Full-automatic chip low-temperature screening platform based on single-chip microcomputer control

Abstract

The utility model relates to a full-automatic chip low-temperature screening platform based on single-chip microcomputer control, and the platform employs a high-precision temperature monitoring module to control the temperature fluctuation of a low-temperature environment within a small range, thereby monitoring whether a chip is tested under a stable low-temperature condition or not, and improving the accuracy of a test result and the reliability of the test. The adopted chip test fixture can test a plurality of chips at the same time, different customization can be carried out according to support of different production tasks, operation is simple, full-automatic screening can be completed through linkage of existing related measurement and control platforms, and the test time of personnel is greatly shortened. By adopting the design that the chip testing clamp is isolated from the temperature monitoring module, the multi-path power supply module and other modules, frequent operation of personnel is avoided, the safety of the personnel and equipment is greatly improved, the secondary damage probability of the chip to be tested is reduced, and efficient, accurate and low-cost screening of the low-temperature performance of the chip is effectively realized.

Description

Technical Field

[0001] This utility model belongs to the field of chip testing technology and relates to a fully automatic low-temperature chip screening platform based on microcontroller control. Background Technology

[0002] Low-temperature environments can have various impacts on chip performance. As the temperature decreases, the electrical properties of the semiconductor materials in the chip change, such as reduced carrier mobility and threshold voltage drift. These changes can lead to problems such as logic errors, increased signal delays, and even functional failures. In special applications such as aerospace and polar scientific research, the chips in the equipment need to operate stably and reliably at extremely low temperatures. Therefore, effective low-temperature screening of chips can improve their reliability in low-temperature environments and reduce the failure rate.

[0003] In current chip manufacturing processes, chip screening is a crucial step in ensuring chip quality. Traditional chip screening methods primarily focus on functional testing at room temperature and simple environmental stress testing. Testing at low temperatures is limited by the harsh environment and cannot be performed in the same way as at room temperature. Currently, the main testing methods for chip performance screening at low temperatures include the following:

[0004] (1) The testing equipment is located outside the high and low temperature test chamber, and the device under test is located inside the test chamber. After the temperature of the test chamber reaches the set temperature, the chamber is opened and the device is quickly taken out for testing. In this test, the ambient temperature has changed significantly, which may lead to inaccurate test results. At the same time, there may be problems such as the device surface frost melting and causing short circuits, resulting in product or equipment damage. In addition, frequent opening and closing of the temperature chamber door at low temperature will cause frost to form inside the temperature chamber. Long-term operation will cause damage to the evaporator of the high and low temperature test chamber. (2) The Handler mode (a technology commonly used in semiconductor testing and packaging) is used to locally raise and lower the temperature of the device under test. Only one device under test can be raised, lowered, and kept warm at a time before testing. The overall testing efficiency is low and it is mainly used in laboratories or small-batch testing. It cannot meet the low temperature screening test requirements of large-batch products. (3) A dedicated large low temperature test chamber is used. This method is often complex in structure and expensive. Its maintenance cost is high, the operation is complicated, professional personnel are required to operate and maintain it, and the equipment is huge. It has high requirements for the laboratory environment. How to achieve efficient, accurate, and low-cost screening of chip low-temperature performance has become a technical problem to be solved. Utility Model Content

[0005] To address the problems existing in the above-mentioned traditional technologies, this utility model proposes a fully automatic chip low-temperature screening platform based on microcontroller control, which can effectively achieve efficient, accurate and low-cost screening of chip low-temperature performance.

[0006] To achieve the above objectives, the embodiments of this utility model adopt the following technical solutions:

[0007] A fully automated low-temperature chip screening platform based on microcontroller control is provided, including a main control module, a serial port module, a chip testing fixture, a temperature monitoring module, a multi-channel power supply module, a data acquisition and processing module, and a structural board. The main control module is connected to the serial port module, the multi-channel power supply module, and the data acquisition and processing module. The data acquisition and processing module is connected to the multi-channel power supply module, the chip testing fixture, and the temperature monitoring module. The serial port module is used to connect to a host computer. The chip testing fixture, the temperature monitoring module, and the data acquisition and processing module are mounted on the structural board via a PCB board.

[0008] The chip test fixture includes a chip mount customized for the chip to be tested, which is used to load the chip to be tested. A multi-channel power supply module and a data acquisition and processing module are connected to the corresponding pins of the chip respectively. The temperature monitoring module is used to monitor the temperature data of the chip test area of ​​the chip test fixture in real time and control the screening test temperature in the temperature chamber to maintain it within the set temperature range.

[0009] Each power supply module in the multi-channel power supply module includes a relay and an ADC detection circuit. The relay is used to switch the power supply to the chip test fixture, the ADC detection circuit is used to detect the real-time power consumption of the chip and transmit it to the main control module, and the data acquisition and processing module is used to collect the performance data of the chip during the low-temperature test and transmit it back to the main control module via a flexible flat cable.

[0010] In one embodiment, the temperature monitoring module includes a TMP117 chip, resistors R111, R112, and R113, and a capacitor C272. The SDA pin of the TMP117 chip is used to connect to the temperature serial data line, the SCL pin of the TMP117 chip is used to connect to the temperature serial clock line, and the ALERT pin of the TMP117 chip is used to output a temperature alarm signal.

[0011] Resistors R111, R112, and R113 are connected to the power supply VCC. The other end of resistor R111 is connected to the temperature serial data line, the other end of resistor R112 is connected to the temperature serial clock line, and the other end of resistor R113 is connected to the ALERT pin of the TMP117 chip. One end of capacitor C272 is connected to the power supply terminal of the TMP117 chip and then to the power supply VCC. The other end of capacitor C272 is grounded.

[0012] In one embodiment, the relay includes an AZ822-2C-5DE relay and a freewheeling diode D4. The freewheeling diode D4 is connected in series with the coil interface of the AZ822-2C-5DE relay to suppress the reverse electromotive force. The ADC detection circuit uses an OPA2171 operational amplifier.

[0013] In one embodiment, the data acquisition and processing module is an STM32F417 series microcontroller.

[0014] In one embodiment, the aforementioned fully automated low-temperature chip screening platform based on microcontroller control further includes a button module, which is connected to the main control module and is used to input screening program switching signals to the main control module.

[0015] One of the above technical solutions has the following advantages and beneficial effects:

[0016] The aforementioned fully automated low-temperature chip screening platform, based on microcontroller control, employs a high-precision temperature monitoring module to control temperature fluctuations within the required low-temperature environment of the chamber within a set range. This allows for direct monitoring of whether chips are being tested under stable low-temperature conditions, improving the accuracy and reliability of test results. The chip testing fixture can test multiple chips simultaneously and can be customized to different production tasks. It is simple to operate and, when applied to large-scale comprehensive testing, can complete fully automated screening by linking with existing chambers and a host computer, significantly reducing manual testing time. Furthermore, the modular design provides module isolation, supporting not only fully automated screening but also avoiding frequent manual operations, greatly improving the safety of personnel and equipment, reducing the probability of secondary damage to the chips under test, and effectively achieving efficient, accurate, and low-cost screening of chip low-temperature performance. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the circuit module structure of a fully automated low-temperature chip screening platform based on microcontroller control in one embodiment;

[0019] Figure 2 This is a schematic diagram of the circuit structure of the temperature monitoring module in one embodiment;

[0020] Figure 3 This is a schematic diagram of a circuit structure for a transistor-controlled relay in one embodiment;

[0021] Figure 4 This is a schematic diagram of the circuit structure of the current sampling circuit in one embodiment;

[0022] Figure 5This is a schematic diagram of the circuit module structure of a fully automated low-temperature chip screening platform based on a microcontroller control, as shown in another embodiment.

[0023] Figure 6 This is a structural diagram of a dedicated overlapping platform in one embodiment;

[0024] Figure 7 A physical diagram showing the module installation on the structural plate in one embodiment;

[0025] Figure 8 This is a physical circuit diagram of the part where the main control module is located in one embodiment. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only for explaining the present utility model and are not intended to limit the present utility model. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the present utility model.

[0027] It should be noted that, in this document, the reference to "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this utility model. The presentation of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will understand that the embodiments described herein can be combined with other embodiments. The term "and / or" as used in the specification and appended claims of this utility model refers to any combination and all possible combinations of one or more of the associated listed items, and includes such combinations.

[0028] The embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0029] When traditional low-temperature screening technology is used to test the low-temperature performance of test chips, due to the insufficient temperature control accuracy of the test environment, the low-temperature test results are inaccurate due to the out-of-chamber test, and additional product defects may even occur during the test due to problems such as frosting, which easily leads to inaccurate test results. The inaccurate test results may cause some chips that will malfunction in the actual low-temperature environment to be misjudged as qualified, or vice versa. The test process of traditional low-temperature test equipment is cumbersome. For example, when testing with a new chip sample each time, it is necessary to reset the test parameters and adjust the low-temperature environment again, which takes a lot of time. Moreover, the number of chips that can be tested by existing low-temperature test equipment at one time is limited. When applied to mass production test tasks, long-term personnel on-site is required, resulting in waste of labor.

[0030] When facing a large number of chip screening tests, due to a large degree of manual intervention, on the one hand, it is easy to cause ESD (Electrostatic Discharge) problems due to negligence, resulting in secondary damage to the chips; on the other hand, non-standard operations of personnel will also increase the safety risks of production. For example, frequent opening and closing of the low-temperature chamber door leads to frosting, and the water vapor after defrosting causes a short circuit in the circuit, resulting in safety problems for personnel and equipment. Traditional low-temperature screening equipment is costly, including equipment procurement costs, operation costs, and maintenance costs. This requires chip manufacturers to invest a large amount of funds in chip low-temperature screening, increasing the production cost of chips and thus affecting the market competitiveness of products.

[0031] In one embodiment, as Figure 1 shown, a fully automatic chip low-temperature screening platform based on single-chip microcomputer control is provided, including a main control module, a serial port module, a chip test fixture, a temperature monitoring module, a multi-channel power supply module, a data acquisition and processing module, and a structure board. The main control module is respectively connected to the serial port module, the multi-channel power supply module, and the data acquisition and processing module. The data acquisition and processing module is respectively connected to the multi-channel power supply module, the chip test fixture, and the temperature monitoring module. The serial port module is used to connect to the upper computer. The chip test fixture, the temperature monitoring module, and the data acquisition and processing module are installed on the structure board through a PCB board. The chip test fixture includes a test chip socket customized for the chips to be tested, which is used to load the chips to be tested, and connects the multi-channel power supply module and the data acquisition and processing module to the corresponding pins of the chips respectively. The temperature monitoring module is used to monitor the temperature data of the chip test area of the chip test fixture in real time and control the screening experiment temperature in the temperature chamber to be kept within the set temperature range. Each power supply module in the multi-channel power supply module includes a relay and an ADC detection circuit. The relay is used to switch the power supply connected to the chip test fixture, and the ADC detection circuit is used to detect the real-time power consumption of the chip and transmit it to the main control module. The data acquisition and processing module is used to collect the performance data of the chip during the low-temperature test and transmit it back to the main control module through a flexible cable.

[0032] It is understood that the overall hardware architecture of the chip low-temperature screening hardware platform in this embodiment adopts a modular design. By reserving mounting holes on the PCB (printed circuit board) for the circuitry of each corresponding module (such as chip test fixture, temperature monitoring module, and data acquisition and processing module), the platform can be selectively assembled to meet the testing needs and environments of different chips, such as mounting different numbers of corresponding modules. The chip test fixture is a chip socket pre-customized with connection circuitry according to the chip to be tested. Its internal pin circuit connection structure ensures accurate signal input and output to each pin of the chip, so that after the chip is mounted on the chip test fixture, it can be directly connected to the circuitry of other corresponding modules.

[0033] The temperature monitoring module consists of a high-precision temperature sensor and a temperature controller. Existing temperature monitoring circuit modules in this field can be used. The temperature sensors are distributed near the chip testing area of ​​the chip testing fixture to monitor changes in the screening temperature of the chip in real time and feed the measured temperature data back to the temperature controller. The temperature controller then automatically and accurately determines the screening start conditions based on the set temperature value and records any abnormal temperature data that occurs during the screening process, thereby ensuring that the screening temperature remains within the required set temperature range. The data acquisition and processing module is responsible for acquiring various predetermined performance data of the chip during the low-temperature testing process, such as electrical parameters and logic function data. It can simulate existing read and write applications on the chip. The data acquired by the data acquisition and processing module is transmitted back to the main control module via a flexible flat cable. The main control module then transmits the data to the host computer via a serial port (such as an RS232 interface) for existing control and analysis functions. The data acquisition and processing module can, but is not limited to, use an existing STM32F415 series microcontroller.

[0034] The multi-channel power module can provide multiple power supplies. The specific number of power channels can be selected based on the number of PCBs mounted on the structure board and the number of power supplies required on each PCB. Each power module uses an electrically controlled relay for power control and incorporates an ADC detection circuit at the power supply point. The ADC detection circuit automatically samples and acquires the chip's real-time power consumption data and reports it to the host computer or main control module (which can be implemented using a microcontroller with existing power control methods) for power control. The aforementioned chip test fixture, data acquisition and processing module, and temperature monitoring module are all housed in an existing temperature chamber. Before testing, the chip to be tested can be inserted into the chip test fixture and fixed so that the chip's functional pins can be connected to the multi-channel power module and the data acquisition and processing module through the pin circuit connection structure provided by the chip test fixture. Each module is designed and selected to ensure that its operating temperature can be as low as -55°C, ensuring that the operating temperature of each module can effectively adapt to the ambient temperature inside the temperature chamber during actual testing, avoiding module failure or deviations in operating status that could affect the accuracy of the test results. The main control module can, but is not limited to, use an STM32F103 series microcontroller. When detecting current, the microcontroller can use its internal ADC module in conjunction with an external sampling circuit (such as the ADC detection circuit mentioned above) to detect the current of the input chip. The current detection result can be used as the control basis for the multi-channel power supply module or reported to the host computer for recording or control via the RS232 interface.

[0035] The aforementioned fully automated low-temperature chip screening platform, based on microcontroller control, employs a high-precision temperature monitoring module to control temperature fluctuations within the required low-temperature environment of the chamber within a set range. This allows for direct monitoring of whether chips are being tested under stable low-temperature conditions, improving the accuracy and reliability of test results. The chip testing fixture can test multiple chips simultaneously and can be customized to different production tasks. It is simple to operate and, when applied to large-scale comprehensive testing, can complete fully automated screening by linking with existing chambers and a host computer, significantly reducing manual testing time. Furthermore, the modular design provides module isolation, supporting not only fully automated screening but also avoiding frequent manual operations, greatly improving the safety of personnel and equipment, reducing the probability of secondary damage to the chips under test, and effectively achieving efficient, accurate, and low-cost screening of chip low-temperature performance.

[0036] In one embodiment, such as Figure 2As shown, the temperature monitoring module includes a TMP117 chip, resistors R111, R112, and R113, and capacitor C272. The SDA pin of the TMP117 chip is used to connect to the temperature serial data line (TEMP_I2C1_SDA), the SCL pin is used to connect to the temperature serial clock line (TEMP_I2C1_SCL), and the ALERT pin is used to output the temperature alarm signal (TEMP_Alarm). Resistors R111, R112, and R113 are connected to the power supply VCC. The other end of resistor R111 is connected to the temperature serial data line, the other end of resistor R112 is connected to the temperature serial clock line, and the other end of resistor R113 is connected to the ALERT pin of the TMP117 chip. One end of capacitor C272 is connected to the power supply terminal of the TMP117 chip and then to the power supply VCC; the other end of capacitor C272 is grounded.

[0037] It is understood that in this embodiment, the temperature monitoring module can use the existing TMP117 device as the main chip, and its peripheral circuitry is as follows: Figure 2 As shown, the chip has an accuracy of ±0.3℃ under temperature conditions of -55℃ to 150℃, 16-bit accuracy, and supports upper and lower temperature limit alarms. It adopts standard I2C (400kHz) communication, has extremely low power consumption, and can avoid measurement errors caused by chip self-heating. Therefore, it is suitable for chip temperature screening scenarios.

[0038] In one embodiment, such as Figure 3 As shown, the controller's electrically controlled relays include an AZ822-2C-5DE relay, a MMBT5551 transistor, resistors R75, R84, and R87, a freewheeling diode D4, a capacitor C116, connector J11, inductor L10, connector J20, LED D7, and resistor R95. The freewheeling diode D4 is used to suppress reverse electromotive force and protect the components in the circuit. Figure 4 The ADC detection circuit shown uses an OPA2171 operational amplifier. Its peripheral circuit includes resistors R114, R115, R116, R117, R118, capacitor C273, resistors R119, R120, R121, R122, and R123. VCC and VCCQ are power input terminals with different voltage levels, POWER is the switching drive signal terminal for the MMBT5551 transistor, SARM_3.3V is the storage voltage terminal, VCC_OUT and VCCQ_OUT are power output terminals with different voltage levels, and ADC_OUT is the ADC sampling output terminal.

[0039] It is understood that in this embodiment, the multi-power module can use transistors and relays to achieve power control. Specifically, the existing AZ822-2C-5DE relay can be used as the switching path for power switching, and a freewheeling diode D4 can be connected to its coil terminal for device protection. The structure of the relay and its peripheral circuit is as follows: Figure 3 As shown, this relay has a 2A overcurrent capability, a maximum operating time of 7ms, and a switching voltage / current of 5V / 10ms, making it suitable for current control in chip temperature screening scenarios. The control power supply and the power supply of the chip under test on the target board are separated, and a transistor control circuit controls the relay's activation.

[0040] By adopting, for example Figure 4 The existing ADC detection circuit shown serves as a current sampling circuit, enabling monitoring of the chip's operating current. An OPA2171 operational amplifier can be used as the current sampling op-amp. This op-amp is a low-noise dual-channel op-amp with a wide operating temperature range of -55℃ to 125℃, meeting low-temperature screening requirements. It features ultra-low temperature drift, noise figure, and bias current, providing high-precision output for easy monitoring of abnormal currents. The corresponding current can be directly obtained by dividing the voltage across the sampling resistor by its resistance value. Figure 4 Taking the 1.8V sampling circuit as an example, the calculation formula is as follows:

[0041] The design makes sampling resistor R117 = R115, and sampling resistor R118 = R114:

[0042] Vadc=(Vin-Vout)×(R117 / R118)

[0043] Where Vadc is the ADC sampling output voltage, Vin is the input voltage of the multiplexer power supply module, and Vout is the output voltage of the multiplexer power supply module. Because the sampling current I:

[0044] I=(Vin-Vout) / R116

[0045] Right now:

[0046] I= (Vadc × R118) / (R117 × R116)

[0047] Press up Figure 4 The calculation results of the data are as follows:

[0048] I = Vadc / 1.2 (A).

[0049] In one embodiment, the data acquisition and processing module can use an STM32F417 series microcontroller to automatically perform predetermined read / write and filtering judgments on the chip, and return the read / write status and judgment results to the main control module and the host computer. For example, the existing workflow for random read / write and filtering judgments of the chip's NVSRAM (Non-Volatile Static Random Access Memory, which is a combination of static random access memory (SRAM)) can be as follows: When the serial port instruction is 0xe5, set the outer loop count to 0; check if the outer loop count is less than 50; if the outer loop count is less than 50, set the inner loop count to 0 and then check if the inner loop count is less than 2; if the inner loop count is not less than 2, set the outer loop count + 1 and return to the step of checking if the outer loop count is less than 50, otherwise start the SRAM test program to perform random read / write, and then the SRAM test program performs a software store operation, that is, stores the relevant test data or program code into the SRAM. Then, after the SRAM test program completes the data storage into the SRAM, it performs a software recall operation. The `recall` operation is then performed, and the process returns to the step where the number of iterations in the inner loop is less than 2.

[0050] If the number of outer loop iterations is not less than 50, then SRAM writes 55aa, then SRAM reads 55aa, the SRAM test program performs a software store operation, then writes aa55 to SRAM, then reads aa55 from SRAM, and then the test ends.

[0051] In one embodiment, such as Figure 5 As shown, the aforementioned fully automatic low-temperature chip screening platform based on microcontroller control also includes a button module. The button module is connected to the main control module and is used to input screening program switching signals to the main control module.

[0052] It is understandable that in practical use, different button signals can be switched through the button operation provided by the button module, so that the main control module can send different filtering program switching signals to the data acquisition and processing module, thereby conveniently and quickly switching between different existing filtering programs and further improving filtering efficiency.

[0053] In addition, the chip low-temperature screening hardware platform adopts a modular design, which includes features such as... Figure 6The structural board shown serves as the mounting carrier for the corresponding modules. The chip low-temperature screening hardware platform, after assembling each module, can include multiple PCB boards. The structural board, as a dedicated mounting platform, can be flexibly combined according to different testing requirements (for example, batch screening tests require a large number of test fixtures, while sampling screening only requires a portion of the test fixtures; different application scenarios have different inherent programs and operating states when requiring low-temperature screening. Relying on the mounting structure of the structural board, different chip pin connection structures can be quickly mounted to support simultaneous screening tests of different chip operating states), improving production efficiency.

[0054] like Figure 7 The diagram shows the installation of the controlled modules on the structural board, as follows: Figure 8 The diagram shows the circuit board installation of the main control module and the multi-channel power supply module. Specifically, to facilitate understanding of the platform's structure and usage, the workflow for implementing low-temperature chip screening using the aforementioned chip low-temperature screening hardware platform can be as follows:

[0055] (1) Hardware platform assembly: Based on the production task and the existing low temperature chamber size, assemble and splice the appropriate size and number of relevant screening platforms, put them into the high and low temperature chamber, and connect the relevant power supply and data cable through the reserved holes in the chamber.

[0056] (2) Chip installation and initialization: Install the chip to be tested into the chip test fixture, ensuring that the chip pins are correctly connected to the internal circuitry of the chip test fixture. Then, perform the existing initialization settings for the chip test fixture, the multi-channel power supply module, and the data acquisition and processing module, including setting the test input signal parameters, voltage and current parameters, and initializing the data acquisition program.

[0057] (3) Low temperature environment setting: Set the target low temperature value in the temperature monitoring, for example -40℃. Turn on the low temperature chamber and start cooling according to the set value. The temperature monitoring module monitors the temperature of the test area in real time. When the temperature reaches the target temperature value and stabilizes within the set accuracy range (such as ±0.5℃), proceed to the next test.

[0058] (4) Chip performance testing: Under a stable low-temperature environment, the data acquisition and processing module sends predetermined test signals to the chip test fixture to test the chip's functions. The test content includes, but is not limited to, the chip's functional tests (such as logic function verification, instruction execution correctness checks, and other predetermined tests) and electrical performance tests (such as measuring the chip's power consumption, input and output voltage, and other predetermined measurements at low temperatures).

[0059] (5) Data processing and analysis: The data acquisition and processing module will perform predetermined analysis and comparison on the acquired chip performance data, such as comparing it with the pre-set qualification standards to determine whether the chip meets the low temperature performance requirements. If all the performance indicators of the chip are within the qualified range, the chip is judged to be qualified in low temperature performance; otherwise, it is judged to be unqualified and the test results are returned to the host computer.

[0060] (6) Test result recording and chip classification: The test results of the chips are recorded in the database. The host computer can mark the corresponding chips according to different test results. For example, qualified chips are marked as products that can be used in low temperature environments, and unqualified chips are marked for subsequent analysis or processing (such as defect analysis, scrapping, etc.).

[0061] Because the chip cryogenic screening hardware platform employs a high-precision temperature monitoring module, it can control temperature fluctuations within the required cryogenic environment of the chamber within a set, relatively small range. This allows for direct monitoring of whether the chips are being tested under stable cryogenic conditions, improving the accuracy and reliability of the test results. The chip testing fixtures used can test multiple chips simultaneously and can be customized to meet different production tasks. Operation is simple; operators only need to issue predetermined test commands on the host computer to complete the relevant tests. When applied to large-scale comprehensive testing, it can also achieve fully automated screening by linking with existing chambers and the host computer, significantly reducing personnel testing time. Compared to traditional large-scale cryogenic testing equipment, the aforementioned chip cryogenic screening hardware platform reduces equipment installation and procurement costs, requiring only existing cryogenic chambers for testing. Moreover, due to the increased testing efficiency, the testing cost per chip is correspondingly reduced, effectively lowering the total cost for chip manufacturers in the cryogenic screening process.

[0062] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0063] The above embodiments only illustrate several implementation methods of this utility model, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of protection of the utility model. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and all such modifications and improvements fall within the scope of protection of this utility model. Therefore, the scope of protection of this utility model should be determined by the appended claims.

Claims

1. A full-automatic chip low-temperature screening platform based on single-chip microcomputer control, characterized in that, The device includes a main control module, a serial port module, a chip testing fixture, a temperature monitoring module, a multi-channel power supply module, a data acquisition and processing module, and a structural board. The main control module is connected to the serial port module, the multi-channel power supply module, and the data acquisition and processing module. The data acquisition and processing module is connected to the multi-channel power supply module, the chip testing fixture, and the temperature monitoring module. The serial port module is used to connect to a host computer. The chip testing fixture, the temperature monitoring module, and the data acquisition and processing module are mounted on the structural board via a PCB board. The chip test fixture includes a chip mount customized for the chip to be tested, used to load the chip to be tested, and the multi-channel power module and the data acquisition and processing module are connected to the corresponding pins of the chip respectively. The temperature monitoring module is used to monitor the temperature data of the chip test area of ​​the chip test fixture in real time and control the screening test temperature in the temperature chamber to be maintained within the set temperature range. Each of the multiple power supply modules includes a relay and an ADC detection circuit. The relay is used to switch the power supply connected to the chip test fixture. The ADC detection circuit is used to detect the real-time power consumption of the chip and transmit it to the main control module. The data acquisition and processing module is used to collect the performance data of the chip during the low-temperature test and transmit it back to the main control module via a flexible flat cable.

2. The full-automatic chip low-temperature screening platform based on single-chip microcomputer control according to claim 1, characterized in that, The temperature monitoring module includes a TMP117 chip, resistors R111, R112, and R113, and a capacitor C272. The SDA pin of the TMP117 chip is used to connect to the temperature serial data line, the SCL pin of the TMP117 chip is used to connect to the temperature serial clock line, and the ALERT pin of the TMP117 chip is used to output a temperature alarm signal. Resistors R111, R112, and R113 are respectively connected to the power supply VCC. The other end of resistor R111 is connected to the temperature serial data line, the other end of resistor R112 is connected to the temperature serial clock line, and the other end of resistor R113 is connected to the ALERT pin of the TMP117 chip. One end of capacitor C272 is connected to the power supply terminal of the TMP117 chip and connected to the power supply VCC, and the other end of capacitor C272 is grounded.

3. The full-automatic chip low-temperature screening platform based on single-chip microcomputer control according to claim 1 or 2, characterized in that, The relay includes an AZ822-2C-5DE relay and a freewheeling diode D4. The freewheeling diode D4 is connected in series with the coil interface of the AZ822-2C-5DE relay to suppress the reverse electromotive force. The ADC detection circuit uses an OPA2171 operational amplifier.

4. The full-automatic chip low-temperature screening platform based on single-chip microcomputer control according to claim 3, characterized in that, The data acquisition and processing module is an STM32F417 series microcontroller.

5. The fully automated low-temperature chip screening platform based on single-chip microcomputer control according to claim 3, characterized in that, It also includes a button module, which is connected to the main control module and is used to input a filtering program switching signal to the main control module.

Images