Optical module

Abstract

The optical module comprises a light emitting component, a first optical fiber adapter and a first shell, and the first shell is connected with the light emitting component and the first optical fiber adapter. The light emitting component comprises a VCSEL laser chip and a first lens, the VCSEL laser chip is used for emitting optical signals in multiple modes, and the irradiance distribution of the optical signals is uneven. The first lens is located in the light emitting direction of the VCSEL laser chip. The first optical fiber adapter comprises a first optical fiber insertion core, the first optical fiber insertion core comprises a fiber core, and the fiber core is a multimode fiber core. A second lens is arranged in an inner cavity of the first shell and located between the first lens and the first optical fiber insertion core. A light uniformizing part is arranged in the inner cavity of the first shell, is located between the first lens and the second lens, and is used for adjusting optical signals with non-uniform irradiance distribution into optical signals with uniform irradiance distribution, so that the optical signals with non-uniform irradiance distribution emitted by the VCSEL laser chip are adjusted into the optical signals with uniform irradiance distribution.

Description

Technical Field

[0001] This disclosure relates to the field of optical fiber communication technology, and in particular to an optical module. Background Technology

[0002] With the development of intelligent and connected vehicles, in-vehicle communication technology has become increasingly important. In-vehicle communication systems mostly use cables for data transmission, but this method suffers from limitations such as limited transmission distance, rapid signal attenuation, and susceptibility to electromagnetic interference. In-vehicle optical modules can achieve high-speed and stable data transmission, facilitating the improvement of the overall performance of in-vehicle communication systems through optical communication. In optical communication technology, optical modules are the tools for converting photoelectric signals to and from each other, and are one of the key components in optical communication equipment. Furthermore, with the development of optical communication technology, the transmission rate of optical modules is constantly increasing. Utility Model Content

[0003] In some embodiments, an optical module is provided such that the irradiance of the light spot entering the first fiber ferrule is uniformly distributed.

[0004] Some embodiments provide an optical module, including:

[0005] Circuit board;

[0006] The light-emitting component is electrically connected to the circuit board.

[0007] A light receiving component is electrically connected to the circuit board;

[0008] First fiber optic adapter;

[0009] The first housing has a first end connected to the light emitting component, a second end connected to the first optical fiber adapter, and a third end connected to the light receiving component;

[0010] The light emitting component includes:

[0011] The laser chip, specifically a VCSEL laser chip, is used to emit optical signals including multiple modes.

[0012] The first lens, located in the light-emitting direction of the laser chip, is used to collimate the optical signal;

[0013] The first fiber optic adapter includes:

[0014] The first optical fiber ferrule includes a fiber core; the fiber core is a multimode fiber core.

[0015] The inner cavity of the first housing is provided with:

[0016] The second lens, located between the first lens and the first fiber optic ferrule, is used to converge the optical signal; the beam equalizer, located between the first lens and the second lens, is used to adjust the optical signal with uneven irradiance distribution into an optical signal with uniform irradiance distribution.

[0017] One of the above technical solutions has the following advantages or beneficial effects: This disclosure provides an optical module, including a circuit board, an optical emitting component, an optical receiving component, a first fiber optic adapter, and a first housing. The circuit board is electrically connected to the optical emitting component so that the optical emitting component emits an optical signal under the action of an electrical signal. The circuit board is also electrically connected to the optical receiving component so that the optical receiving component converts the optical signal into an electrical signal and transmits the electrical signal to the circuit board. A first end of the first housing is connected to the optical emitting component, a second end of the first housing is connected to the first fiber optic adapter, and a third end of the first housing is connected to the optical receiving component, so that the optical signal emitted by the optical emitting component is transmitted through the first housing to the first fiber optic adapter, and the optical signal emitted by the first fiber optic adapter is transmitted through the first housing to the optical receiving component. The optical emitting component includes a VCSEL laser chip and a first lens. The VCSEL laser chip is a multimode laser chip used to emit multiple modes of optical signals, and the irradiance distribution of the optical signals is non-uniform. The first lens is located in the light emission direction of the VCSEL laser chip and is used to collimate the optical signal. The first fiber optic adapter includes a first fiber ferrule, which includes a fiber core, and the fiber core is a multimode fiber core. A second lens is disposed within the inner cavity of the first housing, located between the first lens and the first fiber ferrule. The second lens is used to focus the optical signal. A beam homogenizer is disposed within the inner cavity of the first housing, located between the first and second lenses. The beam homogenizer is used to adjust the optical signal with uneven irradiance distribution into an optical signal with uniform irradiance distribution, thereby adjusting the optical signal emitted by the VCSEL laser chip with uneven irradiance distribution into an optical signal with uniform irradiance distribution, and thus ensuring that the optical signal entering the first fiber ferrule meets the IEC loop flux standard.

[0018] In some embodiments, an optical module is provided, wherein the light homogenizer includes a substrate and a nanostructure array, the nanostructure array being disposed on the substrate, and the height of the nanostructure array being discretely distributed in 16 steps.

[0019] One of the above technical solutions has the following advantages or beneficial effects: the light homogenizer includes a substrate and a nanostructure array. The nanostructure array is disposed on the substrate, and the height of the nanostructure array is discretely distributed in 16 steps. The phase modulation of the nanostructure array is closer to the ideal continuous change, thereby reducing light scattering and undesired diffraction effects caused by phase abrupt changes, resulting in better light homogenization effect of the light homogenizer.

[0020] In some embodiments, an optical module is provided, wherein the inner cavity of the first housing is further provided with:

[0021] The first filter is located between the second lens and the light homogenizer, facing the light emitting component and the light receiving component, and is used to filter the light signal emitted by the light emitting component and reflect the light signal emitted by the optical fiber ferrule to the light receiving component.

[0022] One of the above technical solutions has the following advantages or beneficial effects: it further includes an optical receiving component, which is connected to the third end of the first housing, so that the optical signal from the fiber optic adapter is transmitted to the optical receiving component through the first housing. The optical receiving component receives the optical signal and converts it into an electrical signal. A first filter is also provided inside the first housing, facing the optical emitting component, to filter the optical signal emitted by the optical emitting component. The first filter also faces the receiving component to reflect the optical signal emitted by the fiber optic ferrule to the optical receiving component. The first filter is located between the homogenizer and the second lens, ensuring a uniform irradiance distribution of the light spot entering the fiber optic adapter, without affecting the irradiance of the light spot entering the optical receiving chip of the optical receiving component, thus guaranteeing the intensity of the optical signal received by the optical receiving chip.

[0023] In some embodiments, an optical module is provided, wherein the inner cavity of the first housing is further provided with:

[0024] The second filter is located between the first filter and the light receiving component, and is used to filter the light signal reflected by the first filter.

[0025] One of the above technical solutions has the following advantages or beneficial effects: the inner cavity of the first housing is further provided with a second filter, which is located between the first filter and the light receiving component, and is used to filter the light signal emitted by the first filter to prevent stray light from entering the light receiving component.

[0026] In some embodiments, an optical module is provided, wherein the optical emitting component includes:

[0027] The tube seat has the following on its top surface:

[0028] The first substrate is provided with the laser chip.

[0029] A cap is placed on the tube base to form a storage cavity with the tube base, and the first lens is disposed in the storage cavity;

[0030] The pin extends through the bottom and top surfaces of the socket, with one end connected to the circuit board and the other end electrically connected to the laser chip.

[0031] One of the above technical solutions has the following advantages or beneficial effects: The light emitting component includes a socket, a cap, and pins. A first carrier substrate is disposed on the top surface of the socket, and a laser chip is disposed on the first carrier substrate. The cap covers the socket, and the cap and the socket form a cavity. A first lens is disposed within the cavity, and the first lens is located in the light emission direction of the laser chip so that the light signal emitted by the laser chip is collimated by the first lens. The pins penetrate the bottom and top surfaces of the socket. One end of the pin is connected to the circuit board, and the other end of the pin is electrically connected to the laser chip, so that the laser chip is electrically connected to the circuit board, and the laser chip emits a light signal under the action of an electrical signal.

[0032] Some embodiments provide an optical module, which further includes:

[0033] The first flexible circuit board has one end connected to the light emitting component and the other end connected to the circuit board;

[0034] The second flexible circuit board has one end connected to the light receiving component and the other end connected to the circuit board.

[0035] One of the above technical solutions has the following advantages or beneficial effects: it further includes a first flexible circuit board and a second flexible circuit board. One end of the first flexible circuit board is connected to the light emitting component, and the other end of the first flexible circuit board is connected to the circuit board, thereby connecting the light emitting component and the circuit board. One end of the second flexible circuit board is connected to the light receiving component, and the other end of the second flexible circuit board is connected to the circuit board, thereby connecting the light receiving component and the circuit board.

[0036] Some embodiments provide an optical module, including:

[0037] Circuit board;

[0038] A light-emitting component, one end of which is electrically connected to the circuit board;

[0039] The optical receiving component is electrically connected at one end to the circuit board.

[0040] The second fiber optic adapter is connected to the other end of the optical emitting component via a mounting bracket;

[0041] A third fiber optic adapter is connected to the optical receiving component;

[0042] The light emitting component includes:

[0043] The laser chip, specifically a VCSEL laser chip, is used to emit optical signals including multiple modes.

[0044] The first lens, located in the light-emitting direction of the laser chip, is used to collimate the optical signal;

[0045] The second fiber optic adapter includes:

[0046] The second fiber optic ferrule includes a fiber core; the fiber core is a multimode fiber core.

[0047] The fixing base is provided with:

[0048] The second lens, located between the first lens and the second fiber optic ferrule, is used to converge the optical signal.

[0049] The light emitting component is provided with:

[0050] A light homogenizer, located between the first lens and the second lens, is used to adjust a light signal with uneven irradiance distribution into a light signal with uniform irradiance distribution.

[0051] One of the above technical solutions has the following advantages or beneficial effects: The optical module includes a circuit board, an optical emitting component, a second fiber optic adapter, an optical receiving component, and a third fiber optic adapter. The circuit board is electrically connected to the optical emitting component, and the other end of the second fiber optic adapter is connected to the optical emitting component via a mounting bracket, so that the optical emitting component emits an optical signal under the action of an electrical signal and transmits the optical signal to the second fiber optic adapter. One end of the optical receiving component is electrically connected to the circuit board, and the third fiber optic adapter is connected to the optical receiving component, so that the optical receiving component can receive the optical signal emitted by the third fiber optic adapter, convert the optical signal into an electrical signal, and transmit the electrical signal to the circuit board. The optical emitting component includes a VCSEL laser chip and a first lens. The VCSEL laser chip is a multimode laser chip used to emit multiple modes of optical signals, and the irradiance distribution of the optical signals is non-uniform. The first lens is located in the light-emitting direction of the VCSEL laser chip and is used to collimate the optical signal. The second fiber optic adapter includes a second fiber ferrule, which includes a fiber core, and the fiber core is a multimode fiber core. A second lens is installed within the mounting base, positioned between the first lens and the second fiber ferrule. This second lens focuses the optical signal. A beam homogenizer is installed within the optical emitting component, also positioned between the first and second lenses. This homogenizer adjusts the unevenly distributed irradiance of the optical signal into a uniformly distributed one, thereby ensuring that the optical signal entering the second fiber ferrule meets the IEC loop flux standard.

[0052] In some embodiments, an optical module is provided, wherein the light homogenizer includes a substrate and a nanostructure array, the nanostructure array being disposed on the substrate, and the height of the nanostructure array being discretely distributed in 16 steps.

[0053] One of the above technical solutions has the following advantages or beneficial effects: the light homogenizer includes a substrate and a nanostructure array. The nanostructure array is disposed on the substrate, and the height of the nanostructure array is discretely distributed in 16 steps. The phase modulation of the nanostructure array is closer to the ideal continuous change, thereby reducing light scattering and undesired diffraction effects caused by phase abrupt changes, resulting in better uniformity of the irradiance distribution of the light signal. Attached Figure Description

[0054] To more clearly illustrate the technical solutions in this disclosure, the accompanying drawings used in some embodiments of this disclosure will be briefly introduced below. Obviously, the drawings described below are only drawings of some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of this disclosure.

[0055] Figure 1 This is a partial architecture diagram of an optical communication system according to some embodiments;

[0056] Figure 2 This is a partial structural diagram of a host computer according to some embodiments;

[0057] Figure 3 This is a structural diagram of an optical module according to some embodiments;

[0058] Figure 4 An exploded view of an optical module according to some embodiments;

[0059] Figure 5a This is an internal structural diagram of an optical module according to some embodiments;

[0060] Figure 5b This is an exploded view of the internal structure of an optical module according to some embodiments;

[0061] Figure 6 This is an internal structure diagram of another optical module provided according to some embodiments;

[0062] Figure 7 This is an exploded view of a light emitting component provided according to some embodiments;

[0063] Figure 8 This is a cross-sectional view of a first fiber optic adapter provided according to some embodiments;

[0064] Figure 9a This is a partial view of the internal structure of an optical module according to some embodiments;

[0065] Figure 9bThis is a partially exploded view of the internal structure of an optical module according to some embodiments;

[0066] Figure 10 This is an optical path diagram of an optical module according to some embodiments;

[0067] Figure 11 This is a transmission optical path diagram of another optical module provided according to some embodiments;

[0068] Figure 12 This is a test pattern of the height distribution of a superlens diffraction surface provided according to some embodiments;

[0069] Figure 13 This is a comparison diagram of the irradiance distribution of a light spot according to some embodiments;

[0070] Figure 14 This is a comparison image of light spots provided according to some embodiments. Detailed Implementation

[0071] The embodiments of this disclosure will now be described clearly and in detail with reference to the accompanying drawings. However, the described embodiments are merely some, and not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0072] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as open and inclusive, meaning "including, but not limited to"; the terms "first" and "second" should not be construed as indicating or implying relative importance or indicating an upper limit on the number; the term "multiple" means two or more; the term "connection" should be interpreted broadly, for example, "connection" can be a fixed connection, a detachable connection, or an integral part, and can be a direct connection or an indirect connection through an intermediate medium; the use of the terms "applicable to" or "configured to" implies open and inclusive language, which does not exclude applicability to or configuration to devices performing additional tasks or steps; descriptions such as "parallel," "perpendicular," "identical," "consistent," and "aligned" are not limited to absolute mathematical theoretical relationships, but also include acceptable error ranges arising in practice, and differences based on the same design concept but due to manufacturing reasons.

[0073] Electricity has replaced fuel and chemical energy as the driving energy for automobiles, which has not only promoted the development of new energy vehicles, but also provided sufficient power for vehicle equipment such as road condition image detection and advanced driver assistance functions. The high power demand of in-vehicle communication and display equipment such as lidar, multi-channel cameras around the vehicle, high-computing-power advanced driver assistance chips, and large in-vehicle screens can be met by the power batteries installed in the vehicle.

[0074] Currently, the average number of in-vehicle cameras exceeds 10, with each camera having over 8 million pixels. The computing power of autonomous driving chips exceeds 500 TOPS. This indicates that the signal communication rate inside the vehicle has entered the field of high-frequency signal transmission. This field places high demands on signal transmission quality, transmission rate, and anti-interference capabilities, which traditional cables can no longer meet. The signal transmission of in-vehicle communication display devices is gradually being replaced by optical cables, and optical communication technology is being extended into automotive products.

[0075] The electrical signals output by the vehicle-mounted cameras are converted by the MAC chip and transmitted to the laser driver chip. The laser driver chip then loads the electrical signals into light for transmission. In a vehicle scenario, multiple vehicle-mounted cameras are distributed around the vehicle body, transmitting multiple video signals from different directions to the vehicle-mounted processing chip (including the driver assistance chip and the vehicle infotainment chip) to form multi-view driving images or detection images for driver assistance. The vehicle-mounted cameras are distributed around the vehicle body and are numerous; the vehicle-mounted processing chips are located inside the vehicle and are fewer in number. A majority-to-minority communication network topology is formed between the vehicle-mounted cameras and the vehicle-mounted processing chips, with the unit communication architecture consisting of multiple vehicle-mounted cameras corresponding to one vehicle-mounted processing chip.

[0076] In optical communication technology, to establish information transmission between information processing devices, information is loaded onto light, and the speed of light propagation is used to transmit the information. This light carrying information is called an optical signal. When optical signals are transmitted in optical information transmission equipment, optical power loss can be reduced, enabling long-distance transmission of optical signals. Furthermore, the cost of optical information transmission equipment such as optical fibers is lower than that of electrical information transmission equipment such as copper wires. Therefore, optical communication technology can achieve high-speed, long-distance, and low-cost information transmission.

[0077] Information processing equipment typically includes optical network units (ONUs), optical line terminals (OLTs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, and vehicle communication systems, while optical information transmission equipment typically includes optical fibers and waveguides. Information processing equipment can only recognize and process electrical signals, while optical communication technology uses optical signals for transmission, requiring optical modules to convert between optical and electrical signals.

[0078] An optical module enables the conversion between optical signals and electrical signals between information processing equipment and optical information transmission equipment. In some embodiments, at least one of the optical signal input or output terminals of the optical module is connected to an optical fiber, and at least one of the electrical signal input or output terminals of the optical module is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts the first optical signal into a first electrical signal and transmits the first electrical signal to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber.

[0079] Since multiple information processing devices can transmit information via electrical signals, at least one of these devices needs to be directly connected to the optical module, rather than all of them. Here, the information processing device directly connected to the optical module is also referred to as the host computer of the optical module. Furthermore, the optical signal input or output terminal of the optical module is called the optical port, and the electrical signal input or output terminal is called the electrical port.

[0080] While the architecture of automotive optical communication shares some similarities with the ONU and OLT communication architecture in access network optical communication, significant differences exist. Although the ONU and OLT also employ a multi-to-one communication architecture, it lacks image detection and processing capabilities. Furthermore, both the ONU and OLT act as the host computer for the optical modules, with the host computer supplying power and establishing signal interaction between them. Additionally, the external structural forms of the ONU, OLT, and optical modules are unsuitable for automotive installation environments. These similarities offer some design inspiration for automotive optical communication, but the aforementioned differences present significant technical obstacles to the implementation of automotive optical communication design solutions.

[0081] Figure 1 This is a partial structural diagram of an optical communication system according to some embodiments. Figure 1 As shown, the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100 for optical modules, an optical module 200, an optical fiber 101, and a network cable 103. Among them, the optical fiber 101 is an optical information transmission device, and the network cable 103 is an electrical information transmission device.

[0082] In some embodiments, one end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end of the optical fiber 101 is connected to the optical module 200 through the optical port of the optical module 200. The optical signal can undergo total internal reflection in the optical fiber 101, and the propagation of the optical signal in the direction of total internal reflection can almost maintain the original optical power. The optical signal undergoes multiple total internal reflections in the optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or to transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby realizing long-distance information transmission based on low power loss.

[0083] The optical communication system includes one or more optical fibers 101. In some embodiments, the optical fiber 101 is detachably connected to the optical module 200; in other embodiments, the optical fiber 101 is non-detachably connected to the optical module 200.

[0084] The host computer 100 is configured to provide data signals to the optical module 200, or receive data signals from the optical module 200, or monitor or control the working status of the optical module 200.

[0085] The host computer 100 may include a housing for accommodating the optical module 200, and an optical module interface 102 disposed on the housing. The optical module 200 is inserted into the housing through the optical module interface 102 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the optical module 200.

[0086] The host computer 100 also includes an external power interface that can connect to an electrical signal network. In some embodiments, the external power interface includes a Universal Serial Bus (USB) interface or a network cable interface 104. The network cable interface 104 is configured to connect a network cable 103 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the network cable 103.

[0087] One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the host computer 100, so as to establish an electrical signal connection between the local information processing device 2000 and the host computer 100 through the network cable 103. In some embodiments, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber 101. The second optical signal is transmitted in the optical fiber 101 to the remote information processing device 1000.

[0088] In some embodiments, a first optical signal from a remote information processing device 1000 is transmitted through an optical fiber 101, and the first optical signal from the optical fiber 101 is transmitted to an optical module 200. The optical module 200 converts the first optical signal into a first electrical signal, and transmits the first electrical signal to a host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal and transmits the fourth electrical signal to a local information processing device 2000.

[0089] In some embodiments, the optical module is a tool for converting optical signals to electrical signals. During the conversion process, the information does not change, but the encoding or decoding method of the information changes.

[0090] Figure 2 This is a partial structural diagram of a host computer according to some embodiments. To clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structure of the host computer 100 related to the optical module 200 is shown. For example... Figure 2 As shown, in some embodiments, the host computer 100 further includes a PCB circuit board 105 disposed in the receiving cavity, and a cage 106 disposed on the surface of the PCB circuit board 105; the optical module 200 is inserted into the cage 106 and fixed by the cage 106.

[0091] In some embodiments, a heat sink 107 is provided on the cage 106 to dissipate heat for the optical module; in some embodiments, the heat sink 107 has protruding structures such as fins to increase the heat dissipation area.

[0092] In some embodiments, an electrical connector is provided inside the cage 106, which is configured to connect to the electrical port of the optical module 200.

[0093] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100, and the cage 106 fixes the optical module 200. The heat generated by the optical module 200 is conducted to the cage 106 and then diffused through the heat sink 107.

[0094] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100, and the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, thereby establishing an electrical signal connection between the optical module 200 and the host computer 100.

[0095] In some embodiments, the optical port of the optical module 200 is connected to the optical fiber 101, thereby enabling the optical module 200 to establish an optical signal connection with the optical fiber 101.

[0096] Figure 3 This is a structural diagram of an optical module according to some embodiments. Figure 4This is an exploded view of an optical module according to some embodiments. Figure 3 and Figure 4 As shown, the optical module 200 includes a shell, a circuit board 300 disposed within the shell, a light emitting component 400, and a light receiving component 500. However, this disclosure is not limited thereto; in some embodiments, the optical module 200 includes one of the light emitting component 400 and the light receiving component 500.

[0097] The housing includes an upper housing 201 and a lower housing 202, with the upper housing 201 covering the lower housing 202 to form the aforementioned housing having two openings 204 and 205; the outer contour of the housing is generally square.

[0098] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011, which covers the two lower side plates 2022 of the lower housing 202 to form the aforementioned housing.

[0099] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and perpendicular to the cover plate 2011. The two upper side plates and the two lower side plates 2022 are combined to realize that the upper housing 201 covers the lower housing 202.

[0100] The direction of the line connecting the two openings 204 and 205 can be consistent with or inconsistent with the length direction of the optical module 200. For example, opening 204 is located at the end of the optical module 200. Figure 3 The opening 205 is also located at the end of the optical module 200 (right end). Figure 3 (Left end). Alternatively, opening 204 is located at the end of optical module 200, while opening 205 is located on the side of optical module 200. Opening 204 is an electrical port, from which the gold fingers of circuit board 300 extend and are inserted into the electrical connector of host computer 100; opening 205 is an optical port, configured to connect to external optical fiber 101 so that optical fiber 101 connects optical emitting component 400 and optical receiving component 500 in optical module 200.

[0101] The assembly method using an upper housing 201 and a lower housing 202 facilitates the installation of the circuit board 300, the light emitting component 400, and the light receiving component 500 into the aforementioned housings. The upper housing 201 and the lower housing 202 can encapsulate and protect these devices. Furthermore, the assembly of the circuit board 300, the light emitting component 400, and the light receiving component 500 facilitates the deployment of positioning components, heat dissipation components, and electromagnetic shielding components for these devices, which is beneficial for automated production.

[0102] In some embodiments, the upper housing 201 and the lower housing 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0103] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to establish a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0104] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a locking component that matches the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the locking component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the locking component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the locking component and the host computer, so as to release the fixation between the optical module 200 and the host computer, thereby allowing the optical module 200 to be pulled out of the cage 106.

[0105] Circuit board 300 includes circuit traces, electronic components, and chips. The circuit traces connect the electronic components and chips according to the circuit design to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include, for example, microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers (LIAs), clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0106] Circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also perform a load-bearing function. For example, the rigid circuit board can stably support the aforementioned electronic components and chips. The rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0107] The circuit board 300 also includes gold fingers formed on its end surfaces, each gold finger consisting of a plurality of independent pins. The circuit board 300 is inserted into a cage 106 and is electrically connected to an electrical connector within the cage 106 by the gold fingers. The gold fingers may be located only on one side of the surface of the circuit board 300 (e.g., ...). Figure 4 The upper surface shown can also be positioned on the upper and lower surfaces of the circuit board 300 to provide a greater number of pins, thus adapting to applications with high pin count requirements. The gold fingers are configured to establish an electrical connection with the host computer to achieve power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, and data signal transmission. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards as a supplement to rigid circuit boards.

[0108] At least one of the light emitting component 400 or the light receiving component 500 is located on the side of the circuit board 300 away from the gold fingers.

[0109] In some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300, and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors.

[0110] In some embodiments, at least one of the light emitting component 400 or the light receiving component 500 may be directly disposed on the circuit board 300. For example, at least one of the light emitting component 400 or the light receiving component 500 may be disposed on the surface of the circuit board 300 or the side of the circuit board 300.

[0111] In some embodiments, the light emitting component 400 is connected to one end of the first flexible circuit board 310, and the other end of the first flexible circuit board 310 is connected to the circuit board 300, so that the light emitting component 400 is connected to the circuit board 300, and the light emitting component 400 emits light signals under the action of the electrical signals of the circuit board 300.

[0112] In some embodiments, the light receiving component 500 is connected to one end of the second flexible circuit board 320, and the other end of the second flexible circuit board 320 is connected to the circuit board 300, so that the light receiving component 500 is connected to the circuit board 300, and the light receiving component 500 converts the light signal into an electrical signal and transmits the electrical signal to the circuit board 300.

[0113] Figure 5a This is an internal structural diagram of an optical module according to some embodiments. Figure 5b This is an exploded view of the internal structure of an optical module according to some embodiments. Figure 5a and Figure 5b As shown, in some embodiments, the optical module further includes a first housing 510. A first end of the first housing 510 can be connected to the light emitting component 400, and a second end of the first housing 510 can be connected to the light receiving component 500.

[0114] In some embodiments, a first fiber optic adapter 700 may be disposed inside the housing of the optical module 200. One end of the first fiber optic adapter 700 may be connected to the third end of the first housing 510 so that the received optical signal from the outside is input to the first housing 510 through the first fiber optic adapter 700, and then forwarded to the optical receiving component 500 by the optical components of the first housing 510.

[0115] The first end of the first housing 510 can be connected to the optical transmitting component 400, the second end of the first housing 510 can be connected to the optical receiving component 500, and the third end of the first housing 510 can be connected to one end of the first optical fiber adapter 700, so that the transmitted optical signal emitted by the optical transmitting component 400 is first transmitted to the first housing 510, then transmitted through the first housing 510 to the first optical fiber adapter 700, and finally output through the first optical fiber adapter 700. The optical receiving component 500 and the optical transmitting component 400 share the first optical fiber adapter 700, and thus the uplink and downlink optical signals of the optical module share the same optical fiber 101.

[0116] In some embodiments, the light emitting component 400 and the circuit board 300 can be connected via a flexible circuit board.

[0117] In some embodiments, the light receiving component 500 and the circuit board 300 can be connected via a flexible circuit board.

[0118] In some embodiments, the first end of the first housing 510 and the second end of the first housing 510 may be disposed opposite to each other, and the third end of the first housing 510 and the first end of the first housing 510 may be disposed adjacent to each other, so that the first fiber optic adapter 700 and the optical receiving component 500 are both offset from the middle of the housing, thereby causing the optical port to be offset from the middle of the housing.

[0119] In some embodiments, the optical module 200 can be used in vehicle-to-everything (V2X) communication. In V2X communication, the optical module 200 can convert received optical signals into electrical signals that can be processed by the vehicle-mounted electronic devices, or convert electrical signals emitted by the vehicle-mounted electronic devices into transmitted optical signals. For example, the vehicle-mounted electronic devices may include autonomous driving systems, remote monitoring systems, and in-vehicle entertainment systems. In autonomous driving systems, the optical module 200 can transmit data such as high-definition maps, real-time traffic conditions, and vehicle status. In remote monitoring systems, the optical module transmits vehicle status information to a remote monitoring center, enabling remote control of the vehicle.

[0120] Figure 6 This is an internal structural diagram of another optical module provided according to some embodiments. For example... Figure 6 As shown, in some embodiments, a second fiber optic adapter 710 may be disposed inside the housing of the optical module 200. One end of the second fiber optic adapter 710 may be connected to the optical emitting component 400 so that the optical signal emitted by the optical emitting component 400 can be transmitted out of the optical module through the second fiber optic adapter 710.

[0121] In some embodiments, a third fiber optic adapter 720 may be disposed within the housing of the optical module 200. One end of the third fiber optic adapter 720 may be connected to the optical receiving component 500 so that externally input optical signals can be transmitted to the optical receiving component 500 through the third fiber optic adapter 720.

[0122] In some embodiments, one end of the second fiber optic adapter 710 can be connected to the light emitting component 400 via a mounting base 900. An optoelectronic device can be disposed within the mounting base 900. For example, a second lens can be disposed within the mounting base 900.

[0123] Figure 7 This is an exploded view of a light emitting component according to some embodiments. Figure 7 As shown, in some embodiments, the light emitting component 400 may include a tube base 410, the top surface of which may be connected to the bottom surface of the first carrier substrate 470, and a laser chip 440 may be disposed on the top surface of the first carrier substrate 470, which may emit light signals.

[0124] In some embodiments, a second support substrate 450 may be provided on the top surface of the tube base 410. The bottom surface of the second support substrate 450 is connected to the top surface of the tube base 410, and the first side surface 451 of the second support substrate 450 may be connected to the side surface of the first support substrate 470, so that the first support substrate 470 can be connected to the second support substrate 450. For example, the first side surface 451 of the second support substrate 450 and the side surface of the first support substrate 470 may be connected by welding, adhesive bonding, or other methods.

[0125] In some embodiments, the laser chip 440 may be a VCSEL (Vertical-Cavity Surface-Emitting Laser) laser chip. The optical signal emitted by the VCSEL laser chip may include multiple modes. For example, the optical signal emitted by the VCSEL laser chip includes a (0,0) fundamental mode and a (0,1) higher-order mode.

[0126] In some embodiments, the light emitting component 400 may include a pin 460 that extends through the bottom and top surfaces of the mounting base 410. One end of the pin 460 may be electrically connected to the circuit board 300 via a flexible circuit board, and the other end of the pin 460 protrudes from the top surface of the mounting base 410 and is connected to an optoelectronic device on the mounting base 410, thereby electrically connecting the optoelectronic device to the circuit board. For example, the pin 460 is wire-connected to a laser chip 440, thereby electrically connecting the laser chip 440 to the circuit board 300. The laser chip 440 emits a light signal under the influence of an electrical signal provided by the circuit board 300.

[0127] In some embodiments, the light emitting component 400 may include a cap 420, which may cover the tube base 410 to form a storage cavity. A first lens 430 may be disposed within the storage cavity. The first lens 430 may be located in the light emission direction of the laser chip 440 to receive the light signal emitted by the laser chip 440. The first lens 430 may be a collimating lens to collimate the light signal emitted by the laser chip 440 to obtain collimated light.

[0128] Figure 8 This is a cross-sectional view of a first fiber optic adapter according to some embodiments. Figure 8 As shown, in some embodiments, the first fiber optic adapter 700 may include an adapter body 702 and a first fiber optic ferrule 701. One end of the first fiber optic ferrule 701 may be embedded and connected to the adapter body 702, and the other end of the first fiber optic ferrule 701 may be located within the first housing 510. The first fiber optic ferrule 701 is used to transmit optical transmission signals and optical reception signals, facilitating the coupling of optical transmission signals into the optical fiber 101 and the transmission of optical reception signals output through the optical fiber 101 to the first housing 510.

[0129] Similarly, the second fiber optic adapter 710 may include an adapter body and a second fiber optic ferrule. One end of the second fiber optic ferrule may be embedded and connected to the adapter body 702, and the other end of the second fiber optic ferrule may face the optical emitting component 400. The second fiber optic ferrule is used to transmit optical emission signals, facilitating the coupling of the optical emission signals into the optical fiber 101.

[0130] In some embodiments, the fiber cores in the first fiber ferrule 701 and the second fiber ferrule can both be single-mode fiber cores.

[0131] In some embodiments, the fiber cores in the first fiber ferrule 701 and the second fiber ferrule can both be multimode fiber cores, ensuring that the diameter of the light spot coupled into the multimode fiber core is comparable to the diameter of the multimode fiber core, thereby ensuring that the light energy distribution of the light emission signal and other signals in the multimode fiber core is more uniform, which is more conducive to back-end beam splitting applications.

[0132] In vehicle-mounted communication, optical modules employ a combination of multimode laser chips and multimode fiber cores. The fiber optic adapter's fiber core must meet the IEC Encircled Flux (EF) standard (IEC 61280-1-4 is a specification developed by the International Electrotechnical Commission (IEC) for measuring the performance of light sources in fiber optic communication systems). However, the light energy (i.e., irradiance) of the emitted optical signal from the multimode laser chip is too concentrated, causing the light spot entering the fiber core to fail to meet the IEC Encircled Flux standard. To address this issue, in some embodiments, a beam homogenizer is placed between the multimode laser chip and the multimode fiber. The beam homogenizer can adjust the concentrated energy (i.e., irradiance) of the light spot into a relatively uniform energy spot, thus ensuring that the light spot entering the fiber core meets the IEC Encircled Flux standard.

[0133] Figure 9a This is a partial view of the internal structure of an optical module according to some embodiments. Figure 9b This is a partially exploded view of the internal structure of an optical module according to some embodiments. Figure 10 This is an optical path diagram of an optical module according to some embodiments. For example... Figure 9a , Figure 9b and Figure 10 As shown, in some embodiments, the first housing 510 may include an inner cavity 514, a first port 511, a second port 512, and a third port 513. The inner cavity 514 is connected to the first port 511, the second port 512, and the third port 513, respectively. The first port 511 may be located on the first sidewall of the first housing 510, the second port 512 may be located on the second sidewall of the first housing 510, and the third port 513 may be located on the third sidewall of the first housing 510. The first, second, and third sidewalls of the first housing 510 are sequentially connected, and the first and third sidewalls of the first housing 510 are arranged opposite to each other. A light emitting component 400 may be inserted into the first port 511 so that the light emitting component 400 can be connected to the first end of the first housing 510. A light receiving component 500 may be inserted into the second port 512 so that the light receiving component 500 can be connected to the second end of the first housing 510. The first fiber optic adapter 700 can be inserted into the third port 513 so that the first fiber optic adapter 700 can be connected to the third end of the first housing 510.

[0134] In some embodiments, the inner cavity 514 of the first housing 510 may be provided with a second lens 524. The second lens 524 may be a converging lens to converge the collimated light. The second lens 524 may be located between the first lens 430 and the fiber optic ferrule 701 to converge the collimated light after collimation by the first lens 430 into the fiber optic ferrule 701.

[0135] In some embodiments, the inner cavity 514 of the first housing 510 may be provided with a first filter 522. The first filter 522 may be located between the first lens 430 and the second lens 524 to filter collimated light. The first filter 522 may be tilted toward the light receiving component 500 so that the light signal can be reflected by the first filter 522 and then incident on the light receiving component 500.

[0136] In some embodiments, a second filter 523 may be disposed in the inner cavity 514 of the first housing 510. The second filter 523 can filter optical signals to reduce stray light incident on the light receiving component 500. The second filter 523 may be located between the first filter 522 and the light receiving component 500 so that the optical signal filtered by the second filter 523 is incident on the light receiving component 500. For example, the second filter 523 may be a bandpass filter with a transmission wavelength range in the operating band of the light receiving component.

[0137] In some embodiments, the inner cavity 514 of the first housing 510 may be provided with a light homogenizer 521. The light homogenizer 521 can adjust the light signal to make the irradiance distribution of the light signal spot uniform. The light homogenizer 521 may be located between the first lens 430 and the second lens 524 so that the light homogenizer 521 can adjust the light signal collimated by the first lens 430 to make the irradiance distribution of the light signal focused by the second lens 524 uniform.

[0138] In some embodiments, the light homogenizer 521 can be a superlens. A superlens can precisely control the phase, amplitude, and polarization of incident light through surface microstructures (such as nanostructure arrays), thereby achieving manipulation of the light field. A superlens can adjust unevenly irradiated light spots into light spots with uniform irradiance distribution.

[0139] A superlens can comprise a substrate and a subwavelength nanostructure array, with the nanostructure array disposed on the substrate. By controlling the phase of the nanostructure array, the superlens can homogenize the energy distribution of the light field, reducing scattering and diffraction caused by phase abrupt changes, thereby adjusting unevenly irradiated light spots into uniform ones. The substrate serves as the supporting platform for the superlens and is typically made of optical lens materials. The nanostructure array can be made of transparent materials with high refractive indices, such as silicon nitride, titanium dioxide, or silicon dioxide. The selection of these materials can be based on factors such as their optical properties, mechanical stability, and compatibility with manufacturing processes.

[0140] Nanostructure arrays can be cylindrical or rectangular. Cylindrical nanostructure arrays can provide a more uniform light spot adjustment effect, while rectangular nanostructure arrays may have stronger light field manipulation capabilities in specific directions. By adjusting the shape, size, and arrangement of the nanostructure array, more precise control of the optical signal can be achieved, thereby meeting the needs of different application scenarios.

[0141] In some embodiments, the height of the nanostructure array is discretely distributed in 8 steps, with each step corresponding to a phase delay of 45°.

[0142] In some embodiments, the height of the nanostructure array is discretely distributed in 16 steps, with each step corresponding to a phase delay of 22.5°.

[0143] Phase modulation of superlenses is typically achieved by altering the height or geometric parameters of the nanostructure array. Higher levels of phase discretization (more steps) result in phase modulation of the microstructure that more closely approximates an ideal continuous change, thereby reducing light scattering and undesired diffraction effects caused by abrupt phase changes. This leads to better homogenization of light in a 16-step superlens. Furthermore, the smoother phase transition of a 16-step superlens allows for more effective concentration of incident light energy into the target optical field mode (e.g., focusing, vortex beams), thus improving optical efficiency.

[0144] When the height of the nanostructure array is discretely distributed in 16 steps, the diameter or side length of the nanostructure array is 50-200 nm, and the height is 100-500 nm. This not only ensures sufficient phase modulation accuracy but also maintains high yield and stability in the manufacturing process. For example, the diameter or side length of a single nanostructure is 50-200 nm, and the height is 100-500 nm.

[0145] In some embodiments, the light homogenizer 521 may be located between the first lens 430 and the first filter 522, so that the irradiance of the light spot entering the first optical fiber adapter 700 is uniformly distributed, without affecting the irradiance of the light spot entering the light receiving chip of the light receiving component 500, thus ensuring the intensity of the light signal received by the light receiving chip.

[0146] Figure 11 This is a transmission optical path diagram of another optical module provided according to some embodiments. For example... Figure 11 As shown, in some embodiments, the second lens 524 can be placed inside the mounting base 900, and the light emitting component 400 is provided with a laser chip 440 and a first lens 430. The light homogenizer 521 can be placed inside the light emitting component 400 or inside the mounting base 900. The light signal emitted by the laser chip 440 is collimated by the first lens 430, homogenized by the light homogenizer 521, and focused by the second lens 524 into the fiber core of the second fiber optic ferrule 701a.

[0147] Figure 12 This is a test pattern of the height distribution of a superlens diffraction surface provided according to some embodiments. Figure 12 The horizontal axis represents spatial location, and the vertical axis represents height. For example... Figure 12 As shown, the height of the nanostructure array of the superlens is discretely distributed in 16 steps.

[0148] Figure 13 This is a comparison diagram of the irradiance distribution of a light spot according to some embodiments. Figure 14 This is a comparison image of light spots provided according to some embodiments. Figure 13 The horizontal axis represents the distance from the center point of the light spot, and the vertical axis represents the irradiance. Figure 13 (1) is the irradiance distribution diagram before uniform light distribution, and (2) is the irradiance distribution diagram after uniform light distribution. Figure 14 (1) is the light spot image before uniform illumination, and (2) is the light spot image after uniform illumination. Figure 13 and Figure 14 As shown, a light spot with uneven irradiance distribution becomes a light spot with uniform irradiance distribution after passing through a superlens, and the size of the light spot increases.

[0149] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this disclosure, and are not intended to limit them. Although this disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this disclosure.

Claims

1. An optical module, characterized in that, include: Circuit board; The light-emitting component is electrically connected to the circuit board. A light receiving component is electrically connected to the circuit board; First fiber optic adapter; The first housing has a first end connected to the light emitting component, a second end connected to the first optical fiber adapter, and a third end connected to the light receiving component; The light emitting component includes: The laser chip, specifically a VCSEL laser chip, is used to emit optical signals including multiple modes. The first lens, located in the light-emitting direction of the laser chip, is used to collimate the optical signal; The first fiber optic adapter includes: The first optical fiber ferrule includes a fiber core; the fiber core is a multimode fiber core. The inner cavity of the first housing is provided with: The second lens, located between the first lens and the first optical fiber ferrule, is used to converge the optical signal. A light homogenizer, located between the first lens and the second lens, is used to adjust a light signal with uneven irradiance distribution into a light signal with uniform irradiance distribution.

2. The optical module according to claim 1, characterized in that, The light homogenizer includes a substrate and a nanostructure array, wherein the nanostructure array is disposed on the substrate and the height of the nanostructure array is discretely distributed in 16 steps.

3. The optical module according to claim 1, characterized in that, The inner cavity of the first housing is further provided with: The first filter is located between the second lens and the light homogenizer, facing the light emitting component and the light receiving component, and is used to filter the light signal emitted by the light emitting component and reflect the light signal emitted by the optical fiber ferrule to the light receiving component.

4. The optical module according to claim 3, characterized in that, The inner cavity of the first housing is further provided with: The second filter is located between the first filter and the light receiving component, and is used to filter the light signal reflected by the first filter.

5. The optical module according to claim 1, characterized in that, The light emitting component includes: The tube seat has the following on its top surface: The first substrate is provided with the laser chip. A cap is placed on the tube base to form a storage cavity with the tube base, and the first lens is disposed in the storage cavity; The pin extends through the bottom and top surfaces of the socket, with one end connected to the circuit board and the other end electrically connected to the laser chip.

6. The optical module according to claim 1, characterized in that, Also includes: The first flexible circuit board has one end connected to the light emitting component and the other end connected to the circuit board; The second flexible circuit board has one end connected to the light receiving component and the other end connected to the circuit board.

7. An optical module, characterized in that, include: Circuit board; A light-emitting component, one end of which is electrically connected to the circuit board; The optical receiving component is electrically connected at one end to the circuit board. The second fiber optic adapter is connected to the other end of the optical emitting component via a mounting bracket; A third fiber optic adapter is connected to the optical receiving component; The light emitting component includes: The laser chip, specifically a VCSEL laser chip, is used to emit optical signals including multiple modes. The first lens, located in the light-emitting direction of the laser chip, is used to collimate the optical signal; The second fiber optic adapter includes: The second fiber optic ferrule includes a fiber core; the fiber core is a multimode fiber core. The fixing base is provided with: A second lens, located between the first lens and the second fiber optic ferrule, is used to focus the optical signal; wherein, the optical emitting component is provided with: A light homogenizer, located between the first lens and the second lens, is used to adjust a light signal with uneven irradiance distribution into a light signal with uniform irradiance distribution.

8. The optical module according to claim 7, characterized in that, The light homogenizer includes a substrate and a nanostructure array, wherein the nanostructure array is disposed on the substrate and the height of the nanostructure array is discretely distributed in 16 steps.

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