, the heat sink base plate is in contact with the heat source (electrical equipment). During operation, the heat source may experience overheating in certain areas. For example, the heat generated by the heat source might primarily originate from a chip in one location. When this chip transfers heat to the heat sink base plate, the phase change working fluid at the corresponding location on the heat sink base plate evaporates first. The evaporated gas flows to the heat sink cover plate where it cools and condenses. However, due to the obstruction of the support pillars, the evaporated gas can only diffuse slowly in all directions. This causes the evaporated gas to concentrate in one area of ​​the heat sink cover plate for heat exchange, resulting in low heat dissipation performance. Therefore, to facilitate the diffusion of the evaporated gas, such as... Figure 7 As shown, in one embodiment, a plurality of support columns 413 are spaced apart on the heat dissipation cover plate 410. Each support column 413 has a spiral flow channel 413a on its peripheral wall. The spiral flow channel 413a extends axially around the support column 413. One end of the spiral flow channel 413a extends to the junction of the support column 413 and the heat dissipation base plate, and the other end of the spiral flow channel 413a extends to the junction of the support column 413 and the heat dissipation cover plate 410. In this embodiment, a spiral flow channel 413a is provided on the peripheral wall of the support column 413. One end of the spiral flow channel 413a extends to the junction of the support column 413 and the heat dissipation base plate, and the other end extends to the junction of the support column 413 and the heat dissipation cover plate 410. That is, the spiral flow channel 413a spirals from the bottom to the top along the peripheral wall of the support column 413. In other words, the spiral flow channel 413a is spiral-shaped. When the local temperature of the heat source is too high, the phase change working fluid at the corresponding heat dissipation base plate evaporates. Part of the gas flows upward to the heat dissipation cover plate 410 for heat exchange, while part of the gas diffuses to the surroundings. The gas can diffuse through the spiral flow channel 413a on the support column 413, so that the gas diffuses into the cavity formed by the adjacent support columns 413. This makes the gas distribution more uniform, thereby improving the heat exchange effect between the gas and the heat dissipation cover plate 410.

[0048] Furthermore, in order to make the gas distribution more uniform within the phase change cavity, such as... Figure 7As shown, in one of the embodiments, the peripheral wall of the support column 413 is further provided with a plurality of spoilers 413b, the plurality of spoilers 413b are arranged along the axial direction of the support column 413 in a staggered manner, the plurality of spoilers 413b are respectively connected to the cavity wall of the spiral flow guide channel 413a, each of the spoilers 413b has a preset angle with the support column 413, and the preset angles between the plurality of spoilers 413b and the support column 413 are arranged in a different manner. In this embodiment, the plurality of spoilers 413b are arranged along the axial direction of the support column 413 in a staggered manner, so that the peripheral wall of the support column 413 is covered with spoilers 413b, and each spoiler 413b is respectively connected to the cavity wall of the spiral flow guide channel 413a. When the phase change working medium is heated and evaporated, part of the gas flows along the spiral flow guide channel 413a to the heat dissipation cover plate 410, and part of the gas is blocked by the spoilers 413b, thereby making the gas spread in all directions. This makes the gas distribution more uniform. Further, the preset angles between the plurality of spoilers 413b and the support column 413 are arranged in a different manner, that is, the spoilers 413b are arranged at an angle on the support column 413, and the angles of the plurality of spoilers 413b are different, that is, when the gas passes through the plurality of spoilers 413b, the angles of the gas spreading in all directions are inconsistent, that is, the spoilers are formed inside the phase change cavity, which makes the gas distribution in the phase change cavity more uniform, thereby making the heat exchange effect of the gas and the heat dissipation cover plate 410 better.

[0049] Further, the liquid phase change working medium can return to the heat dissipation bottom plate by gravity and the capillary action of the capillary layer. However, for equipment with relatively complex use environment, the liquid cooling head may be installed in an inclined or inverted manner. For the above-mentioned situation, especially when it is installed in an inverted manner, the liquid phase change working medium only relies on the capillary action of the capillary layer to return. At this time, the capillary force of the capillary layer may be relatively low, and the liquid phase change working medium cannot be returned to the heat dissipation bottom plate more quickly and completely. Therefore, in order to solve the above-mentioned problem, as shown in Figure 8As shown, in one of the embodiments, the uniform temperature heat dissipation assembly further comprises a copper mesh structure 430, the copper mesh structure 430 comprises a low-mesh copper mesh 431 and a high-mesh copper mesh 432, the high-mesh copper mesh 432 is connected with the capillary layer, the low-mesh copper mesh 431 is laminated on the high-mesh copper mesh 432, and the mesh density of the high-mesh copper mesh 432 is greater than that of the low-mesh copper mesh 431, the high-mesh copper mesh 432 is adjacent to the heat dissipation bottom plate, and the low-mesh copper mesh 431 is adjacent to the heat dissipation cover plate. It can be understood that the capillary layer is formed on the cavity wall of the phase change cavity by sintering copper powder, but the capillary force of the capillary layer is low, and when the liquid cooling head is installed upside down, it is difficult for the capillary force of the capillary layer to quickly or more completely return the liquid phase change working medium to the heat dissipation bottom plate. In this embodiment, the low-mesh copper mesh 431 and the high-mesh copper mesh 432 are laminated on the capillary layer in sequence, the high-mesh copper mesh 432 and the low-mesh copper mesh 431 are welded by diffusion welding, the high-mesh copper mesh 432 is welded with the capillary layer, the low-mesh copper mesh 431 is a copper mesh with 50 meshes and a mesh diameter of 0.1 mm, the low-mesh copper mesh 431 is located in the outermost layer and serves as a main return channel, the large pore diameter is used to reduce the flow resistance, the high-mesh copper mesh 432 is a copper mesh with 200 meshes and a mesh diameter of 0.025 mm, and is located between the low-mesh copper mesh 431 and the capillary layer to provide high capillary pressure and drive the working medium to flow against gravity. In this way, the pore size of the copper mesh gradually increases from the hot end to the cold end, the fine and dense copper mesh (high mesh number) at the hot end provides strong capillary force to promote evaporation, the sparse copper mesh (low mesh number) at the cold end reduces the return resistance of the condensed liquid, and the copper mesh structure 430 and the capillary layer cooperate with each other to make the capillary force stronger and the liquid phase change working medium return to the heat dissipation bottom plate better.

[0050] Further, in other embodiments, the copper mesh structure 430 and the capillary layer can be cut by CNC machining to form grooves on the surface of the copper mesh structure 430 or the capillary layer, the grooves form stepped capillary channels with the pores of the copper mesh and the pores of the capillary layer, and the penetration and return speed of the phase change working medium is enhanced.

[0051] The application also provides a heat dissipation device comprising the integrated uniform temperature liquid cooling head of any of the above embodiments. Compared with the prior art, the present disclosure has at least the following advantages:

[0052] 1. The integrated uniform temperature liquid cooling head 10, the upper cover 300 is provided with the water inlet nozzle 100 and the water outlet nozzle 200, the upper cover 300, the heat dissipation cover plate 410 and the heat dissipation bottom plate 420 are stacked, the upper cover 300 and the heat dissipation cover plate 410 jointly form the liquid flow cavity 500, the heat dissipation cover plate 410 and the heat dissipation bottom plate 420 jointly form the phase change cavity 600, the phase change cavity 600 is provided with the phase change working medium, when the heat dissipation bottom plate 420 abuts against the heat source, heat is transmitted to the heat dissipation bottom plate 420, so that the phase change working medium in the phase change cavity 600 is heated and evaporated, so as to take heat to the bottom of the heat dissipation cover plate 410, then the heat is transmitted to the heat dissipation spade tooth 411, at this time, the cooling liquid is circulated in the liquid flow cavity 500 through the water inlet nozzle 100 and the water outlet nozzle 200, so that the cooling liquid contacts the heat dissipation spade tooth 411 to take away heat, while the heat dissipation spade tooth 411 is cooled by the circulating cooling liquid, the gaseous phase change working medium evaporated in the phase change cavity 600 is condensed by cooling, and finally flows back to the heat source end (i.e. the heat dissipation bottom plate 420) through gravity and capillary layer effect, so that the heat dissipation performance is better through the continuous circulation inside.

[0053] 2. The integrated uniform temperature liquid cooling head 10, through the phase change of the phase change working medium and the circulation of the cooling liquid, heat is dissipated, while ensuring the heat dissipation performance, compared with the traditional liquid cooling head, the internal impeller, stator and the like are reduced, so that the liquid cooling head structure of the application is more simple and convenient, and the space utilization is higher.

[0054] The above-described embodiments only express several embodiments of the present disclosure, and the description is more specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be noted that, for ordinary skilled persons in the art, without departing from the concept of the present disclosure, a number of modifications and improvements can be made, which all belong to the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure patent should be subject to the appended claims.

Claims

1. An integrated liquid cooling head, comprising a water inlet nozzle, a water outlet nozzle and an upper cover, the water inlet nozzle and the water outlet nozzle being arranged at intervals on the upper cover, characterized in that, the integrated liquid cooling head further comprises a uniform temperature heat dissipation assembly, the uniform temperature heat dissipation assembly comprising a heat dissipation cover plate and a heat dissipation bottom plate, one side of the heat dissipation cover plate being connected with the upper cover, the heat dissipation cover plate being provided with heat dissipation spurs, the heat dissipation cover plate and the upper cover jointly forming a liquid flow cavity, the heat dissipation spurs being located in the liquid flow cavity, the liquid flow cavity being in communication with the water inlet nozzle and the water outlet nozzle respectively; the other side of the heat dissipation cover plate is connected with the heat dissipation bottom plate, the heat dissipation bottom plate and the heat dissipation cover plate jointly forming a phase change cavity, the phase change cavity being used for accommodating a phase change working medium, an inner wall of the phase change cavity being provided with a capillary layer, the heat dissipation bottom plate being used for abutting against a heat source, the phase change working medium being used for transferring heat to the heat dissipation spurs when phase change conversion occurs, so that the cooling liquid makes the heat dissipation spurs cool down after circulating through the water inlet nozzle, the liquid flow cavity and the water outlet nozzle, and the capillary layer is used for returning the liquid phase phase change working medium to the heat dissipation bottom plate.

2. The integrated LCR cold head of claim 1, wherein, The heat dissipation spurs comprise a plurality of rectangular splines, the plurality of rectangular splines being arranged at intervals along the length direction of the heat dissipation cover plate.

3. The integrated LCR cold head of claim 1, wherein, The capillary layer is a copper powder sintering layer or a copper mesh spot welding layer.

4. The integrated LCR cold head of claim 1, wherein, The heat dissipation cover plate is provided with a containing groove on the surface, and part of the structure of the upper cover is located in the containing groove and is welded with the heat dissipation cover plate.

5. The integrated LCLHP of claim 1, wherein, The heat dissipation cover plate and the heat dissipation bottom plate are welded.

6. The integrated LCLHP of claim 1, wherein, The phase change working medium is pure water or refrigerant.

7. The integrated LCLHP of claim 1, wherein, The side of the heat dissipation cover plate away from the heat dissipation spurs is provided with a support column, the support column being located in the phase change cavity and abutting against the heat dissipation bottom plate.

8. The integrated LCR cold head of claim 7, wherein, The number of the support columns is a plurality, and the plurality of support columns are arranged at intervals on the heat dissipation cover plate.

9. The integrated LCLHP of claim 1, wherein, The water inlet nozzle and the water outlet nozzle are located on the same side of the upper cover.

10. A heat dissipating apparatus characterized by comprising: An integrated liquid cooling head according to any one of claims 1 to 9. An integrated liquid cooling head according to any one of claims 1 to 9.

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