Wafer bonding machine

Abstract

The utility model relates to the technical field of wafer bonding, in particular to a wafer bonding machine, which comprises an upper cavity and a lower cavity, the upper cavity is arranged above the lower cavity, a sealed vacuum cavity is formed by the upper cavity and the lower cavity, the upper cavity comprises an upper cavity frame, an inflation tube and an air bag assembly, and the lower cavity comprises a lower cavity frame, an inflation tube and an air bag assembly. The upper cavity comprises an upper cavity frame and a lower cavity frame, the lower cavity comprises a lower cavity frame and a lower pressing head, the air bag assembly is arranged in the upper cavity frame in a sealed mode, air is inflated into or exhausted out of the air bag assembly to drive a sealing spring washer of the air bag assembly to be close to or away from the lower pressing head, and the lower pressing head is arranged in the lower cavity frame. And in the process of attaching the wafers to each other, the self-adaptive capability is high and the pressure uniformity is good.

Description

Technical Field

[0001] This utility model relates to the field of wafer bonding technology, and in particular to a wafer bonding machine. Background Technology

[0002] During wafer fabrication, wafers often warp, resulting in a certain degree of warping, which refers to the warping deformation of the outermost edge of the wafer and its center point. In existing wafer bonding machines, most of the bonding processes use direct pressure bonding. However, this method has poor self-adaptability and uneven pressure during the wafer bonding process. Summary of the Invention

[0003] This invention provides a wafer bonding machine to solve the problems of poor adaptability and poor pressure uniformity in the process of bonding wafers together in the prior art.

[0004] This utility model provides a wafer bonding machine, including an upper cavity and a lower cavity. The upper cavity is disposed above the lower cavity, and the upper cavity and the lower cavity form a sealed vacuum cavity. The upper cavity includes an upper cavity frame, an inflation tube, and an airbag assembly. The lower cavity includes a lower cavity frame and a lower pressure head. The airbag assembly is sealed inside the upper cavity frame. Gas is filled into or discharged from the airbag assembly to drive the sealing spring of the airbag assembly to approach or move away from the lower pressure head. The lower pressure head is disposed inside the lower cavity frame.

[0005] According to the wafer bonding machine of this utility model, the airbag assembly further includes a sealing plate, which is disposed around the sealing gasket.

[0006] The wafer bonding machine according to this utility model further includes a sealing spring gasket groove and a sealing plate protrusion; the sealing spring gasket groove is provided on the side of the sealing spring gasket, and the sealing plate protrusion is provided on the side of the sealing plate, with the sealing plate protrusion disposed in the sealing spring gasket groove.

[0007] The wafer bonding machine according to this utility model also includes a pressure sensor, which is disposed on the upper part of the upper cavity frame and detects the pressure inside the airbag assembly.

[0008] The wafer bonding machine according to this utility model further includes a sealing fastener, an upper cavity cooling pipe, and an upper protective cover; the sealing fastener fixes the sealing plate and the sealing spring gasket, the upper cavity cooling pipe is provided on the upper part of the upper cavity, and the upper protective cover is provided on the upper cavity frame.

[0009] The wafer bonding machine according to this utility model also includes multiple raised strips and multiple lower cavity cooling holes; multiple independent raised strips are provided at the bottom of the lower cavity; the lower cavity cooling holes are provided inside the raised strips, and the lower cavity cooling holes are filled with cooling material and controlled independently.

[0010] The wafer bonding machine according to this utility model further includes a vacuum pumping mechanism and a lower cavity gas filling pipe; the vacuum pumping mechanism is arranged below the lower cavity, and the lower cavity gas filling pipe is arranged at the lower part of the lower cavity.

[0011] The wafer bonding machine according to this utility model also includes multiple locking mechanisms, which are arranged around the outer periphery of the vacuum chamber.

[0012] The bonding machine's upper pressure head is a sealed spring-loaded airbag pressure head, which features excellent pressure uniformity. The airbag evenly distributes pressure between the chip and substrate during bonding, preventing uneven pressure that could cause poor soldering or chip damage. It also boasts strong adaptability, automatically adjusting its shape to fit the unevenness of the bonding material surface, ensuring optimal bonding results. Furthermore, it provides excellent cushioning, effectively buffering pressure to prevent excessive pressure from damaging the chip, substrate, or bonding wires. Attached Figure Description

[0013] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0014] Figure 1 This is a schematic diagram of the three-dimensional structure of a wafer bonding machine;

[0015] Figure 2 This is a cross-sectional view of a wafer bonding machine;

[0016] Figure 3 This is a magnified view of the structure of part A.

[0017] Figure 4 This is a schematic diagram of the three-dimensional structure of the lower cavity;

[0018] Figure 5 Schematic diagram of the upper cavity assembly Figure 1 ;

[0019] Figure 6 This is a cross-sectional view of the upper cavity and a schematic diagram of its structure.

[0020] Figure 7 Schematic diagram of the upper cavity assembly Figure 2 ;

[0021] Reference numerals: 1. Lower cavity; 2. Upper cavity; 3. Locking mechanism; 4. Handle; 11. Lower cavity frame; 12. Lower heating plate; 13. Lower heating tube; 14. Lower pressure head; 15. Shielding cover; 16. Lower cavity inflation tube; 17. Vacuuming mechanism; 111. Raised strip; 112. Lower cavity cooling hole; 21. Sealing spring gasket; 22. Sealing plate; 23. Inflation tube; 24. Upper cavity frame; 25. Sealing fastener; 26. Upper protective cover; 27. Pressure sensor; 28. Upper cavity cooling pipe; 211. Sealing spring gasket groove; 221. Sealing plate protrusion. Detailed Implementation

[0022] The embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and should not be construed as limiting the scope of this utility model.

[0023] In the description of the embodiments of this utility model, it should be noted that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this utility model. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0024] In the description of the embodiments of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this utility model based on the specific circumstances.

[0025] In this embodiment of the utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0026] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0027] The following is combined Figure 1-7 A wafer bonding machine according to an embodiment of the present invention includes an upper cavity 2 and a lower cavity 1. The upper cavity 2 is disposed above the lower cavity 1, and the upper cavity 2 and the lower cavity 1 form a sealed vacuum cavity. The upper cavity 2 includes an upper cavity frame 24, an inflation tube 23, and an airbag assembly. The lower cavity 1 includes a lower cavity frame 11 and a lower pressure head 14. The airbag assembly is sealed inside the upper cavity frame 24. Gas is filled into or discharged from the airbag assembly to drive the sealing spring pad 21 of the airbag assembly to approach or move away from the lower pressure head 14. The lower pressure head 14 is disposed inside the lower cavity frame 11.

[0028] In some embodiments, the airbag assembly further includes a sealing plate 22 disposed around the sealing pad 21.

[0029] In some embodiments, the device further includes a sealing spring gasket groove 211 and a sealing plate protrusion 221; the sealing spring gasket 21 is provided with a sealing spring gasket groove 211 on its side, and the sealing plate 22 is provided with a sealing plate protrusion 221 on its side, and the sealing plate protrusion 221 is disposed in the sealing spring gasket groove 211.

[0030] In some embodiments, a pressure sensor 27 is also included, which is disposed on the upper part of the upper cavity frame 24 and detects the pressure inside the airbag assembly.

[0031] In some embodiments, the system further includes a sealing fastener 25, an upper cavity cooling pipe 28, and an upper cover 26; the sealing fastener 25 fixes the sealing plate 22 and the sealing spring gasket 21, the upper cavity cooling pipe 28 is provided on the upper part of the upper cavity 2, and the upper cover 26 is provided on the upper cavity frame 24.

[0032] In some embodiments, the system further includes a plurality of raised strips 111 and a plurality of lower cavity cooling holes 112; a plurality of independent raised strips 111 are provided at the bottom of the lower cavity 1; the lower cavity cooling holes 112 are provided inside the raised strips 111, and the lower cavity cooling holes 112 are filled with cooling material and controlled independently.

[0033] In some embodiments, the system further includes a vacuuming mechanism 17 and a lower cavity inflation pipe 16; the vacuuming mechanism 17 is disposed below the lower cavity 1, and the lower cavity inflation pipe 16 is disposed at the lower part of the lower cavity 1.

[0034] In some embodiments, a plurality of locking mechanisms 3 are also included, with locking mechanisms 3 provided around the outer periphery of the vacuum cavity.

[0035] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and not to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A wafer bonding machine, comprising an upper cavity and a lower cavity, the upper cavity being disposed above the lower cavity, the upper cavity and the lower cavity forming a sealed vacuum cavity, characterized in that, The upper cavity includes an upper cavity frame, an inflation tube, and an airbag assembly. The lower cavity includes a lower cavity frame and a lower pressure head. The airbag assembly is sealed inside the upper cavity frame. Gas is injected into or released from the airbag assembly to drive the sealing gasket of the airbag assembly to approach or move away from the lower pressure head. The lower pressure head is located inside the lower cavity frame.

2. The wafer bonding machine according to claim 1, characterized in that, The airbag assembly also includes a sealing plate disposed around the sealing gasket.

3. The wafer bonding machine according to claim 2, characterized in that, It also includes a sealing spring gasket groove and a sealing plate protrusion; the sealing spring gasket is provided with a sealing spring gasket groove on its side, and the sealing plate protrusion is provided with a sealing plate protrusion on its side, and the sealing plate protrusion is disposed in the sealing spring gasket groove.

4. The wafer bonding machine according to claim 2, characterized in that, It also includes a pressure sensor, which is disposed on the upper part of the upper cavity frame, and the pressure sensor detects the pressure inside the airbag assembly.

5. The wafer bonding machine according to claim 2, characterized in that, It also includes sealing fasteners, upper cavity cooling pipes, and an upper protective cover; the sealing fasteners fix the sealing plate and the sealing spring gasket, the upper cavity cooling pipes are provided on the upper part of the upper cavity, and the upper protective cover is provided on the upper cavity frame.

6. The wafer bonding machine according to claim 1, characterized in that, It also includes multiple raised strips and multiple lower cavity cooling holes; multiple independent raised strips are provided at the bottom of the lower cavity; the lower cavity cooling holes are provided inside the raised strips, and the lower cavity cooling holes are filled with cooling material and controlled independently.

7. The wafer bonding machine according to claim 1, characterized in that, It also includes a vacuuming mechanism and a lower cavity inflation tube; the vacuuming mechanism is located below the lower cavity, and the lower cavity inflation tube is located at the lower part of the lower cavity.

8. The wafer bonding machine according to claim 1, characterized in that, It also includes multiple locking mechanisms, which are arranged around the outer perimeter of the vacuum cavity.

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