Test probe structure and power supply ripple noise test device
By using a combination of a positive probe, a negative probe, and an insulating clamp on the power supply circuit board, the problems of difficult soldering and damage in small capacitor testing are solved, and efficient and accurate power supply ripple noise testing is achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-03
- Publication Date
- 2026-04-14
AI Technical Summary
Existing technologies make it difficult to solder coaxial cables when testing small capacitors on power supply circuit boards, which can easily damage the circuit board and result in inaccurate test results.
The system employs a combination of a positive probe, a negative probe, and an insulating clamp. Small capacitors are held in place by the insulating clamp for testing, avoiding welding and ensuring a reliable electrical connection.
This technology enables efficient and reliable testing of small capacitors, avoids damage to circuit boards, improves the accuracy and efficiency of test results, and reduces maintenance costs.
Smart Images
Figure CN224122732U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of power supply ripple noise testing equipment, and in particular to a test probe structure and a power supply ripple noise testing device. Background Technology
[0002] In existing hardware testing, power supply ripple noise testing is very important, as it is closely related to product lifespan and the ability to perform normal functions.
[0003] As circuit boards become increasingly miniaturized and integrated, the use of small capacitors, such as the 0201 type, is growing. Under this trend, the drawbacks of the traditional method of soldering coaxial lines across the capacitors for noise testing are becoming increasingly apparent: First, it increases the difficulty of soldering. The small size of 0201 type capacitors makes soldering difficult, as the circuitry used for noise testing is almost identical in size to the capacitors themselves, making it extremely unsuitable for noise testing. Second, due to the small size of the capacitors, after soldering the coaxial lines, it's easy to accidentally pull the capacitor or the solder pad off, potentially damaging the circuit board. In such cases, resoldering the capacitor or using jumper wires is usually necessary, further increasing the workload of the noise testing process and potentially reducing the quality of the noise test signal, leading to distorted test results.
[0004] Therefore, there is an urgent need for a power supply ripple noise testing device to achieve efficient and reliable testing of small capacitors on power supply circuit boards. Utility Model Content
[0005] This application provides a test probe structure and a power supply ripple noise testing device to achieve efficient and reliable testing of small capacitors on power supply circuit boards.
[0006] In a first aspect, embodiments of this application provide a test probe structure, which includes: a positive probe, a negative probe, an insulating clamp, and a communication line; the communication line is connected to the positive probe and the negative probe; the insulating clamp is disposed on the communication line; the insulating clamp is used to bring the positive probe and the negative probe closer together when the communication line is pulled, so that both the positive probe and the negative probe are in contact with the component under test.
[0007] In one possible implementation, the test probe structure further includes an insulating elastic band; wherein the insulating elastic band connects one end of the positive probe to one end of the negative probe; and a communication line is connected to the other end of the positive probe and the other end of the negative probe for communication.
[0008] In one possible implementation, the test probe structure further includes an insulating fixing component; a first end of the communication line is connected to the positive probe and the negative probe; a second end of the communication line is used to connect to an oscilloscope; an insulating fixing clip is disposed on the communication line near the first end of the communication line, and an insulating fixing component is disposed on the communication line near the second end of the communication line; the insulating fixing component is used to fix to the circuit board where the component under test is located, so as to fix the test probe structure on the circuit board.
[0009] In one possible implementation, the insulating fixing component is at least one of a suction cup, a clamp, or a snap fastener.
[0010] In one possible implementation, the test probe structure also includes an oscilloscope, and a bayonet nut connector is provided on the second end of the communication line; the oscilloscope is connected to the communication line via the bayonet nut connector; the oscilloscope is used to display information about the signals acquired by the positive probe and the negative probe.
[0011] In one possible implementation, a positive probe is disposed on a first probe structure, and a first pressure sensor is disposed in the first probe structure. The first pressure sensor is insulated from the positive probe. The outer shell of the first probe structure is an insulator. The positive probe is a metal sheet. The first pressure sensor is used to detect the clamping pressure of the first probe structure.
[0012] In one possible implementation, the first probe structure is further provided with a first insulating sheet, which is disposed between the positive probe and the first pressure sensor.
[0013] In one possible implementation, the negative probe is disposed on the second probe structure, and the second probe structure contains a second pressure sensor, which is insulated from the negative probe; the outer shell of the second probe structure is an insulator; the negative probe is a metal sheet; and the second pressure sensor is used to detect the clamping pressure of the second probe structure.
[0014] In one possible implementation, the second probe structure is further provided with a second insulating sheet, which is disposed between the negative probe and the second pressure sensor.
[0015] In one possible implementation, the communication line includes a signal line and a mesh shielding line, the signal line being communicatively connected to the positive probe, and the mesh shielding line being communicatively connected to the negative probe; the mesh shielding line is grounded.
[0016] Secondly, embodiments of this application provide a power supply ripple noise testing device, which includes the aforementioned test probe structure.
[0017] The test probe structure provided in this application, through the coordinated operation of a positive probe, a negative probe, and an insulating clamp, achieves a reliable electrical connection to the component under test (DUT), thereby enabling efficient and reliable testing of small capacitors and other DUTs on power supply circuit boards. Compared to existing methods that involve soldering coaxial cables across capacitors for noise testing, this application eliminates the need for soldering, achieving high-efficiency testing and being more user-friendly for noise testing. Furthermore, the insulating clamp secures the positive and negative probes to the DUT, preventing the removal of capacitors or other DUTs, or the removal of solder pads, thus avoiding damage to the circuit board, reducing the workload of the noise testing process, and preventing a decrease in noise test signal quality, ensuring the accuracy of the test results. This application features a simple and low-cost structure, is easy to assemble and maintain, and is suitable for large-scale deployment. Attached Figure Description
[0018] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.
[0019] Figure 1 A partial structural schematic diagram (I) of a test probe structure provided for one embodiment of this application;
[0020] Figure 2 A partial structural schematic diagram (II) of a test probe structure provided for one embodiment of this application.
[0021] Figure 3 A schematic diagram illustrating the interaction between a first probe structure and a positive probe, provided for one embodiment of this application;
[0022] Figure 4 This is a schematic diagram illustrating the interaction between the second probe structure and the negative probe, as provided in one embodiment of this application.
[0023] The above figures include the following reference numerals:
[0024] 10. Positive probe; 11. First probe structure; 12. First pressure sensor; 13. First insulating sheet;
[0025] 20. Negative probe; 21. Second probe structure; 22. Second pressure sensor; 23. Second insulating sheet;
[0026] 30. Insulating fixing clip;
[0027] 40. Communication lines;
[0028] 50. The component under test;
[0029] 60. Insulating elastic band;
[0030] 70. Insulating fixing components;
[0031] 80. Bayonet nut connector.
[0032] The accompanying drawings have illustrated specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to specific embodiments. Detailed Implementation
[0033] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.
[0034] like Figures 1 to 4 As shown, an embodiment of this application provides a test probe structure, which includes: a positive probe 10, a negative probe 20, an insulating clamp 30, and a communication line 40; the communication line 40 is communicatively connected to the positive probe 10 and the negative probe 20; the insulating clamp 30 is disposed on the communication line 40; the insulating clamp 30 is used to bring the positive probe 10 and the negative probe 20 closer together when the communication line 40 is pulled, so that both the positive probe 10 and the negative probe 20 are in contact with the component under test 50.
[0035] The test probe structure provided in this application, through the coordinated operation of the positive probe 10, the negative probe 20, and the insulating clamp 30, achieves a reliable electrical connection to the component under test 50, thereby enabling efficient and reliable testing of the component 50, such as small capacitors on the power supply circuit board. Compared with the existing method of soldering coaxial lines to both ends of the capacitor for noise testing, this application eliminates the need for soldering, thus achieving high-efficiency testing and being more user-friendly for noise testing. Furthermore, this application uses the insulating clamp 30 to hold and fix the positive probe 10 and the negative probe 20 to the component under test 50, avoiding the problem of pulling off the capacitor or other component under test 50 or removing the solder pads, thereby preventing damage to the circuit board, reducing the workload of the noise testing process, and preventing the degradation of the noise test signal quality, ensuring the accuracy of the test results. This application has a simple structure and low cost, is easy to assemble and maintain, and is suitable for large-scale promotion and use.
[0036] like Figure 2As shown, in one possible implementation, the test probe structure further includes an insulating elastic band 60; wherein the insulating elastic band 60 connects one end of the positive probe 10 to one end of the negative probe 20; and the communication line 40 is connected to the other end of the positive probe 10 and the other end of the negative probe 20 for communication.
[0037] The addition of the insulating elastic band 60 allows the test probe structure to adapt to test components 50 of different sizes, improving the flexibility and adaptability of the test. This design also allows the test probe structure to clamp the test component 50 more tightly, ensuring the stability and accuracy of signal acquisition. Application scenarios include power ripple noise testing on circuit boards of various specifications, especially in situations where multiple capacitors of different sizes need to be tested, the adjustable function of the insulating elastic band 60 is particularly important.
[0038] In one specific embodiment of this application, there are multiple insulating elastic bands 60, which are spaced apart and respectively provide elastic force for clamping and fixing the positive probe 10 and the negative probe 20 to both ends of the tested element 50.
[0039] like Figure 2 As shown, the test probe structure also includes an insulating fixing component 70; the first end of the communication line 40 is connected to the positive probe 10 and the negative probe 20; the second end of the communication line 40 is used to connect to an oscilloscope; the insulating fixing clip 30 is disposed on the communication line 40 near the first end of the communication line 40, and the insulating fixing component 70 is disposed on the communication line 40 near the second end of the communication line 40; the insulating fixing component 70 is used to fix to the circuit board where the component under test 50 is located, so as to fix the test probe structure to the circuit board.
[0040] The use of the insulating fixing component 70 allows the test probe structure to be firmly fixed on the circuit board, avoiding signal quality degradation caused by probe movement during the test. The above design improves the stability of the test and ensures the continuity and consistency of signal acquisition. Application scenarios include automated test environments where power supply ripple noise needs to be tested continuously for a long time. The fixing function of the insulating fixing component 70 ensures the continuity and reliability of the test.
[0041] Specifically, the insulating fixing component 70 is at least one of a suction cup, a clamp, and a buckle.
[0042] Different types of insulating fixing components 70 are suitable for different types of circuit boards and test environments, improving the versatility and adaptability of the test probe structure. The above design allows users to select the most suitable insulating fixing component 70 according to the specific test environment and circuit board type, ensuring the stable fixing of the test probe structure. Application scenarios include power ripple noise testing on circuit boards of different materials and thicknesses, such as PCB boards, ceramic substrates, metal substrates, etc. Selecting the appropriate insulating fixing component 70 can ensure the stable fixing of the test probe structure.
[0043] Specifically, the test probe structure also includes an oscilloscope, and a bayonet nut connector 80 is provided on the second end of the communication line 40; the oscilloscope is connected to the communication line 40 through the bayonet nut connector 80; the oscilloscope is used to display information of the signals collected by the positive probe 10 and the negative probe 20.
[0044] The use of the bayonet nut connector 80 ensures a stable connection between the communication line 40 and the oscilloscope, improving the reliability and accuracy of signal transmission. This allows users to clearly observe the power supply ripple noise signal of the component under test 50 through the oscilloscope, providing accurate data support for subsequent analysis and diagnosis. Application scenarios include situations where precise measurement and analysis of power supply ripple noise is required during power circuit design, debugging, and verification. The integrated use of the oscilloscope simplifies the configuration of test equipment and improves test efficiency.
[0045] like Figure 2 and Figure 3 As shown, in one possible implementation, the positive probe 10 is disposed on the first probe structure 11, and the first probe structure 11 is provided with a first pressure sensor 12, which is insulated from the positive probe 10; the outer shell of the first probe structure 11 is an insulator; the positive probe 10 is a metal sheet; and the first pressure sensor 12 is used to detect the clamping pressure of the first probe structure 11.
[0046] The addition of the first pressure sensor 12 enables the test probe structure to monitor the contact pressure between the positive probe 10 and the component under test 50 in real time, ensuring the stability and reliability of the contact. This setting avoids inaccurate signal acquisition or component damage due to insufficient or excessive contact pressure. Application scenarios include power supply ripple noise testing where precise control of contact pressure is required, such as when testing sensitive components. The monitoring function of the first pressure sensor 12 can ensure that the testing process is carried out gently and avoid damage to the component under test 50.
[0047] like Figure 3 As shown, the first probe structure 11 is also provided with a first insulating sheet 13, which is disposed between the positive probe 10 and the first pressure sensor 12.
[0048] The addition of the first insulating sheet 13 further enhances the insulation performance between the positive probe 10 and the first pressure sensor 12, avoiding signal interference and short-circuit risks, thereby improving the signal acquisition quality and safety of the test probe structure. Application scenarios include power supply ripple noise testing on high-voltage, high-frequency circuit boards. The use of the first insulating sheet 13 effectively isolates the positive probe 10 and the first pressure sensor 12, ensuring the accuracy and safety of the test.
[0049] like Figure 2 and Figure 4 As shown, the negative probe 20 is disposed on the second probe structure 21, and the second probe structure 21 is provided with a second pressure sensor 22. The second pressure sensor 22 is insulated from the negative probe 20. The outer shell of the second probe structure 21 is an insulator. The negative probe 20 is a metal sheet. The second pressure sensor 22 is used to detect the clamping pressure of the second probe structure 21.
[0050] The addition of the second pressure sensor 22, combined with its collaborative operation with the first pressure sensor 12, ensures the stability and reliability of the contact between the positive probe 10 and the negative probe 20 and the component under test 50. This improves the accuracy and consistency of the test and avoids test errors caused by poor contact. Application scenarios include situations requiring dual-end measurements of power supply ripple noise. The monitoring function of the second pressure sensor 22 ensures that both ends of the test probe structure can contact the component under test 50 with appropriate pressure, improving the accuracy and reliability of the test.
[0051] like Figure 4 As shown, the second probe structure 21 also includes a second insulating sheet 23, which is disposed between the negative probe 20 and the second pressure sensor 22.
[0052] By incorporating a second insulating sheet 23, the insulation performance between the negative probe 20 and the second pressure sensor 22 is further enhanced, avoiding signal interference and short-circuit risks, thereby improving the signal acquisition quality and safety of the test probe structure. Application scenarios include power supply ripple noise testing on high-voltage, high-frequency circuit boards. The use of the second insulating sheet 23 effectively isolates the negative probe 20 and the second pressure sensor 22, ensuring the accuracy and safety of the test.
[0053] Optionally, the communication line 40 includes a signal line and a mesh shielded line. The signal line is communicatively connected to the positive probe 10, and the mesh shielded line is communicatively connected to the negative probe 20. The mesh shielded line is grounded.
[0054] The improved design of the communication line 40, through the combination of signal lines and mesh shielding, enhances the anti-interference capability and stability of signal transmission. This allows users to obtain cleaner and more accurate power supply ripple noise signals, providing reliable data support for subsequent analysis and diagnosis. Application scenarios include power supply ripple noise testing in environments with severe electromagnetic interference. The improved design of the communication line 40 effectively suppresses external interference, ensuring the purity and accuracy of the test signal.
[0055] In one specific embodiment of this application, the internal structure of the communication line 40 is basically consistent with that of a conventional coaxial cable. The center of the line is the signal line, and there is an insulating layer outside the signal line. Outside the insulating layer is a mesh shielding wire, and outside the mesh shielding wire is the outermost insulating layer. The insulating fixing assembly 70 includes a rubber insulating suction cup, which is disposed on the outer periphery of the communication line 40 for fixing the communication line 40 in a designated position. The positive probe 10 and the negative probe 20 include metal plates for receiving signals. The metal plates are in contact with the component under test 50 to achieve electrical connection.
[0056] An embodiment of this application also provides a power supply ripple noise testing device, which includes the test probe structure described above.
[0057] The technical solution of this application and how the technical solution of this application solves the above-mentioned technical problems are described in detail below with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments. The embodiments of this application will now be described with reference to the accompanying drawings.
[0058] When using the test probe structure of this application to perform power supply ripple noise testing, firstly, according to the size and position of the component under test 50, adjust the insulating elastic band 60 to ensure that the positive probe 10 and negative probe 20 can stably clamp the component under test 50; then, fix the test probe structure to the circuit board through the insulating fixing component 70 to ensure that it will not move during the test; next, connect the second end of the communication line 40 to the oscilloscope through the bayonet nut connector 80 to ensure the stability and reliability of signal transmission; finally, power on and perform the test. The oscilloscope displays the signal information collected by the positive probe 10 and negative probe 20 in real time, and the user can perform subsequent analysis and diagnosis based on the displayed signal information; throughout the test, the first pressure sensor 12 and the second pressure sensor 22 monitor the positive probe 10 and negative probe in real time. The contact pressure between the test probe 20 and the component under test 50 ensures the stability and reliability of the contact, improving the accuracy and consistency of the test. Furthermore, the use of the first insulating sheet 13 and the second insulating sheet 23 further enhances the signal acquisition quality and safety of the test probe structure, avoiding signal interference and short-circuit risks. This is particularly significant when performing power supply ripple noise testing on high-voltage, high-frequency circuit boards. The improved design of the communication line 40, through the combination of the signal line and the mesh shielded wire, improves the anti-interference capability and stability of signal transmission, ensuring that users can obtain a cleaner and more accurate power supply ripple noise signal, providing reliable data support for subsequent analysis and diagnosis. The improved design of the communication line 40 is especially significant when performing power supply ripple noise testing in environments with severe electromagnetic interference.
[0059] The test probe structure and power supply ripple noise testing device proposed in this application not only simplify the testing process and reduce the testing difficulty, but also effectively protect the circuit board and avoid additional maintenance costs, providing an efficient, accurate, and safe solution for power supply ripple noise testing. Especially with the trend of circuit board miniaturization and integration, its advantages are even more obvious. It is suitable for testing small capacitors and other components under test on various power supply circuit boards. No soldering is required, which greatly simplifies the testing process, improves testing efficiency and accuracy, and provides strong support for power circuit design, debugging, and verification.
[0060] In summary, this application achieves a reliable electrical connection to the component under test (DUT) 50 by using a positive probe 10, a negative probe 20, and an insulating clamp 30 in conjunction. This enables efficient and reliable testing of DUTs such as small capacitors on the power supply circuit board. Compared to existing methods that involve soldering coaxial cables across the capacitors for noise testing, this application eliminates the need for soldering, resulting in highly efficient and more user-friendly noise testing. Furthermore, the insulating clamp 30 secures the positive probe 10 and negative probe 20 to the DUT 50, preventing the capacitor or other DUTs from being pulled off or the solder pads from being removed. This avoids damage to the circuit board, reduces the workload of the noise testing process, and prevents degradation of the noise test signal quality, ensuring the accuracy of the test results. This application has a simple structure, low cost, and is easy to assemble and maintain, making it suitable for large-scale deployment.
[0061] Finally, it should be noted that other embodiments of this application will readily conceive of by those skilled in the art upon consideration of the specification and practice of the technology disclosed herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein, and is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.
Claims
1. A test probe structure, characterized in that, The test probe structure includes: a positive probe, a negative probe, an insulating clamp, and a communication line; The communication line is communicatively connected to the positive probe and the negative probe; the insulating fixing clip is disposed on the communication line; The insulating clamp is used to bring the positive probe and the negative probe closer together when the communication line is pulled, so that both the positive probe and the negative probe are in contact with the component under test.
2. The test probe structure according to claim 1, characterized in that, The test probe structure also includes an insulating elastic band; wherein, the insulating elastic band connects one end of the positive probe to one end of the negative probe; the communication line is communicatively connected to the other end of the positive probe and the other end of the negative probe.
3. The test probe structure according to claim 1, characterized in that, The test probe structure also includes an insulating fixing component; The first end of the communication line is connected to the positive probe and the negative probe; the second end of the communication line is used to connect to an oscilloscope. The insulating fixing clip is disposed on the communication line near the first end of the communication line, and the insulating fixing assembly is disposed on the communication line near the second end of the communication line; The insulating fixing assembly is used to fix the test probe structure to the circuit board where the test element is located.
4. The test probe structure according to claim 3, characterized in that, The insulating fixing component is at least one of suction cup, clamp, and buckle.
5. The test probe structure according to claim 3, characterized in that, The test probe structure also includes the oscilloscope, and a bayonet nut connector is provided on the second end of the communication line; the oscilloscope is communicatively connected to the communication line through the bayonet nut connector. The oscilloscope is used to display information about the signals acquired by the positive probe and the negative probe.
6. The test probe structure according to claim 1, characterized in that, The positive electrode probe is disposed on the first probe structure, and the first probe structure is provided with a first pressure sensor. The first pressure sensor is insulated from the positive electrode probe. The outer shell of the first probe structure is an insulator. The positive electrode probe is a metal sheet. The first pressure sensor is used to detect the clamping pressure of the first probe structure.
7. The test probe structure according to claim 6, characterized in that, The first probe structure also includes a first insulating sheet, which is disposed between the positive probe and the first pressure sensor.
8. The test probe structure according to claim 1, characterized in that, The negative electrode probe is disposed on the second probe structure, and the second probe structure contains a second pressure sensor. The second pressure sensor is insulated from the negative electrode probe. The outer shell of the second probe structure is an insulator. The negative electrode probe is a metal sheet. The second pressure sensor is used to detect the clamping pressure of the second probe structure.
9. The test probe structure according to claim 8, characterized in that, The second probe structure also includes a second insulating sheet, which is disposed between the negative probe and the second pressure sensor.
10. The test probe structure according to any one of claims 1-9, characterized in that, The communication line includes a signal line and a mesh shielding line. The signal line is communicatively connected to the positive probe, and the mesh shielding line is communicatively connected to the negative probe. The mesh shielding line is grounded.
11. A power supply ripple noise testing device, characterized in that, The power supply ripple noise testing device includes the test probe structure according to any one of claims 1 to 10.