MEMS (Micro Electro Mechanical System) silicon-based atomizing core with capillary micropore double substrates
By adopting a capillary microporous dual-substrate structure on the silicon-based atomizing core, the problems of uneven heating, slow atomization speed and poor liquid retention performance are solved, achieving uniform heating, fast speed and delicate atomization effect, and avoiding atomizing core explosion.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- MEMSYS (HANGZHOU) MICROELECTRONICS CO LTD
- Filing Date
- 2025-04-27
- Publication Date
- 2026-04-17
AI Technical Summary
Existing atomizing cores suffer from uneven heating, slow atomization speed, poor liquid retention and storage performance, and are prone to bursting.
A MEMS silicon-based atomizing core with capillary micropores is used, including a first substrate with high thermal conductivity and a second substrate with low thermal conductivity. Atomizing holes are arrayed on the first substrate and through holes are arrayed on the second substrate through micro-nano fabrication technology to form a microchannel liquid storage cavity, which is heated by metal electrodes.
It achieves consistency in the size and shape of the atomizing holes, ensuring uniform and rapid heating and atomization, improving the liquid retention effect, avoiding the phenomenon of atomizing core bursting, and enhancing the fineness of the atomization effect and the overall atomization efficiency.
Smart Images
Figure CN224125288U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of heating atomizing core technology, specifically a MEMS silicon-based atomizing core with capillary micropore dual substrates. Background Technology
[0002] As the core component of liquid atomizing products, the heated atomizing core heats the liquid, transforming it into a mist-like aerosol that is then released. To ensure users receive a good taste and achieve rapid absorption, the atomizing element must heat the atomized liquid quickly, evenly, consistently, and finely, while minimizing the generation of harmful substances.
[0003] There are currently three main types of heated atomizing cores for electronic cigarettes:
[0004] The first type is the ceramic atomizing core. This is a mature technology and the mainstream solution currently used in products. It consists of two parts: ceramic and heating electrodes. The ceramic is sintered at high temperature to form a bowl-shaped structure. The heating film is designed with a specific shape and attached to the ceramic surface. During operation, the heating film heats the liquid evenly to form mist, which is then dispersed through the ceramic honeycomb pores. However, existing ceramic atomizing cores, due to the use of porous ceramic sintering technology, cannot guarantee the uniformity of the pore size of the ceramic honeycomb pores. This easily leads to uneven liquid atomization, localized overheating, and carbonization blockage. Furthermore, during the high-temperature atomization process on the heating wire, metal elements may be introduced into the liquid, posing a certain degree of harm to the human body. Additionally, the poor thermal conductivity of ceramic results in a slow atomization speed, further exacerbating the uneven atomization.
[0005] The second type is the cotton atomizing core, a relatively mature technology. Its structure consists of a heating wire spirally wound around organic cotton. During operation, the heating wire heats the liquid absorbed by the cotton, atomizing it. However, existing cotton atomizing cores, because the heating wire is in direct contact with the cotton core, the high temperature may cause the cotton core material to be atomized and inhaled by the user, posing a health risk. Furthermore, the cotton core has a short lifespan, is prone to dry burning, resulting in poor atomization stability. Moreover, this design cannot be mass-produced automatically, failing to meet the demand required for its development.
[0006] The third type is silicon-based atomizing cores, currently in the research and development stage. Compared to ceramic cores, they offer better consistency in processing, greater structural diversity, and are made from relatively environmentally friendly materials, representing a future technological direction. Generally, micro-nano fabrication techniques are used to deposit metal materials on a silicon substrate, patterning them into metal resistance heating wires and electrodes of specific shapes. Perforations are then etched around the metal resistance wires and electrodes on the silicon substrate to serve as channels for liquid atomization. Existing silicon-based atomizing cores offer consistent pore diameters and good thermal conductivity, overcoming some of the shortcomings of ceramic cores. However, this also brings some problems. For example, using a single silicon substrate structure, limited by mechanical strength, requires a relatively thick silicon substrate, typically greater than 300μm. Due to process limitations, it is difficult to achieve high aspect ratio through-hole structures. The diameter or side length of the atomizing holes is usually greater than 30μm, resulting in less fine atomization and poor liquid retention. Because the atomizing core of this structure has good thermal conductivity, it cannot come into direct contact with the liquid tank, otherwise it may cause the tank to explode. In addition, its liquid storage and locking performance is poor, so auxiliary liquid-separating, liquid-storing and liquid-locking materials are required. Utility Model Content
[0007] The purpose of this invention is to provide a MEMS silicon-based atomizing core with capillary micropores to solve the problems of uneven heating, slow atomization speed, poor liquid retention and storage performance, and easy chamber explosion in existing atomizing cores.
[0008] To achieve the above objectives, this utility model adopts the following technical solution: a MEMS silicon-based atomizing core with capillary micropore dual substrates, comprising:
[0009] The first substrate is a silicon substrate with high thermal conductivity, on which several atomization holes are arranged in an array, and a metal electrode is disposed on its top surface;
[0010] The second substrate is a low thermal conductivity material substrate, which is bonded to the bottom surface of the first substrate through an intermediate layer, and has a number of through holes arranged in an array on it.
[0011] The atomizing hole is connected to the through hole to form a microchannel liquid storage cavity.
[0012] As a further description of the above technical solution:
[0013] The thickness of the first substrate is 10μm-200μm.
[0014] As a further description of the above technical solution:
[0015] The aperture of the atomizing hole is 10μm-200μm.
[0016] As a further description of the above technical solution:
[0017] The second substrate is a glass sheet, a quartz sheet, or a ceramic sheet.
[0018] As a further description of the above technical solution:
[0019] The diameter of the through hole is 10μm-100μm.
[0020] As a further description of the above technical solution:
[0021] The material of the metal electrode includes any one of Ti / Au, Ti / Pt, Ti / TiN / Au, Ti / TiN / Pt, Ta / Au, Ta / Pt, Ta / TaN / Au, and Ta / TaN / Pt.
[0022] In summary, by adopting the above technical solution, this utility model has the following beneficial effects compared with the prior art:
[0023] This invention discloses a silicon-based atomizing core and its corresponding manufacturing method. Through micro-nano fabrication technology, the consistency of the atomizing hole size and shape can be improved, thereby ensuring uniform heating and atomization with a fast heating speed. A dual-substrate structure is employed. A second substrate of low thermal conductivity material is fixed below a high thermal conductivity silicon substrate. With the support of the second substrate, the thickness of the silicon substrate and the diameter of the atomizing holes can be made very small. While ensuring structural strength, this allows the liquid entering the atomizing core from the storage chamber to be stored in the microchannel storage cavity through the capillary action formed by the through-holes, improving the liquid retention effect. The liquid enters the atomizing holes and heats up the silicon structure of the first substrate by energizing it, achieving the heating effect and thus atomizing the liquid. This improves the atomization performance of the silicon-based atomizing core, resulting in a finer atomization effect and reducing the difficulty of liquid atomization preparation. Furthermore, the second substrate forms a heat buffer zone between the first substrate used for heating and atomization and the storage chamber, preheating the liquid to improve overall atomization efficiency while preventing the heat transferred from the first substrate in the atomizing core from directly contacting the storage chamber and causing a chamber explosion. Attached Figure Description
[0024] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0025] Figure 1 This is a schematic diagram of a MEMS silicon-based atomizing core with capillary micropores as its dual substrate.
[0026] Figure 2 This is a schematic diagram of the fabrication process of a MEMS silicon-based atomizing core with capillary micropores in step S1.
[0027] Figure 3 This is a schematic diagram of the fabrication process of a MEMS silicon-based atomizing core with capillary micropores in step S2.
[0028] Figure 4 This is a schematic diagram of the fabrication process of a MEMS silicon-based atomizing core with capillary micropores in step S3.
[0029] Figure 5 This is a schematic diagram of the fabrication process of a MEMS silicon-based atomizing core with capillary micropores in step S4.
[0030] Figure 6 This is a schematic diagram of the fabrication process of a MEMS silicon-based atomizing core with capillary micropores in step S5.
[0031] Legend:
[0032] 1. First substrate; 2. Atomizing hole; 3. Metal electrode; 4. Second substrate; 5. Intermediate layer; 6. Through hole; 10. Second substrate original sheet; 20. First substrate original sheet; 30. First substrate substrate. Detailed Implementation
[0033] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0034] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.
[0035] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.
[0036] In the description of the embodiments of this utility model, it should be noted that the terms "upper" and "inner" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the utility model product is usually placed when in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0037] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection, an indirect connection through an intermediate medium, or a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0038] Example 1:
[0039] Please see Figure 1-6 This utility model provides a technical solution: a MEMS silicon-based atomizing core with capillary micropore dual substrates, comprising:
[0040] The first substrate 1 is a silicon substrate with high thermal conductivity, on which a plurality of atomizing holes 2 are arranged in an array, and a metal electrode 3 is disposed on its top surface; the first substrate 1 is made of silicon wafer, which has a certain electrical conductivity and can be used as a heating atomizing structure layer.
[0041] The second substrate 4 is a substrate made of low thermal conductivity material. It is bonded to the bottom surface of the first substrate 1 through an intermediate layer 5, and several through holes 6 are arranged in an array on it.
[0042] The atomizing hole 2 is connected to the through hole 6 to form a microchannel liquid storage cavity.
[0043] The above-mentioned method for manufacturing a MEMS silicon-based atomizing core with capillary micropore dual substrates includes the following steps:
[0044] S1. Prepare a second substrate 10 and drill holes in it to form a plurality of through holes 6; the drilling method can be laser drilling, sandblasting drilling or etching processes.
[0045] S2. Prepare the first substrate 20 and bond it to the second substrate 4 formed in step S1. Specifically, anodic bonding process, glass paste bonding process, metal eutectic bonding or diffusion bonding and other technologies can be used to achieve the bonding of the structure.
[0046] S3. Thinning process is performed on the first substrate 20 to form the first substrate 30; the thinning process can be chemical mechanical thinning, wet etching thinning or other processes.
[0047] S4. Deposit the metal electrode 3 on the surface of the first substrate 30 and etch it to form a specific pattern by dry etching or wet etching process;
[0048] S5. An atomizing hole 2 communicating with the through hole 6 is etched on the first substrate 30, thereby forming a heating atomizing structure layer.
[0049] This silicon-based atomizing core utilizes micro-nano fabrication technology to improve the consistency of atomization hole size and shape, thereby ensuring uniform heating and atomization with rapid heating speed. Employing a dual-substrate structure, a second substrate of low thermal conductivity material is fixed beneath a high thermal conductivity silicon substrate. With the support of the second substrate, the thickness of the silicon substrate and the diameter of its atomization holes can be made very small. While ensuring structural strength, this allows the liquid entering the atomizing core from the storage chamber to be stored in the microchannel storage cavity through the capillary action formed by the through-holes, improving the liquid retention effect. The liquid enters the atomization holes and heats up the silicon structure of the first substrate by energizing it, achieving the heating effect and thus atomizing the liquid. This improves the atomization performance of the silicon-based atomizing core, resulting in a finer atomization effect and reducing the difficulty of liquid atomization preparation. The specific directions of liquid flow and atomized gas movement are as follows: Figure 1 As shown by the middle arrow, the arrangement of the second substrate creates a heat buffer zone between the first substrate used for heating and atomization and the liquid storage chamber, preheating the liquid to improve the overall atomization efficiency while preventing the heat transferred by the first substrate in the atomizing core from directly contacting the liquid storage chamber and causing it to explode.
[0050] Example 2:
[0051] Based on the above embodiment one, preferably, the thickness of the first substrate 1 is 10μm-200μm. The pore diameter of the atomizing hole 2 is 10μm-200μm. Compared with common silicon-based atomizing cores (thickness greater than 300μm, pore diameter of atomizing hole greater than 30μm), the thickness of the first silicon-based substrate of this atomizing core is greatly reduced and the structural strength is high. The pore diameter of the atomizing hole can be as low as 10μm, which can achieve a high aspect ratio of the flow passage, making the atomization finer and improving the liquid storage and liquid retention performance.
[0052] Example 3:
[0053] Based on the above embodiment one, preferably, the second substrate 4 is a glass sheet, quartz sheet, or ceramic sheet to achieve stable heat buffering between the first substrate and the liquid storage tank, preheating the liquid to improve overall atomization efficiency while preventing the heat transferred from the first substrate in the atomizing core from directly contacting the liquid storage tank and causing tank bursting. The diameter of the through hole 6 is 10μm-100μm. This increases the aspect ratio of the flow hole, making the capillary effect significant and improving the liquid-locking effect.
[0054] Example 4:
[0055] Based on the above embodiment 1, preferably, the material of the metal electrode 3 includes any one of Ti / Au, Ti / Pt, Ti / TiN / Au, Ti / TiN / Pt, Ta / Au, Ta / Pt, Ta / TaN / Au, and Ta / TaN / Pt. All of the above are metal materials that are harmless to the human body, so as to reduce the damage of the atomizing core to the human body.
[0056] In summary, due to the adoption of the above technical solution, the MEMS silicon-based atomizing core with capillary micropore dual substrate of this embodiment has the following advantages compared with the prior art:
[0057] This invention discloses a silicon-based atomizing core and its corresponding manufacturing method. Through micro-nano fabrication technology, the consistency of the atomizing hole size and shape can be improved, thereby ensuring uniform heating and atomization with a fast heating speed. A dual-substrate structure is employed. A second substrate of low thermal conductivity material is fixed below a high thermal conductivity silicon substrate. With the support of the second substrate, the thickness of the silicon substrate and the diameter of the atomizing holes can be made very small. While ensuring structural strength, this allows the liquid entering the atomizing core from the storage chamber to be stored in the microchannel storage cavity through the capillary action formed by the through-holes, improving the liquid retention effect. The liquid enters the atomizing holes and heats up the silicon structure of the first substrate by energizing it, achieving the heating effect and thus atomizing the liquid. This improves the atomization performance of the silicon-based atomizing core, resulting in a finer atomization effect and reducing the difficulty of liquid atomization preparation. Furthermore, the second substrate forms a heat buffer zone between the first substrate used for heating and atomization and the storage chamber, preheating the liquid to improve overall atomization efficiency while preventing the heat transferred from the first substrate in the atomizing core from directly contacting the storage chamber and causing a chamber explosion.
[0058] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.
Claims
1. A MEMS silicon-based atomizing core with capillary-like microporous dual substrates, characterized in that, include: The first substrate is a silicon substrate with high thermal conductivity, on which several atomization holes are arranged in an array, and a metal electrode is disposed on its top surface; The second substrate is a low thermal conductivity material substrate, which is bonded to the bottom surface of the first substrate through an intermediate layer, and has a number of through holes arranged in an array on it. The atomizing hole is connected to the through hole to form a microchannel liquid storage cavity.
2. The MEMS silicon-based atomizing core with a capillary micro-porous double substrate according to claim 1, characterized in that, The thickness of the first substrate is 10μm-200μm.
3. The MEMS silicon-based atomizing core with a capillary micro-porous double substrate according to claim 1, characterized in that, The aperture of the atomizing hole is 10μm-200μm.
4. The MEMS silicon-based atomizing core with a capillary micro-porous double substrate according to claim 1, characterized in that, The second substrate is a glass sheet, a quartz sheet, or a ceramic sheet.
5. The MEMS silicon-based atomizing core with a capillary micro-porous double substrate according to claim 1, characterized in that, The diameter of the through hole is 10μm-100μm.
6. A MEMS silicon-based atomizing core with capillary-like microporous dual substrates according to claim 1, characterized in that, The material of the metal electrode includes any one of Ti / Au, Ti / Pt, Ti / TiN / Au, Ti / TiN / Pt, Ta / Au, Ta / Pt, Ta / TaN / Au, and Ta / TaN / Pt.