Double-station metal oxide semiconductor (MOS) tube pin cutting, chamfering and assembling mechanism

Abstract

The utility model discloses a double-station metal oxide semiconductor (MOS) tube pin cutting, chamfering and assembling mechanism, which comprises two MOS tube feeding devices, two first MOS tube feeding devices, two MOS tube staggered distributing devices, two MOS tube pin cutting devices, two second MOS tube feeding devices, two MOS tube pushing devices, two MOS tube chamfering devices, an X-axis module, a Y-axis module and an MOS tube sucking and assembling device, the MOS tube feeding devices are arranged in parallel downwards in an inclined mode, the chamfering portions of the MOS tube chamfering devices are in butt joint with the pushing-out portions of the MOS tube pushing devices, the X-axis module is arranged above one sides of the two MOS tube chamfering devices in parallel, one end of the Y-axis module is installed on the translation portion of the X-axis module, and the other end of the Y-axis module is installed on the translation portion of the Y-axis module. And the MOS tube sucking and assembling device is downwards arranged on the translation part of the Y-axis module. According to the utility model, a series of automatic operations such as automatic feeding, automatic pin cutting, automatic chamfering and automatic assembling of the MOS tubes can be realized, the efficiency is high, the operation is stable and reliable, the product quality can be improved, and the high-speed production requirements of enterprises are met.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of automation assembly, more particularly to a double-station MOS tube pin cutting and chamfering assembly mechanism. BACKGROUND

[0002] MOS tube, full name metal oxide semiconductor field effect transistor, is a widely used semiconductor element. MOS tube is mainly used for controlling the switch of current and voltage in the radiator, and heat is generated during work, so the radiator is needed for heat dissipation to keep the MOS tube in a safe working temperature. Before the MOS tube is installed with the radiator, the MOS tube needs to be pin cut and chamfered in production to facilitate the fixation of the MOS tube on the radiating fins and insulating sheets of the radiator. In the traditional production process of the radiator, the chamfer hole of the MOS tube is usually manually aligned and assembled with the hole of the radiating fin and the insulating sheet, but the manual installation process is time-consuming and laborious, the production efficiency is low, the cost is high, the assembly is not firm, and the product quality is unstable. SUMMARY

[0003] The utility model aims at overcoming the above-mentioned defects in the prior art, and provides a double-station MOS tube pin cutting and chamfering assembly mechanism capable of realizing a series of automatic operations such as automatic feeding, automatic pin cutting, automatic chamfering and automatic assembly of the MOS tube, and having high production efficiency, stable and reliable operation.

[0004] In order to achieve the above object, the utility model provides a double position MOS tube pin cutting chamfer assembly mechanism, including MOS tube feeding device, first MOS tube feeding device, MOS tube misplacement material distribution device, MOS tube pin cutting device, second MOS tube feeding device, MOS tube pushing device, MOS tube chamfer device, X axle module, Y axle module and MOS tube suction assembly device, the MOS tube feeding device is equipped with two and is respectively parallel and downwardly inclined setting, the first MOS tube feeding device is equipped with two and makes its inlet end respectively with the discharge end of each corresponding MOS tube feeding device is opposite, the second MOS tube feeding device is equipped with two and makes its inlet end respectively through each corresponding MOS tube misplacement material distribution device and the discharge end of first MOS tube feeding device is opposite, the MOS tube pin cutting device is equipped with two and makes its cutting angle position and the discharge port of MOS tube misplacement material distribution device and the inlet end of second MOS tube feeding device is opposite, the MOS tube chamfer device is equipped with two and is located below one side of two second MOS tube feeding devices respectively, the inlet position of MOS tube pushing device is opposite the discharge end of second MOS tube feeding device respectively, the chamfer position of MOS tube chamfer device is opposite the push position of MOS tube pushing device respectively, the X axle module is parallelly arranged on the upper side of two MOS tube chamfer devices, one end of Y axle module is installed on the translation position of X axle module and makes its other end towards MOS tube chamfer device, the MOS tube suction assembly device is downwardly installed on the translation position of Y axle module.

[0005] As preferred, the MOS tube feeding device comprises an inclined support, an inclined bottom plate, an empty tube discharging cylinder, an empty tube pushing plate, an empty tube pushing block, a sliding rail sliding block assembly, an empty tube collecting box, a low-position tube limiting seat and a high-position tube limiting seat, the inclined bottom plate is arranged above the inclined plate body of the inclined support, the empty tube pushing plate is below the inclined bottom plate and is slidingly connected with the top surface of the inclined plate body of the inclined support through the sliding rail sliding block assembly, the empty tube discharging cylinder is fixedly installed on one side edge of the inclined plate body of the inclined support, the output shaft of the empty tube discharging cylinder is in transmission connection with one side of the empty tube pushing plate, the low-position tube limiting seat and the high-position tube limiting seat are installed on the inclined bottom plate, the accommodation space for stacking the MOS tube is formed between the low-position tube limiting seat and the high-position tube limiting seat, the MOS tube outlet for the MOS tube flowing out of the MOS tube is formed between the lower end of the low-position tube limiting seat and the inclined bottom plate, the tube pushing-out gap for the empty MOS tube being pushed out to the empty tube collecting box is formed between the lower end side of the low-position tube limiting seat and the lower end side of the high-position tube limiting seat and the inclined bottom plate, and the opening of the empty tube collecting box is located on the other side of the inclined bottom plate.

[0006] As preferred, the first MOS tube feeding device comprises a first MOS tube straight vibration track and a first straight vibration feeder, the first MOS tube straight vibration track is installed on the top of the first straight vibration feeder; the second MOS tube feeding device comprises a second MOS tube straight vibration track and a second straight vibration feeder, the second MOS tube straight vibration track is installed on the top of the second straight vibration feeder, the feeding inlet of the MOS tube staggered distribution device is connected with the discharging end of the first MOS tube straight vibration track, and the discharging outlet of the MOS tube staggered distribution device is connected with the feeding end of the second MOS tube straight vibration track.

[0007] As preferred, the MOS tube staggered distribution device comprises a support vertical plate, a staggered distribution groove seat, a horizontal staggered distribution cylinder, a horizontal staggered distribution block, a vertical staggered distribution cylinder and a vertical staggered distribution block, the feeding inlet of the staggered distribution groove seat is connected with the discharging end of the first MOS tube straight vibration track, the discharging outlet of the staggered distribution groove seat is connected with the feeding end of the second MOS tube straight vibration track, the horizontal staggered distribution cylinder is fixedly arranged on one side of the staggered distribution groove seat through the support vertical plate, the output shaft of the horizontal staggered distribution cylinder is in transmission connection with one end of the horizontal staggered distribution block and can drive the horizontal staggered distribution block to move in the staggered distribution groove seat, the vertical staggered distribution cylinder is arranged on the other side of the staggered distribution groove seat along the direction perpendicular to the staggered distribution groove seat, the output shaft of the vertical staggered distribution cylinder is in transmission connection with one end of the vertical staggered distribution block and can drive the vertical staggered distribution block to move in the staggered distribution groove seat, and the horizontal staggered distribution block and the vertical staggered distribution block are arranged vertically.

[0008] As preferred, the MOS tube pin cutting device comprises a pin cutting support, a pin cutting driving cylinder, a cutter seat and a pin cutter, the pin cutting driving cylinder is installed on the top of the pin cutting support, the output part of the pin cutting cylinder penetrates through the top of the pin cutting support and is connected with the pin cutter through the cutter seat, and the cutting part of the pin cutter is connected with the output direction of the horizontal staggered distribution cylinder.

[0009] As preferred, the MOS tube chamfering device comprises a MOS tube chamfering lifting module, a motor connecting plate, a MOS tube chamfering motor and a MOS tube chamfering drill bit, the MOS tube chamfering motor is installed downward on one side of the motor connecting plate and is fixedly arranged at the lifting position of the MOS tube chamfering lifting module through the motor connecting plate, and the MOS tube chamfering drill bit is in transmission connection with the output shaft of the MOS tube chamfering motor through a transmission assembly and is located on the other side of the motor connecting plate.

[0010] As preferred, the MOS tube pushing device comprises a pushing cylinder, a pushing groove base and a pushing block, the pushing cylinder and the pushing groove base are both mounted on the top of the pushing support and above the MOS tube chamfering motor, the feeding part of the pushing groove base is connected with the discharging end of the second MOS tube straight vibration track, the output part of the pushing cylinder is connected with the pushing block and drives it to move horizontally in the inside of the pushing groove base along the direction perpendicular to the second MOS tube straight vibration track, and the discharging part of the pushing groove base is connected with the extending part of the MOS tube chamfering drill bit.

[0011] As preferred, the MOS tube sucking assembly device comprises a MOS tube assembly up-down cylinder, a connecting vertical plate, a MOS tube carrying suction disc and a MOS tube positioning needle, the MOS tube assembly up-down cylinder is fixedly arranged on the translation part of the Y-axis module, the MOS tube carrying suction disc is downwardly arranged and is drivingly connected with the MOS tube assembly up-down cylinder through the connecting vertical plate, and the MOS tube positioning needle is embedded in the MOS tube carrying suction disc and extends out of the bottom surface of the MOS tube carrying suction disc.

[0012] Compared with the prior art, the MOS tube sucking assembly device has the beneficial effects that:

[0013] The MOS tube sucking assembly device has the beneficial effects that: BRIEF DESCRIPTION OF DRAWINGS

[0014] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor based on these drawings.

[0015] Figure 1 is the overall structure schematic diagram provided by the embodiment of the present application;

[0016] Figure 2 is the partial structure schematic diagram provided by the embodiment of the present application;

[0017] Figure 3 is the side view enlarged schematic diagram of the MOS tube feeding device provided by the embodiment of the present application;

[0018] Figure 4 This is an enlarged schematic diagram of the MOS transistor misalignment and material distribution device and the MOS transistor lead cutting device provided in this embodiment of the utility model;

[0019] Figure 5 This is an enlarged schematic diagram of the MOS transistor misalignment and sorting device and the MOS transistor chamfering device provided in this embodiment of the utility model;

[0020] Figure 6 This is a schematic diagram of the MOS transistor chamfering device provided in this embodiment of the utility model;

[0021] Figure 7 This is a schematic diagram of the structure of the MOS tube feeding and assembly device provided in this embodiment of the utility model;

[0022] Figure 8 This is a schematic diagram of the operation of the X-axis module, Y-axis module, and MOS tube feeding and assembly device provided in this embodiment of the utility model. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0024] Please refer to Figure 1 The present invention provides a dual-station MOS transistor lead-cutting and chamfering assembly mechanism, including a MOS transistor feeding device 1, a first MOS transistor feeding device 2, a MOS transistor misalignment and sorting device 3, a MOS transistor lead-cutting device 4, a second MOS transistor feeding device 5, a MOS transistor pushing device 6, a MOS transistor chamfering device 7, an X-axis module 81, a Y-axis module 82, and a MOS transistor suction and assembly device 9, etc. The components of this embodiment will be described in detail below with reference to the accompanying drawings.

[0025] like Figure 1As shown, the MOS tube feeding device 1 can be provided with two and arranged side by side downwardly inclined, the first MOS tube feeding device 2 is provided with two and the inlet end is respectively connected with the outlet end of the corresponding MOS tube feeding device 1, the second MOS tube feeding device 5 is provided with two and the inlet end is respectively connected with the outlet end of the first MOS tube feeding device 2 through the corresponding MOS tube staggered distribution device 3, the MOS tube foot cutting device 4 is provided with two and the cutting corner part is respectively connected with the outlet of the MOS tube staggered distribution device 3 and the inlet end of the second MOS tube feeding device 5, the MOS tube chamfering device 7 is provided with two and located below one side of the two second MOS tube feeding devices 5, the feeding part of the MOS tube pushing device 6 is respectively connected with the outlet end of the second MOS tube feeding device 5, the chamfering part of the MOS tube chamfering device 7 is respectively connected with the pushing part of the MOS tube pushing device 6, the X-axis module 81 is parallelly arranged above one side of the two MOS tube chamfering devices 7, one end of the Y-axis module 82 is installed on the translation part of the X-axis module 81 and the other end is towards the MOS tube chamfering device 7, the MOS tube suction assembly device 9 is downwardly installed on the translation part of the Y-axis module 82.

[0026] As shown in Figure 2 and Figure 3 The MOS tube feeding device 1 can include an inclined support 11, an inclined bottom plate 12, an empty tube unloading cylinder 13, an empty tube pushing plate 14, an empty tube pushing block 6415, a sliding rail sliding block assembly 16, an empty tube collecting box 17, a low-position tube limiting seat 18 and a high-position tube limiting seat 19. The inclined bottom plate 12 is arranged above the inclined plate body 111 of the inclined support 11, the empty tube pushing plate 14 is located below the inclined bottom plate 12 and is slidingly connected with the top surface of the inclined plate body of the inclined support through the sliding rail sliding block assembly 16, the empty tube unloading cylinder 13 is fixedly installed on one side edge of the inclined plate body of the inclined support, the output shaft of the empty tube unloading cylinder 13 is drivingly connected with one side of the empty tube pushing plate 14, the low-position tube limiting seat 18 and the high-position tube limiting seat 19 are installed on the inclined bottom plate 12, the low-position tube limiting seat 18 and the high-position tube limiting seat 19 form a containing space for stacking the MOS tube between them, the MOS tube outlet 181 for the MOS tube in the MOS tube to flow out is formed between the lower end of the low-position tube limiting seat 18 and the inclined bottom plate 12, the tube pushing-out gap 171 for the empty MOS tube to be pushed out to the empty tube collecting box 17 is formed between the lower end of the low-position tube limiting seat 18 and the inclined bottom plate 12, and the lower end of the high-position tube limiting seat 19, the opening of the empty tube collecting box 17 is located on the other side of the inclined bottom plate 12.

[0027] In the embodiment, the MOS tube pipe is designed as a cuboid tube with two open ends, and can accommodate multiple MOS tubes. When the MOS tube pipe falls to the lowermost layer, the MOS tube outlet 181 is formed between the lower end of the low-position pipe limiting seat 18 and the inclined bottom plate 12, so that the MOS tube can slide out of the open end of the lowermost pipe and flow to the first MOS tube feeding device 2 through the MOS tube outlet. The design of the inclined support 11 helps the MOS tube to slide smoothly.

[0028] In specific implementation, when the MOS tubes in one MOS tube pipe are all discharged, the empty tube unloading cylinder 13 will drive the empty tube pushing block 6415 to push the empty pipe out and move towards the empty pipe collecting box 17. The empty MOS tube pipe flows out through the pushing gap and falls into the empty pipe collecting box. At the same time, the previous pipe falls to the lowermost position and continues the next feeding cycle.

[0029] As shown in Figure 4 each of the first MOS tube feeding devices 2 can include a first MOS tube straight vibration track 21 and a first straight vibration feeder 22, and the first MOS tube straight vibration track 21 is installed on the top of the first straight vibration feeder 22. Each of the second MOS tube feeding devices 5 can include a second MOS tube straight vibration track 51 and a second straight vibration feeder 52, and the second MOS tube straight vibration track 51 is installed on the top of the second straight vibration feeder 52. The inlet of the MOS tube staggered distribution device 3 is connected to the outlet end of the first MOS tube straight vibration track 21, and the outlet of the MOS tube staggered distribution device 3 is connected to the inlet end of the second MOS tube straight vibration track 51.

[0030] Specifically, each of the MOS tube staggered distribution devices 3 can include a support vertical plate 31, a staggered distribution groove seat 32, a horizontal staggered distribution cylinder 33, a horizontal staggered distribution block 34, a vertical staggered distribution cylinder 35, and a vertical staggered distribution block 36. The inlet of the staggered distribution groove seat 32 is connected to the outlet end of the first MOS tube straight vibration track 21, and the outlet of the staggered distribution groove seat 32 is connected to the inlet end of the second MOS tube straight vibration track 51. The horizontal staggered distribution cylinder 33 is fixedly arranged on one side of the staggered distribution groove seat 32 through the support vertical plate 31. The output shaft of the horizontal staggered distribution cylinder 33 is in transmission connection with one end of the horizontal staggered distribution block 34 and can drive the horizontal staggered distribution block 34 to move in the staggered distribution groove seat 32. The vertical staggered distribution cylinder 35 is arranged on the other side of the staggered distribution groove seat 32 along the direction perpendicular to the staggered distribution groove seat 32. The output shaft of the vertical staggered distribution cylinder 35 is in transmission connection with one end of the vertical staggered distribution block 36 and can drive the vertical staggered distribution block 36 to move in the staggered distribution groove seat 32. The horizontal staggered distribution block 34 and the vertical staggered distribution block 36 are arranged vertically.

[0031] Furthermore, the MOSFET lead cutting device 4 may include a lead cutting support 41, a lead cutting drive cylinder 42, a cutter holder 43, and a lead cutter 44. The lead cutting drive cylinder 42 is mounted on the top of the lead cutting support 41. The output part of the lead cutting cylinder passes through the top of the lead cutting support 41 and is connected to the lead cutter 44 through the cutter holder 43. The cutting part of the lead cutter 44 is aligned with the output direction of the transverse offset material distribution cylinder.

[0032] In specific implementation, when the MOS tube in the first MOS tube straight vibration track 21 is transported to the misaligned material distribution slot 32, the transverse misaligned material distribution cylinder 33 drives the transverse misaligned material distribution block 34 to push the MOS tube along the vertical direction of the first MOS tube straight vibration track 21, so that the MOS tube moves to the bottom of the MOS tube cutting device 4 for cutting. The cutting drive cylinder 42 drives the lead cutter 44 to move downward to cut the lead of the MOS tube. Next, the longitudinal misaligned material distribution cylinder 35 drives the longitudinal misaligned material distribution block 36 to push the cut MOS tube into the second MOS tube straight vibration track 51.

[0033] like Figure 5 and Figure 6 As shown, the MOS transistor chamfering device 7 may include a MOS transistor chamfering lifting module 71, a motor connecting plate 72, a MOS transistor chamfering motor 73, and a MOS transistor chamfering drill bit 74. The MOS transistor chamfering motor 73 is installed facing upwards on one side below the motor connecting plate 72 and is fixedly mounted on the lifting part of the MOS transistor chamfering lifting module 71 through the motor connecting plate 72. The MOS transistor chamfering drill bit 74 is connected to the output shaft of the MOS transistor chamfering motor 73 through a transmission assembly (synchronous pulley 75 + belt 76) and is located on the other side of the motor connecting plate 72.

[0034] Preferably, the MOS transistor pusher device 6 may include a pusher cylinder 62, a pusher slot 63, and a pusher block 64. The pusher cylinder 62 and the pusher slot 63 are both installed on the top of the motor connecting plate 72 and located above the MOS transistor chamfering motor 73. The feed part of the pusher slot 63 is connected to the discharge end of the second MOS transistor linear vibration track 51. The output part of the pusher cylinder 62 is connected to the pusher block 64 and drives it to move laterally inside the pusher slot 63 in a direction perpendicular to the second MOS transistor linear vibration track 51. The discharge part of the pusher slot 63 is connected to the protruding part of the MOS transistor chamfering drill bit 74.

[0035] In specific implementation, when the MOS tube on the second MOS tube direct vibration track 51 moves to the pusher slot seat 63, the pusher cylinder 62 drives the pusher block 64 to push the MOS tube above the MOS tube chamfering drill bit 74. The MOS tube chamfering lifting module 71 drives the motor connecting plate 72 to move upward. Then, the MOS tube chamfering motor 73 drives the MOS tube chamfering drill bit 74 to rotate and perform chamfering and enlarging operations on the lower end of the hole of the MOS tube.

[0036] As Figure 7 And Figure 8 As shown in the drawings, the MOS tube suction assembly device 9 can include a MOS tube assembly up-down air cylinder 91, a connecting vertical plate 92, a MOS tube carrying suction disc 93, and a MOS tube positioning needle 94. The MOS tube assembly up-down air cylinder 91 is fixedly arranged on the translation position of the Y-axis module 82. The MOS tube carrying suction disc 93 is downwardly arranged and is in driving connection with the MOS tube assembly up-down air cylinder 91 through the connecting vertical plate 92. The MOS tube positioning needle 94 is embedded in the MOS tube carrying suction disc 93 and extends out of the bottom surface of the MOS tube carrying suction disc 93.

[0037] Further, the MOS tube suction assembly device 9 is driven to move forward, backward, leftward and rightward by the combination of the X-axis module 81 and the Y-axis module 82. After the MOS tube positioning needle 94 positions the MOS tube, the MOS tube carrying suction disc 93 can accurately suck the MOS tube 101 and assemble it on the insulating sheet placed on the corresponding heat sink 10.

[0038] In summary, the utility model adopts a double-station design. The MOS tube feeding device, the MOS tube feeding device and the MOS tube misalignment distribution device can respectively realize automatic feeding and distribution of MOS tubes. The MOS tube pin cutting device and the MOS tube chamfering device can respectively cut and chamfer the pins of the MOS tube. The utility model has high automation degree, improves space utilization, and is provided with the X-axis module and the Y-axis module to drive the MOS tube suction assembly device to move forward, backward, leftward and rightward, so as to conveniently realize double-station suction assembly, improve production efficiency, and meet the high-speed production demand of enterprises.

[0039] The above embodiments are the preferred embodiments of the utility model, but the embodiments of the utility model are not limited by the above embodiments. Any change, modification, replacement, combination and simplification made without departing from the spirit and principle of the utility model should be an equivalent replacement mode and should be included in the protection scope of the utility model.

Claims

1. A dual-station MOS transistor lead-cutting and chamfering assembly mechanism, characterized in that: The application relates to a MOS tube feeding device, a first MOS tube feeding device, a MOS tube misalignment distributing device, a MOS tube pin cutting device, a second MOS tube feeding device, a MOS tube pushing device, a MOS tube chamfering device, an X-axis module, a Y-axis module and a MOS tube suction assembling device, wherein the MOS tube feeding device is provided with two parallel downward inclined devices, the first MOS tube feeding device is provided with two devices whose feeding ends are respectively connected with the discharging ends of the corresponding MOS tube feeding devices, the second MOS tube feeding device is provided with two devices whose feeding ends are respectively connected with the discharging ends of the corresponding MOS tube misalignment distributing devices and the first MOS tube feeding device, the MOS tube pin cutting device is provided with two devices whose pin cutting parts are respectively connected with the discharging ports of the MOS tube misalignment distributing devices and the feeding ends of the second MOS tube feeding devices, the MOS tube chamfering device is provided with two devices which are respectively located below one side of the two second MOS tube feeding devices, the feeding parts of the MOS tube pushing device are respectively connected with the discharging ends of the second MOS tube feeding devices, the chamfering parts of the MOS tube chamfering device are respectively connected with the pushing parts of the MOS tube pushing device, the X-axis module is parallelly arranged above one side of the two MOS tube chamfering devices, one end of the Y-axis module is arranged on the translation part of the X-axis module and the other end of the Y-axis module is arranged towards the MOS tube chamfering device, and the MOS tube suction assembling device is arranged downwards on the translation part of the Y-axis module.

2. The double-station MOS transistor pin chamfer assembly mechanism according to claim 1, characterized in that: The MOS tube feeding device comprises an inclined support, an inclined bottom plate, an empty tube discharging cylinder, an empty tube pushing plate, an empty tube pushing block, a slide rail sliding block assembly, an empty tube collecting box, a low-position tube limiting seat and a high-position tube limiting seat, the inclined bottom plate is arranged above the inclined plate body of the inclined support, the empty tube pushing plate is arranged below the inclined bottom plate and is slidably connected with the top surface of the inclined plate body of the inclined support through the slide rail sliding block assembly, the empty tube discharging cylinder is fixedly arranged on one side edge of the inclined plate body of the inclined support, the output shaft of the empty tube discharging cylinder is in transmission connection with one side of the empty tube pushing plate, the low-position tube limiting seat and the high-position tube limiting seat are arranged on the inclined bottom plate, the accommodation space for stacking the MOS tube is formed between the low-position tube limiting seat and the high-position tube limiting seat, the MOS tube outlet for discharging the MOS tube in the MOS tube is formed between the lower end of the low-position tube limiting seat and the inclined bottom plate, the tube pushing gap for pushing the empty MOS tube into the empty tube collecting box is formed between the lower end of the low-position tube limiting seat, the lower end of the high-position tube limiting seat and the inclined bottom plate, and the opening of the empty tube collecting box is located on the other side of the inclined bottom plate.

3. The double-station MOS transistor pin chamfer assembly mechanism according to claim 1, characterized in that: The first MOS tube feeding device comprises a first MOS tube straight vibration track and a first straight vibration feeder, and the first MOS tube straight vibration track is installed on the top of the first straight vibration feeder.

4. The double-station MOS transistor lead bending and chamfering assembly mechanism according to claim 3, characterized in that: The MOS tube staggered distribution device comprises a support vertical plate, a staggered distribution groove base, a horizontal staggered distribution air cylinder, a horizontal staggered distribution block, a vertical staggered distribution air cylinder and a vertical staggered distribution block.

5. The dual station MOS transistor lead bending and chamfering assembly mechanism of claim 4, wherein: The MOS tube pin cutting device comprises a pin cutting support, a pin cutting driving air cylinder, a cutter base and a pin cutter.

6. The dual station MOS transistor lead bending and chamfering assembly mechanism of claim 1, wherein: The MOS tube chamfering device comprises a MOS tube chamfering lifting module, a motor connecting plate, a MOS tube chamfering motor and a MOS tube chamfering drill bit.

7. The double-station MOS transistor lead bending and chamfering assembly mechanism of claim 6, wherein: The MOS tube pushing device comprises a pushing air cylinder, a pushing groove base and a pushing block.

8. The dual station MOS transistor lead bending and chamfering assembly mechanism of claim 1, wherein: The MOS pipe suction assembly device comprises MOS pipe assembly up-and-down air cylinders, connecting vertical plates, MOS pipe carrying suction discs and MOS pipe positioning needles, the MOS pipe assembly up-and-down air cylinders are fixedly arranged on the translation position of the Y-axis module, the MOS pipe carrying suction discs are downwardly arranged and are in transmission connection with the MOS pipe assembly up-and-down air cylinders through the connecting vertical plates, and the MOS pipe positioning needles are embedded in the MOS pipe carrying suction discs and extend out of the bottom surface of the MOS pipe carrying suction discs.

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